MMBT4403 [ONSEMI]

PNP 通用放大器;
MMBT4403
型号: MMBT4403
厂家: ONSEMI    ONSEMI
描述:

PNP 通用放大器

放大器
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2N4403 / MMBT4403  
PNP General-Purpose Amplifier  
Description  
This device is designed for use as a general-purpose  
amplifier and switch for collector currents to 500 mA.  
C
E
TO-92  
EB C  
SOT-23  
Mark:2T  
B
Figure 1. 2N4403 Device Package  
Figure 2. MMBT4403 Device Package  
Ordering Information  
Part Number  
2N4403BU  
2N4403TF  
Marking  
2N4403  
2N4403  
2N4403  
2N4403  
2N4403  
2T  
Package  
TO-92 3L  
TO-92 3L  
TO-92 3L  
TO-92 3L  
TO-92 3L  
SOT-23 3L  
Packing Method  
Bulk  
Tape and Reel  
Tape and Reel  
Ammo  
2N4403TFR  
2N4403TA  
2N4403TAR  
MMBT4403  
Ammo  
Tape and Reel  
Publication Order Number:  
MMBT4403/D  
© 2001 Semiconductor Components Industries, LLC.  
October-2017, Rev. 2  
Absolute Maximum Ratings(1),(2)  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-  
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-  
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The  
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.  
Symbol  
VCEO  
VCBO  
VEBO  
IC  
Parameter  
Collector-Emitter Voltage  
Value  
-40  
Unit  
V
Collector-Base Voltage  
Emitter-Base Voltage  
-40  
V
-5.0  
V
Collector Current - Continuous  
-600  
mA  
°C  
TJ, TSTG Operating and Storage Junction Temperature Range  
Notes:  
1. These ratings are based on a maximum junction temperature of 150°C.  
-55 to +150  
2. These are steady-state limits. ON Semiconductor should be consulted on applications involving pulsed or low-  
duty cycle operations.  
Thermal Characteristics  
Values are at TA = 25°C unless otherwise noted.  
Max.  
Symbol  
Parameter  
Total Device Dissipation  
Unit  
2N4403(3)  
625  
MMBT4403(4)  
350  
2.8  
mW  
mW/°C  
°C/W  
PD  
Derate Above 25°C  
5.0  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
83.3  
200  
357  
°C/W  
Notes:  
3. PCB size: FR-4, 76 mm x 114 mm x 1.57 mm (3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size.  
4. Device mounted on FR-4 PCB 1.6 inch x 1.6 inch x 0.06 inch.  
www.onsemi.com  
2
Electrical Characteristics  
Values are at TA = 25°C unless otherwise noted.  
Symbol  
Parameter  
Conditions  
Min.  
Max.  
Unit  
Off Characteristics  
Collector-Emitter Breakdown  
Voltage(5)  
V(BR)CEO  
V(BR)CBO  
IC = -1.0 mA, IB = 0  
IC = -0.1 mA, IE = 0  
-40  
V
V
Collector-Base Breakdown  
Voltage  
-40  
V(BR)EBO Emitter-Base Breakdown Voltage  
IE = -0.1 mA, IC = 0  
-5.0  
V
IBL  
Base Cut-Off Current  
VCE = -35 V, VEB = -0.4 V  
VCE = -35 V, VEB = -0.4 V  
-0.1  
-0.1  
μA  
μA  
ICEX  
Collector Cut-Off Current  
On Characteristics  
IC = -0.1 mA, VCE = -1.0 V  
IC = -1.0 mA, VCE = -1.0 V  
IC = -10 mA, VCE = -1.0 V  
IC = -150 mA, VCE = -2.0 V(5)  
IC = -500 mA, VCE = -2.0 V(5)  
IC = -150 mA, IB = -15 mA  
IC = -500 mA, IB = -50 mA  
IC = -150 mA, IB = -15 mA(5)  
IC = -500 mA, IB = -50 mA  
30  
60  
hFE  
DC Current Gain  
100  
100  
20  
300  
-0.40  
-0.75  
-0.95  
-1.30  
Collector-Emitter Saturation  
Voltage(5)  
VCE(sat)  
V
V
-0.75  
200  
VBE(sat) Base-Emitter Saturation Voltage  
Small Signal Characteristics  
IC = -20 mA, VCE = -10 V,  
f = 100 MHz  
fT  
Current Gain - Bandwidth Product  
Collector-Base Capacitance  
Emitter-Base Capacitance  
Input Impedance  
MHz  
pF  
VCB = -10 V, IE = 0,  
Ccb  
Ceb  
hie  
8.5  
30  
f = 140 kHz  
VBE = -0.5 V, IC = 0,  
f = 140 kHz  
pF  
IC = -1.0 mA, VCE = -10 V,  
f = 1.0 kHz  
1.5  
0.1  
60  
1
15.0  
8.0  
kΩ  
IC = -1.0 mA, VCE = -10 V,  
f = 1.0 kHz  
hre  
hfe  
Voltage Feedback Ratio  
Small-Signal Current Gain  
Output Admittance  
x10-4  
IC = -1.0 mA, VCE = -10 V,  
f = 1.0 kHz  
500  
100  
IC = -1.0 mA, VCE = -10 V,  
f = 1.0 kHz  
hoe  
μmhos  
Switching Characteristics  
td  
tr  
Delay Time  
Rise Time  
Storage Time  
Fall Time  
15  
20  
ns  
ns  
ns  
ns  
V
CC = -30 V, IC = -150 mA,  
IB1 = -15 mA  
ts  
tf  
225  
30  
VCC = -30 V, IC = -150 mA,  
IB1 = IB2 = -15 mA  
Note:  
5. Pulse test: pulse width 300 μs, duty cycle 2.0%.  
www.onsemi.com  
3
Typical Performance Characteristics  
0.5  
0.4  
0.3  
0.2  
0.1  
0
500  
VCE = 5V  
β = 10  
400  
125 °C  
300  
25 °C  
25 °C  
200  
125 °C  
100  
- 40 °C  
- 40 °C  
0
0.1  
0.3  
1
3
10  
30  
100 300  
IC - COLLECTOR CURRENT (mA)  
1
10  
100  
500  
IC - COLLECTOR CURRENT (mA)  
Figure 4. Collector-Emitter Saturation Voltage vs.  
Collector Current  
Figure 3. Typical Pulsed Current Gain vs.  
Collector Current  
1
1
- 40 °C  
- 40 °C  
0.8  
0.8  
25 °C  
0.6  
25 °C  
0.6  
125 °C  
0.4  
0.4  
125°C  
β = 10  
V
= 5V  
CE  
0.2  
0.2  
0
0
1
10  
100  
500  
0.1  
1
10  
25  
I C- COLLECTOR CURRENT (mA)  
IC - COLLECTOR CURRENT (mA)  
Figure 6. Base-Emitter On Voltage vs.  
Collector Current  
Figure 5. Base-Emitter Saturation Voltage  
vs. Collector Current  
100  
20  
16  
12  
8
V
= 35V  
CB  
10  
1
C
ib  
0.1  
C
ob  
4
0.01  
0
25  
50  
75  
100  
°
125  
0.1  
1
10  
50  
TA- AMBIE NT TEMP ERATURE ( C)  
REVERSE BIAS VOLTAGE (V)  
Figure 8. Input and Output Capacitance vs.  
Reverse Bias Voltage  
Figure 7. Collector Cut-Off Current vs.  
Ambient Temperature  
www.onsemi.com  
4
Typical Performance Characteristics (Continued)  
250  
500  
400  
300  
200  
100  
0
I
c
I
10  
c
IB1= IB2  
=
IB1= IB2  
=
10  
200  
150  
100  
50  
V
= 15 V  
V
= 15 V  
cc  
cc  
t
s
t
f
t
t
r
off  
t
on  
t
d
0
10  
100  
- COLLECTOR CURRENT (mA)  
1000  
10  
100  
- COLLECTOR CURRENT (mA)  
1000  
I
I
C
C
Figure 10. Turn-On and Turn-Off Times vs.  
Collector Current  
Figure 9. Switching Times vs. Collector Current  
50  
20  
1
SOT-223  
0.75  
TO-92  
10  
5
t
= 15 V  
r
0.5  
SOT-23  
30 ns  
60 ns  
0.25  
0
2
1
10  
100  
500  
0
25  
50  
75  
100  
125  
150  
I
- COLLECTOR CURRENT (mA)  
C
TEMPERATURE (oC)  
Figure 12. Power Dissipation vs.  
Ambient Temperature  
Figure 11. Rise Time vs.  
Collector and Turn-On Base Currents  
1.3  
1.2  
1.1  
1
5
h
oe  
h
h
h
re  
ie  
fe  
h
and h  
oe  
re  
h
2
1
re  
h
oe  
h
fe  
h
0.5  
ie  
h
ie  
0.9  
0.8  
I
= -10mA  
= 25oC  
A
V
T
= -10 V  
C
T
0.2  
CE  
A
= 25oC  
h
fe  
0.1  
_
_
_
_
_
_
1
2
5
10  
20  
50  
-4  
-8  
-12  
-16  
-20  
I C - COLLECTOR CURRENT (mA)  
VCE- COLLECTOR VOLTAGE (V)  
Figure 14. Common Emitter Characteristics  
Figure 13. Common Emitter Characteristics  
www.onsemi.com  
5
Typical Performance Characteristics (Continued)  
1.5  
I
V
= -10mA  
= -10 V  
h
h
h
h
C
CE  
fe  
ie  
re  
oe  
1.4  
1.3  
1.2  
1.1  
1
h
oe  
0.9  
0.8  
0.7  
0.6  
0.5  
h
h
re  
ie  
h
fe  
-40  
-20  
0
20  
40  
60  
80  
100  
T A - AMBIENT TEMPERATURE (oC)  
Figure 15. Common Emitter Characteristics  
www.onsemi.com  
6
Physical Dimensions  
TO-92 3L (Tape and Reel, Ammo)  
Figure 16. 3-LEAD, TO-92, MOLDED 0.200 IN LINE SPACING LD FORM (J61Z OPTION) (ACTIVE)  
Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in  
any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to  
verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor’s worldwide terms and  
conditions, specifically the warranty therein, which covers ON Semiconductor products.  
www.onsemi.com  
7
Physical Dimensions (Continued)  
TO-92 3L (Bulk)  
D
Figure 17. 3-LEAD, JEDEC TO-92 COMPLIANT STRAGHIT LEAD CONFIGURATION (OLD TO92AM3)  
Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in any  
manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor’s worldwide terms and  
conditions, specifically the warranty therein, which covers ON Semiconductor products.  
www.onsemi.com  
8
Physical Dimensions (Continued)  
SOT-23 3L  
0.95  
2.92 0.20  
3
1.40  
+0.20  
1.30  
2.20  
1.00  
-0.15  
1
2
0.60  
0.37  
(0.29)  
0.95  
0.20  
A B  
1.90  
1.90  
LAND PATTERN  
RECOMMENDATION  
SEE DETAIL A  
1.20 MAX  
(0.93)  
0.10  
0.00  
0.10  
C
C
2.40 0.30  
NOTES: UNLESS OTHERWISE SPECIFIED  
GAGE PLANE  
A) REFERENCE JEDEC REGISTRATION  
TO-236, VARIATION AB, ISSUE H.  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSIONS ARE INCLUSIVE OF BURRS,  
MOLD FLASH AND TIE BAR EXTRUSIONS.  
D) DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M - 1994.  
0.23  
0.08  
0.25  
0.20 MIN  
(0.55)  
E) DRAWING FILE NAME: MA03DREV10  
SEATING  
PLANE  
SCALE: 2X  
Figure 18. 3-LEAD, SOT23, JEDEC TO-236, LOW PROFILE (ACTIVE)  
Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in  
any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to  
verify or obtain the most recent revision. Packagespecificationsdonotexpand the terms of ON Semiconductor's worldwide terms and  
conditions, specifically the warranty therein, which covers ON Semiconductor products.  
www.onsemi.com  
9
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
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application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
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