MCH6660-TL-W [ONSEMI]
互补双路功率 MOSFET 20V;型号: | MCH6660-TL-W |
厂家: | ONSEMI |
描述: | 互补双路功率 MOSFET 20V 开关 光电二极管 晶体管 |
文件: | 总8页 (文件大小:1218K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MCH6660
Power MOSFET
www.onsemi.com
–
–
Ω
Ω
20V, 136m , 2A, 20V, 266m , 1.5A Complementary Dual
Features
•
•
•
ON-resistance Nch : R (on)1=105m (typ.)
1.8V Drive
ESD Diode - Protected Gate
Ω
DS
Pch : R (on)1=205m (typ.)
Ω
DS
Pb-Free, Halogen Free and RoHS Compliance
Ultrasmall Package MCPH6(2.0mm 2.1mm
•
•
•
mmt)
×
×0.85
Nch MOSFET and Pch MOSFET are put in MCPH6 Package
Applications
•
General-Purpose Switching Device Applications
Specifications
at Ta=25°C
Absolute Maximum Ratings
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
Drain Current (DC)
Symbol
Conditions
N-channel
20
P-channel
Unit
V
V
V
--20
±10
--1.5
--6
DSS
GSS
±10
2
V
I
I
A
D
Drain Current (Pulse)
Power Dissipation
PW 10 s, duty cycle 1%
8
A
≤
μ
≤
DP
P
When mounted on ceramic substrate (900mm2 0.8mm) 1unit
0.8
W
°C
°C
×
D
Junction Temperature
Storage Temperature
Tj
150
Tstg
--55 to +150
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,
damage may occur and reliability may be affected.
Package Dimensions
unit : mm (typ)
Product & Package Information
• Package
: MCPH6
7022A-006
• JEITA, JEDEC
: SC-88, SC-70-6, SOT-363
• Minimum Packing Quantity : 3,000 pcs./reel
MCH6660-TL-H
MCH6660-TL-W
2.0
0.15
Packing Type : TL
Marking
6
5
4
3
0 to 0.02
XM
1
2
TL
0.65
0.3
Electrical Connection
1 : Source1
2 : Gate1
6
5
4
3 : Drain2
4 : Source2
5 : Gate2
1
2
3
4
6 : Drain1
MCPH6
6
5
1
2
3
ORDERING INFORMATION
See detailed ordering and shipping information on page 8 of this data sheet.
©Semiconductor Components Industries, LLC, 2014
Publication Order Nunber:
MCH6660/D
1
December 2014 - Rev. 2
MCH6660
at Ta=25°C
Electrical Characteristics
Value
typ
Parameter
Symbol
Conditions
Unit
V
min
max
[N-channel]
Drain-to-Source Breakdown Voltage
Zero-Gate Voltage Drain Current
Gate-to-Source Leakage Current
Gate Threshold Voltage
V
I
I
=1mA, V =0V
20
(BR)DSS
D
GS
V
V
V
V
I
=20V, V =0V
GS
1
A
A
μ
DSS
GSS
DS
GS
DS
DS
I
=±8V, V =0V
DS
±10
1.3
μ
V
g
(th)
=10V, I =1mA
0.4
V
GS
D
Forward Transconductance
=10V, I =1A
1.9
S
FS
D
R
(on)1
DS
(on)2
DS
(on)3
DS
=1A, V =4.5V
GS
105
147
212
128
28
136
205
318
m
Ω
Ω
Ω
D
Static Drain-to-Source On-State Resistance
R
R
I
D
I
D
=0.5A, V =2.5V
GS
m
m
=0.3A, V =1.8V
GS
Input Capacitance
Ciss
pF
Output Capacitance
Coss
Crss
V
=10V, f=1MHz
DS
pF
pF
ns
ns
ns
ns
nC
nC
nC
V
Reverse Transfer Capacitance
Turn-ON Delay Time
21
t (on)
d
5.1
Rise Time
t
11
r
See specified Test Circuit.
Turn-OFF Delay Time
Fall Time
t (off)
d
14.5
12
t
f
Total Gate Charge
Qg
1.8
Gate-to-Source Charge
Gate-to-Drain “Miller” Charge
Forward Diode Voltage
[P-channel]
Qgs
Qgd
V
=10V, V =4.5V, I =2A
DS GS
0.3
D
0.55
0.85
V
I =2A, V =0V
1.2
SD
S
GS
Drain-to-Source Breakdown Voltage
Zero-Gate Voltage Drain Current
Gate-to-Source Leakage Current
Gate Threshold Voltage
Forward Transconductance
V
I
I
=-- 1mA, V =0V
GS
--20
V
(BR)DSS
D
V
V
V
V
I
=-- 20V, V =0V
--1
±10
--1.4
A
A
μ
DSS
GSS
DS
GS
I
=±8V, V =0V
DS
μ
GS
DS
DS
V
g
(th)
=-- 10V, I =-- 1mA
--0.4
V
GS
D
=-- 10V, I =-- 750mA
1.9
205
295
430
120
26
S
FS
D
R
(on)1
DS
(on)2
DS
(on)3
DS
=-- 750mA, V =-- 4.5V
GS
266
413
645
m
Ω
Ω
Ω
D
Static Drain-to-Source On-State Resistance
R
R
I
I
=-- 300mA, V =-- 2.5V
GS
m
m
D
D
=-- 100mA, V =-- 1.8V
GS
Input Capacitance
Ciss
pF
Output Capacitance
Reverse Transfer Capacitance
Turn-ON Delay Time
Rise Time
Coss
Crss
V
=--10V, f=1MHz
DS
pF
pF
ns
ns
ns
ns
nC
nC
nC
V
20
t (on)
d
5.3
t
9.7
r
See specified Test Circuit.
Turn-OFF Delay Time
Fall Time
t (off)
d
16
t
14
f
Total Gate Charge
Qg
1.7
Gate-to-Source Charge
Gate-to-Drain “Miller” Charge
Forward Diode Voltage
Qgs
Qgd
V
=-- 10V, V =-- 4.5V, I =--1.5A
DS GS
0.28
0.47
--0.89
D
V
I =--1.5A, V =0V
GS
--1.2
SD
S
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be
indicated by the Electrical Characteristics if operated under different conditions.
Thermal Resistance Ratings
Parameter
Symbol
Value
156.3
Unit
C/W
Junction to Ambient
R
°
JA
θ
When mounted on ceramic substrate (900mm2 0.8mm) 1unit
×
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2
MCH6660
Switching Time Test Circuit
[N-channel]
[P-channel]
V
=10V
V
= --10V
DD
V
V
IN
DD
IN
4.5V
0V
0V
--4.5V
I
=1A
I = --750mA
D
R =13.3Ω
L
D
V
V
IN
IN
R =10Ω
L
D
V
D
V
OUT
OUT
PW=10μs
D.C.≤1%
PW=10μs
D.C.≤1%
G
G
MCH6660
MCH6660
P. G
P. G
50Ω
50Ω
S
S
[Nch]
[Nch]
I
-- V
I
-- V
D GS
D
DS
2.0
1.5
1.0
2.5
2.0
1.5
1.0
V
=10V
Ta=25°C
DS
1.5V
0.5
0
0.5
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Drain-to-Source Voltage, V
-- V
IT16372
[Nch]
Gate-to-Source Voltage, V
GS
-- V
IT16373
DS
R
(on) -- V
R
(on) -- Ta
DS
[Nch]
DS
GS
400
350
300
250
200
150
100
400
350
300
250
200
150
100
Ta=25°C
I =0.3A
D
0.5A
1A
50
0
50
0
0
1
2
3
4
5
6
7
8
9
10
--60 --40 --20
0
20
40
60
80 100 120 140 160
IT16646
Gate-to-Source Voltage, V
-- V
IT16645
Ambient Temperature, Ta -- °C
GS
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3
MCH6660
[Nch]
=10V
[Nch]
=0V
g
-- I
I
-- V
SD
FS
D
S
10
10
7
V
V
GS
DS
5
7
3
2
5
1.0
3
2
7
5
3
2
1.0
0.1
7
5
7
5
3
2
0.01
3
2
7
5
3
2
0.1
0.01
0.001
0
0.2
0.4
0.6
0.8
1.0
1.2
2
3
5
7
2
3
5
7
2
3
5 7
10
0.1
1.0
Drain Current, I -- A
SW Time -- I
D
Forward Diode Voltage, V -- V
SD
IT16376
[Nch]
=10V
IT16377
D
Ciss, Coss, Crss -- V
[Nch]
DS
1000
1000
V
V
f=1MHz
DD
7
5
7
=4.5V
GS
5
3
2
3
2
100
7
5
100
3
2
7
5
10
t (on)
d
7
5
3
2
3
2
1.0
0.01
10
0
2
4
6
8
10
12
14
16
18
20
2
3
5
7
2
3
5
7
2
3
5 7
10
0.1
1.0
Drain Current, I -- A
IT16379
[Nch]
IT16644
Drain-to-Source Voltage, V
-- V
D
DS
V
-- Qg
S O A
[Nch]
GS
10
4.5
V
=10V
=2A
7
5
DS
I
=8A (PW≤10μs)
DP
I
4.0
3.5
D
3
2
I =2A
D
1.0
7
5
3.0
2.5
2.0
1.5
1.0
3
2
Operation in this
area is limited by R (on).
DS
0.1
7
5
3
2
Ta=25°C
0.5
0
Single pulse
When mounted on ceramic substrate (900mm2×0.8mm) 1unit
0.01
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2
3
5
7
2
3
5
7
2
3
5 7
100
1.0
10
Total Gate Charge, Qg -- nC
IT16380
Drain-to-Source Voltage, V -- V
DS
IT16647
I
-- V
[Pch]
I
-- V
[Pch]
D
DS
D
GS
--2.0
--1.8
--1.6
--1.4
--1.2
--1.0
--0.8
--0.6
--0.4
--2.0
--1.8
--1.6
--1.4
--1.2
--1.0
--0.8
--0.6
--0.4
V
DS
= --10V
--0.2
0
--0.2
0
0
--0.1 --0.2 --0.3 --0.4 --0.5 --0.6 --0.7 --0.8 --0.9 --1.0
IT14614
0
--0.5
--1.0
--1.5
--2.0
--2.5
--3.0
IT14615
Drain-to-Source Voltage, V
DS
-- V
Gate-to-Source Voltage, V -- V
GS
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4
MCH6660
R
(on) -- V
[Pch]
R
(on) -- Ta
DS
[Pch]
DS
GS
700
600
500
400
300
200
700
600
500
400
300
200
Ta=25°C
I = --0.1A
D
--0.3A
--0.75A
100
0
100
0
--60 --40 --20
0
20
40
60
80 100 120 140 160
0
--1
--2
--3
--4
--5
--6
--7
--8
--9
--10
Gate-to-Source Voltage, V
GS
-- V
IT16648
Ambient Temperature, Ta -- °C
IT16649
[Pch]
I
-- V
[Pch]
g
-- I
FS
D
S
SD
5
5
V
= --10V
V
=0V
DS
GS
3
2
3
2
--1.0
7
5
1.0
3
2
7
5
--0.1
3
2
7
5
3
2
0.1
7
--0.01
--0.01
2
3
5
7
2
3
5
7
--1.0
2
3
0
--0.2
--0.4
--0.6
--0.8
--1.0
--1.2
--0.1
Drain Current, I -- A
HD14618
Forward Diode Voltage, V -- V
SD
HD14619
D
SW Time -- I
D
Ciss, Coss, Crss -- V
[Pch]
[Pch]
DS
3
2
5
V
= --10V
= --4.5V
f=1MHz
DD
V
GS
3
2
100
t
7
5
f
10
7
5
3
2
t (on)
d
3
2
10
7
2
3
5
7
2
3
0
--2
--4
--6
--8
--10 --12 --14 --16 --18 --20
--0.1
--1.0
Drain Current, I -- A
HD141104
[Pch]
Drain-to-Source Voltage, V
-- V
IT14621
D
DS
V
-- Qg
S O A
[Pch]
GS
--4.5
--10
7
5
I
= --6A (PW≤10μs)
V
= --10V
= --1.5A
DP
DS
I
--4.0
--3.5
--3.0
--2.5
--2.0
--1.5
--1.0
D
3
2
I
= --1.5A
D
--1.0
7
5
3
2
Operation in
this area is
limited by R (on).
--0.1
DS
7
5
3
2
Ta=25°C
--0.5
0
Single pulse
When mounted on ceramic substrate (900mm2×0.8mm) 1unit
--0.01
--0.1
2
3
5
7
2
3
5
7
2
3
5 7
--100
HD16650
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
--1.0
--10
Total Gate Charge, Qg -- nC
Drain-to-Source Voltage, V -- V
DS
IT14622
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5
MCH6660
P
-- Ta
[Nch/Pch]
D
1.0
0.8
0.6
0.4
When mounted on ceramic substrate
(900mm2×0.8mm) 1unit
0.2
0
0
20
40
60
80
100
120
140
160
Ambient Temperature, Ta -- °C
HD16651
[Nch]
R
-- Pulse Time
θJA
1000
7
5
3
2
Duty Cycle=0.5
100
7
5
0.2
3
2
0.1
0.05
10
7
5
0.02
0.01
3
2
1.0
7
5
3
2
When mounted on ceramic substrate
(900mm2×0.8mm)1unit
0.1
2
3
5
7
2
3
5
7
2
3
5
7
2
3
5
7
2
3
5
7
2
3
5
7
2
3
5 7
10
0.000001
0.0001
0.001
0.01
0.1
1.0
0.00001
Pulse Time, PT -- s
HD141121
[Pch]
R
-- Pulse Time
θJA
1000
7
5
3
2
Duty Cycle=0.5
100
7
5
0.2
3
2
0.1
0.05
10
7
5
0.02
0.01
3
2
1.0
7
5
3
2
When mounted on ceramic substrate
(900mm2×0.8mm)1unit
0.1
2
3
5
7
2
3
5
7
2
3
5
7
2
3
5
7
2
3
5
7
2
3
5
7
2
3
5 7
10
HD141121
0.000001
0.0001
0.001
0.01
0.1
1.0
0.00001
Pulse Time, PT -- s
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6
MCH6660
Paclage Dimensions
unit : mm
MCH6660-TL-H, MCH6660-TL-W
SC-88FL / MCPH6
CASE 419AS
ISSUE O
Recommended Soldering
Footprint
0.4
0.65 0.65
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7
MCH6660
ORDERING INFORMATION
Device
MCH6660-TL-H
MCH6660-TL-W
Package
MCPH6
Shipping
3,000pcs./reel
memo
Pb-Free and Halogen Free
Note on usage : Since the MCH6660 is a MOSFET product, please avoid using this device in the vicinity of
highly charged objects.
ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States
and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of
SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf . SCILLC reserves the right to make changes without
further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose,
nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do
vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not
designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or
sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers,
employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was
negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
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8
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