MMDL6050T1G [ONSEMI]

Switching Diode; 开关二极管
MMDL6050T1G
型号: MMDL6050T1G
厂家: ONSEMI    ONSEMI
描述:

Switching Diode
开关二极管

二极管 开关 光电二极管
文件: 总3页 (文件大小:48K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MMDL6050T1  
Switching Diode  
Features  
Pb−Free Package is Available  
http://onsemi.com  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
1
2
Continuous Reverse Voltage  
V
70  
Vdc  
R
CATHODE  
ANODE  
Peak Forward Current  
I
200  
500  
mAdc  
mAdc  
F
Peak Forward Surge Current  
I
FM(surge)  
2
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
1
Total Device Dissipation FR-5 Board  
P
D
(Note 1) @T = 25°C  
200  
1.57  
mW  
mW/°C  
A
Derate above 25°C  
PLASTIC  
SOD−323  
CASE 477  
STYLE 1  
Thermal Resistance, Junction−to−Ambient  
Junction and Storage Temperature  
RqJA  
635  
°C/W  
°C  
T , T  
−55 to 150  
J
stg  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
MARKING DIAGRAM  
1. FR-4 Minimum Pad.  
5A M G  
G
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
OFF CHARACTERISTICS  
Reverse Breakdown Voltage  
Symbol Min Max  
Unit  
5A = Device Code  
M
= Date Code*  
V
70  
Vdc  
mAdc  
Vdc  
(BR)  
G
= Pb−Free Package  
(I  
= 100 mAdc)  
(BR)  
(Note: Microdot may be in either location)  
*Date Code orientation may vary depending  
upon manufacturing location.  
Reverse Voltage Leakage Current  
(V = 50 Vdc)  
R
I
0.1  
R
Forward Voltage  
V
F
(I = 1.0 mAdc)  
(I = 100 mAdc)  
F
0.55  
0.85  
0.7  
1.1  
F
ORDERING INFORMATION  
Reverse Recovery Time  
t
4.0  
ns  
rr  
Device  
Package  
Shipping  
(I = I = 10 mAdc, I = 1.0 mAdc)  
F
R
R(REC)  
(Figure 1)  
MMDL6050T1  
MMDL6050T1G  
SOD−323  
3000/Tape & Reel  
3000/Tape & Reel  
Capacitance  
(V = 0 V)  
R
C
2.5  
pF  
SOD−323  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
February, 2006 − Rev. 3  
MMDL6050T1/D  
 
MMDL6050T1  
820 W  
I
F
+10 V  
t
r
t
p
t
2.0 k  
0.1 mF  
I
F
t
t
100 mH  
rr  
10%  
90%  
0.1 mF  
D.U.T.  
i
= 1.0 mA  
R(REC)  
50 W OUTPUT  
PULSE  
GENERATOR  
50 W INPUT  
SAMPLING  
OSCILLOSCOPE  
I
R
V
R
OUTPUT PULSE  
(I = I = 10 mA; MEASURED  
INPUT SIGNAL  
F
R
at i  
= 1.0 mA)  
R(REC)  
Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (I ) of 10 mA.  
F
Notes: 2. Input pulse is adjusted so I  
is equal to 10 mA.  
R(peak)  
Notes: 3. t » t  
p
rr  
Figure 1. Recovery Time Equivalent Test Circuit  
10  
100  
10  
T = 150°C  
A
T = 85°C  
A
T = 125°C  
A
1.0  
T = −ꢀ40°C  
A
T = 85°C  
A
0.1  
T = 55°C  
A
1.0  
T = 25°C  
A
0.01  
T = 25°C  
A
0.001  
0.1  
0.2  
50  
0.4  
0.6  
0.8  
1.0  
1.2  
0
10  
20  
30  
40  
V , FORWARD VOLTAGE (VOLTS)  
F
V , REVERSE VOLTAGE (VOLTS)  
R
Figure 2. Forward Voltage  
Figure 3. Leakage Current  
0.68  
0.64  
0.60  
0.56  
0.52  
0
2
4
6
8
V , REVERSE VOLTAGE (VOLTS)  
R
Figure 4. Capacitance  
http://onsemi.com  
2
MMDL6050T1  
PACKAGE DIMENSIONS  
SOD−323  
CASE 477−02  
ISSUE G  
NOTES:  
H
E
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING  
WITH SOLDER PLATING.  
D
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
5. DIMENSION L IS MEASURED FROM END OF  
RADIUS.  
1
E
b
2
MILLIMETERS  
DIM MIN NOM MAX MIN  
0.80  
INCHES  
NOM MAX  
1.00 0.031 0.035 0.040  
0.10 0.000 0.002 0.004  
0.006 REF  
A3  
A
A
0.90  
0.05  
A1 0.00  
A3  
0.15 REF  
0.32  
0.12 0.177 0.003 0.005 0.007  
1.70  
1.25  
b
C
D
E
L
0.25  
0.089  
1.60  
1.15  
0.08  
2.30  
0.4 0.010 0.012 0.016  
1.80 0.062 0.066 0.070  
1.35 0.045 0.049 0.053  
0.003  
L
A1  
C
NOTE 5  
NOTE 3  
H
E
2.50  
2.70 0.090 0.098 0.105  
STYLE 1:  
PIN 1. CATHODE  
2. ANODE  
SOLDERING FOOTPRINT*  
0.63  
0.025  
0.83  
0.033  
1.60  
0.063  
2.85  
0.112  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
MMDL6050T1/D  

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