MCT6 [ONSEMI]

8 引脚 DIP 双沟道光电晶体管输出光耦合器;
MCT6
型号: MCT6
厂家: ONSEMI    ONSEMI
描述:

8 引脚 DIP 双沟道光电晶体管输出光耦合器

输出元件 晶体管 光电晶体管
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August 2016  
MCT6, MCT61, MCT62  
8-Pin Dual Channel Phototransistor Optocouplers  
Features  
Description  
Two Isolated Channels Per Package  
Safety and Regulatory Approvals:  
– UL1577, 5,000 VACRMS for 1 Minute  
– DIN-EN/IEC60747-5-5, 890 V Peak Working  
Insulation Voltage  
The general purpose optocouplers, MCT6, MCT61, and  
MCT62, have two isolated channels in a standard plastic  
8-pin dual-in-line (DIP) package for density applications.  
Each channel consists of a gallium arsenide infrared  
emitting diode driving a NPN silicon planar  
phototransistor. For four channel applications, two  
packages fit into a standard 16-pin DIP socket.  
Applications  
AC line/digital logic – isolate high voltage transients  
Digital logic/digital logic – eliminate spurious grounds  
Digital logic/AC triac control – isolate high voltage  
transients  
Twisted pair line receiver – eliminate ground loop  
feedthrough  
Telephone/telegraph line receiver – isolate high  
voltage transients  
High frequency power supply feedback control –  
maintain floating grounds and transients  
Relay contact monitor – isolate floating grounds and  
transients  
Power supply monitor – isolate transients  
Functional Schematic  
Package Outlines  
ANODE  
EMITTER  
1
8
8
1
CATHODE  
CATHODE  
COLLECTOR  
COLLECTOR  
2
3
4
7
6
5
8
8
1
1
ANODE  
EMITTER  
Figure 2. Package Outlines  
Figure 1. Schematic  
©2006 Fairchild Semiconductor Corporation  
MCT6, MCT61, MCT62 Rev.1.6  
www.fairchildsemi.com  
Safety and Insulation Ratings  
As per DIN EN/IEC 60747-5-5, this optocoupler is suitable for “safe electrical insulation” only within the safety limit  
data. Compliance with the safety ratings shall be ensured by means of protective circuits.  
Parameter  
Installation Classifications per DIN VDE  
Characteristics  
< 150 VRMS  
< 300 VRMS  
I–IV  
I–IV  
0110/1.89 Table 1, For Rated Mains Voltage  
Climatic Classification  
55/115/21  
2
Pollution Degree (DIN VDE 0110/1.89)  
Comparative Tracking Index  
175  
Symbol  
Parameter  
Value  
Unit  
Input-to-Output Test Voltage, Method A, VIORM x 1.6 = VPR  
Type and Sample Test with tm = 10 s, Partial Discharge < 5 pC  
,
1424  
1668  
Vpeak  
VPR  
Input-to-Output Test Voltage, Method B, VIORM x 1.875 = VPR  
100% Production Test with tm = 1 s, Partial Discharge < 5 pC  
,
Vpeak  
VIORM  
VIOTM  
Maximum Working Insulation Voltage  
Highest Allowable Over-Voltage  
External Creepage  
890  
8000  
7  
Vpeak  
Vpeak  
mm  
mm  
mm  
°C  
External Clearance  
7  
DTI  
TS  
Distance Through Insulation (Insulation Thickness)  
Case Temperature(1)  
Input Current(1)  
0.4  
175  
60  
IS,INPUT  
mA  
PS,OUTPUT Output Power(1)  
RIO  
Insulation Resistance at TS, VIO = 500 V(1)  
Note:  
150  
> 109  
mW  
1. Safety limit values – maximum values allowed in the event of a failure.  
©2006 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
MCT6, MCT61, MCT62 Rev.1.6  
2
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-  
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-  
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The  
absolute maximum ratings are stress ratings only. TA = 25°C unless otherwise specified.  
Symbol  
TSTG  
TOPR  
TJ  
Parameter  
Value  
Unit  
°C  
Storage Temperature  
Operating Temperature  
Junction Temperature  
-55 to +150  
-55 to +100  
-55 to +125  
°C  
°C  
260 for 10 sec-  
onds  
TSOL  
PD  
Lead Solder Temperature  
°C  
Total Device Power Dissipation @ TA = 25°C  
Derate Above 25°C  
400  
mW  
5.33  
mW/°C  
EMITTER (Each channel)  
IF  
IF(pk)  
VR  
DC / Average Forward Input Current  
60  
3
mA  
A
Forward Current - Peak (PW = 1μs, 300pps)  
Reverse Input Voltage  
3
V
Total Power Dissipation @ TA = 25°C  
Derate Above 25°C  
100  
1.3  
mW  
mW/°C  
PD(EMITTER)  
DETECTOR  
IC  
Continuous Collector Current  
Total Power Dissipation @ TA = 25°C  
Derate Above 25°C  
30  
150  
2.0  
mA  
mW  
PD(DETECTOR)  
mW/°C  
©2006 Fairchild Semiconductor Corporation  
MCT6, MCT61, MCT62 Rev.1.6  
www.fairchildsemi.com  
3
Electrical Characteristics  
TA = 25°C unless otherwise specified.  
Individual Component Characteristics  
Symbol Parameter  
Test Conditions  
Min. Typ. Max.  
Unit  
EMITTER  
VF  
VR  
IR  
Input Forward Voltage  
Reverse Voltage  
IF = 20 mA  
1.2  
25  
1.5  
V
V
IR = 10 μA  
3
Reverse Leakage Current  
Junction Capacitance  
VR = 5 V  
0.001 10  
50  
μA  
pF  
CJ  
VF = 0 V, f = 1 MHz  
DETECTOR  
Collector-to-Emitter Breakdown  
Voltage  
BVCEO  
BVECO  
IC = 1.0 mA, IF = 0  
30  
6
85  
13  
V
V
Emitter-to-Collector Breakdown  
Voltage  
IE = 100 μA, IF = 0  
ICEO  
CCE  
Collector-to-Emitter Dark Current VCE = 10 V, IF = 0  
Capacitance VCE = 0 V, f = 1 MHz  
5
8
100  
nA  
pF  
Transfer Characteristics  
Symbol  
Parameter  
Device  
Test Conditions  
Min. Typ. Max.  
Unit  
DC CHARACTERISTICS  
MCT6  
IF = 10 mA, VCE = 10 V  
IF = 5 mA, VCE = 5 V  
20  
50  
Current Transfer Ratio, Collector-  
to-Emitter  
CTR  
MCT61  
MCT62  
%
V
100  
Saturation Voltage, Collector-to-  
Emitter  
VCE(SAT)  
ALL  
IF = 16 mA, IC = 2 mA  
0.15 0.4  
AC CHARACTERISTICS  
Symbol  
Parameter  
Test Conditions  
Min. Typ. Max.  
Unit  
Non-Saturated  
TON  
TOFF  
TR  
Turn-On Time  
3.0  
3.0  
2.4  
2.4  
µs  
µs  
µs  
µs  
Turn-Off Time  
Rise Time  
Fall Time  
RL = 100 , IC = 2 mA, VCC = 10 V  
TF  
Saturated  
TON  
Turn-On Time  
Turn-Off Time  
2.4  
µs  
µs  
IF = 16 mA, RL = 1.9 k, VCE = 5 V  
TOFF  
25.0  
Isolation Characteristics  
Symbol Parameter  
Test Conditions  
II-O 10 µA, t = 1 Minute  
f = 1 MHz  
Min. Typ. Max.  
Unit  
VACRMS  
pF  
VISO  
CISO  
RISO  
5,000  
0.5  
1011  
Input-Output Isolation Voltage  
Isolation Capacitance  
Isolation Resistance  
VI-O = 500 VDC  
©2006 Fairchild Semiconductor Corporation  
MCT6, MCT61, MCT62 Rev.1.6  
www.fairchildsemi.com  
4
Typical Performance Curves  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
1.4  
V
T
= 5.0V  
Normalized to  
= 10mA  
CE  
= 25°C  
I
A
F
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
I
= 5mA  
F
I
= 10mA  
F
Normalized to  
I
T
= 10mA  
A
F
I = 20mA  
F
= 25°C  
0
5
10  
15  
20  
-75  
-50  
-25  
0
25  
50  
75  
100 125  
I
- FORWARD CURRENT (mA)  
T
A
- AMBIENT TEMPERATURE (°C)  
F
)LJꢀꢁꢃꢁ1RUPDOL]HGꢁ&75ꢁYVꢀꢁ$PELHQW7HPSHUDWXUH  
)LJꢀꢁꢂꢁ1RUPDOL]HGꢁ&75ꢁYVꢀꢁ)RUZDUGꢁ&XUUHQW  
101  
100  
1000  
I
V
T
= 10mA  
=10V  
F
CC  
V
CE  
= 10V  
= 25°C  
A
100  
10  
1
10-1  
10-2  
10-3  
10-4  
10-5  
10-6  
T
2))  
T
)
T
21  
T
5
0
25  
50  
75  
100  
125  
0.1  
1  
10ꢀ  
0.1ꢀ  
100ꢀ  
T
- AMBIENT TEMPERATURE (°C)  
A
R - LOAD RESISTOR (kΩ)  
)LJꢀꢁꢇꢁ6ZLWFKLQJꢁ6SHHGꢁYVꢀꢁ/RDGꢁ5HVLVWRU  
)LJꢀꢁꢈꢁ'DUNꢁ&XUUHQWꢁYVꢀꢁ$PELHQWꢁ7HPSHUDWXUH  
1.8  
1.7  
1.6  
1.5  
1.4  
100  
T
= 25°C  
A
10  
1
I
= 2.5mA  
F
T
= 55°C  
= 25°C  
A
0.1  
1.3  
1.2  
1.1  
1.0  
T
A
I
=20mA  
F
0.01  
I
=10mA  
F
I
= 5mA  
F
T
A
= 100°C  
0.001  
1
10  
100  
0.01  
0.1  
1
10  
IF - LED FORWARD CURRENT (mA)  
IC - COLLECTOR CURRENT (mA)  
)LJꢀꢁꢆꢁ/('ꢁ)RUZDUGꢁ9ROWDJHꢁYVꢀꢁ)RUZDUGꢁ&XUUHQW  
)LJꢀꢁꢄꢁ&ROOHFWRUꢅ(PLWWHUꢁ6DWXUDWLRQꢁ9ROWDJHꢁ  
YVꢀꢁ&ROOHFWRUꢁ&XUUHQW  
©2006 Fairchild Semiconductor Corporation  
MCT6, MCT61, MCT62 Rev.1.6  
www.fairchildsemi.com  
5
Switching Time Test Circuit and Waveforms  
TEST CIRCUIT  
WAVE FORMS  
VCC = 10 V  
INPUT PULSE  
IC  
IF  
RL  
10%  
90%  
INPUT  
OUTPUT  
OUTPUT PULSE  
RBE  
75  
7)  
72))  
721  
IF to produce IC = 2 mA  
Adjust  
Figure 9. Switching Time Test Circuit and Waveforms  
©2006 Fairchild Semiconductor Corporation  
MCT6, MCT61, MCT62 Rev.1.6  
www.fairchildsemi.com  
6
Reflow Profile  
Max. Ramp-up Rate = 3°C/S  
Max. Ramp-down Rate = 6°C/S  
T
P
260  
240  
220  
200  
180  
160  
140  
120  
100  
80  
t
P
T
L
Tsmax  
t
L
Preheat Area  
Tsmin  
t
s
60  
40  
20  
0
120  
Time 25°C to Peak  
240  
360  
Time (seconds)  
Profile Feature  
Pb-Free Assembly Profile  
150°C  
Temperature Min. (Tsmin)  
Temperature Max. (Tsmax)  
200°C  
Time (t ) from (Tsmin to Tsmax)  
60–120 seconds  
3°C/second max.  
217°C  
S
Ramp-up Rate (t to t )  
L
P
Liquidous Temperature (T )  
L
Time (t ) Maintained Above (T )  
60–150 seconds  
260°C +0°C / –5°C  
30 seconds  
L
L
Peak Body Package Temperature  
Time (t ) within 5°C of 260°C  
P
Ramp-down Rate (T to T )  
6°C/second max.  
8 minutes max.  
P
L
Time 25°C to Peak Temperature  
©2006 Fairchild Semiconductor Corporation  
MCT6, MCT61, MCT62 Rev.1.6  
www.fairchildsemi.com  
7
Ordering Information  
Part Number  
Package  
Packing Method  
Tube (50 units per tube)  
MCT6  
DIP 8-Pin  
MCT6S  
SMT 8-Pin (Lead Bend)  
SMT 8-Pin  
Tube (50 units per tube)  
MCT6SD  
MCT6300  
MCT63S  
MCT63SD  
MCT6300W  
Tape and Reel (1,000 units per reel)  
Tube (50 units per tube)  
DIN EN/IEC 60747-5-5 Option  
SMT 8-Pin (Lead Bend); DIN EN/IEC 60747-5-5 Option  
SMT 8-Pin; DIN EN/IEC 60747-5-5 Option  
0.4” Lead Spacing; DIN EN/IEC 60747-5-5 Option  
Tube (50 units per tube)  
Tape and Reel (1,000 units per reel)  
Tube (50 units per tube)  
Note  
1. The product orderable part number system listed in this table also applies to the MCT61 and MCT62.  
Marking Information  
1
2
MCT6  
6
V XX YY H  
5
3
4
Figure 10. Top Mark  
Table 1. Top Mark Definitions  
1
2
3
4
5
6
Fairchild Logo  
Device Number  
DIN EN/IEC60747-5-5 Option (only appears on component ordered with this option)  
Two-Digit Year Code, e.g., “16”  
Digit Work Week, Ranging from “01” to “53”  
Assembly Package Code  
©2006 Fairchild Semiconductor Corporation  
MCT6, MCT61, MCT62 Rev.1.6  
www.fairchildsemi.com  
8
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ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
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literature is subject to all applicable copyright laws and is not for resale in any manner.  
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