MMBTH10L [ONSEMI]

VHF/UHF Transistor; 甚高频/超高频晶体管
MMBTH10L
型号: MMBTH10L
厂家: ONSEMI    ONSEMI
描述:

VHF/UHF Transistor
甚高频/超高频晶体管

晶体 晶体管
文件: 总6页 (文件大小:56K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MMBTH10LT1,  
MMBTH10−4LT1  
Preferred Devices  
VHF/UHF Transistor  
NPN Silicon  
Device Marking: 3EM  
http://onsemi.com  
Device Marking:  
Features  
COLLECTOR  
3
Pb−Free Package May be Available. The G−Suffix Denotes a  
Pb−Free Lead Finish  
1
BASE  
MAXIMUM RATINGS  
2
EMITTER  
Rating  
Symbol  
Value  
25  
Unit  
Vdc  
Vdc  
Vdc  
Collector-Emitter Voltage  
Collector-Base Voltage  
Emitter-Base Voltage  
V
CEO  
V
CBO  
V
EBO  
30  
3.0  
3
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
1
Total Device Dissipation  
FR−5 Board (Note 1)  
P
D
2
T
= 25°C  
225  
1.8  
mW  
mW/°C  
A
CASE 318  
SOT−23  
Derate above 25°C  
STYLE 6  
Thermal Resistance,  
Junction to Ambient (Note 1)  
R
556  
°C/W  
θJA  
Total Device Dissipation  
Alumina Substrate (Note 2)  
P
D
T
= 25°C  
300  
2.4  
mW  
mW/°C  
ORDERING INFORMATION  
A
Derate above 25°C  
Device  
Package  
Shipping  
Thermal Resistance,  
Junction to Ambient (Note 2)  
R
417  
°C/W  
°C  
θJA  
MMBTH10LT1  
SOT−23  
3000/Tape & Reel  
3000/Tape & Reel  
MMBTH10LT1G  
SOT−23  
(Pb−Free)  
Junction and Storage  
Temperature Range  
T , T  
J stg  
−55 to  
+150  
MMBTH10−4LT1  
SOT−23  
3000/Tape & Reel  
1. FR−5 = 1.0 x 0.75 x 0.062 in.  
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Preferred devices are recommended choices for future use  
and best overall value.  
Semiconductor Components Industries, LLC, 2003  
1
Publication Order Number:  
December, 2003 − Rev. 2  
MMBTH10LT1/D  
 
MMBTH10LT1, MMBTH10−4LT1  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collector−Emitter Breakdown Voltage  
(I = 1.0 mAdc, I = 0)  
V
V
25  
30  
3.0  
Vdc  
Vdc  
(BR)CEO  
C
B
Collector−Base Breakdown Voltage  
(I = 100 µAdc, I = 0)  
(BR)CBO  
C
E
Emitter−Base Breakdown Voltage  
(I = 10 µAdc, I = 0)  
V
Vdc  
(BR)EBO  
E
C
Collector Cutoff Current  
(V = 25 Vdc, I = 0)  
I
100  
100  
nAdc  
nAdc  
CBO  
CB  
Emitter Cutoff Current  
(V = 2.0 Vdc, I = 0)  
E
I
EBO  
EB  
C
ON CHARACTERISTICS  
DC Current Gain  
(I = 4.0 mAdc, V  
C
h
FE  
= 10 Vdc)  
CE  
MMBTH10LT1  
MMBTH10−4LT1  
60  
120  
240  
Collector−Emitter Saturation Voltage  
(I = 4.0 mAdc, I = 0.4 mAdc)  
V
0.5  
Vdc  
Vdc  
CE(sat)  
C
B
Base−Emitter On Voltage  
(I = 4.0 mAdc, V = 10 Vdc)  
V
BE  
0.95  
C
CE  
SMALL−SIGNAL CHARACTERISTICS  
Current−Gain − Bandwidth Product  
f
T
MHz  
(I = 4.0 mAdc, V  
= 10 Vdc, f = 100 MHz)  
MMBTH10LT1  
MMBTH10−4LT1  
650  
800  
C
CE  
Collector−Base Capacitance  
(V = 10 Vdc, I = 0, f = 1.0 MHz)  
C
0.7  
0.65  
9.0  
pF  
pF  
ps  
cb  
CB  
Common−Base Feedback Capacitance  
(V = 10 Vdc, I = 0, f = 1.0 MHz)  
E
C
rb  
CB  
Collector Base Time Constant  
(I = 4.0 mAdc, V = 10 Vdc, f = 31.8 MHz)  
E
rbC  
c
C
CB  
http://onsemi.com  
2
                 
                 
                 
10  
20  
30  
MMBTH10LT1, MMBTH10−4LT1  
TYPICAL CHARACTERISTICS  
COMMON−BASE y PARAMETERS versus FREQUENCY  
(V  
= 10 Vdc, I = 4.0 mAdc, T = 25°C)  
CB  
C A  
y
ib  
, INPUT ADMITTANCE  
0
80  
70  
60  
50  
40  
30  
20  
g
ib  
−ꢀ10  
−ꢀ20  
−ꢀb  
ib  
1000 MHz  
−ꢀ30  
700  
−ꢀ40  
−ꢀ50  
400  
200  
100  
10  
0
−ꢀ60  
1000  
100  
200  
300  
400 500  
700  
0
10  
20  
30  
40  
g (mmhos)  
ib  
50  
60  
70  
80  
f, FREQUENCY (MHz)  
Figure 1. Rectangular Form  
Figure 2. Polar Form  
y
fb  
, FORWARD TRANSFER ADMITTANCE  
70  
60  
50  
60  
400  
b
fb  
200  
50  
600  
100  
40  
30  
700  
−ꢀg  
fb  
40  
30  
20  
10  
0
1000 MHz  
20  
10  
1000  
100  
200  
300  
400 500  
700  
70  
60  
50  
40  
30  
g
20  
10  
0
−ꢀ10 −ꢀ20 −ꢀ30  
f, FREQUENCY (MHz)  
(mmhos)  
fb  
Figure 3. Rectangular Form  
Figure 4. Polar Form  
http://onsemi.com  
3
MMBTH10LT1, MMBTH10−4LT1  
TYPICAL CHARACTERISTICS  
COMMON−BASE y PARAMETERS versus FREQUENCY  
(V  
= 10 Vdc, I = 4.0 mAdc, T = 25°C)  
CB  
C A  
y , REVERSE TRANSFER ADMITTANCE  
rb  
0
5.0  
4.0  
100  
200  
−ꢀ1.0  
MPS H11  
400  
700  
3.0  
2.0  
1.0  
−ꢀ2.0  
−ꢀ3.0  
−b  
rb  
−b  
rb  
MPS H10  
−ꢀ4.0  
−ꢀ5.0  
−g  
rb  
1000 MHz  
0.4 0.8 1.2 1.6 2.0  
0
1000  
−2.0 −1.8 −1.2 −0.8 −0.4  
0
100  
200  
300  
400 500  
700  
f, FREQUENCY (MHz)  
g (mmhos)  
rb  
Figure 5. Rectangular Form  
Figure 6. Polar Form  
y
ob  
, OUTPUT ADMITTANCE  
10  
10  
1000 MHz  
9.0  
8.0  
7.0  
8.0  
700  
6.0  
5.0  
6.0  
4.0  
b
ob  
4.0  
3.0  
400  
200  
2.0  
1.0  
0
2.0  
0
g
ob  
100  
1000  
0
2.0  
4.0  
g
6.0  
8.0  
10  
100  
200  
300  
400 500  
700  
f, FREQUENCY (MHz)  
(mmhos)  
ob  
Figure 7. Rectangular Form  
Figure 8. Polar Form  
http://onsemi.com  
4
MMBTH10LT1, MMBTH10−4LT1  
PACKAGE DIMENSIONS  
SOT−23  
(TO−236AB)  
CASE 318−08  
ISSUE AH  
NOTES:  
ꢁꢂ1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
ꢁꢂ2. CONTROLLING DIMENSION: INCH.  
ꢁꢂ3. MAXIMUM LEAD THICKNESS INCLUDES LEAD  
FINISH THICKNESS. MINIMUM LEAD THICKNESS  
IS THE MINIMUM THICKNESS OF BASE  
MATERIAL.  
A
L
ꢁꢂ4. 318−03 AND −07 OBSOLETE, NEW STANDARD  
318−08.  
3
INCHES  
DIM MIN MAX  
MILLIMETERS  
S
C
B
MIN  
2.80  
1.20  
0.89  
0.37  
1.78  
MAX  
3.04  
1.40  
1.11  
0.50  
2.04  
0.100  
0.177  
0.69  
1.02  
2.64  
0.60  
1
2
A
B
C
D
G
H
J
0.1102 0.1197  
0.0472 0.0551  
0.0350 0.0440  
0.0150 0.0200  
0.0701 0.0807  
V
G
0.0005 0.0040 0.013  
0.0034 0.0070 0.085  
K
L
0.0140 0.0285  
0.0350 0.0401  
0.0830 0.1039  
0.0177 0.0236  
0.35  
0.89  
2.10  
0.45  
S
V
H
J
D
K
STYLE 6:  
PIN 1. BASE  
2. EMITTER  
3. COLLECTOR  
SOLDERING FOOTPRINT*  
0.95  
0.037  
0.95  
0.037  
2.0  
0.079  
0.9  
0.035  
0.8  
0.031  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
Figure 9. SOT−23  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
5
MMBTH10LT1, MMBTH10−4LT1  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
MMBTH10LT1/D  

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