MICROFC-10035-SMT-TR1 [ONSEMI]
硅光电倍增传感器，C 系列 (SiPM);
| 型号： | MICROFC-10035-SMT-TR1 |
| 厂家： | 
ONSEMI |
| 描述： | 硅光电倍增传感器，C 系列 (SiPM) 光电 传感器 |
| 文件： | 总16页 (文件大小：1205K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
Silicon Photomultipliers
(SiPM), Low-Noise,
Blue-Sensitive
C-Series SiPM Sensors
The C−Series low-light sensors from onsemi feature an
industry-leading low dark-count rate combined with a high PDE. For
ultrafast timing applications, C−Series sensors have a fast output that
can have a rise time of 300 ps and a pulse width of 600 ps. The
C−Series is available in different sensor sizes (1 mm, 3 mm and 6 mm)
and packaged in a 4-side tileable surface mount (SMT) package that is
compatible with industry standard, lead-free, reflow soldering
processes.
Figure 1. C−Series Sensors
ORDERING INFORMATION
See detailed ordering and shipping information on page 14 of
this data sheet.
The C−Series Silicon Photomultipliers (SiPM) form a range of high
gain, single-photon sensitive, UV-to-visible light sensors. They have
performance characteristics similar to a conventional PMT, while
benefiting from the practical advantages of solid-state technology: low
operating voltage, excellent temperature stability, robustness,
compactness, output uniformity, and low cost. For advice on the usage
of these sensors please refer to the Biasing and Readout Application
Note.
Table 1. PERFORMANCE PARAMETERS
Sensor
Size
Microcell Size
10m, 20m, 35m
20m, 35m, 50m
Parameter (Note 1)
Overvoltage
Min.
Typ.
Max.
Units
Breakdown Voltage (Vbr) (Note 3)
V
24.2
24.7
1 mm
3 mm
6 mm
1 mm
3 mm
6 mm
1 mm
3 mm
6 mm
1 mm
3 mm
6 mm
35m
Recommended overvoltage Range
(Voltage above Vbr) (Note 2)
V
10m, 20m, 35m
20m, 35m, 50m
35m
1.0
5.0
Spectral Range (Note 4)
nm
nm
10m, 20m, 35m
20m, 35m, 50m
35m
300
950
Peak Wavelength (lp)
420
10m, 20m, 35m
20m, 35m, 50m
35m
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
February, 2022 − Rev. 9
MICROC−SERIES/D
C−Series SiPM Sensors
Table 1. PERFORMANCE PARAMETERS (continued)
Sensor
Size
Microcell Size
Parameter (Note 1)
PDE (Note 5) at lp
Overvoltage
Min.
Typ.
14
Max.
Units
%
1 mm
1 mm
3 mm
3 mm
Vbr + 2.5 V
10m
20m
35m
10m
20m
35m
20m
35m
50m
20m
35m
50m
35m
35m
10m
20m
35m
20m
35m
50m
35m
10m
20m
35m
20m
35m
50m
35m
24
%
31
%
Vbr + 5.0 V
Vbr + 2.5 V
Vbr + 5.0 V
18
%
31
%
41
%
24
%
31
%
35
%
31
%
41
%
47
%
6 mm
Vbr + 2.5 V
31
%
6 mm
1 mm
Vbr + 5.0 V
Vbr + 2.5 V
41
%
Gain
5
6
6
6
6
6
6
2 × 10
1 × 10
3 × 10
1 × 10
3 × 10
6 × 10
3 × 10
1
(anode to cathode readout)
3 mm
6 mm
1 mm
Dark Current (Note 6)
Vbr + 2.5 V
3
nA
nA
nA
nA
nA
nA
nA
5
16
15
49
3 mm
6 mm
50
142
443
914
1750
154
319
618
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2
C−Series SiPM Sensors
Table 1. PERFORMANCE PARAMETERS (continued)
Sensor
Size
Microcell Size
Parameter (Note 1)
Dark Count Rate
Overvoltage
Min.
Typ.
30
Max.
96
Units
kHz
kHz
kHz
kHz
kHz
kHz
kHz
ns
1 mm
Vbr + 2.5 V
10m
20m
30
96
35m
30
96
3 mm
20m
300
300
300
1200
0.3
0.6
1.0
0.6
1.5
3.2
5
860
860
860
3400
35m
50m
35m
6 mm
1 mm
3 mm
6 mm
1 mm
3 mm
Rise Time − Fast Output (Note 7)
10m, 20m, 35m
20m, 35m, 50m
ns
35m
10m, 20m, 35m
20m, 35m, 50m
35m
ns
Signal Pulse Width − Fast Output (FWHM)
Microcell recharge time constant (Note 8)
ns
ns
6 mm
1 mm
ns
10m
ns
20m
23
ns
35m
82
ns
3 mm
20m
23
ns
35m
82
ns
50m
159
95
ns
35m
6 mm
1 mm
ns
Capacitance (Note 9)
(anode−cathode)
Vbr + 2.5 V
10m
50
pF
20m
90
pF
35m
100
770
850
920
3400
1
pF
3 mm
20m
pF
35m
pF
50m
pF
35m
6 mm
1 mm
pF
Capacitance (Note 9)
(fast terminal to cathode)
Vbr + 2.5 V
10m
pF
20m
1
pF
35m
1
pF
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3
C−Series SiPM Sensors
Table 1. PERFORMANCE PARAMETERS (continued)
Sensor
Size
Microcell Size
20m
Parameter (Note 1)
Overvoltage
Min.
Typ.
20
12
7
Max.
Units
pF
3 mm
Capacitance (Note 9)
(fast terminal to cathode)
Vbr + 2.5 V
35m
pF
50m
pF
35m
6 mm
1 mm
3 mm
6 mm
1 mm
3 mm
48
pF
Temperature dependence of Vbr
Temperature dependence of Gain (Note 10)
Crosstalk
21.5
mV/°C
10m, 20m, 35m
20m, 35m, 50m
35m
−0.8
%/°C
10m, 20m, 35m
20m, 35m, 50m
35m
6 mm
1 mm
Vbr + 2.5 V
10m
0.6
3
%
%
%
%
%
%
%
%
%
%
%
%
%
%
20m
35m
20m
35m
50m
35m
10m
20m
35m
20m
35m
50m
35m
7
3 mm
3
7
10
7
6 mm
1 mm
Afterpulsing
Vbr + 2.5 V
0.2
0.2
0.2
0.2
0.2
0.6
0.2
3 mm
6 mm
1. All measurements made at 2.5 V overvoltage and 21°C unless otherwise stated.
2. Please consult the maximum current levels on page 6 when selecting the overvoltage to apply.
3. The breakdown voltage (Vbr) is defined as the value of the voltage intercept of a straight line fit to a plot of √I vs V, where I is the current and
V is the bias voltage.
4. The range where PDE > 1% at Vbr + 5.0 V.
5. Note that the PDE does not contain contributions from afterpulsing or crosstalk.
6. Dark current derived from dark count data as DC × M × q × (1 + CT), where DC is dark count, M is gain, q is the charge of an electron, and
CT is cross talk.
7. Measured as time to go from 10% to 90% of the peak amplitude.
8. RC charging time constant of the microcell (t)
9. Internal capacitance of the sensor. Typically add 2−3 pF for sensor in package. Listed by unique microcell size for each part version.
10.Quoted as the percentage change per degree C from the measured value at 21°C.
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4
C−Series SiPM Sensors
GENERAL PARAMETERS
Table 2. GENERAL PARAMETERS
1 mm
3 mm
6 mm
60035
10010, 10020, 10035
30020, 30035, 30050
2
2
2
Active area
1 × 1 mm
3 × 3 mm
6 × 6 mm
No. of microcells
30020: 10998
30035: 4774
30050: 2668
60035: 18980
10010: 2880
10020: 1296
10035: 504
Microcell fill factor
30020: 48%
30035: 64%
30050: 72%
60035: 64%
10010: 28%
10020: 48%
10035: 64%
Table 3. PACKAGE PARAMETERS
1 mm
3 mm
6 mm
60035
10010, 10020, 10035
30020, 30035, 30050
2
2
2
Package dimensions
1.5 × 1.8 mm
4 × 4 mm
7 × 7 mm
Recommended operating
temperature range
−40°C to +85°C
Maximum storage temperature
Soldering conditions
+105°C
Lead−free, reflow soldering process compatible
(MSL 3 for tape & reel quantities; MSL 4 for tape only qty.)
See the SMT Handling Tech Note for more details.
Encapsulant type
Clear transfer molding compound
1.59 @ 420 nm
Encapsulant refractive Index
Table 4. MAXIMUM CURRENT LEVELS FOR EACH SENSOR SIZE
1 mm
10010, 10020, 10035
6 mA
3 mm
30020, 30035, 30050
15 mA
6 mm
60035
20 mA
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5
C−Series SiPM Sensors
CIRCUIT SCHEMATICS
An SiPM is formed of a large number (hundreds or
a close-packed array with all of the like terminals (e.g. all of
the anodes) summed together. The array of microcells can
thus be considered as a single photodiode sensor with three
terminals: anode, cathode and fast output.
thousands) of microcells. Each microcell is an avalanche
photodiode with its own quench resistor and a capacitively
coupled fast output. These microcells are arranged in
Circuit schematic of the SensL SiPM microcell,
showing details of the Fast Output.
SensL SiPM component symbol.
®
Simplified circuit schematic of the SensL SiPM showing
only a 12 microcell example. Typically, SiPM sensors have
hundreds or thousands of microcells.
Figure 2. Circuit Schematic
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6
C−Series SiPM Sensors
PERFORMANCE
Figure 3. PDE versus Wavelength
(MicroFC−30035−SMT)
Figure 4. Responsivity versus Wavelength
(MicroFC−30035−SMT)
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7
C−Series SiPM Sensors
Figure 5. PDE at 420 nm versus Voltage
Figure 6. Dark Count Rate versus Overvoltage
Figure 7. Gain versus Overvoltage
Figure 8. Dark Current versus Voltage
and Temperature
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8
C−Series SiPM Sensors
EVALUATION BOARD OPTIONS
SMA Biasing Board (MicroFC−SMA−XXXXX)
information is shown in the table below. The SMTPA board
electrical schematics are shown in Figure 12 and are
available to download in AND9809/D.
The MicroFC−SMA is a printed circuit board (PCB) that
can facilitate the evaluation of the C−Series SMT sensors.
The board has three female SMA connectors for connecting
the bias voltage, the standard output from the anode and the
fast output signal. The output signals can be connected
directly to a 50 W-terminated oscilloscope for viewing. The
biasing and output signal tracks are laid out in such a way as
to preserve the fast timing characteristics of the sensor.
The MicroFC−SMA is recommended for users who
require a plug-and-play set-up to quickly evaluate C−Series
SMT sensors with optimum timing performance. The board
also allows the standard output from the anode-cathode
readout to be observed at the same time as the fast output.
The outputs can be connected directly to the oscilloscope or
measurement device, but external preamplification may be
required to boost the signal. The table below lists the SMA
board connections. The SMA board electrical schematics
are available to download in AND9809/D.
Figure 10. Pin Adapter
Figure 11. MicroFC−SMTPA−XXXXX
Figure 9. SMA Biasing Board
MicroFC−SMA−XXXXX
Output
Vbias
Fout
Function
Positive bias input (cathode)
Fast output
Sout
Standard output (anode)
Figure 12. SMTPA Board Circuit Schematic
Pin Adapter (MicroFC−SMTPA−XXXXX)
The SMT Pin Adapter board (SMTPA) is a small PCB
board that houses the SMT sensor and has through-hole pins
to allow for use with standard sockets or probe clips. This
product is useful for those needing a quick way to evaluate
the C−Series SMT sensors without the need for specialist
surface-mount soldering. While this is a ‘quick fix’ suitable
for many evaluations, it should be noted that the timing
performance from this board will not be optimized and if the
best possible timing performance is required, the
MicroFC−SMA−XXXXX is recommended. The pin-out
MicroFC−SMTPA−XXXXX
Pin No.
Connection
Anode
1
2
3
4
5
Fast output
Cathode
Ground
No connect
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C−Series SiPM Sensors
PACKAGE DIMENSIONS
(All Dimensions in mm)
MicroFC−60035−SMT
BOTTOM VIEW
Pin Assignments
TOP VIEW
Pin #
1
MicroFC−60035−SMT
Anode
Fast Output
Cathode
2
3
SIDE VIEW
4, 5
No Connect*
*The ‘No Connect’ pin 4 should be soldered to the PCB. This pin can be connected to ground but it can also be left floating without affecting
the dark noise. It is recommended that the Pin 5 paddle is NOT soldered to the PCB and is left floating to achieve optimal soldering on pins
1 to 4. Please note the full advice in the CAD file.
The complete MicroFC−60035−SMT POD is available to download here.
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10
C−Series SiPM Sensors
PACKAGE DIMENSIONS
(All Dimensions in mm)
MicroFC−30020−SMT, MicroFC−30035−SMT, MicroFC−30050−SMT
BOTTOM VIEW
TOP VIEW
Pin Assignments
MicroFC−300XX−SMT
Pin #
1
2
3
4
Anode
Fast Output
Cathode
SIDE VIEW
No Connect*
*The ‘No Connect’ pin 4 should be soldered to the PCB. It can be connected to ground but it can also be left floating without affecting the dark
noise.
The complete MicroFC−300xx−SMT POD is available to download here.
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11
C−Series SiPM Sensors
PACKAGE DIMENSIONS
(All Dimensions in mm)
MicroFC−10010−SMT, MicroFC−10020−SMT & MicroFC−10035−SMT
TOP VIEW
BOTTOM VIEW
Pin Assignments
Pin #
MicroFC−100XX−SMT
Anode
1
2
3
4
Fast Output
Cathode
SIDE VIEW
No Connect*
*The ‘No Connect’ pin 4 should be soldered to the PCB. It can be connected to ground but it can also be left floating without affecting the dark
noise.
The complete MicroFC−100XX−SMT POD is available to download here.
www.onsemi.com
12
C−Series SiPM Sensors
PACKAGE DIMENSIONS
(All Dimensions in mm)
MicroFC−SMTPA Board
TOP VIEW
SIDE VIEW
BOTTOM VIEW
The electrical schematics for the SMTPA board is available in AND9809/D.
MicroFC−SMA Board
BOTTOM VIEW
SIDE VIEW
TOP VIEW
The electrical schematics for the SMA board is available in AND9809/D.
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13
C−Series SiPM Sensors
USEFUL LINKS
• Introduction to Silicon Photomultipliers Application Note − If you are new to SiPM, this document explains their
operation and main performance parameters.
• Biasing and Readout Application Note − This document gives detailed information on how to bias the sensor for both
standard and fast configurations, and amplifying and reading out the signal.
• How to Evaluate and Compare Silicon Photomultipliers Application Note − Information on what to consider when
selecting an SiPM.
• Handling and Soldering Guide − This document gives information on safe handling of the sensors and soldering to PCB.
ORDERING INFORMATION
Table 5. ORDERING INFORMATION
Delivery
Options
(Note 12)
Product Code
(Note 11)
Microcell Size
(Total Number)
Sensor
Active Area
Package Type
10000 Series
MICROFC−10010−SMT
10 mm
1 mm × 1 mm
4-side tileable, surface mount package
(SMT)
TR1, TR
PK
(2880 microcells)
MICROFC−SMA−10010−GEVB
MICROFC−SMTPA−10010−GEVB
MICROFC−10020−SMT
SMT sensor mounted onto a PCB with
SMA connectors for bias and output.
SMT sensor mounted onto a pin
adapter board.
PK
20 mm
(1296 microcells)
4-side tileable, surface mount
package (SMT)
TR1, TR
PK
MICROFC−SMA−10020−GEVB
MICROFC−SMTPA−10020−GEVB
MICROFC−10035−SMT
SMT sensor mounted onto a PCB with
SMA connectors for bias and output.
SMT sensor mounted onto a pin
adapter board.
PK
35 mm
(504 microcells)
4-side tileable, surface mount
package (SMT)
TR1, TR
PK
MICROFC−SMA−10035−GEVB
MICROFC−SMTPA−10035−GEVB
SMT sensor mounted onto a PCB with
SMA connectors for bias and output.
SMT sensor mounted onto a pin
adapter board.
PK
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14
C−Series SiPM Sensors
Table 5. ORDERING INFORMATION (continued)
Delivery
Options
(Note 12)
Product Code
(Note 11)
Microcell Size
(Total Number)
Sensor
Active Area
Package Type
30000 Series
MICROFC−30020−SMT
20 mm
3 mm × 3 mm
4-side tileable, surface mount package
(SMT)
TR1, TR
PK
(10998 microcells)
MICROFC−SMA−30020−GEVB
MICROFC−SMTPA−30020−GEVB
MICROFC−30035−SMT
SMT sensor mounted onto a PCB with
SMA connectors for bias and output.
SMT sensor mounted onto a pin
adapter board
PK
35 mm
(4774 microcells)
4-side tileable, surface mount package
(SMT)
TR1, TR
PK
MICROFC−SMA−30035−GEVB
MICROFC−SMTPA−30035−GEVB
MICROFC−30050−SMT
SMT sensor mounted onto a PCB with
SMA connectors for bias and output.
SMT sensor mounted onto a pin
adapter board
PK
50 mm
(2668 microcells)
4-side tileable, surface mount package
(SMT)
TR1, TR
PK
MICROFC−SMA−30050−GEVB
MICROFC−SMTPA−30050−GEVB
SMT sensor mounted onto a PCB with
SMA connectors for bias and output.
SMT sensor mounted onto a pin
adapter board
PK
60000 Series
MICROFC−60035−SMT
35 mm
(18980 microcells)
6mm × 6mm
4-side tileable, surface mount package
(SMT)
TR1, TR
PK
MICROFC−SMA−60035−GEVB
MICROFC−SMTPA−60035−GEVB
SMT sensor mounted onto a PCB with
SMA connectors for bias and output.
SMT sensor mounted onto a pin
adapter board
PK
11. All Devices are Pb-Free and are RoHS Compliant.
12.The two-letter delivery option code should be appended to the order number, e.g.) to receive MICROFC−60035−SMT on tape and reel, use
MICROFC−60035−SMT−TR. The codes are as follows:
PK = ESD Package
TR1 = Tape
TR = Tape and Reel
There is a minimum order quantity (MOQ) of 3000 for the tape and reel (TR) option. The TR option is only available in multiples of the MOQ.
SensL is a registered trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United
States and/or other countries.
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15
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
ADDITIONAL INFORMATION
TECHNICAL PUBLICATIONS:
Technical Library: www.onsemi.com/design/resources/technical−documentation
onsemi Website: www.onsemi.com
ONLINE SUPPORT: www.onsemi.com/support
For additional information, please contact your local Sales Representative at
www.onsemi.com/support/sales
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