MMBD301LT1G [ONSEMI]
Silicon Hot−Carrier Diodes SCHOTTKY Barrier Diodes; 硅热载流子二极管肖特基势垒二极管
| 型号： | MMBD301LT1G |
| 厂家： | 
ONSEMI |
| 描述： | Silicon Hot−Carrier Diodes SCHOTTKY Barrier Diodes |
| 文件： | 总5页 (文件大小：66K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MBD301, MMBD301LT1
Preferred Device
Silicon Hot−Carrier Diodes
SCHOTTKY Barrier Diodes
These devices are designed primarily for high−efficiency UHF and
VHF detector applications. They are readily adaptable to many other
fast switching RF and digital applications. They are supplied in an
inexpensive plastic package for low−cost, high−volume consumer
and industrial/commercial requirements. They are also available in a
Surface Mount package.
http://onsemi.com
30 VOLTS
SILICON HOT−CARRIER
DETECTOR AND SWITCHING
DIODES
Features
• Extremely Low Minority Carrier Lifetime − 15 ps (Typ)
• Very Low Capacitance − 1.5 pF (Max) @ V = 15 V
R
MBD301
• Low Reverse Leakage − I = 13 nAdc (Typ) MBD301, MMBD301
R
MARKING
DIAGRAM
• Pb−Free Packages are Available
TO−92
(TO−226AC)
CASE 182
STYLE 1
MBD
301
AYWWG
MAXIMUM RATINGS
MBD301 MMBD301LT1
G
1
2
Rating
Reverse Voltage
Symbol
Value
Unit
A
Y
= Assembly Location
= Year
V
R
30
V
Total Device Dissipation
P
WW
= Work Week
= Pb−Free Package
F
J
@ T = 25°C
280
2.8
200
2.0
mW
mW/°C
A
G
Derate above 25°C
(Note: Microdot may be in either location)
Operating Junction
Temperature Range
T
−55 to +125
°C
2
1
Storage Temperature Range
T
stg
−55 to +150
°C
CATHODE
ANODE
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
RecommendedOperating Conditions may affect device reliability.
MMBD301LT1
MARKING
DIAGRAM
3
SOT−23
(TO−236)
CASE 318
STYLE 8
4T M G
G
1
2
1
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
3
1
CATHODE
ANODE
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2007
1
Publication Order Number:
January, 2007 − Rev. 4
MBD301/D
MBD301, MMBD301LT1
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
Symbol
Min
30
−
Typ
−
Max
−
Unit
V
Reverse Breakdown Voltage (I = 10 mA)
V
(BR)R
R
Total Capacitance (V = 15 V, f = 1.0 MHz) Figure 1
C
T
0.9
13
1.5
200
0.45
0.6
pF
R
Reverse Leakage (V = 25 V) Figure 3
I
R
−
nAdc
Vdc
Vdc
R
Forward Voltage (I = 1.0 mAdc) Figure 4
V
V
−
0.38
0.52
F
F
Forward Voltage (I = 10 mAdc) Figure 4
−
F
F
ORDERING INFORMATION
†
Device
Package
Shipping
MBD301
TO−92
5000 Units / Bulk
5000 Units / Bulk
MBD301G
TO−92
(Pb−Free)
MMBD301LT1
SOT−23
3000 / Tape & Reel
3000 / Tape & Reel
MMBD301LT1G
SOT−23
(Pb−Free)
MMBD301LT3
SOT−23
10,000 / Tape & Reel
10,000 / Tape & Reel
MMBD301LT3G
SOT−23
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
2
MBD301, MMBD301LT1
TYPICAL ELECTRICAL CHARACTERISTICS
2.8
2.4
500
f = 1.0 MHz
400
2.0
1.6
1.2
0.8
0.4
0
KRAKAUER METHOD
300
200
100
0
0
3.0 6.0 9.0
12
15
18
21
24
27
30
0
10
20
30
40
50
60
70
80
90 100
V , REVERSE VOLTAGE (VOLTS)
R
I , FORWARD CURRENT (mA)
F
Figure 1. Total Capacitance
Figure 2. Minority Carrier Lifetime
10
100
10
T = 100°C
A
1.0
T = ꢀ40°C
T = 85°C
A
A
75°C
25°C
0.1
1.0
0.1
T = 25°C
A
0.01
0.001
0
6.0
12
18
24
30
0.2
0.4
0.6
0.8
1.0
1.2
V , REVERSE VOLTAGE (VOLTS)
R
V , FORWARD VOLTAGE (VOLTS)
F
Figure 3. Reverse Leakage
Figure 4. Forward Voltage
I
F(PEAK)
CAPACITIVE
CONDUCTION
I
R(PEAK)
FORWARD
STORAGE
CONDUCTION
CONDUCTION
BALLAST
NETWORK
(PADS)
SAMPLING
OSCILLOSCOPE
(50 W INPUT)
SINUSOIDAL
GENERATOR
PADS
DUT
Figure 5. Krakauer Method of Measuring Lifetime
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3
MBD301, MMBD301LT1
PACKAGE DIMENSIONS
TO−92 (TO−226AC)
CASE 182−06
ISSUE L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
A
B
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND ZONE R IS
UNCONTROLLED.
R
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
SEATING
PLANE
D
INCHES
DIM MIN MAX
MILLIMETERS
L
P
MIN
4.45
4.32
3.18
0.407
MAX
5.21
5.33
4.19
0.533
A
B
C
D
G
H
J
0.175
0.170
0.125
0.016
0.205
0.210
0.165
0.021
J
K
0.050 BSC
0.100 BSC
1.27 BSC
2.54 BSC
0.36
SECTION X−X
X X
0.014
0.016
−−−
−−−
0.41
−−−
−−−
2.66
1.27
−−−
−−−
D
K
L
0.500
0.250
0.080
−−−
12.70
6.35
2.03
−−−
G
N
P
R
V
0.105
0.050
−−−
H
0.115
0.135
2.93
3.43
−−−
V
C
STYLE 1:
PIN 1. ANODE
2. CATHODE
1
2
N
N
http://onsemi.com
4
MBD301, MMBD301LT1
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
D
SEE VIEW C
3
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
H
E
E
MILLIMETERS
INCHES
DIM
A
A1
b
c
D
E
e
L
L1
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
MAX
MIN
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
c
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
1
2
b
0.25
e
q
A
H
2.10
2.40
2.64
0.083
0.094
0.104
E
L
STYLE 8:
PIN 1. ANODE
A1
L1
VIEW C
2. NO CONNECTION
3. CATHODE
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
mm
inches
ǒ
Ǔ
SCALE 10:1
0.8
0.031
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
MountingTechniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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MBD301/D
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