MCT5210M [ONSEMI]

6 引脚 DIP 低输入电流光电晶体管输出光耦合器;
MCT5210M
型号: MCT5210M
厂家: ONSEMI    ONSEMI
描述:

6 引脚 DIP 低输入电流光电晶体管输出光耦合器

输出元件 晶体管 光电晶体管
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April 2015  
MCT5210M, MCT5211M  
6-Pin DIP Low Input Current Phototransistor Optocouplers  
Features  
Description  
High CTR  
Comparable to Darlingtons  
The MCT5210M and MCT5211M devices consist of a  
high-efficiency AlGaAs infrared emitting diode coupled  
with an NPN phototransistor in a six-pin dual-in-line  
package.  
CE(SAT)  
High Common Mode Transient Rejection: 5 kV/µs  
Data Rates Up to 150 kbits/s (NRZ)  
Safety and Regulatory Approvals:  
The devices are well suited for CMOS to LSTT/TTL inter-  
– UL1577, 4,170 VAC  
for 1 Minute  
RMS  
faces, offering 250% CTR  
with 1 mA of LED input  
CE(SAT)  
– DIN-EN/IEC60747-5-5, 850 V Peak Working  
Insulation Voltage  
current. With an LED input current of 1.6 mA, data rates  
to 20K bits/s are possible.  
Applications  
Both can easily interface LSTTL to LSTTL/TTL, and with  
use of an external base-to-emitter resistor data rates of  
100K bits/s can be achieved.  
CMOS to CMOS/LSTTL Logic Isolation  
LSTTL to CMOS/LSTTL Logic Isolation  
RS-232 Line Receiver  
Telephone Ring Detector  
AC Line Voltage Sensing  
Switching Power Supply  
Schematic  
Package Outlines  
1
2
6
BASE  
ANODE  
CATHODE  
5 COLLECTOR  
4 EMITTER  
3
Figure 2. Package Outlines  
Figure 1. Schematic  
©1983 Fairchild Semiconductor Corporation  
MCT5210M, MCT5211M Rev. 1.3  
www.fairchildsemi.com  
Safety and Insulation Ratings  
As per DIN EN/IEC 60747-5-5, this optocoupler is suitable for “safe electrical insulation” only within the safety limit  
data. Compliance with the safety ratings shall be ensured by means of protective circuits.  
Parameter  
Characteristics  
< 150 V  
< 300 V  
I–IV  
I–IV  
Installation Classifications per DIN VDE  
0110/1.89 Table 1, For Rated Mains Voltage  
RMS  
RMS  
Climatic Classification  
55/100/21  
2
Pollution Degree (DIN VDE 0110/1.89)  
Comparative Tracking Index  
175  
Symbol  
Parameter  
Value  
Unit  
Input-to-Output Test Voltage, Method A, V  
x 1.6 = V  
,
IORM  
PR  
1360  
V
V
peak  
peak  
Type and Sample Test with t = 10 s, Partial Discharge < 5 pC  
m
V
PR  
Input-to-Output Test Voltage, Method B, V  
x 1.875 = V  
,
IORM  
PR  
1594  
100% Production Test with t = 1 s, Partial Discharge < 5 pC  
m
V
Maximum Working Insulation Voltage  
Highest Allowable Over-Voltage  
850  
6000  
7  
V
V
IORM  
peak  
V
IOTM  
peak  
External Creepage  
mm  
mm  
mm  
mm  
°C  
External Clearance  
7  
External Clearance (for Option TV, 0.4" Lead Spacing)  
Distance Through Insulation (Insulation Thickness)  
10  
0.5  
175  
350  
800  
DTI  
(1)  
T
Case Temperature  
S
(1)  
I
Input Current  
mA  
mW  
Ω
S,INPUT  
(1)  
P
Output Power  
S,OUTPUT  
(1)  
9
R
Insulation Resistance at T , V = 500 V  
> 10  
IO  
S
IO  
Note:  
1. Safety limit values – maximum values allowed in the event of a failure.  
©1983 Fairchild Semiconductor Corporation  
MCT5210M, MCT5211M Rev. 1.3  
www.fairchildsemi.com  
2
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
Parameters  
Value  
Unit  
TOTAL DEVICE  
T
Storage Temperature  
Operating Temperature  
Junction Temperature  
Lead Solder Temperature  
-40 to +125  
-40 to +100  
-40 to +125  
260 for 10 seconds  
225  
°C  
°C  
STG  
T
OPR  
T
ºC  
J
T
°C  
SOL  
Total Device Power Dissipation @ 25°C (LED plus detector)  
Derate Linearly From 25°C  
mW  
mW/°C  
P
D
3.5  
EMITTER  
I
Continuous Forward Current  
Reverse Input Voltage  
50  
6
mA  
V
F
V
R
I (pk)  
Forward Current – Peak (1 µs pulse, 300 pps)  
LED Power Dissipation @ 25°C  
Derate Linearly From 25°C  
3.0  
75  
1.0  
A
F
mW  
mW/°C  
P
D
DETECTOR  
I
Continuous Collector Current  
Detector Power Dissipation @ 25°C  
Derate Linearly From 25°C  
150  
150  
2.0  
mA  
mW  
C
P
D
mW/°C  
©1983 Fairchild Semiconductor Corporation  
MCT5210M, MCT5211M Rev. 1.3  
www.fairchildsemi.com  
3
Electrical Characteristics  
T = 25°C unless otherwise specified.  
A
Individual Component Characteristics  
Symbol  
EMITTER  
Parameters  
Test Conditions  
Min.  
Typ. Max. Unit  
V
Input Forward Voltage  
I = 5 mA  
1.25  
1.50  
V
F
F
ΔV  
Forward Voltage Temperature  
Coefficient  
F
I = 2 mA  
-1.75  
mV/°C  
F
ΔT  
A
V
Reverse Voltage  
I = 10 µA  
6
V
R
R
C
Junction Capacitance  
V = 0 V, f = 1.0 MHz  
18  
pF  
J
F
DETECTOR  
Breakdown Voltage,  
Collector-to-Emitter  
BV  
BV  
I = 1.0 mA, I = 0  
30  
30  
5
100  
120  
10  
V
V
V
CEO  
CBO  
EBO  
C
F
Breakdown Voltage,  
Collector-to-Base  
I = 10 µA, I = 0  
C
F
Breakdown Voltage,  
Emitter-to-Base  
BV  
I
I = 10 µA, I = 0  
E
F
Dark Current, Collector-to-Emitter  
Capacitance, Collector-to-Emitter  
Capacitance, Collector-to-Base  
Capacitance, Emitter-to-Base  
V
= 10 V, I = 0, R = 1 MΩ  
1
100  
nA  
pF  
pF  
pF  
CER  
CE  
CE  
CB  
EB  
F
BE  
C
C
C
V
V
V
= 0, f = 1 MHz  
10  
80  
15  
CE  
CB  
EB  
= 0, f = 1 MHz  
= 0, f = 1 MHz  
©1983 Fairchild Semiconductor Corporation  
MCT5210M, MCT5211M Rev. 1.3  
www.fairchildsemi.com  
4
Electrical Characteristics (Continued)  
T = 25°C unless otherwise specified.  
A
Transfer Characteristics  
Symbol  
Characteristics  
Test Conditions  
Device  
Min. Typ. Max. Unit  
DC CHARACTERISTICS  
I = 3.0 mA, V = 0.4 V  
MCT5210M 60  
%
%
%
%
%
%
%
%
%
V
F
CE  
Saturated Current  
Transfer Ratio  
Collector-to-Emitter  
CTR  
I = 1.6 mA, V = 0.4 V  
100  
MCT5211M  
75  
CE(SAT)  
F
CE  
(2)  
I = 1.0 mA, V = 0.4 V  
F
CE  
I = 3.0 mA, V = 5.0 V  
MCT5210M 70  
F
CE  
Current Transfer Ratio  
Collector-to-Emitter  
CTR  
I = 1.6 mA, V = 5.0 V  
150  
MCT5211M  
110  
(CE)  
(2)  
F
CE  
I = 1.0 mA, V = 5.0 V  
F
CE  
I = 3.0 mA, V = 4.3 V  
MCT5210M 0.2  
F
CE  
Current Transfer Ratio  
CTR  
I = 1.6 mA, V = 4.3 V  
0.3  
MCT5211M  
0.25  
(CB)  
(3)  
F
CE  
Collector-to-Base  
I = 1.0 mA, V = 4.3 V  
F
CE  
I = 3.0 mA, I = 1.8 mA  
MCT5210M  
MCT5211M  
0.4  
0.4  
F
CE  
V
Saturation Voltage  
CE(SAT)  
I = 1.6 mA, I = 1.6 mA  
V
F
CE  
AC CHARACTERISTICS  
R = 330 Ω, R = ∞  
10  
7
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
I = 3.0 mA,  
L
BE  
F
MCT5210M  
MCT5211M  
MCT5210M  
MCT5211M  
V
= 5.0 V  
R = 3.3 kΩ, R = 39 kΩ  
CC  
L
BE  
R = 750 Ω, R = ∞  
14  
15  
17  
24  
0.4  
8
Propagation Delay  
HIGH-to-LOW  
I = 1.6 mA,  
F
L
BE  
T
(4)  
PHL  
V
= 5.0 V  
R = 4.7 kΩ, R = 91 kΩ  
CC  
L
BE  
R = 1.5 kΩ, R = ∞  
I = 1.0 mA,  
L
BE  
F
V
= 5.0 V  
R = 10 kΩ, R = 160 kΩ  
CC  
L
BE  
R = 330 Ω, R = ∞  
I = 3.0 mA,  
L
BE  
F
V
= 5.0 V  
R = 3.3 kΩ, R = 39 kΩ  
CC  
L
BE  
R = 750 Ω, R = ∞  
2.5  
11  
7
Propagation Delay  
LOW-to-HIGH  
I = 1.6 mA,  
F
L
BE  
T
(5)  
PLH  
V
= 5.0 V  
R = 4.7 kΩ, R = 91 kΩ  
CC  
L
BE  
R = 1.5 kΩ, R = ∞  
I = 1.0 mA,  
L
BE  
F
V
= 5.0 V  
R = 10 kΩ, R = 160 kΩ  
16  
CC  
L
BE  
Notes:  
2. DC Current Transfer Ratio (CTR ) is defined as the transistor collector current (I ) divided by the input LED  
CE  
CE  
current (I ) x 100%, at a specified voltage between the collector and emitter (V ).  
F
CE  
3. The collector base Current Transfer Ratio (CTR ) is defined as the transistor collector base photocurrent (I  
)
CB  
CB  
divided by the input LED current (I ) time 100%.  
F
4. Referring to Figure 16 the T  
propagation delay is measured from the 50% point of the rising edge of the data input  
PHL  
pulse to the 1.3 V point on the falling edge of the output pulse.  
5. Referring to Figure 16 the T propagation delay is measured from the 50% point of the falling edge of data input  
PLH  
pulse to the 1.3 V point on the rising edge of the output pulse.  
©1983 Fairchild Semiconductor Corporation  
MCT5210M, MCT5211M Rev. 1.3  
www.fairchildsemi.com  
5
Electrical Characteristics (Continued)  
T = 25°C unless otherwise specified.  
A
Isolation Characteristics  
Symbol  
Characteristic  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Input-Output Isolation  
Voltage  
V
t = 1 Minute  
4170  
VAC  
RMS  
(6)  
ISO  
(6)  
11  
R
Isolation Resistance  
Isolation Capacitance  
V
V
=
500 VDC, T = 25°C  
10  
Ω
ISO  
I-O  
I-O  
A
(7)  
C
= 0 V, f = 1 MHz  
0.4  
0.6  
pF  
ISO  
Common Mode Transient  
Rejection – Output HIGH  
CM  
V
V
= 50 V , R = 750 Ω, I = 0  
5000  
V/µs  
V/µs  
H
CM  
CM  
P-P  
L
F
Common Mode Transient  
Rejection – Output LOW  
CM  
= 50 V , R = 750 Ω, I =1.6 mA  
5000  
L
P-P  
L
F
Notes:  
6. Device considered a two terminal device: pins 1, 2, and 3 shorted together and pins 5, 6 and 7 are shorted together.  
7. C is the capacitance between the input (pins 1, 2, 3 connected) and the output (pin 4, 5, 6 connected).  
ISO  
©1983 Fairchild Semiconductor Corporation  
MCT5210M, MCT5211M Rev. 1.3  
www.fairchildsemi.com  
6
Typical Performance Curves  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
2.0  
1.8  
1.6  
1.4  
T
= -40°C  
= 25°C  
A
1.2  
1.0  
0.8  
T
A
Normalized to:  
I
V
T
= 5 mA  
= 5 V  
F
CE  
T
= 100°C  
A
= 25°C  
A
0.1  
1
10  
100  
0.1  
1
10  
I – FORWARD CURRENT (mA)  
F
I
– LED FORWARD CURRENT (mA)  
F
Figure 3. LED Forward Voltage  
vs. Forward Current  
Figure 4. Normalized Current Transfer Ratio  
vs. Forward Current  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
10  
Normalized to:  
I
V
T
= 5 mA  
= 5 V  
F
CE  
I
= 10 mA  
F
1
0.1  
I
F
= 5 mA  
= 2 mA  
I
F
= 10 mA  
I
F
= 5 mA  
= 25°C  
A
I
= 2 mA  
= 1 mA  
F
I
F
I
I
F
F
I
= 0. 5mA  
F
0.01  
= 1 mA  
I
= 0.2 mA  
F
I
= 0.5 mA  
F
Normalized to:  
= 5 mA  
0.001  
0.0001  
I
V
T
F
I
= 0.2 mA  
F
= 5 V  
= 25°C  
CE  
A
-40  
-20  
100 120  
– AMBIENT TEMPERATURE (°C)  
-20  
0
20  
40  
60  
0.1  
1
10  
T
V
CE  
– COLLECTOR-EMITTER VOLTAGE (V)  
A
Figure 6. Normalized Collector  
vs. Collector-Emitter Voltage  
Figure 5. Normalized CTR vs.Temperature  
100  
10  
1
I
= 10 mA  
= 5 mA  
F
I
F
10  
1
I
F
= 2 mA  
0.1  
I
F
= 1 mA  
I
= 0.5 mA  
= 0.2 mA  
F
Normalized to:  
= 5 mA  
0.1  
0.01  
Normalized to:  
I
F
I
F
I
= 5 mA  
F
V
T
= 4.3 V  
= 25°C  
CB  
V
T
= 4.3 V  
= 25°C  
CB  
A
A
0.01  
0.001  
-60 -40  
-20  
0
20  
40  
60  
80 100  
0.1  
1
10  
100  
T
– AMBIENT TEMPERATURE (°C)  
I
F
– FORWARD CURRENT (mA)  
A
Figure 7. Normalized Collector Base Photocurrent  
Ratio vs. Forward Current  
Figure 8. Normalized Collector-Base Current  
vs.Temperature  
©1983 Fairchild Semiconductor Corporation  
MCT5210M, MCT5211M Rev. 1.3  
www.fairchildsemi.com  
7
Typical Performance Curves (Continued)  
30  
25  
20  
15  
10  
5
10000  
I
V
= 0 mA  
Refer to Figure 15 for switching time circuit  
I
= 10 mA  
= 5 V  
F
F
CC  
= 10 V  
V
R
R
CE  
= 1 kΩ  
= 330 kΩ  
L
1000  
100  
10  
BE  
t
f
t
PLH  
t
s
1
t
d
t
t
r
PHL  
0
-40  
0.1  
-20  
0
20  
T – AMBIENT TEMPERATURE (°C)  
A
40  
60  
80  
100 120  
0
10 20 30 40 50 60 70 80 90 100  
– AMBIENT TEMPERATURE (°C)  
T
A
Figure 9. Collector-Emitter Dark Current  
vs. Ambient Temperature  
Figure 10. Switching Time  
vs. Ambient Temperature  
30  
25  
20  
15  
10  
5
20  
16  
12  
8
I
V
R
R
= 10 mA  
I = 5 mA  
F
Refer to Figure 15 for switching time circuit  
F
Refer to Figure 15 for switching time circuit  
= 5 V  
V
= 5 V  
CC  
CC  
= 1 kΩ  
BE  
R
R
= 1 kΩ  
L
= 330 kΩ  
BE  
L
= 100 kΩ  
t
f
t
f
t
t
PLH  
PLH  
t
s
t
s
4
t
t
PHL  
r
t
r
t
d
t
t
d
PHL  
0
-40  
0
-40  
-20  
0
20  
40  
60  
80  
100  
120  
-20  
0
20  
T – AMBIENT TEMPERATURE (°C)  
A
40  
60  
80  
100 120  
T
A
– AMBIENT TEMPERATURE (°C)  
Figure 12. Switching Time  
vs. Ambient Temperature  
Figure 11. Switching Time  
vs. Ambient Temperature  
20  
16  
12  
8
100  
10  
1
I
V
R
R
= 5 mA  
F
Refer to Figure 15 for switching time circuit  
t
I
R
PLH  
= 5 V  
CC  
= 1.6 mA  
F
t
, I = 1 mA, R = 10 kΩ  
PLH  
F
L
= 1 kΩ  
BE  
L
= 4.7 kΩ  
L
= 100 kΩ  
t
I
R
PLH  
= 3 mA  
F
= 3.3 kΩ  
L
t
f
t
, I = 1 mA, R = 10 kΩ  
PHL  
F
L
t
PLH  
t
, I = 1.6 mA, R = 4.7 kΩ  
PHL  
F
L
t
s
t
, I = 3 mA, R = 3.3 kΩ  
PHL  
F
L
4
V
T
= 5 V  
CC  
t
r
t
PHL  
= 25°C  
A
t
d
0
-40  
10  
100  
1000  
10000  
-20  
0
20  
40  
60  
80  
100 120  
T
– AMBIENT TEMPERATURE (°C)  
R
BE  
– BASE-EMITTER RESISTANCE (kΩ)  
A
Figure 13. Switching Time vs.  
Ambient Temperature  
Figure 14. Switching Time vs.  
Base-Emitter Resistance  
©1983 Fairchild Semiconductor Corporation  
MCT5210M, MCT5211M Rev. 1.3  
www.fairchildsemi.com  
8
Switching Time Test Circuits and Waveforms  
T = 25°C unless otherwise specified.  
A
VCC = 5.0 V  
VCC = 5.0 V  
Pulse Gen  
ZO = 50Ω  
f = 10KHz  
10% D.F.  
Pulse Gen  
ZO = 50Ω  
f = 10KHz  
10% D.F.  
1K  
1K  
VO  
4.7K  
VO  
D2  
D3  
D4  
D1  
IF monitor  
IF monitor  
330K  
330K  
100 Ω  
100 Ω  
tr, tf, td, ts  
TEST CIRCUIT  
t
PHL, tPLH  
TEST CIRCUIT  
Figure 15. Switching Time Test Circuits  
INPUT  
(IF)  
50%  
0
td  
90%  
90%  
tPHL  
OUTPUT  
(VO)  
tPLH  
1.3 V  
1.3 V  
10%  
10%  
0
tr  
ts  
tf  
Figure 16. Switching Time Waveforms  
©1983 Fairchild Semiconductor Corporation  
MCT5210M, MCT5211M Rev. 1.3  
www.fairchildsemi.com  
9
Reflow Profile  
300  
260°C  
280  
260  
240  
220  
200  
180  
160  
140  
120  
100  
80  
> 245°C = 42 s  
Time above  
183°C = 90 s  
°C  
1.822°C/s Ramp-up rate  
60  
40  
33 s  
20  
0
0
60  
120  
180  
270  
360  
Time (s)  
Figure 17. Reflow Profile  
©1983 Fairchild Semiconductor Corporation  
MCT5210M, MCT5211M Rev. 1.3  
www.fairchildsemi.com  
10  
Ordering Information  
Part Number  
Package  
Packing Method  
MCT5210M  
DIP 6-Pin  
Tube (50 Units)  
MCT5210SM  
MCT5210SR2M  
MCT5210VM  
MCT5210SVM  
SMT 6-Pin (Lead Bend)  
SMT 6-Pin (Lead Bend)  
Tube (50 Units)  
Tape and Reel (1000 Units)  
Tube (50 Units)  
DIP 6-Pin, DIN EN/IEC60747-5-5 Option  
SMT 6-Pin (Lead Bend), DIN EN/IEC60747-5-5 Option  
Tube (50 Units)  
MCT5210SR2VM SMT 6-Pin (Lead Bend), DIN EN/IEC60747-5-5 Option  
Tape and Reel (1000 Units)  
Tube (50 Units)  
MCT5210TVM  
DIP 6-Pin, 0.4” Lead Spacing, DIN EN/IEC60747-5-5 Option  
Note:  
8. The product orderable part number system listed in this table also applies to the MCT5211M device.  
Marking Information  
1
2
MCT5210  
6
V X YY Q  
5
3
4
Figure 18. Top Mark  
Table 1. Top Mark Definitions  
1
2
3
4
5
6
Fairchild Logo  
Device Number  
DIN EN/IEC60747-5-5 Option (only appears on component ordered with this option)  
One-Digit Year Code, e.g., “5”  
Digit Work Week, Ranging from “01” to “53”  
Assembly Package Code  
©1983 Fairchild Semiconductor Corporation  
MCT5210M, MCT5211M Rev. 1.3  
www.fairchildsemi.com  
11  
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