MCR72-003 [ONSEMI]

Sensitive Gate Silicon Controlled Rectifier - SCR, TO-220 3 LEAD STANDARD, 500-BLKBX;
MCR72-003
型号: MCR72-003
厂家: ONSEMI    ONSEMI
描述:

Sensitive Gate Silicon Controlled Rectifier - SCR, TO-220 3 LEAD STANDARD, 500-BLKBX

文件: 总6页 (文件大小:60K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MCR72−3, MCR72−6,  
MCR72−8  
Preferred Device  
Sensitive Gate Silicon  
Controlled Rectifiers  
Reverse Blocking Thyristors  
Designed for industrial and consumer applications such as  
temperature, light and speed control; process and remote controls;  
warning systems; capacitive discharge circuits and MPU interface.  
http://onsemi.com  
SCRs  
Features  
8 AMPERES RMS  
100 thru 600 VOLTS  
Center Gate Geometry for Uniform Current Density  
All Diffused and Glass-Passivated Junctions for Parameter  
Uniformity and Stability  
Small, Rugged Thermowatt Construction for Low Thermal  
Resistance, High Heat Dissipation and Durability  
Low Trigger Currents, 200 mA Maximum for Direct Driving from  
Integrated Circuits  
G
A
K
Pb−Free Packages are Available*  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
Unit  
Peak Repetitive Off−State Voltage (Note 1)  
V
V
V
DRM,  
RRM  
(T = *40 to 110°C, Sine Wave,  
J
TO−220AB  
CASE 221A−07  
STYLE 3  
50 to 60 Hz, Gate Open)  
MCR72−3  
MCR72−6  
MCR72−8  
100  
400  
600  
1
2
3
On-State RMS Current  
(180° Conduction Angles; T = 83°C)  
I
8.0  
A
A
T(RMS)  
C
Peak Non-Repetitive Surge Current  
I
100  
TSM  
(1/2 Cycle, 60 Hz, T = 110°C)  
J
2
2
Circuit Fusing Considerations (t = 8.3 ms)  
I t  
40  
A s  
Forward Peak Gate Voltage  
V
"5.0  
V
A
GM  
TO−220AB  
CASE 221A−09  
STYLE 3  
(t 10 ms, T = 83°C)  
C
Forward Peak Gate Current  
I
1.0  
5.0  
GM  
(t 10 ms, T = 83°C)  
C
1
2
3
Forward Peak Gate Power  
P
W
GM  
(t 10 ms, T = 83°C)  
C
Average Gate Power (t = 8.3 ms, T = 83°C)  
P
0.75  
−40 to +110  
−40 to +150  
8.0  
W
°C  
C
G(AV)  
PIN ASSIGNMENT  
Operating Junction Temperature Range  
Storage Temperature Range  
Mounting Torque  
T
J
1
Cathode  
Anode  
Gate  
T
°C  
stg  
2
3
4
in. lb.  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
Anode  
1. V  
and V  
for all types can be applied on a continuous basis. Ratings  
DRM  
RRM  
MARKING AND ORDERING INFORMATION  
See detailed marking, ordering, and shipping information in  
the package dimensions section on page 4 of this data sheet.  
apply for zero or negative gate voltage; however, positive gate voltage shall  
not be applied concurrent with negative potential on the anode. Blocking  
voltages shall not be tested with a constant current source such that the  
voltage ratings of the devices are exceeded.  
Preferred devices are recommended choices for future use  
and best overall value.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 20005  
1
Publication Order Number:  
December, 2005 − Rev. 3  
MCR72/D  
 
MCR72−3, MCR72−6, MCR72−8  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
2.2  
60  
Unit  
°C/W  
°C/W  
°C  
Thermal Resistance, Junction−to−Case  
R
q
JC  
JA  
L
Thermal Resistance, Junction−to−Ambient  
R
q
Maximum Lead Temperature for Soldering Purposes 1/8from Case for 10 Secs  
T
260  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted.)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Peak Repetitive Forward or Reverse Blocking Current (Note 2)  
I
, I  
DRM RRM  
(V = Rated V  
or V  
; R = 1 kW)  
T = 25°C  
T = 110°C  
J
10  
500  
mA  
mA  
AK  
DRM  
RRM  
GK  
J
High Logic Level Supply Current from V  
ON CHARACTERISTICS  
I
4
4
mA  
mA  
CC  
CCH  
Peak Forward On-State Voltage  
(I = 16 A Peak, Pulse Width p1 ms, Duty Cycle p2%)  
TM  
V
1.7  
30  
0.5  
2.0  
200  
1.5  
V
mA  
V
TM  
Gate Trigger Current (Continuous dc) (Note 3)  
I
GT  
(V = 12 V, R = 100 W)  
D
L
Gate Trigger Voltage (Continuous dc) (Note 3)  
(V = 12 V, R = 100 W)  
V
GT  
D
L
Gate Non−Trigger Voltage  
V
0.1  
V
GD  
(V = 12 Vdc, R = 100 W, T = 110°C)  
D
L
J
Holding Current  
(V = 12 V, Initiating Current = 200 mA, Gate Open)  
D
I
6.0  
mA  
ms  
H
Gate Controlled Turn-On Time  
t
1.0  
gt  
(V = Rated V  
, I = 16 A, I = 2 mA)  
DRM TM G  
D
DYNAMIC CHARACTERISTICS  
Critical Rate-of-Rise of Off-State Voltage  
(V = Rated V , R = 1 kW, T = 110°C, Exponential Waveform)  
dv/dt  
10  
V/ms  
D
DRM  
GK  
J
2. Ratings apply for negative gate voltage or R = 1 kW. Devices shall not haveapositive gate voltage concurrently withanegative voltage  
GK  
on the anode. Devices should not be tested with a constant current source for forward and reverse blocking capability such that the  
voltage applied exceeds the rated blocking voltage.  
3. R current not included in measurement.  
GK  
http://onsemi.com  
2
 
MCR72−3, MCR72−6, MCR72−8  
Voltage Current Characteristic of SCR  
+ Current  
Anode +  
V
Symbol  
Parameter  
TM  
V
Peak Repetitive Off State Forward Voltage  
Peak Forward Blocking Current  
Peak Repetitive Off State Reverse Voltage  
Peak Reverse Blocking Current  
Peak On State Voltage  
DRM  
DRM  
on state  
I
I
H
I
at V  
RRM  
RRM  
V
RRM  
I
RRM  
V
TM  
+ Voltage  
I
Holding Current  
H
I
at V  
DRM  
Reverse Blocking Region  
(off state)  
DRM  
Forward Blocking Region  
(off state)  
Reverse Avalanche Region  
Anode −  
110  
100  
90  
16  
dc  
12  
α
α
180°  
α = Conduction Angle  
α = Conduction Angle  
α = 30°  
90°  
8.0  
60°  
90°  
60°  
α = 30°  
180°  
80  
70  
4.0  
0
dc  
0
2.0  
4.0  
6.0  
8.0  
0
2.0  
4.0  
6.0  
8.0  
I
, AVERAGE ON-STATE CURRENT (AMP)  
I
T(AV)  
, AVERAGE ON-STATE CURRENT (AMP)  
T(AV)  
Figure 1. Average Current Derating  
Figure 2. On−State Power Dissipation  
3.0  
2.0  
0.7  
V
= 12 Vdc  
D
0.6  
0.5  
V
= 12 Vdc  
D
1.0  
0.4  
0.3  
0.2  
0.1  
0.5  
0.3  
−40 −20  
0
20  
40  
60  
80  
90  
100 120 140  
−60 −40 −20  
0
20  
40  
60  
80  
100 120  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 3. Normalized Gate Current  
Figure 4. Gate Voltage  
http://onsemi.com  
3
MCR72−3, MCR72−6, MCR72−8  
MARKING DIAGRAMS  
TO−220AB  
TO−220AB  
CASE 221A−07  
CASE 221A−09  
AY WW  
MCR72−xG  
AKA  
AY WW  
MCR72−6TG  
AKA  
A
= Assembly Location  
A
= Assembly Location  
Y
= Year  
Y
= Year  
WW  
= Work Week  
WW  
= Work Week  
MCR72−x = Device Code  
x = 3, 6, 8, or 8T  
MCR72−6T = Device Code  
G
= Pb−Free Package  
= Diode Polarity  
G
= Pb−Free Package  
= Diode Polarity  
AKA  
AKA  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MCR72−3  
TO−220AB  
MCR72−3G  
TO−220AB  
(Pb−Free)  
500 Units / Box  
MCR72−6  
TO−220AB  
MCR72−6G  
TO−220AB  
(Pb−Free)  
MCR72−6T  
TO−220AB  
50 Units / Rail  
500 Units / Box  
50 Units / Rail  
TO−220AB  
(Pb−Free)  
MCR72−6TG  
MCR72−8  
TO−220AB  
MCR72−8G  
TO−220AB  
(Pb−Free)  
MCR72−8T  
TO−220AB  
TO−220AB  
(Pb−Free)  
MCR72−8TG  
http://onsemi.com  
4
MCR72−3, MCR72−6, MCR72−8  
PACKAGE DIMENSIONS  
TO−220AB  
CASE 221A−07  
ISSUE AA  
NOTES:  
SEATING  
PLANE  
−T−  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION Z DEFINES A ZONE WHERE ALL  
BODY AND LEAD IRREGULARITIES ARE  
ALLOWED.  
B
F
C
T
S
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
14.48  
9.66  
4.07  
0.64  
3.61  
2.42  
2.80  
0.36  
12.70  
1.15  
4.83  
2.54  
2.04  
1.15  
5.97  
0.00  
1.15  
−−−  
MAX  
15.75  
10.28  
4.82  
0.88  
3.73  
2.66  
3.93  
0.55  
14.27  
1.52  
5.33  
3.04  
2.79  
1.39  
6.47  
1.27  
−−−  
4
3
A
B
C
D
F
0.570  
0.380  
0.160  
0.025  
0.142  
0.095  
0.110  
0.014  
0.500  
0.045  
0.190  
0.100  
0.080  
0.045  
0.235  
0.000  
0.045  
0.620  
0.405  
0.190  
0.035  
0.147  
0.105  
0.155  
0.022  
0.562  
0.060  
0.210  
0.120  
0.110  
0.055  
0.255  
0.050  
−−−  
Q
A
K
1
2
U
H
G
H
J
Z
K
L
N
Q
R
S
T
R
L
V
J
G
U
V
Z
D
N
−−− 0.080  
2.04  
STYLE 3:  
PIN 1. CATHODE  
2. ANODE  
3. GATE  
4. ANODE  
TO−220AB  
CASE 221A−09  
ISSUE AA  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
SEATING  
PLANE  
−T−  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION Z DEFINES A ZONE WHERE ALL  
BODY AND LEAD IRREGULARITIES ARE  
ALLOWED.  
C
B
F
T
S
4
1
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
14.48  
9.66  
4.07  
0.64  
3.61  
2.42  
2.80  
0.46  
12.70  
1.15  
4.83  
2.54  
2.04  
1.15  
5.97  
0.00  
1.15  
−−−  
MAX  
15.75  
10.28  
4.82  
0.88  
3.73  
2.66  
3.93  
0.64  
14.27  
1.52  
5.33  
3.04  
2.79  
1.39  
6.47  
1.27  
−−−  
A
Q
Z
A
B
C
D
F
0.570  
0.380  
0.160  
0.025  
0.142  
0.095  
0.110  
0.018  
0.500  
0.045  
0.190  
0.100  
0.080  
0.045  
0.235  
0.000  
0.045  
0.620  
0.405  
0.190  
0.035  
0.147  
0.105  
0.155  
0.025  
0.562  
0.060  
0.210  
0.120  
0.110  
0.055  
0.255  
0.050  
−−−  
2
3
U
H
K
G
H
J
K
L
L
R
N
Q
R
S
T
V
J
G
D
U
V
Z
N
−−− 0.080  
2.04  
STYLE 3:  
PIN 1. CATHODE  
2. ANODE  
3. GATE  
4. ANODE  
http://onsemi.com  
5
MCR72−3, MCR72−6, MCR72−8  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
MCR72/D  

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