MM74HCT245MTCX [ONSEMI]
八路 3 态收发器;
| 型号： | MM74HCT245MTCX |
| 厂家： | 
ONSEMI |
| 描述： | 八路 3 态收发器 光电二极管 逻辑集成电路 |
| 文件： | 总9页 (文件大小：293K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
Octal 3-State Transceiver
MM74HCT245
SOIC−20 WB
CASE 751D−05
TSSOP−20 WB TSSOP−20 WB
Description
CASE 948E
CASE 948AQ
The MM74HCT245 3−STATE bi−directional buffer utilizes
advanced silicon−gate CMOS technology and is intended for two−way
asynchronous communication between data buses. It has high drive
current outputs which enable high speed operation even when driving
large bus capacitances. This circuit possesses the low power
consumption of CMOS circuitry, yet has speeds comparable to low
power Schottky TTL circuits.
MARKING DIAGRAMS
20
1
HCT
245A
ALYW
HCT245A
AWLYYWW
This device is TTL input compatible and can drive up to 15 LS−TTL
loads, and all inputs are protected from damage due to static discharge
(TSSOP−WB)
(SOIC−20 WB)
by diodes to V and ground.
CC
The MM74HCT245 has one active low enable input (G), and a
direction control (DIR). When the DIR input is HIGH, data flows from
the A inputs to the B outputs. When DIR is LOW, data flows from B to
A.
HCT245A= Specific Device Code
A
= Assembly Location
= Wafer Lot
WL
YY
WW
= Year
= Work Week
MM74HCT devices are intended to interface between TTL and
NMOS components and standard CMOS devices. These parts are also
plug−in replacements for LS−TTL devices and can be used to reduce
power consumption in existing designs.
CONNECTION DIAGRAM
Features
• TTL Input Compatible
• 3−STATE Outputs for connection to system busses
• High Output Drive Current: 6 mA (min)
• High Speed: 16 ns Typical propagation delay
• Low Power: 160 mA (74HCT Series)
Top View
TRUTH TABLE
Control
Inputs
Operation
G
L
DIR
L
245
B data to A bus
A data to B bus
isolation
L
L
H
H
H = HIGH Level
L = LOW Level
X = Irrelevant
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
December, 2022 − Rev 1
MM74HCT245/D
MM74HCT245
Figure 1. Logic Diagram
www.onsemi.com
2
MM74HCT245
ABSOLUTE MAXIMUM RATINGS (Note 1) (Note 2)
Symbol Parameter
Rating
Unit
V
V
CC
Supply Voltage
–0.5 to +7.0
V
IN
DC Input Voltage
–0.5 to V +0.5
V
CC
V
OUT
DC Output Voltage
–0.5 to V +0.5
V
CC
I , I
Clamp Diode Current
DC Output Current, per pin
Maximum Junction Temperature
Storage Temperature Range
20
35
mA
mA
mA
°C
IK OK
I
OUT
I
70
CC
T
STG
–65 to +150
P
Power Dissipation
S.O. Package only
mW
D
500
260
T
Lead Temperature (Soldering 10 seconds)
°C
L
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Absolute Maximum Ratings are those values beyond which damage to the device may occur.
2. Unless otherwise specified all voltages are referenced to ground.
RECOMMENDED OPERATING RANGES
Symbol
Parameter
Min.
4.5
0
Max.
Unit
V
V
CC
Supply Voltage
5.5
V
V
DC Input or Output Voltage
Operating Temperature Range
Input Rise or Fall Times
V
CC
V
IN, OUT
T
A
−55
−
+125
500
°C
ns
t , t
r
f
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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3
MM74HCT245
DC ELECTRICAL CHARACTERISTICS (V = 5 V 10%, unless otherwise specified.)
CC
T
= –40°C
T = –55°C
A
to 125°C
A
to 85°C
T
A
= 25°C
Typ.
Guaranteed Limits
Symbol
Parameter
Test Conditions
Unit
V
Minimum HIGH Level Input
Voltage
−
−
2.0
0.8
2.0
2.0
0.8
V
IH
V
Maximum LOW Level Input
Voltage
−
−
0.8
V
V
IL
V
OH
Minimum HIGH Level Output
Voltage
V
= V or V ,
IN IH IL
− 0.1
− 0.1
− 0.1
V
CC
V
V
V
CC
|I
| = 20 mA
CC
CC
OUT
OUT
OUT
4.2
5.2
3.98
4.98
3.84
4.84
3.7
4.7
|I
|I
| = 6.0 mA,V = 4.5 V
CC
CC
| = 7.2 mA,V = 5.5 V
V
OL
Maximum LOW Level Output
Voltage
V
= V or V ,
V
IN
IH
IL
0
0.2
0.2
0.1
0.26
0.26
0.1
0.33
0.33
0.1
0.4
0.4
|I
|I
|I
| = 20 mA
OUT
OUT
OUT
| = 6.0 mA,V = 4.5 V
| = 7.2 mA,V = 5.5 V
CC
CC
I
Maximum Input Current
V
V
= V or GND
−
0.1
0.5
8
1.0
5.0
80
1.0
mA
mA
mA
mA
IN
IN
CC
or V Pin 1or 19
IH
IL,
=
I
I
Maximum 3−STATE Output
Leakage Current
V
out
V
CC
or GND
−
10
OZ
G = V
IH
Maximum Quiescent Supply
Current
−
160
1.5
V
IN
= V or GND,
CC
CC
IOUT = 0 mA
V
IN
= 2.4 V or 0.5 V (Note 4)
0.6
1.0
1.3
3. Measured per input. All other inputs at V or ground.
CC
AC ELECTRICAL CHARACTERISTICS (V = 5.0 V, t = t = 6 ns, T = 25°C unless otherwise specified)
CC
r
f
A
Guaranteed
Limit
Test Conditions
Symbol
Parameter
Typ.
Unit
t
t
Maximum Output Propagation
Delay
C = 45 pF
L
16
20
ns
PHL, PLH
t
t
Maximum Output Enable Time
C = 45 pF
R = 1 kQ
L
29
20
40
ns
ns
PZL, PZH
L
t
t
Maximum Output Disable Time
C = 5 pF
L
25
PLZ, PHZ
R = 1 kQ
L
www.onsemi.com
4
MM74HCT245
AC ELECTRICAL CHARACTERISTICS (V = 5.0 V 10%, t = t = 6 ns, unless otherwise specified)
CC
r
f
T
= –40°C
T = –55°C
A
to 125°C
A
to 85°C
T
A
= 25°C
Typ.
17
Guaranteed Limits
Symbol
Parameter
Test Conditions
C = 50 pF
Unit
t
t
Maximum Output Propagation De-
lay
23
30
42
29
38
53
34
45
63
ns
PHL, PLH
L
C = 150 pF
L
24
t
Maximum Output Enable Time
Maximum Output Enable Time
Maximum Output Disable Time
R = 1 kQ
31
ns
ns
ns
ns
PZL
L
C = 50 pF
L
t
R = 1 kQ
23
21
8
33
30
12
41
38
49
45
18
PZH
L
C = 50 pF
L
t
t
R = 1 kQ
L
PHZ, PLZ
C = 50 pF
L
t
t
Maximum Output Rise and Fall
Time
C = 50 pF
L
15 NIL
THL, TLH
C
Maximum Input Capacitance
−
−
10
20
15
25
15
25
15
25
pF
pF
IN
C
Maximum Output/Input Capaci-
tance
OUT
C
Power Dissipation Capacitance
G = V (Note 5)
G = GND
7
100
−
−
−
pF
pF
PD
CC
2
4. C determines the no load dynamic power consumption, P = C
V
f + I V , and the no load dynamic current consumption,
CC CC
PD
D
PD CC
I
= C
V
f + I
.
S
PD CC
CC
ORDERING INFORMATION
Product Number
†
Package
Shipping
75 Units / Tube
2500 Units / Tape and Reel
38 Units / Tube
TSSOP−20 WB,Case, 948E
(Pb−Free)
MM74HCT245MTC
MM74HCT245MTCX
MM74HCT245WM
MM74HCT245WMX
TSSOP−20 WB, 948AQ
(Pb−Free)
SOIC−20 WB
(Pb−Free)
SOIC−20 WB
(Pb−Free)
1000 Units / Tape and Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−20 WB
CASE 751D−05
ISSUE H
DATE 22 APR 2015
SCALE 1:1
D
A
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
20
11
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
E
B
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
1
10
MILLIMETERS
DIM MIN
MAX
2.65
0.25
0.49
0.32
12.95
7.60
20X b
A
A1
b
2.35
0.10
0.35
0.23
12.65
7.40
M
S
S
B
T
0.25
A
c
D
E
e
A
1.27 BSC
H
h
10.05
0.25
0.50
0
10.55
0.75
0.90
7
SEATING
PLANE
L
18X e
q
_
_
A1
c
T
GENERIC
MARKING DIAGRAM*
RECOMMENDED
20
SOLDERING FOOTPRINT*
20X
20X
0.52
1.30
XXXXXXXXXXX
XXXXXXXXXXX
AWLYYWWG
20
11
10
1
XXXXX = Specific Device Code
11.00
A
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
1
WL
YY
WW
G
1.27
PITCH
DIMENSIONS: MILLIMETERS
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42343B
SOIC−20 WB
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−20 WB
CASE 948E
ISSUE D
DATE 17 FEB 2016
SCALE 2:1
NOTES:
20X K REF
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
K
K1
M
S
S
0.10 (0.004)
T U
V
S
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
0.15 (0.006) T U
J J1
20
11
2X L/2
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
B
SECTION N−N
L
−U−
PIN 1
IDENT
0.25 (0.010)
N
1
10
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
M
S
0.15 (0.006) T U
A
−V−
N
MILLIMETERS
INCHES
MIN
DIM MIN
MAX
6.60
4.50
1.20
0.15
0.75
MAX
0.260
0.177
0.047
0.006
0.030
F
A
B
6.40
4.30
---
0.252
0.169
---
DETAIL E
C
D
0.05
0.50
0.002
0.020
F
G
H
0.65 BSC
0.026 BSC
−W−
0.27
0.09
0.09
0.19
0.19
0.37
0.20
0.16
0.30
0.25
0.011
0.004
0.004
0.007
0.007
0.015
0.008
0.006
0.012
0.010
C
J
J1
K
G
D
H
K1
L
DETAIL E
6.40 BSC
0.252 BSC
0
0.100 (0.004)
−T− SEATING
M
0
8
8
_
_
_
_
PLANE
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT
7.06
XXXX
XXXX
ALYWG
G
1
A
L
= Assembly Location
= Wafer Lot
Y
W
G
= Year
= Work Week
= Pb−Free Package
0.65
PITCH
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
01.36X6
16X
1.26
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASH70169A
TSSOP−20 WB
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP20, 4.4x6.5
CASE 948AQ−01
ISSUE A
DATE 19 MAR 2009
b
SYMBOL
MIN
NOM
MAX
A
A1
A2
b
1.20
0.15
1.05
0.30
0.20
6.60
6.50
4.50
0.05
0.80
0.19
0.09
6.40
6.30
4.30
E1
E
c
D
6.50
6.40
E
E1
e
4.40
0.65 BSC
0.60
L
0.45
0.75
L1
1.00 REF
0º
8º
θ
e
TOP VIEW
D
c
A2
A
θ1
L
A1
L1
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-153.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34453E
TSSOP20, 4.4X6.5
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
ADDITIONAL INFORMATION
TECHNICAL PUBLICATIONS:
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