MM74HC273WMX [ONSEMI]
八路 D 型触发器，带清除;
| 型号： | MM74HC273WMX |
| 厂家： | 
ONSEMI |
| 描述： | 八路 D 型触发器，带清除 光电二极管 逻辑集成电路 触发器 |
| 文件： | 总9页 (文件大小：298K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
Octal D-Type Flip-Flops
with Clear
SOIC−20 WB
CASE 751D−05
MM74HC273
General Description
The MM74HC273 edge triggered flip−flops utilize advanced
silicon−gate CMOS technology to implement D−type flip−flops. They
possess high noise immunity, low power, and speeds comparable
to low power Schottky TTL circuits. This device contains
8 master−slave flip−flops with a common clock and common clear.
Data on the D input having the specified setup and hold times is
transferred to the Q output on the LOW−to−HIGH transition
of the CLOCK input. The CLEAR input when LOW, sets all outputs
to a low state.
SOIC−20, 300 mils
CASE 751BJ−01
TSSOP−20 WB
CASE 948E
Each output can drive 10 low power Schottky TTL equivalent loads.
The MM74HC273 is functionally as well as pin compatible
to the 74LS273. All inputs are protected from damage due to static
MARKING DIAGRAMS
SOIC−20 WB
20
discharge by diodes to V and ground.
CC
HC273A
AWLYYWW
Features
• Typical Propagation Delay: 18 ns
• Wide Operating Voltage Range
• Low Input Current: 1 mA Maximum
• Low Quiescent Current: 160 mA (74 Series)
• Output Drive: 10 LS−TTL Loads
• This is a Pb−Free Device
1
TSSOP−20 WB
20
HC
273A
ALYW
V
CC
8Q
19
7D
17
7Q
16
6Q
15
6D
14
5D
13
5Q CLOCK
8D
18
20
12
11
1
D
CK
Q
D
CK
Q
D
CK
Q
D
CK
Q
CLEAR
CLEAR
CLEAR
CLEAR
HC273A = Specific Device Code
A
WL, L
Y
= Assembly Location
= Wafer Lot Number
= Year
CLEAR
CK
CLEAR
CK
Q
CLEAR
CK
CLEAR
CK
WW, YW = Work Week
Q
D
D
D
Q
Q
D
1
2
3
1D
4
5
2Q
6
7
3D
8
9
4Q
10
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
CLEAR 1Q
2D
3Q
4D
GND
Figure 1. Connection Diagram
© Semiconductor Components Industries, LLC, 1983
1
Publication Order Number:
November, 2022 − Rev. 2
MM74HC273/D
MM74HC273
TRUTH TABLE (Each Flip−Flop)
Inputs
Outputs
Clear
Clock
D
X
H
L
Q
L
L
H
H
H
X
↑
↑
L
H
L
X
Q
0
NOTES:
H
L
X
↑
Q
= HIGH Level (Steady State)
= LOW Level (Steady State)
= Don’t Care
= Transition from LOW−to−HIGH level
= The level of Q before the indicated steady state input
conditions were established.
0
Figure 2. Logic Diagram
ABSOLUTE MAXIMUM RATINGS (Note 1)
Symbol
Rating
Value
Unit
V
V
CC
Supply Voltage
−0.5 to +7.0 V
V
IN
DC Input Voltage
−0.5 to V +0.5 V
V
CC
V
DC Output Voltage
Clamp Diode Current
DC Output Current, per pin
−0.5 to V +0.5 V
V
OUT
CC
I , I
IK OK
20
25
mA
mA
mA
°C
I
OUT
I
DC V or GND Current, per pin
50
CC
CC
T
STG
Storage Temperature Range
Power Dissipation
−65 to +150
600
P
Note 2
mW
mW
°C
D
S. O. Package only
500
T
Lead Temperature (Soldering 10 seconds)
260
L
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Unless otherwise specified all voltages are referenced to ground.
2. Power Dissipation temperature derating − plastic “N” package: 12 mW/°C from 65°C to 85°C.
www.onsemi.com
2
MM74HC273
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2
Max
Unit
V
V
CC
Supply Voltage
6
V
IN
, V
DC Input or Output Voltage
Operating Temperature Range
Input Rise or Fall Times
0
V
CC
V
OUT
T
A
−55
−
125
1000
500
°C
ns
ns
ns
t , t
r
V
CC
V
CC
V
CC
= 2.0 V
= 4.5 V
= 6.0 V
f
−
−
400
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS (Note 3)
T
A
= 25°C
T
A
= −40 to
85°C
T
A
= −55 to
125°C
Symbol
Parameter
Conditions
V
CC
Typ
Guaranteed Limits
Unit
V
IH
Minimum HIGH Level
Input Voltage
2.0 V
4.5 V
6.0 V
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
V
V
V
V
IL
Maximum LOW Level
Input Voltage
2.0 V
4.5 V
6.0 V
0.5
1.35
1.8
0.5
1.35
1.8
0.5
1.35
1.8
V
V
V
V
OH
Minimum HIGH Level
Output Voltage
V
= V or V
IL
⎪ ≤ 20 mA
2.0 V
4.5 V
6.0 V
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
V
V
IN
IH
⎪I
OUT
V
⎪I
⎪I
= V or V
IH IL
IN
⎪ ≤ 4.0 mA
OUT
⎪ ≤ 5.2 mA
OUT
4.5 V
6.0 V
4.2
5.7
3.98
5.48
3.84
5.34
3.7
5.2
V
V
V
OL
Maximum LOW Level
Output Voltage
V
= V or V
IL
⎪ ≤ 20 mA
2.0 V
4.5 V
6.0 V
0
0
0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
V
V
IN
IH
⎪I
OUT
V
⎪I
⎪I
= V or V
IH IL
IN
⎪ ≤ 4.0 mA
OUT
⎪ ≤ 5.2 mA
OUT
4.5 V
6.0 V
0.2
0.2
0.26
0.26
0.33
0.33
0.4
0.4
V
V
I
IN
Maximum Input
Current
V
IN
= V or GND
6.0 V
0.1
1.0
1.0
mA
CC
I
Maximum Quiescent
Supply Current
V
= V or GND
= 0 mA
6.0 V
8
80
160
mA
CC
IN
CC
I
OUT
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. For a power supply of 5 V 10% the worst case output voltages (V , and V ) occur for HC at 4.5 V. Thus the 4.5 V values should be used
OH
OL
when designing with this supply. Worst case V and V occur at V = 5.5 V and 4.5 V respectively. (The V value at 5.5 V is 3.85 V.) The
IH
IL
CC
IH
worst case leakage current (I , I , and I ) occur for CMOS at the higher voltage and so the 6.0 V values should be used.
IN CC
OZ
www.onsemi.com
3
MM74HC273
AC ELECTRICAL CHARACTERISTICS
(V = 5 V, T = 25°C, C = 15 pF, t = t = 6 ns)
CC
A
L
r
f
Symbol
Parameter
Conditions
Typ
Guaranteed Limit
Unit
f
Maximum Operating Frequency
50
30
MHz
MAX
t
, t
Maximum Propagation Delay,
Clock to Output
18
18
10
10
−2
10
27
27
20
20
0
ns
ns
ns
ns
ns
ns
PHL PLH
t
Maximum Propagation Delay,
Clear to Output
PHL
t
Minimum Removal Time,
Clear to Clock
REM
t
s
Minimum Setup Time,
Data to Clock
t
H
Minimum Hold Time,
Clock to Data
t
W
Minimum Pulse Width,
Clock to Clear
16
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
AC ELECTRICAL CHARACTERISTICS
(C = 50 pF, t = t = 6 ns, unless otherwise specified)
L
r
f
T
A
= 25°C
T
A
= −40 to
85°C
T
A
= −55 to
125°C
Symbol
Parameter
Conditions
V
CC
Typ
Guaranteed Limits
Unit
f
Maximum Operating
Frequency
2.0 V
4.5 V
6.0 V
16
74
78
5
27
31
4
21
24
3
18
20
MHz
MHz
MHz
MAX
t
, t
Maximum Propagation
Delay, Clock to Output
2.0 V
4.5 V
6.0 V
38
14
12
135
27
23
170
34
29
205
41
35
ns
ns
ns
PHL PLH
t
Maximum Propagation
Delay, Clear to Output
2.0 V
4.5 V
6.0 V
42
19
18
135
27
23
170
34
29
205
41
35
ns
ns
ns
PHL
t
Minimum Removal Time,
Clear to Clock
2.0 V
4.5 V
6.0 V
0
0
0
25
5
4
32
6
5
37
7
6
ns
ns
ns
REM
t
s
Minimum Setup Time,
Data to Clock
2.0 V
4.5 V
6.0 V
26
7
5
100
20
17
125
25
21
150
30
25
ns
ns
ns
t
H
Minimum Hold Time,
Clock to Clock
2.0 V
4.5 V
6.0 V
−15
−6
−4
0
0
0
0
0
0
0
0
0
ns
ns
ns
t
W
Minimum Pulse Width,
Clock or Clear
2.0 V
4.5 V
6.0 V
34
11
10
80
16
14
100
20
18
120
24
20
ns
ns
ns
t , t
Maximum Input Rise
and Fall Time, Clock
2.0 V
4.5 V
6.0 V
−
−
−
1000
500
400
1000
500
400
1000
500
400
ns
ns
ns
r
f
t
, t
Maximum Output Rise
and Fall Time
2.0 V
4.5 V
6.0 V
28
11
9
75
15
13
95
19
16
110
22
19
ns
ns
ns
THL TLH
www.onsemi.com
4
MM74HC273
AC ELECTRICAL CHARACTERISTICS (continued)
(C = 50 pF, t = t = 6 ns, unless otherwise specified)
L
r
f
T
A
= 25°C
T
A
= −40 to
85°C
T
A
= −55 to
125°C
Symbol
Parameter
Conditions
(per flip−flop)
V
CC
Typ
Guaranteed Limits
Unit
C
Power Dissipation
45
pF
PD
Capacitance (Note 4)
C
Maximum Input
Capacitance
7
10
10
10
pF
IN
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2
4. C determines the no load dynamic power consumption, P = C
V
f + I V , and the no load dynamic current consumption,
PD
D
PD CC
CC CC
I
= C
V
f + I
.
S
PD CC
CC
ORDERING INFORMATION
Device
†
Package
SOIC−20 WB
Shipping
MM74HC273WM
38 Units / Tube
(Pb−Free and Halide Free)
MM74HC273WMX
SOIC−20, 300 mils
(Pb−Free and Halide Free)
1000 / Tape & Reel
MM74HC273MTC
MM74HC273MTCX
TSSOP−20 WB
(Pb−Free)
75 Units / Tube
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−20, 300 mils
CASE 751BJ−01
ISSUE O
DATE 19 DEC 2008
SYMBOL
MIN
NOM
MAX
2.64
0.30
2.55
0.51
0.33
13.00
10.64
7.60
2.36
2.49
A
A1
A2
b
0.10
2.05
0.31
0.41
0.27
c
0.20
E1
E
D
12.60
10.01
7.40
12.80
10.30
7.50
E
E1
e
1.27 BSC
h
0.25
0.40
0º
0.75
1.27
8º
0.81
L
b
e
θ
5º
15º
θ1
PIN#1 IDENTIFICATION
TOP VIEW
D
h
h
q1
q
A2
A
q1
L
c
A1
END VIEW
SIDE VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MS-013.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34287E
SOIC−20, 300 MILS
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−20 WB
CASE 751D−05
ISSUE H
DATE 22 APR 2015
SCALE 1:1
D
A
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
20
11
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
E
B
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
1
10
MILLIMETERS
DIM MIN
MAX
2.65
0.25
0.49
0.32
12.95
7.60
20X b
A
A1
b
2.35
0.10
0.35
0.23
12.65
7.40
M
S
S
B
T
0.25
A
c
D
E
e
A
1.27 BSC
H
h
10.05
0.25
0.50
0
10.55
0.75
0.90
7
SEATING
PLANE
L
18X e
q
_
_
A1
c
T
GENERIC
MARKING DIAGRAM*
RECOMMENDED
20
SOLDERING FOOTPRINT*
20X
20X
0.52
1.30
XXXXXXXXXXX
XXXXXXXXXXX
AWLYYWWG
20
11
10
1
XXXXX = Specific Device Code
11.00
A
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
1
WL
YY
WW
G
1.27
PITCH
DIMENSIONS: MILLIMETERS
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42343B
SOIC−20 WB
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−20 WB
CASE 948E
ISSUE D
DATE 17 FEB 2016
SCALE 2:1
NOTES:
20X K REF
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
K
K1
M
S
S
0.10 (0.004)
T U
V
S
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
0.15 (0.006) T U
J J1
20
11
2X L/2
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
B
SECTION N−N
L
−U−
PIN 1
IDENT
0.25 (0.010)
N
1
10
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
M
S
0.15 (0.006) T U
A
−V−
N
MILLIMETERS
INCHES
MIN
DIM MIN
MAX
6.60
4.50
1.20
0.15
0.75
MAX
0.260
0.177
0.047
0.006
0.030
F
A
B
6.40
4.30
---
0.252
0.169
---
DETAIL E
C
D
0.05
0.50
0.002
0.020
F
G
H
0.65 BSC
0.026 BSC
−W−
0.27
0.09
0.09
0.19
0.19
0.37
0.20
0.16
0.30
0.25
0.011
0.004
0.004
0.007
0.007
0.015
0.008
0.006
0.012
0.010
C
J
J1
K
G
D
H
K1
L
DETAIL E
6.40 BSC
0.252 BSC
0
0.100 (0.004)
−T− SEATING
M
0
8
8
_
_
_
_
PLANE
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT
7.06
XXXX
XXXX
ALYWG
G
1
A
L
= Assembly Location
= Wafer Lot
Y
W
G
= Year
= Work Week
= Pb−Free Package
0.65
PITCH
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
01.36X6
16X
1.26
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASH70169A
TSSOP−20 WB
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
ADDITIONAL INFORMATION
TECHNICAL PUBLICATIONS:
Technical Library: www.onsemi.com/design/resources/technical−documentation
onsemi Website: www.onsemi.com
ONLINE SUPPORT: www.onsemi.com/support
For additional information, please contact your local Sales Representative at
www.onsemi.com/support/sales
相关型号：
©2020 ICPDF网 联系我们和版权申明