MMBTA13LT1_06 [ONSEMI]
Darlington Amplifier Transistors; 达林顿晶体管放大器型号: | MMBTA13LT1_06 |
厂家: | ONSEMI |
描述: | Darlington Amplifier Transistors |
文件: | 总6页 (文件大小:74K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MMBTA13LT1,
MMBTA14LT1
MMBTA14LT1 is a Preferred Device
Darlington Amplifier
Transistors
NPN Silicon
http://onsemi.com
Features
COLLECTOR 3
• Pb−Free Packages are Available
BASE
1
MAXIMUM RATINGS
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Symbol
Value
30
Unit
Vdc
EMITTER 2
V
CES
CBO
EBO
V
V
30
Vdc
10
Vdc
3
SOT−23 (TO−236)
Collector Current − Continuous
I
300
mAdc
C
CASE 318
STYLE 6
1
THERMAL CHARACTERISTICS
Characteristic
2
Symbol
Max
Unit
Total Device Dissipation FR−5 Board
P
D
MARKING DIAGRAM
(Note 1) T = 25°C
225
1.8
mW
mW/°C
A
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
R
q
JA
556
°C/W
Total Device Dissipation Alumina
P
D
1x M G
Substrate, (Note 2) T = 25°C
300
2.4
mW
mW/°C
A
G
Derate above 25°C
1
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature
R
417
°C/W
°C
q
JA
T , T
J
−55 to +150
1x = Device Code
x = M for MMBTA13LT1
stg
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR−5 = 1.0 ꢀ 0.75 ꢀ 0.062 in.
2. Alumina = 0.4 ꢀ 0.3 ꢀ 0.024 in. 99.5% alumina.
x = N for MMBTA14LT1
= Date Code*
M
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
†
Device
Package
Shipping
MMBTA13LT1
SOT−23
3,000 / Tape & Reel
3,000 / Tape & Reel
MMBTA13LT1G SOT−23
(Pb−Free)
MMBTA14LT1
SOT−23
3,000 / Tape & Reel
3,000 / Tape & Reel
MMBTA14LT1G SOT−23
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
January, 2006 − Rev. 2
MMBTA13LT1/D
MMBTA13LT1, MMBTA14LT1
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Collector−Emitter Breakdown Voltage
V
Vdc
nAdc
nAdc
(BR)CES
(I = 100 mAdc, V = 0)
30
−
−
C
BE
Collector Cutoff Current
(V = 30 Vdc, I = 0)
I
CBO
100
100
CB
E
Emitter Cutoff Current
(V = 10 Vdc, I = 0)
I
EBO
−
EB
C
ON CHARACTERISTICS (Note 3)
DC Current Gain
h
FE
−
(I = 10 mAdc, V = 5.0 Vdc)
C
MMBTA13
MMBTA14
5000
10,000
−
−
CE
(I = 100 mAdc, V = 5.0 Vdc)
MMBTA13
MMBTA14
10,000
20,000
−
−
C
CE
Collector−Emitter Saturation Voltage
(I = 100 mAdc, I = 0.1 mAdc)
V
Vdc
Vdc
CE(sat)
−
−
1.5
2.0
C
B
Base−Emitter On Voltage
(I = 100 mAdc, V = 5.0 Vdc)
V
BE
C
CE
SMALL−SIGNAL CHARACTERISTICS
Current−Gain − Bandwidth Product (Note 4)
f
MHz
T
(I = 10 mAdc, V = 5.0 Vdc, f = 100 MHz)
125
−
C
CE
3. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.
4. f = |h | • f
.
test
T
fe
R
S
i
n
e
n
IDEAL
TRANSISTOR
Figure 1. Transistor Noise Model
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2
MMBTA13LT1, MMBTA14LT1
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25°C)
500
2.0
BANDWIDTH = 1.0 Hz
R ≈ 0
BANDWIDTH = 1.0 Hz
S
1.0
0.7
0.5
200
100
50
I
C
= 1.0 mA
0.3
0.2
10 mA
100 mA
100 mA
10 mA
0.1
0.07
0.05
20
I
C
= 1.0 mA
10
0.03
0.02
5.0
10 20
50 100 200 500 1ꢀk 2ꢀk 5ꢀk 10ꢀk 20ꢀk 50ꢀk 100ꢀk
f, FREQUENCY (Hz)
10 20
50 100 200 500 1ꢀk 2ꢀk 5ꢀk 10ꢀk 20ꢀk 50ꢀk 100ꢀk
f, FREQUENCY (Hz)
Figure 2. Noise Voltage
Figure 3. Noise Current
200
14
12
BANDWIDTH = 10 Hz TO 15.7 kHz
BANDWIDTH = 10 Hz TO 15.7 kHz
= 10 mA
100
70
10
8.0
6.0
4.0
2.0
0
I
C
10 mA
50
100 mA
100 mA
30
20
I
= 1.0 mA
C
1.0 mA
10
1.0 2.0
5.0
10
20
50 100 200
500 1000
1.0 2.0
5.0
10
20
50 100 200
500 1000
R , SOURCE RESISTANCE (kW)
S
R , SOURCE RESISTANCE (kW)
S
Figure 4. Total Wideband Noise Voltage
Figure 5. Wideband Noise Figure
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3
MMBTA13LT1, MMBTA14LT1
SMALL−SIGNAL CHARACTERISTICS
20
10
4.0
V
= 5.0 V
CE
f = 100 MHz
T = 25°C
J
T = 25°C
J
2.0
7.0
5.0
C
ibo
1.0
0.8
C
obo
0.6
0.4
3.0
2.0
0.2
0.04
0.1 0.2
0.4
1.0 2.0 4.0
10 20
40
0.5 1.0 2.0
0.5 10 20
50
100 200
500
V , REVERSE VOLTAGE (VOLTS)
R
I , COLLECTOR CURRENT (mA)
C
Figure 6. Capacitance
Figure 7. High Frequency Current Gain
200ꢀk
3.0
2.5
2.0
1.5
1.0
0.5
T = 125°C
J
T = 25°C
J
100ꢀk
70ꢀk
50ꢀk
I
C
=
50 mA
250 mA 500 mA
10 mA
25°C
30ꢀk
20ꢀk
10ꢀk
7.0ꢀk
5.0ꢀk
−ꢁ55°C
V
= 5.0 V
CE
3.0ꢀk
2.0ꢀk
500
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000
5.0 7.0 10
20 30
50 70 100
200 300
I , COLLECTOR CURRENT (mA)
C
I , BASE CURRENT (mA)
B
Figure 8. DC Current Gain
Figure 9. Collector Saturation Region
1.6
1.4
−ꢁ1.0
−ꢁ2.0
−ꢁ3.0
−ꢁ4.0
−ꢁ5.0
−ꢁ6.0
*APPLIES FOR I /I ≤ h /3.0
C B
FE
25°C TO 125°C
T = 25°C
J
*R
FOR V
CE(sat)
q
VC
V
@ I /I = 1000
−ꢁ55°C TO 25°C
25°C TO 125°C
BE(sat)
C B
1.2
1.0
0.8
0.6
V
@ V = 5.0 V
CE
BE(on)
q
FOR V
BE
VB
−ꢁ55°C TO 25°C
V
@ I /I = 1000
C B
CE(sat)
5.0 7.0
10
20 30
50 70 100 200 300
500
5.0 7.0 10
20 30
50 70 100
200 300 500
I , COLLECTOR CURRENT (mA)
C
I , COLLECTOR CURRENT (mA)
C
Figure 10. “On” Voltages
Figure 11. Temperature Coefficients
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4
MMBTA13LT1, MMBTA14LT1
1.0
0.7
0.5
D = 0.5
0.2
0.3
0.2
SINGLE PULSE
0.05
0.1
0.1
0.07
SINGLE PULSE
0.05
0.03
0.02
Z
Z
= r(t) • R ꢂT
− T = P
Z
q
q
q
q
JC(t)
JC
J(pk)
C
(pk) JC(t)
= r(t) • R ꢂT
− T = P
Z
q
q
JA
JA(t)
J(pk)
A
(pk) JA(t)
0.01
0.1
0.2
0.5
1.0
2.0
5.0
10
20
50
100
200
500
1.0ꢀk
2.0ꢀk
5.0ꢀk 10ꢀk
t, TIME (ms)
Figure 12. Thermal Response
1.0ꢀk
700
1.0 ms
500
T
= 25°C
300
200
C
100 ms
T
A
= 25°C
1.0 s
100
70
50
30
20
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
10
40
0.4 0.6
1.0
2.0 4.0 6.0 10
20
V
, COLLECTOR−EMITTER VOLTAGE (VOLTS)
CE
Figure 13. Active Region Safe Operating Area
FIGURE A
t
P
P
P
P
P
t
1
1/f
DUTYꢀCYCLE + t ꢀf +
t
1
1
t
P
PEAK PULSE POWER = P
P
Design Note: Use of Transient Thermal Resistance Data
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5
MMBTA13LT1, MMBTA14LT1
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
SEE VIEW C
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
3
H
E
E
c
1
2
MILLIMETERS
INCHES
b
DIM
A
A1
b
c
D
E
e
L
L1
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
MAX
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
MIN
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.25
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
e
q
A
L
A1
L1
VIEW C
H
E
2.10
2.40
2.64
0.083
0.094
0.104
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
mm
inches
ǒ
Ǔ
SCALE 10:1
0.8
0.031
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MMBTA13LT1/D
相关型号:
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