MMBFJ211 [ONSEMI]

N 沟道 RF 晶体管;


型号：	MMBFJ211
厂家：	ONSEMI
描述：	N 沟道 RF 晶体管放大器光电二极管晶体管
文件：	总9页 (文件大小：361K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DATA SHEET

www.onsemi.com

N-Channel RF Amplifier

J211, MMBFJ211

1. Drain

2. Source

3. Gate

Description

This device is designed for HF/VHF mixer/amplifier and

applications where process 50 is not adequate. Sufficient gain and

low−noise for sensitive receivers. Sourced from process 90.

Bent Lead

Tape & Reel

Ammo Packing

TO−92 3

CASE 135AR

MAXIMUM RATINGS (T = 25°C unless otherwise noted) (Notes 1, 2)

Symbol

Parameter

Drain−Gate Voltage

Value

Unit

Gate−Source Voltage

Forward Gate Current

−25

°C

NOTE: Source & Drain are

interchangeable

T , T

Operating and Storage Junction

Temperature Range

−55 to 150

STG

SOT−23

CASE 318−08

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. These ratings are based on a maximum junction temperature of 150°C.

2. These are steady−state limits. onsemi should be consulted on applications

involving pulsed or low− duty−cycle operations.

MARKING DIAGRAM

211

YWW

THERMAL CHARACTERISTICS (T = 25°C unless otherwise noted)

Max

J211

(Note 3)

MMBFJ211

(Note 3)

62WM

Symbol

Parameter

Total Device Dissipation

Derate Above 25°C

Unit

350

2.8

225

1.8

−

J211−D74Z

MMBFJ211

mW/°C

°C/W

Thermal Resistance,

Junction−to−Case

125

J211, 62W = Device Code

= Assembly Site

= Work Week Number

= Year of Production

= Date Code

Thermal Resistance,

Junction−to−Ambient

357

556

°C/W

3. Device mounted on FR−4 PCB 36 mm x 18 mm x 1.5 mm; mounting pad for

the collector lead minimum 6 cm .

ORDERING INFORMATION

See detailed ordering and shipping information on page 5 of

this data sheet.

Publication Order Number:

August, 2022 − Rev. 3

MMBFJ211/D

J211, MMBFJ211

ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)

Symbol

Parameter

Conditions

Min

Max

Unit

OFF CHARACTERISTICS

Gate−Source Breakdown Voltage

Gate Reverse Current

= 1.0 mA, V = 0

−25

−

(BR)GSS

= 15 V, V = 0

−100

−4.5

GSS

(off)

Gate−Source Cut−Off Voltage

= 15 V, I = 1.0 nA

−2.5

ON CHARACTERISTICS

Zero−Gate Voltage Drain Current (Note 4)

SMALL SIGNAL CHARACTERISTICS

= 15 V, V = 0

7.0

DSS

Common Source Forward Transconductance

Common Source Output Conductance

= 15 V, V = 0, f = 1.0 kHz

7000

−

12000

200

mmhos

oss

= 15 V, V = 0, f = 1.0 kHz

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

4. Pulse test: pulse width ≤ 300 ms

TYPICAL PERFORMANCE CHARACTERISTICS

Figure 1. Parameter Interactions

Figure 2. Common Drain−Source

Figure 3. Transfer Characteristics

Figure 4. Transfer Characteristics

www.onsemi.com

J211, MMBFJ211

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Figure 5. Leakage Current vs. Voltage

Figure 6. Noise Voltage vs. Frequency

Figure 7. Transconductance vs. Drain Current

Figure 8. Output Conductance vs. Drain Current

Figure 9. Capacitance vs. Voltage

www.onsemi.com

J211, MMBFJ211

COMMON SOURCE CHARACTERISTICS

Figure 10. Input Admittance

Figure 11. Forward Transadmittance

Figure 12. Output Admittance

Figure 13. Reverse Transadmittance

www.onsemi.com

J211, MMBFJ211

COMMON GATE CHARACTERISTICS

Figure 14. Input Admittance

Figure 15. Forward Transadmittance

Figure 16. Output Admittance

Figure 17. Reverse Transadmittance

ORDERING INFORMATION

†

Part Number

J211−D74Z

Top Mark

Package

Packing Method

J211

TO−92 3L

(Pb−Free)

Ammo

MMBFJ211

62W

SOT−23 3L

(Pb−Free)

Tape and Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

www.onsemi.com

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

TO−92 3 4.83x4.76 LEADFORMED

CASE 135AR

ISSUE O

DATE 30 SEP 2016

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DOCUMENT NUMBER:

DESCRIPTION:

98AON13879G

TO−92 3 4.83X4.76 LEADFORMED

PAGE 1 OF 1

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

www.onsemi.com

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

SOT−23 (TO−236)

CASE 318

ISSUE AT

DATE 01 MAR 2023

SCALE 4:1

GENERIC

MARKING DIAGRAM*

XXXMG

XXX = Specific Device Code

= Date Code

= Pb−Free Package

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “G”, may

or may not be present. Some products may

not follow the Generic Marking.

STYLES ON PAGE 2

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DOCUMENT NUMBER:

DESCRIPTION:

98ASB42226B

SOT−23 (TO−236)

PAGE 1 OF 2

onsemi and

are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves

the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular

purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation

special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.

www.onsemi.com

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

SOT−23 (TO−236)

CASE 318

ISSUE AT

DATE 01 MAR 2023

STYLE 1 THRU 5:

CANCELLED

STYLE 6:

STYLE 7:

PIN 1. EMITTER

2. BASE

STYLE 8:

PIN 1. BASE

PIN 1. ANODE

2. EMITTER

3. COLLECTOR

2. NO CONNECTION

3. CATHODE

3. COLLECTOR

STYLE 9:

PIN 1. ANODE

2. ANODE

STYLE 10:

STYLE 11:

PIN 1. ANODE

2. CATHODE

STYLE 12:

STYLE 13:

PIN 1. SOURCE

2. DRAIN

STYLE 14:

PIN 1. CATHODE

2. GATE

PIN 1. DRAIN

2. SOURCE

3. GATE

PIN 1. CATHODE

2. CATHODE

3. ANODE

3. CATHODE

3. CATHODE−ANODE

3. GATE

3. ANODE

STYLE 15:

STYLE 16:

STYLE 17:

PIN 1. NO CONNECTION

2. ANODE

STYLE 18:

STYLE 19:

STYLE 20:

PIN 1. CATHODE

2. ANODE

PIN 1. GATE

2. CATHODE

3. ANODE

PIN 1. ANODE

2. CATHODE

3. CATHODE

PIN 1. NO CONNECTION PIN 1. CATHODE

2. CATHODE

3. ANODE

2. ANODE

3. CATHODE−ANODE

3. CATHODE

3. GATE

STYLE 21:

STYLE 22:

STYLE 23:

PIN 1. ANODE

2. ANODE

STYLE 24:

STYLE 25:

STYLE 26:

PIN 1. GATE

2. SOURCE

3. DRAIN

PIN 1. RETURN

2. OUTPUT

3. INPUT

PIN 1. GATE

2. DRAIN

PIN 1. ANODE

2. CATHODE

3. GATE

PIN 1. CATHODE

2. ANODE

3. SOURCE

3. NO CONNECTION

3. CATHODE

STYLE 27:

STYLE 28:

PIN 1. CATHODE

2. CATHODE

3. CATHODE

PIN 1. ANODE

2. ANODE

3. ANODE

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DOCUMENT NUMBER:

DESCRIPTION:

98ASB42226B

SOT−23 (TO−236)

PAGE 2 OF 2

onsemi and

are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves

the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular

purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation

special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.

www.onsemi.com

onsemi,

, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates

and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.

A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any

products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the

information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use

of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products

and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information

provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may

vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license

under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems

or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should

Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

ADDITIONAL INFORMATION

TECHNICAL PUBLICATIONS:

Technical Library: www.onsemi.com/design/resources/technical−documentation

onsemi Website: www.onsemi.com

ONLINE SUPPORT: www.onsemi.com/support

For additional information, please contact your local Sales Representative at

www.onsemi.com/support/sales



MMBFJ211 [ONSEMI]

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