MMBTA56WT1G [ONSEMI]
Driver Transistor PNP Silicon; 驱动晶体管PNP硅型号: | MMBTA56WT1G |
厂家: | ONSEMI |
描述: | Driver Transistor PNP Silicon |
文件: | 总5页 (文件大小:68K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MMBTA56WT1
Driver Transistor
PNP Silicon
Features
• Moisture Sensitivity Level: 1
• ESD Rating: Human Body Model − 4 kV
Machine Model − 400 V
• Pb−Free Package is Available
http://onsemi.com
COLLECTOR
3
1
MAXIMUM RATINGS
BASE
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Symbol
Value
−80
Unit
Vdc
2
V
CEO
CBO
EMITTER
V
−80
Vdc
V
EBO
−4.0
−500
Vdc
Collector Current − Continuous
I
C
mAdc
3
1
2
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR−5 Board
P
D
150
mW
T = 25°C
A
SC−70 (SOT−323)
CASE 419
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature
R
833
°C/W
°C
q
JA
STYLE 3
T , T
J
−55 to +150
stg
Maximum ratings are those values beyond which device damage can occur.
Maximumratings applied to the device are individual stress limit values (not normal
operating conditions) and are not valid simultaneously. If these limits are exceeded,
device functional operation is not implied, damage may occur and reliability may
be affected.
MARKING DIAGRAM
FM M G
G
1
FM = Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
†
Device
Package
Shipping
MMBTA56WT1
MMBTA56WT1G
SC−70
3000/Tape & Reel
3000/Tape & Reel
SC−70
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
January, 2006 − Rev. 1
MMBTA56WT1/D
MMBTA56WT1
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
OFF CHARACTERISTICS
Symbol
Min
Max
Unit
Collector−Emitter Breakdown Voltage (Note 1)
V
−80
−4.0
−
−
−
Vdc
Vdc
(BR)CEO
(I = −1.0 mAdc, I = 0)
C
B
Emitter−Base Breakdown Voltage
V
(BR)EBO
(I = −100 mAdc, I = 0)
E
C
Collector Cutoff Current
I
−0.1
mAdc
mAdc
CES
(V = −60 Vdc, I = 0)
CE
B
Collector Cutoff Current
I
CBO
(V = −60 Vdc, I = 0)
−
−
−
−0.1
CB
E
(V = −80 Vdc, I = 0)
CB
E
ON CHARACTERISTICS
DC Current Gain
h
FE
−
(I = −10 mAdc, V = −1.0 Vdc)
100
100
−
−
C
CE
CE
(I = −100 mAdc, V = −1.0 Vdc)
C
Collector−Emitter Saturation Voltage
V
−
−0.25
Vdc
Vdc
CE(sat)
(I = −100 mAdc, I = −10 mAdc)
C
B
Base−Emitter On Voltage
V
BE(on)
−
−1.2
(I = −100 mAdc, V = −1.0 Vdc)
C
CE
SMALL−SIGNAL CHARACTERISTICS
Current−Gain − Bandwidth Product (Note 2)
f
T
50
−
MHz
(I = −100 mAdc, V = −1.0 Vdc, f = 100 MHz)
C
CE
1. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0%.
2. f is defined as the frequency at which |h | extrapolates to unity.
T
fe
TURN−ON TIME
TURN−OFF TIME
V
V
+V
BB
CC
CC
−1.0 V
+40 V
+40 V
5.0 ms
100
R
100
R
L
L
OUTPUT
OUTPUT
+10 V
0
V
in
R
V
in
R
B
B
t = 3.0 ns
r
* C t 6.0 pF
S
* C t 6.0 pF
S
5.0 mF
5.0 mF
100
100
5.0 ms
t = 3.0 ns
r
*Total Shunt Capacitance of Test Jig and Connectors
For PNP Test Circuits, Reverse All Voltage Polarities
Figure 1. Switching Time Test Circuits
http://onsemi.com
2
MMBTA56WT1
200
100
70
T = 25°C
J
V
= −2.0 V
CE
T = 25°C
J
50
C
ibo
100
70
30
20
50
C
10
obo
30
20
7.0
5.0
−0.1 −0.2
−2.0 −3.0 −5.0 −7.0 −10
−20 −30 −50 −70 −100
−200
−0.5 −1.0 −2.0
−5.0 −10 −20
−50 −100
I , COLLECTOR CURRENT (mA)
C
V , REVERSE VOLTAGE (VOLTS)
R
Figure 2. Current−Gain — Bandwidth Product
Figure 3. Capacitance
1.0 k
700
−1.0 k
100 ms
1.0 ms
−700
−500
500
t
s
300
200
−300
−200
1.0 s
T
= 25°C
C
T = 25°C
A
100
70
−100
−70
t
f
50
−50
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
V
= −40 V
CC
30
20
−30
−20
I /I = 10
C
B
= I
I
B1 B2
t
t @ V
d
= −0.5 V
r
BE(off)
T = 25°C
J
10
−10
−5.0 −7.0 −10
−20 −30
−50 −70 −100
−200 −300 −500
−1.0
−2.0 −3.0 −5.0 −7.0 −10
−20 −30 −50 −70 −100
I , COLLECTOR CURRENT (mA)
C
V
CE
, COLLECTOR−EMITTER VOLTAGE (VOLTS)
Figure 4. Switching Time
Figure 5. Active−Region Safe Operating Area
400
−1.0
−0.8
−0.6
−0.4
T = 25°C
J
T = 125°C
J
V
CE
= −1.0 V
V
@ I /I = 10
C B
BE(sat)
200
25°C
V
BE(on)
@ V = −1.0 V
CE
−55°C
100
80
−0.2
0
60
V
@ I /I = 10
C B
CE(sat)
40
−0.5 −1.0 −2.0
−5.0 −10 −20
−50 −100 −200
−500
−0.5 −1.0 −2.0
−5.0 −10 −20
−50 −100 −200 −500
I , COLLECTOR CURRENT (mA)
C
I , COLLECTOR CURRENT (mA)
C
Figure 6. DC Current Gain
Figure 7. “ON” Voltages
http://onsemi.com
3
MMBTA56WT1
−0.8
−1.0
−0.8
−0.6
−0.4
T = 25°C
J
−1.2
−1.6
−2.0
I
=
I
=
I
=
I
=
C
C
C
C
−250 mA
−100 mA
−50 mA
−500 mA
R
for V
BE
q
VB
I
=
C
−10 mA
−2.4
−2.8
−0.2
0
−0.5 −1.0 −2.0
−5.0 −10 −20
−50 −100 −200 −500
−0.05 −0.1 −0.2
−0.5 −1.0 −2.0 −5.0 −10 −20
−50
I , COLLECTOR CURRENT (mA)
C
I , BASE CURRENT (mA)
B
Figure 9. Base−Emitter Temperature
Coefficient
Figure 8. Collector Saturation Region
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4
MMBTA56WT1
PACKAGE DIMENSIONS
SC−70 (SOT−323)
CASE 419−04
ISSUE M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
D
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
e1
MILLIMETERS
INCHES
3
DIM
A
A1
A2
b
c
D
E
e
MIN
0.80
0.00
NOM
0.90
0.05
0.7 REF
0.35
0.18
2.10
1.24
1.30
MAX
1.00
0.10
MIN
0.032
0.000
NOM
0.035
0.002
0.028 REF
0.014
0.007
0.083
0.049
0.051
MAX
0.040
0.004
E
H
E
1
2
0.30
0.10
1.80
1.15
1.20
0.40
0.25
2.20
1.35
1.40
0.012
0.004
0.071
0.045
0.047
0.016
0.010
0.087
0.053
0.055
b
e
0.65 BSC
0.425 REF
2.10
0.026 BSC
0.017 REF
0.083
e1
L
H
2.00
2.40
0.079
0.095
E
c
STYLE 3:
A2
A
PIN 1. BASE
2. EMITTER
3. COLLECTOR
0.05 (0.002)
L
A1
SOLDERING FOOTPRINT*
0.65
0.025
0.65
0.025
1.9
0.075
0.9
0.035
0.7
0.028
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
MountingTechniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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USA/Canada
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Order Literature: http://www.onsemi.com/litorder
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Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
MMBTA56WT1/D
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