MJD42C [ONSEMI]

Complementary Power Transistors; 互补功率晶体管
MJD42C
型号: MJD42C
厂家: ONSEMI    ONSEMI
描述:

Complementary Power Transistors
互补功率晶体管

晶体 晶体管 功率双极晶体管 开关
文件: 总6页 (文件大小:93K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MJD41C (NPN)  
MJD42C (PNP)  
Preferred Device  
Complementary Power  
Transistors  
DPAK For Surface Mount Applications  
http://onsemi.com  
Designed for general purpose amplifier and low speed switching  
applications.  
SILICON  
POWER TRANSISTORS  
6 AMPERES  
Features  
Lead Formed for Surface Mount Applications in Plastic Sleeves  
(No Suffix)  
100 VOLTS  
20 WATTS  
Straight Lead Version in Plastic Sleeves (“1” Suffix)  
Lead Formed Version in 16 mm Tape and Reel (“T4” Suffix)  
Electrically Similar to Popular TIP41 and TIP42 Series  
Monolithic Construction With Built−in Base − Emitter Resistors  
Epoxy Meets UL 94, V−0 @ 0.125 in.  
MARKING  
DIAGRAMS  
ESD Ratings: Human Body Model, 3B u 8000 V  
Machine Model, C u 400 V  
4
DPAK  
CASE 369C  
STYLE 1  
YWW  
J4xC  
2
1
3
MAXIMUM RATINGS  
Rating  
Collector−Emitter Voltage  
Collector−Base Voltage  
Emitter−Base Voltage  
Symbol  
Max  
100  
100  
5
Unit  
Vdc  
Vdc  
Vdc  
Adc  
4
V
CEO  
DPAK−3  
CASE 369D  
STYLE 1  
YWW  
J4xC  
V
CB  
EB  
V
1
2
I
C
6
10  
Collector Current − Continuous  
Peak  
3
Y
= Year  
Base Current  
I
B
2
Adc  
WW  
x
= Work Week  
= 1 or 2  
P
D
20  
0.16  
W
W/°C  
Total Power Dissipation @ T = 25°C  
C
Derate above 25°C  
P
D
1.75  
0.014  
Total Power Dissipation* @ T = 25°C  
W
W/°C  
A
ORDERING INFORMATION  
Derate above 25°C  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
Operating and Storage Junction  
Temperature Range  
T , T  
65 to  
+150  
°C  
J
stg  
Preferred devices are recommended choices for future use  
and best overall value.  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
6.25  
71.4  
Unit  
°C/W  
°C/W  
Thermal Resistance, Junction−to−Case  
Thermal Resistance, Junction−to−Ambient*  
R
q
JC  
JA  
R
q
*These ratings are applicable when surface mounted on the minimum pad sizes  
recommended.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
August, 2004 − Rev. 5  
MJD41C/D  
MJD41C (NPN) MJD42C (PNP)  
ELECTRICAL CHARACTERISTICS (T = 25_C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Max  
Unit  
OFF CHARACTERISTICS  
Collector−Emitter Sustaining Voltage (Note 1)  
(I = 30 mAdc, I = 0)  
V
100  
Vdc  
mAdc  
mAdc  
mAdc  
CEO(sus)  
C
B
I
50  
10  
0.5  
Collector Cutoff Current  
(V = 60 Vdc, I = 0)  
CEO  
CE  
B
I
Collector Cutoff Current  
(V = 100 Vdc, V = 0)  
CES  
CE  
EB  
I
Emitter Cutoff Current  
(V = 5 Vdc, I = 0)  
EBO  
BE  
C
ON CHARACTERISTICS (Note 1)  
h
FE  
DC Current Gain  
(I = 0.3 Adc, V = 4 Vdc)  
30  
15  
75  
C
CE  
(I = 3 Adc, V = 4 Vdc)  
C
CE  
V
1.5  
2
Vdc  
Vdc  
Collector−Emitter Saturation Voltage  
(I = 6 Adc, I = 600 mAdc)  
CE(sat)  
C
B
V
Base−Emitter On Voltage  
(I = 6 Adc, V = 4 Vdc)  
BE(on)  
C
CE  
DYNAMIC CHARACTERISTICS  
f
3
MHz  
Current Gain − Bandwidth Product (Note 2)  
T
(I = 500 mAdc, V = 10 Vdc, f = 1 MHz)  
test  
C
CE  
h
20  
Small−Signal Current Gain  
(I = 0.5 Adc, V = 10 Vdc, f = 1 kHz)  
fe  
C
CE  
1. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.  
2. f = h f  
.
test  
T
fe  
ORDERING INFORMATION  
Device  
Package Type  
DPAK  
Package  
369C  
369C  
369C  
369D  
369C  
369C  
Shipping  
MJD41CRL  
1800 Tape & Reel  
2500 Tape & Reel  
75 Units / Rail  
MJD41CT4  
DPAK  
MJD42C  
DPAK  
MJD42C1  
DPAK−3  
DPAK  
75 Units / Rail  
MJD42CRL  
1800 Tape & Reel  
2500 Tape & Reel  
MJD42CT4  
DPAK  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
2
 
MJD41C (NPN) MJD42C (PNP)  
TYPICAL CHARACTERISTICS  
T
T
C
V
CC  
+ꢀ30 V  
A
2.5 25  
R
C
2
20  
25 ms  
SCOPE  
+11 V  
R
B
0
1.5 15  
T
C
D
1
51  
−ꢀ9 V  
T SURFACE MOUNT  
A
1
10  
t , t 10 ns  
r
f
DUTY CYCLE = 1%  
−ꢀ4 V  
0.5  
0
5
0
R and R VARIED TO OBTAIN DESIRED CURRENT LEVELS  
B
C
ꢃD MUST BE FAST RECOVERY TYPE, e.g.:  
1
ꢃꢃMSB5300 USED ABOVE I 100 mA  
B
ꢃꢃMSD6100 USED BELOW I 100 mA  
B
REVERSE ALL POLARITIES FOR PNP.  
25  
50  
75  
100  
125  
150  
T, TEMPERATURE (°C)  
Figure 1. Power Derating  
Figure 2. Switching Time Test Circuit  
2
1
500  
T = 25°C  
J
300  
200  
V
CE  
= 2 V  
V
CC  
I /I = 10  
= 30 V  
T = 150°C  
J
C B  
0.7  
0.5  
100  
70  
25°C  
0.3  
0.2  
t
r
50  
30  
20  
0.1  
−ꢀ55°C  
0.07  
t @ V  
d
5 V  
BE(off)  
0.05  
10  
7
0.03  
0.02  
5
0.06  
0.2 0.3 0.4 0.6  
1
2
4
6
0.06  
0.2  
0.4 0.6  
1
2
4
6
0.1  
0.1  
I , COLLECTOR CURRENT (AMP)  
C
I , COLLECTOR CURRENT (AMP)  
C
Figure 3. DC Current Gain  
Figure 4. Turn−On Time  
5
2
1.6  
1.2  
0.8  
0.4  
0
T = 25°C  
J
T = 25°C  
3
2
J
V
CC  
I /I = 10  
= 30 V  
C B  
t
s
I = I  
B1 B2  
1
0.7  
0.5  
V
@ I /I = 10  
C B  
CE(sat)  
0.3  
0.2  
V
BE  
@ V = 4 V  
CE  
t
f
0.1  
0.07  
0.05  
V
@ I /I = 10  
C B  
BE(sat)  
0.06  
0.2 0.3 0.4 0.6  
1
2
3
4
6
0.06  
0.2  
0.4 0.6  
1
2
4
6
0.1  
0.1  
I , COLLECTOR CURRENT (AMP)  
C
I , COLLECTOR CURRENT (AMP)  
C
Figure 5. “On” Voltages  
Figure 6. Turn−Off Time  
http://onsemi.com  
3
MJD41C (NPN) MJD42C (PNP)  
2
300  
T = 25°C  
J
T = 25°C  
J
200  
1.6  
I
C
= 1 A  
2.5 A  
5 A  
C
C
ib  
1.2  
0.8  
0.4  
0
100  
70  
ob  
50  
30  
0.5  
1
2
3
5
10  
20 30  
50  
10  
20 30  
50  
100  
200 300 500  
1000  
V , REVERSE VOLTAGE (VOLTS)  
R
I , BASE CURRENT (mA)  
B
Figure 8. Capacitance  
Figure 7. Collector Saturation Region  
1
0.7  
D = 0.5  
0.2  
0.5  
0.3  
0.2  
P
(pk)  
R
R
= r(t) R  
q
JC  
q
JC(t)  
0.1  
= 6.25°C/W MAX  
q
JC  
0.1  
0.07  
0.05  
0.05  
D CURVES APPLY FOR POWER  
PULSE TRAIN SHOWN  
READ TIME AT t  
t
1
0.02  
1
t
2
T
− T = P q  
C (pk) JC(t)  
J(pk)  
0.03  
0.02  
DUTY CYCLE, D = t /t  
0.01  
1 2  
SINGLE PULSE  
0.01  
0.01  
0.02 0.03 0.05  
0.1  
0.2 0.3 0.5  
1
2
3
5
10  
20 30  
50  
100  
200 300 500  
1000  
t, TIME (ms)  
Figure 9. Thermal Response  
10  
5
There are two limitations on the power handling ability of  
a transistor: average junction temperature and second  
100ꢂms  
500ꢂms  
3
2
breakdown. Safe operating area curves indicate I − V  
C
CE  
1ꢂms  
dc  
limits of the transistor that must be observed for reliable  
operation; i.e., the transistor must not be subjected to greater  
dissipation than the curves indicate.  
5ꢂms  
1
0.5  
0.3  
WIRE BOND LIMIT  
THERMAL LIMIT  
SECOND BREAKDOWN LIMIT  
The data of Figure 10 is based on T  
variable depending on conditions. Second breakdown pulse  
= 150_C; T is  
J(pk)  
C
CURVES APPLY BELOW RATED V  
CEO  
0.1  
limits are valid for duty cycles to 10% provided T  
J(pk)  
0.05  
0.03  
v 150_C.  
T
may be calculated from the data in  
J(pk)  
T
= 25°C SINGLE PULSE  
C
Figure 9. At high case temperatures, thermal limitations will  
reduce the power that can be handled to values less than the  
limitations imposed by second breakdown.  
T = 150°C  
J
MJD41C, 42C  
0.01  
1
2
3
5
7
10  
20 30  
50 70 100  
V
CE  
, COLLECTOR−EMITTER VOLTAGE (VOLTS)  
Figure 10. Maximum Forward Bias  
Safe Operating Area  
http://onsemi.com  
4
 
MJD41C (NPN) MJD42C (PNP)  
PACKAGE DIMENSIONS  
DPAK  
CASE 369C  
ISSUE O  
NOTES:  
SEATING  
−T−  
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
PLANE  
C
2. CONTROLLING DIMENSION: INCH.  
B
R
INCHES  
DIM MIN MAX  
MILLIMETERS  
E
V
MIN  
5.97  
6.35  
2.19  
0.69  
0.46  
0.94  
MAX  
6.22  
6.73  
2.38  
0.88  
0.58  
1.14  
A
B
C
D
E
F
G
H
J
0.235 0.245  
0.250 0.265  
0.086 0.094  
0.027 0.035  
0.018 0.023  
0.037 0.045  
0.180 BSC  
0.034 0.040  
0.018 0.023  
0.102 0.114  
0.090 BSC  
4
2
Z
A
K
S
1
3
4.58 BSC  
U
0.87  
0.46  
2.60  
1.01  
0.58  
2.89  
K
L
2.29 BSC  
F
J
R
S
U
V
Z
0.180 0.215  
0.025 0.040  
4.57  
0.63  
0.51  
0.89  
3.93  
5.45  
1.01  
−−−  
1.27  
−−−  
L
H
0.020  
0.035 0.050  
0.155 −−−  
−−−  
D 2 PL  
M
G
0.13 (0.005)  
T
STYLE 1:  
PIN 1. BASE  
2. COLLECTOR  
3. EMITTER  
4. COLLECTOR  
SOLDERING FOOTPRINT  
6.20  
3.0  
0.244  
0.118  
2.58  
0.101  
5.80  
0.228  
1.6  
0.063  
6.172  
0.243  
mm  
inches  
ǒ
Ǔ
SCALE 3:1  
http://onsemi.com  
5
MJD41C (NPN) MJD42C (PNP)  
PACKAGE DIMENSIONS  
DPAK−3  
CASE 369D−01  
ISSUE B  
NOTES:  
C
B
R
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
V
S
E
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
5.97  
6.35  
2.19  
0.69  
0.46  
0.94  
MAX  
6.35  
6.73  
2.38  
0.88  
0.58  
1.14  
4
2
Z
A
B
C
D
E
F
G
H
J
K
R
S
V
Z
0.235 0.245  
0.250 0.265  
0.086 0.094  
0.027 0.035  
0.018 0.023  
0.037 0.045  
0.090 BSC  
0.034 0.040  
0.018 0.023  
0.350 0.380  
0.180 0.215  
0.025 0.040  
0.035 0.050  
A
K
1
3
−T−  
SEATING  
PLANE  
2.29 BSC  
0.87  
0.46  
8.89  
4.45  
0.63  
0.89  
3.93  
1.01  
0.58  
9.65  
5.45  
1.01  
1.27  
−−−  
J
F
H
0.155  
−−−  
D 3 PL  
STYLE 1:  
PIN 1. BASE  
G
M
T
0.13 (0.005)  
2. COLLECTOR  
3. EMITTER  
4. COLLECTOR  
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
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MJD41C/D  

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