MM5Z6V2T5G [ONSEMI]

500 mW 标准容差齐纳二极管稳压器;


型号：	MM5Z6V2T5G
厂家：	ONSEMI
描述：	500 mW 标准容差齐纳二极管稳压器二极管齐纳二极管稳压器
文件：	总4页 (文件大小：102K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MM5ZxxxT1G Series,

SZMM5ZxxxT1G Series

Zener Voltage Regulators

300 mW SOD−523 Surface Mount

This series of Zener diodes is packaged in a SOD−523 surface

mount package. They are designed to provide voltage regulation

protection and are especially attractive in situations where space is at a

premium. They are well suited for applications such as cellular

phones, hand held portables, and high density PC boards.

http://onsemi.com

SOD−523

CASE 502

STYLE 1

Specification Features:

• Standard Zener Breakdown Voltage Range − 2.4 V to 75 V

• Steady State Power Rating of 300 mW

• Small Body Outline Dimensions:

0.047″ x 0.032″ (1.20 mm x 0.80 mm)

• Low Body Height: 0.028″ (0.7 mm)

• ESD Rating of Class 3 (> 16 kV) per Human Body Model

Cathode

Anode

• AEC−Q101 Qualified and PPAP Capable − SZMM5ZxxxT1G

• SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements

• These are Pb−Free Devices*

MARKING DIAGRAM

XX M G

Mechanical Characteristics:

CASE: Void-free, transfer-molded, thermosetting plastic

Epoxy Meets UL 94 V−0

LEAD FINISH: 100% Matte Sn (Tin)

MOUNTING POSITION: Any

XX = Specific Device Code

= Date Code*

= Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation may vary depending

upon manufacturing location.

QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 1 Requirements

ORDERING INFORMATION

MAXIMUM RATINGS

†

Device

Package

Shipping

Rating

Symbol

Max

Unit

MM5ZxxxxT1G

SOD−523

(Pb−Free)

3,000 /

Tape & Reel

Total Device Dissipation FR−5 Board,

300

@ T = 25°C

SZMM5ZxxxT1G SOD−523

(Pb−Free)

3,000 /

Tape & Reel

Thermal Resistance,

390

°C/W

°C

Junction−to−Ambient (Note 1)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Junction and Storage

Temperature Range

T , T

−65 to +150

stg

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics tables starting on

page 3 of this data sheet.

1. EIA/JEDEC51.3 board design and EIA/JEDEC51.2 still air test method

(25 mm , 2 oz., 3.8 mm plating).

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Semiconductor Components Industries, LLC, 2013

Publication Order Number:

April, 2013 − Rev. 10

MM5Z2V4T1/D

MM5ZxxxT1G Series, SZMM5ZxxxT1G Series

ELECTRICAL CHARACTERISTICS

(T = 25°C unless otherwise noted,

V = 0.9 V Max. @ I = 10 mA for all types)

Symbol

Parameter

Reverse Zener Voltage @ I

Reverse Current

Maximum Zener Impedance @ I

Reverse Current

Maximum Zener Impedance @ I

Reverse Leakage Current @ V

Reverse Voltage

Forward Current

Forward Voltage @ I

Maximum Temperature Coefficient of V

Zener Voltage Regulator

Max. Capacitance @V = 0 and f = 1 MHz

TYPICAL CHARACTERISTICS

100

125

150

TEMPERATURE (°C)

Figure 1. Steady State Power Derating

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MM5ZxxxT1G Series, SZMM5ZxxxT1G Series

ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted, V = 0.9 V Max. @ I = 10 mA for all types)

Zener Voltage (Note 1)

Zener Impedance Leakage Current

(mV/k) @ I

@ V = 0

@ I

V (Volts)

@ I

@ V

f = 1 MHz

R R

Device

Marking

Min Nom Max

Volts

1.0

Min

−3.5

Max

Device*

MM5Z2V4T1G

MM5Z2V7T1G

MM5Z3V0T1G

MM5Z3V3T1G

MM5Z3V6T1G

2.2

2.5

2.8

3.1

3.4

2.4

2.7

3.0

3.3

3.6

2.6

2.9

3.2

3.5

3.8

100

1000 1.0

450

1.0

450

1.0

450

1.0

450

1.0

450

MM5Z4V3T1G

MM5Z4V7T1G

4.0

4.4

4.3

4.7

4.6

5.0

1.0

2.0

−3.5

450

260

800

500

200

100

160

1.0

0.2

MM5Z5V1T1G

MM5Z5V6T1G

MM5Z6V2T1G

MM5Z6V8T1G

MM5Z7V5T1G

MM5Z8V2T1G

MM5Z9V1T1G

MM5Z10VT1G

MM5Z11VT1G

MM5Z12VT1G

MM5Z13VT1G

MM5Z15VT1G

MM5Z16VT1G

MM5Z18VT1G

MM5Z20VT1G

MM5Z22VT1G

MM5Z24VT1G

MM5Z27VT1G

MM5Z30VT1G

MM5Z33VT1G

MM5Z36VT1G

MM5Z39VT1G

MM5Z43VT1G

MM5Z47VT1G

MM5Z51VT1G

MM5Z56VT1G

MM5Z62VT1G

MM5Z68VT1G

MM5Z75VT1G

4.8

5.2

5.8

6.4

7.0

7.7

8.5

9.4

10.4

11.4

5.1

5.6

6.2

6.8

7.5

8.2

9.1

5.4

6.0

2.0

−2.7

−2.0

0.4

1.2

2.5

225

200

185

155

140

135

130

120

110

105

100

6.6

4.0

3.7

7.2

4.0

1.2

4.5

7.9

5.0

2.5

5.3

8.7

0.7

0.2

5.0

3.2

6.2

9.6

7.0

3.8

7.0

10.6

11.6

12.7

0.1

8.0

4.5

8.0

0.1

8.0

5.4

9.0

0.1

8.0

6.0

12.4 13.25 14.1

0.1

8.0

7.0

14.3

15.8

17.1

19.1

21.2

23.3

25.6

28.9

0.05

10.5

11.2

12.6

14.0

15.4

16.8

18.9

21.0

23.2

25.2

27.3

30.1

32.9

35.7

39.2

43.4

47.6

52.5

9.2

15.3 16.2

10.4

12.4

14.4

16.4

18.4

21.4

24.4

27.4

30.4

33.4

37.6

42.0

46.6

52.2

58.8

65.6

73.4

16.8

18.8

20.8

100

120

300

500

22.8 24.2

25.1

25.3

29.4

33.4

37.4

41.2

46.6

51.8

57.2

63.8

71.6

79.8

88.6

130

150

170

180

200

215

240

255

1. Zener voltage is measured with a pulse test current I at an ambient temperature of 25°C.

*Include SZ-prefix devices where applicable.

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MM5ZxxxT1G Series, SZMM5ZxxxT1G Series

PACKAGE DIMENSIONS

SOD−523

CASE 502

ISSUE E

NOTES:

−X−

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.

MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL.

−Y−

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-

TRUSIONS, OR GATE BURRS.

MILLIMETERS

DIM

MIN

0.50

0.25

0.07

1.10

0.70

1.50

NOM

0.60

0.30

0.14

1.20

0.80

1.60

0.30 REF

0.20

MAX

0.70

0.35

0.20

1.30

0.90

1.70

2X b

0.08

X Y

TOP VIEW

0.15

0.25

STYLE 1:

PIN 1. CATHODE (POLARITY BAND)

2. ANODE

H_E

SIDE VIEW

RECOMMENDED

SOLDERING FOOTPRINT*

1.80

0.48

0.40

PACKAGE

OUTLINE

BOTTOM VIEW

DIMENSION: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,

copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC

reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any

particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without

limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications

and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC

does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for

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MM5Z2V4T1/D

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