MMBZ39VCLT3G [ONSEMI]
Zener Diode Protection, Common Cathode, 40 Watt Peak Power, SOT-23;
| 型号： | MMBZ39VCLT3G |
| 厂家： | 
ONSEMI |
| 描述： | Zener Diode Protection, Common Cathode, 40 Watt Peak Power, SOT-23 二极管 瞬态抑制器 |
| 文件： | 总8页 (文件大小：54K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MMBZ15VDLT1,
MMBZ27VCLT1
Preferred Devices
40 Watt Peak Power
Zener Transient Voltage
Suppressors
http://onsemi.com
SOT–23 Dual Common Cathode Zeners
for ESD Protection
1
These dual monolithic silicon zener diodes are designed for
applications requiring transient overvoltage protection capability. They
are intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment and other applications. Their dual junction common
cathode design protects two separate lines using only one package.
These devices are ideal for situations where board space is at a
premium.
3
2
PIN 1. ANODE
2. ANODE
3. CATHODE
3
Specification Features:
• SOT–23 Package Allows Either Two Separate Unidirectional
Configurations or a Single Bidirectional Configuration
• Working Peak Reverse Voltage Range – 12.8 V, 22 V
1
2
SOT–23
CASE 318
STYLE 9
• Standard Zener Breakdown Voltage Range – 15 V, 27 V
• Peak Power – 40 Watts @ 1.0 ms (Bidirectional),
per Figure 5. Waveform
• ESD Rating of Class N (exceeding 16 kV) per the Human
Body Model
MARKING DIAGRAM
• Maximum Clamping Voltage @ Peak Pulse Current
• Low Leakage < 100 nA
xxx
• Flammability Rating UL 94V–O
Mechanical Characteristics:
xxx = 15D or 27C
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
Package designed for optimal automated board assembly
Small package size for high density applications
Available in 8 mm Tape and Reel
M
= Date Code
ORDERING INFORMATION
Device
Package
SOT–23
SOT–23
SOT–23
Shipping
MMBZ15VDLT1
MMBZ15VDLT3
MMBZ27VCLT1
3000/Tape & Reel
10,000/Tape & Reel
3000/Tape & Reel
Use the Device Number to order the 7 inch/3,000 unit reel.
Replace the “T1” with “T3” in the Device Number to order the
13 inch/10,000 unit reel.
Preferred devices are recommended choices for future use
and best overall value.
Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
April, 2001 – Rev. 5
MMBZ15VDLT1/D
MMBZ15VDLT1, MMBZ27VCLT1
MAXIMUM RATINGS
Rating
Peak Power Dissipation @ 1.0 ms (Note 1.) @ T ≤ 25°C
Symbol
Value
Unit
P
pk
40
Watts
L
Total Power Dissipation on FR–5 Board (Note 2.) @ T = 25°C
Derate above 25°C
°P °
D
225
1.8
°mW°
mW/°C
A
Thermal Resistance Junction to Ambient
R
556
°C/W
θ
JA
Total Power Dissipation on Alumina Substrate (Note 3.) @ T = 25°C
Derate above 25°C
°P °
D
300
2.4
°mW
mW/°C
A
Thermal Resistance Junction to Ambient
Junction and Storage Temperature Range
Lead Solder Temperature – Maximum (10 Second Duration)
R
417
– 55 to +150
230
°C/W
°C
θ
JA
T , T
J
stg
T
°C
L
1. Non–repetitive current pulse per Figure 5. and derate above T = 25°C per Figure 6.
A
2. FR–5 = 1.0 x 0.75 x 0.62 in.
3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
ELECTRICAL CHARACTERISTICS
I
(T = 25°C unless otherwise noted)
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3)
A
I
F
Symbol
Parameter
I
PP
Maximum Reverse Peak Pulse Current
V
C
Clamping Voltage @ I
PP
V
C
V
V
BR RWM
V
I
V
F
V
RWM
Working Peak Reverse Voltage
R
T
I
I
R
Maximum Reverse Leakage Current @ V
RWM
V
Breakdown Voltage @ I
Test Current
BR
T
I
T
I
PP
QV
Maximum Temperature Coefficient of V
BR
BR
I
F
Forward Current
Uni–Directional TVS
V
F
Forward Voltage @ I
F
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2
MMBZ15VDLT1, MMBZ27VCLT1
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3)
(VF = 0.9 V Max @ IF = 10 mA)
Breakdown Voltage
V @ I (Note 5.)
C PP
V
BR
(Note 4.) (V)
@ I
V
C
I
PP
V
RWM
I
R
@ V
QV
BR
T
RWM
Device
mV/5C
12
Volts
nA
Min
14.3
Nom
Max
mA
V
A
Marking
Device
MMBZ15VDLT1
15D
12.8
100
15
15.8
1.0
21.2
1.9
(VF = 1.1 V Max @ IF = 200 mA)
Breakdown Voltage
V
C
@ I (Note 5.)
PP
V
BR
(Note 4.) (V)
@ I
V
C
I
PP
V
RWM
I
R
@ V
QV
T
RWM
BR
Device
mV/5C
26
Volts
nA
Min
Nom
Max
mA
V
A
Marking
Device
MMBZ27VCLT1
27C
22
50
25.65
27
28.35
1.0
38
1.0
4. V measured at pulse test current I at an ambient temperature of 25°C.
BR
T
5. Surge current waveform per Figure 5. and derate per Figure 6.
TYPICAL CHARACTERISTICS
MMBZ15VDLT1
MMBZ27VCLT1
17
16
15
29
28
27
BIDIRECTIONAL
BIDIRECTIONAL
14
13
26
25
UNIDIRECTIONAL
-ā40
+ā25
+ā85
+ā125
-ā55
+ā25
+ā85
+ā125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 1. Typical Breakdown Voltage
versus Temperature
Figure 2. Typical Breakdown Voltage
versus Temperature
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3
MMBZ15VDLT1, MMBZ27VCLT1
10000
100
10
1
0.1
0.01
-ā40
+ā25
+ā85
+ā125
TEMPERATURE (°C)
Figure 3. Typical Leakage Current
versus Temperature
300
250
200
PULSE WIDTH (t ) IS DEFINED
P
AS THAT POINT WHERE THE
PEAK CURRENT DECAYS TO
t ≤ 10 ms
r
ALUMINA SUBSTRATE
50% OF I
.
PP
PEAK VALUEĂĊĂI
PP
100
50
0
I
PP
150
100
50
HALF VALUEĂĊ
2
FR-5 BOARD
t
P
0
0
25
50
75
100
125
150
175
0
1
2
3
4
TEMPERATURE (°C)
t, TIME (ms)
Figure 4. Steady State Power Derating Curve
Figure 5. Pulse Waveform
100
90
80
70
60
50
40
30
20
10
0
0
25
50
75
100
125
150
175
200
T , AMBIENT TEMPERATURE (°C)
A
Figure 6. Pulse Derating Curve
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4
MMBZ15VDLT1, MMBZ27VCLT1
INFORMATION FOR USING THE SOT–23 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.037
0.95
0.037
0.95
0.079
2.0
0.035
0.9
0.031
0.8
inches
mm
SOT–23
SOT–23 POWER DISSIPATION
The power dissipation of the SOT–23 is a function of the
SOLDERING PRECAUTIONS
drain pad size. This can vary from the minimum pad size
for soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference shall be a maximum of 10°C.
• The soldering temperature and time shall not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the
maximum temperature gradient shall be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied
during cooling.
determined by T
, the maximum rated junction
J(max)
temperature of the die, R , the thermal resistance from
θJA
the device junction to ambient, and the operating
temperature, T . Using the values provided on the data
A
sheet for the SOT–23 package, P can be calculated as
D
follows:
TJ(max) – TA
PD =
Rθ
JA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature T of 25°C,
A
one can calculate the power dissipation of the device which
in this case is 225 milliwatts.
150°C – 25°C
PD =
= 225 milliwatts
556°C/W
The 556°C/W for the SOT–23 package assumes the use
of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 225
milliwatts. There are other alternatives to achieving higher
power dissipation from the SOT–23 package. Another
alternative would be to use a ceramic substrate or an
aluminum core board such as Thermal Clad . Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
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5
MMBZ15VDLT1, MMBZ27VCLT1
Transient Voltage Suppressors – Surface Mount
40 Watts Peak Power
SOT–23
TO–236AB
CASE 318–08
ISSUE AF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
A
L
3
INCHES
DIM MIN MAX
MILLIMETERS
S
C
B
MIN
2.80
1.20
0.89
0.37
1.78
0.013
0.085
0.35
0.89
2.10
0.45
MAX
3.04
1.40
1.11
1
2
A
B
C
D
G
H
J
0.1102 0.1197
0.0472 0.0551
0.0350 0.0440
0.0150 0.0200
0.0701 0.0807
0.0005 0.0040
0.0034 0.0070
0.0140 0.0285
0.0350 0.0401
0.0830 0.1039
0.0177 0.0236
V
G
0.50
2.04
0.100
0.177
0.69
1.02
2.64
0.60
K
L
S
V
H
J
D
K
STYLE 9:
PIN 1. ANODE
2. ANODE
3. CATHODE
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6
MMBZ15VDLT1, MMBZ27VCLT1
Notes
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7
MMBZ15VDLT1, MMBZ27VCLT1
Thermal Clad is a trademark of the Bergquist Company
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
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attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
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MMBZ15VDLT1/D
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