MMBZ27VCWT3G [ONSEMI]

40 Watt Peak Power Zener Surge Protection Device;


型号：	MMBZ27VCWT3G
厂家：	ONSEMI
描述：	40 Watt Peak Power Zener Surge Protection Device
文件：	总5页 (文件大小：120K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

40 Watt Peak Power

Zener Surge Protection

Device

SC−70 Dual Common Cathode Zeners

MMBZ27VCW

These dual monolithic silicon zener diodes are designed for

applications requiring transient overvoltage protection capability. They

are intended for use in voltage and ESD sensitive equipment such as

computers, printers, business machines, communication systems,

medical equipment and other applications. Their dual junction common

cathode design protects two separate lines using only one package.

These devices are ideal for situations where board space is at a

premium.

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PIN 1. ANODE

2. ANODE

3. CATHODE

Specification Features:

• SC−70 Package Allows Either Two Separate Unidirectional

Configurations or a Single Bidirectional Configuration

• Working Peak Reverse Voltage Range − 22 V

• Standard Zener Breakdown Voltage − 27 V

MARKING

DIAGRAM

AC MG

• Peak Power − 40 W @ 1.0 ms (Bidirectional),

SC−70

CASE 419

STYLE 4

per Figure 4 Waveform

• ESD Rating of Class N (exceeding 16 kV) per the Human

Body Model

AC = Specific Device Code

• Low Leakage < 100 nA

= Date Code

= Pb−Free Package

• Flammability Rating: UL 94 V−O

(Note: Microdot may be in either location)

• SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

ORDERING INFORMATION

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

†

Device

Package

Shipping

MMBZ27VCWT1G

SC−70

(Pb−Free)

3000 / Tape &

Reel

Mechanical Characteristics:

CASE: Void-free, transfer-molded, thermosetting plastic case

FINISH: Corrosion resistant finish, easily solderable

MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

260°C for 10 Seconds

SZMMBZ27VCWT1G

MMBZ27VCWT3G

SC−70

(Pb−Free)

3000 / Tape &

Reel

SC−70

(Pb−Free)

10000 / Tape &

Reel

SZMMBZ27VCWT3G

SC−70

(Pb−Free)

10000 / Tape &

Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Publication Order Number:

August, 2020 − Rev. 3

MMBZ27VCW/D

MMBZ27VCW

MAXIMUM RATINGS

Rating

Peak Power Dissipation @ 1.0 ms (Note 1) @ T ≤ 25°C

Symbol

Value

Unit

Watts

Total Power Dissipation on FR−5 Board (Note 2) @ T = 25°C

°P °

200

1.6

°mW°

mW/°C

Derate above 25°C

Thermal Resistance Junction−to−Ambient

Junction and Storage Temperature Range

618

°C/W

°C

T , T

− 55 to +150

stg

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Nonrepetitive current pulse per Figure 4 and derate above T = 25°C per Figure 5.

2. FR−5 = 1.0 x 0.75 x 0.62 in.

ELECTRICAL CHARACTERISTICS

(T = 25°C unless otherwise noted)

UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3)

Symbol

Parameter

Maximum Reverse Peak Pulse Current

Clamping Voltage @ I

BR RWM

Working Peak Reverse Voltage

RWM

Maximum Reverse Leakage Current @ V

RWM

Breakdown Voltage @ I

Test Current

Maximum Temperature Coefficient of V

Forward Current

Uni−Directional TVS

Forward Voltage @ I

ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)

UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3)

(V = 1.1 V Max @ I = 200 mA)

Breakdown Voltage

@ I (Note 4)

(Note 3) (V)

@ I

RWM

@ V

RWM

Device

mV/5C

Volts

Min

Nom

Max

Marking

Device

MMBZ27VCWT1G,

SZMMBZ27VCWT1G,

MMBZ27VCWT3G,

SZMMBZ27VCWT3G

25.65

28.35

1.0

3. V measured at pulse test current I at an ambient temperature of 25°C.

4. Surge current waveform per Figure 4 and derate per Figure 5

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MMBZ27VCW

TYPICAL CHARACTERISTICS

BIDIRECTIONAL

-ꢀ55

+ꢀ25

+ꢀ85

+ꢀ125

TEMPERATURE (°C)

Figure 1. Typical Breakdown Voltage

versus Temperature

10000

100

300

250

200

ALUMINA SUBSTRATE

150

100

FR-5 BOARD

0.1

0.01

-ꢀ40

+ꢀ25

+ꢀ85

+ꢀ125

100

125

150

175

TEMPERATURE (°C)

Figure 2. Typical Leakage Current

versus Temperature

Figure 3. Steady State Power Derating Curve

100

PULSE WIDTH (t ) IS DEFINED

AS THAT POINT WHERE THE

t ≤ 10 ms

PEAK CURRENT DECAYS TO

50% OF I .

PEAK VALUEꢁ—ꢁI

100

HALF VALUEꢁ—

100

125

150

175

200

T , AMBIENT TEMPERATURE (°C)

t, TIME (ms)

Figure 4. Pulse Waveform

Figure 5. Pulse Derating Curve

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MMBZ27VCW

TYPICAL APPLICATIONS

Batt

Single Wire

CAN Transceiver

47 mH

Bus

Loss of

Ground

Protection

Circuit

Load

9.09 kW 1%

Load

GND

220 pF 10%

*ESD Protection − MMBZ27VCWT1 or equivalent. May be

located in each ECU (C needs to be reduced accordingly)

Load

or at a central point near the DLC.

Figure 6. Single Wire CAN Network

Figure is the recommended solution for transient EMI/ESD protection. This circuit is shown in the

Society of Automotive Engineers February, 2000 J2411 “Single Wire CAN Network for Vehicle Applications” specification

(Figure 6, page 11). Note: the dual common anode zener configuration shown above is electrically equivalent to a dual common

cathode zener configuration.

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MMBZ27VCW

PACKAGE DIMENSIONS

SC−70 (SOT−323)

CASE 419−04

ISSUE N

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

MILLIMETERS

INCHES

DIM

MIN

0.80

0.00

NOM

0.90

0.05

0.70 REF

0.35

0.18

2.10

1.24

1.30

0.65 BSC

0.38

MAX

1.00

0.10

MIN

0.032

0.000

NOM

0.035

0.002

0.028 REF

0.014

0.007

0.083

0.049

0.051

0.026 BSC

0.015

MAX

0.040

0.004

0.30

0.10

1.80

1.15

1.20

0.40

0.25

2.20

1.35

1.40

0.012

0.004

0.071

0.045

0.047

0.016

0.010

0.087

0.053

0.055

0.20

2.00

0.56

2.40

0.008

0.079

0.022

0.095

2.10

0.083

STYLE 4:

PIN 1. CATHODE

2. CATHODE

3. ANODE

0.05 (0.002)

SOLDERING FOOTPRINT*

0.65

0.025

0.65

0.025

1.9

0.075

0.9

0.035

0.7

0.028

inches

SCALE 10:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

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TECHNICAL SUPPORT

North American Technical Support:

Voice Mail: 1 800−282−9855 Toll Free USA/Canada

Phone: 011 421 33 790 2910

Europe, Middle East and Africa Technical Support:

Phone: 00421 33 790 2910

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