MMQA13VT1G [ONSEMI]
ESD Protector, Common Anode, SC-59;
| 型号： | MMQA13VT1G |
| 厂家： | 
ONSEMI |
| 描述： | ESD Protector, Common Anode, SC-59 局域网 光电二极管 |
| 文件： | 总7页 (文件大小：81K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MMQA, SZMMQA Quad
Common Anode Series
SC-74 Quad Monolithic
Common Anode
Transient Voltage Suppressors for ESD
Protection
www.onsemi.com
SC−74 QUAD TRANSIENT
VOLTAGE SUPPRESSOR
24 WATTS PEAK POWER
5.6 − 33 VOLTS
This quad monolithic silicon voltage suppressor is designed for
applications requiring transient overvoltage protection capability. It is
intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment, and other applications. Its quad junction common
anode design protects four separate lines using only one package.
These devices are ideal for situations where board space is at a
premium.
SC−74
CASE 318F
STYLE 1
Features
• SC−74 Package Allows Four Separate Unidirectional Configurations
• Peak Power − Min. 24 W @ 1.0 ms (Unidirectional),
per Figure 5 Waveform
PIN ASSIGNMENT
• Peak Power − Min. 150 W @ 20 ms (Unidirectional),
per Figure 6 Waveform
PIN 1. CATHODE
2. ANODE
1
2
3
6
5
4
• Maximum Clamping Voltage @ Peak Pulse Current
• Low Leakage < 2.0 mA
3. CATHODE
4. CATHODE
5. ANODE
• ESD Rating of Class 3B (exceeding 16 kV) per the Human Body
6. CATHODE
Model
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
MARKING DIAGRAM
• These Devices are Pb−Free and are RoHS Compliant*
xxxMG
G
xxx = Specific Device Code
M
= Date Cade
G
= Pb−Free Package
(Note: Microdot may be in either location)
DEVICE MARKING & ORDERING
INFORMATION
See specific marking and ordering information in the device
marking and ordering information table on page 6 of this data
sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
January, 2015 − Rev. 11
MMQA/D
MMQA, SZMMQA Quad Common Anode Series
THERMAL CHARACTERISTICS (T = 25°C Unless Otherwise Noted)
A
Characteristic
Symbol
Value
24
Unit
Peak Power Dissipation @ 1.0 ms (Note 1)
P
pk
W
@ T ≤ 25°C
A
Peak Power Dissipation @ 20 ms (Note 2)
P
pk
W
150
@ T ≤ 25°C
A
Total Power Dissipation on FR-5 Board (Note 3)
P
D
225
1.8
MW
mW/°C
@ T = 25°C
A
Thermal Resistance from Junction−to−Ambient
R
556
°C/W
q
JA
Total Power Dissipation on Alumina Substrate (Note 4)
P
D
@ T = 25°C
300
2.4
MW
mW/°C
A
Derate above 25°C
Thermal Resistance from Junction−to−Ambient
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum (10 Second Duration)
R
417
−55 to +150
260
°C/W
°C
q
JA
T , T
J
stg
T
°C
L
1. Non-repetitive current pulse per Figure 5 and derate above T = 25°C per Figure 4.
A
2. Non-repetitive current pulse per Figure 6 and derate above T = 25°C per Figure 4.
A
3. FR-5 = 1.0 x 0.75 x 0.62 in.
4. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
ELECTRICAL CHARACTERISTICS (T = 25°C Unless Otherwise Noted)
A
UNIDIRECTIONAL
(Circuit tied to pins 1, 2, and 5; Pins 2, 3, and 5; Pins 2, 4, and 5; or Pins 2, 5, and 6) (V = 0.9 V Max @ I = 10 mA)
F
F
Max
Max
Reverse
Voltage @
Capacitance
@ 0 Volt
Reverse
Leakage
Current
Bias, 1 MHz
Breakdown Voltage
Max
I
Maximum
Temperature
Coefficient
RSM
VZT
(Note 6)
Max Zener
Impedance
(Note 7)
Reverse
Surge
Current
(Note 8)
(Clamping
Voltage)
(V)
@ I
I
R
V
R
(pF)
of V
ZT
Z
Device
(Note 5)
ZZT @ IZT
(W) (mA)
IRSM
(A)
VRSM
(V)
Min
Nom
5.6
6.2
6.8
12
Max (mA) (nA) (V)
(mV/°C)
1.26
10.6
10.9
14
Min
−
Max
−
MMQA5V6T1G
5.32
5.88
6.51
7.14
12.6
13.7
15.8
18.9
21
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2000 3.0
700 4.0
500 4.3
400
300
300
80
3.0
2.66
2.45
1.39
1.29
1.1
8.0
9.0
MMQA6V2T1G/T3G 5.89
−
−
MMQA6V8T1G
MMQA12VT1G
MMQA13VT1G
MMQA15VT1G
MMQA18VT1G
6.46
11.4
12.4
14.3
17.1
9.8
100
−
250
−
75
75
75
75
75
75
75
75
75
9.1
9.8
11
17.3
18.6
21.7
26
13
80
15
−
−
15
80
16
−
−
18
14
15
17
18
21
25
80
0.923
0.84
0.758
0.694
0.615
0.504
19
−
−
MMQA20VT1G/T3G 19
20
80
28.6
31.7
34.6
39
20.1
22
−
−
MMQA22VT1G
MMQA24VT1G
MMQA27VT1G
MMQA33VT1G
20.9
22.8
25.7
31.4
22
23.1
25.2
28.4
34.7
80
−
−
24
100
125
200
25
−
−
27
28
−
−
33
48.6
37
−
−
5. Includes SZ-prefix devices where applicable.
6. V measured at pulse test current I at an ambient temperature of 25°C.
Z
T
7. Z is measured by dividing the AC voltage drop across the device by the AC current supplied. The specified limits are I
= 0.1 I
,
ZT
Z(AC)
Z(DC)
with AC frequency = 1 kHz.
8. Surge current waveform per Figure 5 and derate per Figure 4.
www.onsemi.com
2
MMQA, SZMMQA Quad Common Anode Series
TYPICAL CHARACTERISTICS
300
250
200
150
100
10,000
BIASED AT 0 V
BIASED AT 1 V
BIASED AT 50%
1,000
OF V NOM
Z
+150°C
100
10
0
+25°C
-40°C
50
0
5.6
6.8
20
27
33
5.6
6.8
12
20
27
33
V , NOMINAL ZENER VOLTAGE (V)
Z
V , NOMINAL ZENER VOLTAGE (V)
Z
Figure 1. Typical Capacitance
Figure 2. Typical Leakage Current
100
90
80
70
60
50
40
30
20
10
0
300
250
200
ALUMINA SUBSTRATE
150
100
50
FR‐5 BOARD
0
0
25
50
75
100
125
150
175
200
0
25
50
75
100
125
150
175
T , AMBIENT TEMPERATURE (°C)
A
T , AMBIENT TEMPERATURE (°C)
A
Figure 3. Steady State Power Derating Curve
Figure 4. Pulse Derating Curve
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3
MMQA, SZMMQA Quad Common Anode Series
TYPICAL CHARACTERISTICS
100
PULSE WIDTH (t ) IS DEFINED
P
AS THAT POINT WHERE THE
t
r
PEAK VALUE I
@ 8 ms
RSM
90
80
70
60
50
40
30
20
t
r
PEAK CURRENT DECAYS TO 50%
PULSE WIDTH (t ) IS DEFINED
P
AS THAT POINT WHERE THE
OF I
.
PEAK VALUEꢀ—ꢀI
RSM
RSM
100
50
0
t ≤ 10 ms
r
PEAK CURRENT DECAY = 8 ms
HALF VALUE I /2 @ 20 ms
RSM
I
RSM
HALF VALUEꢀ—
2
t
P
t
P
10
0
0
1
2
3
4
0
20
40
t, TIME (ms)
60
80
t, TIME (ms)
Figure 5. 10 × 1000 ms Pulse Waveform
Figure 6. 8 × 20 ms Pulse Waveform
200
180
160
140
120
100
80
100
RECTANGULAR
WAVEFORM, TA = 25°C
8 × 20 WAVEFORM AS PER FIGURE 6
10
UNIDIRECTIONAL
10 × 100 WAVEFORM AS PER FIGURE 5
60
40
20
0
1.0
0.1
1.0
10
100
1000
5.6
6.8
12
20
NOMINAL V
27
33
PW, PULSE WIDTH (ms)
Z
Figure 7. Maximum Non−Repetitive Surge
Power, Ppk versus PW
Figure 8. Typical Maximum Non−Repetitive
Surge Power, Ppk versus VZ
Power is defined as V
x I (pk) where V
is the clamping voltage at I (pk).
RSM Z
RSM
Z
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4
MMQA, SZMMQA Quad Common Anode Series
TYPICAL COMMON ANODE APPLICATIONS
A quad junction common anode design in a SC-74
package protects four separate lines using only one package.
This adds flexibility and creativity to PCB design especially
when board space is at a premium. A simplified example of
MMQA/SZMMQA Series Device applications is illustrated
below.
A
B
KEYBOARD
TERMINAL
PRINTER
ETC.
FUNCTIONAL
DECODER
C
I/O
D
GND
MMQA/SZMMQA SERIES DEVICE
Figure 9. Computer Interface Protection
V
DD
V
GG
ADDRESS BUS
RAM
ROM
DATA BUS
CPU
I/O
CLOCK
CONTROL BUS
GND
MMQA/SZMMQA SE-
RIES DEVICE
Figure 10. Microprocessor Protection
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5
MMQA, SZMMQA Quad Common Anode Series
DEVICE MARKING AND ORDERING INFORMATION
Device*
MMQA5V6T1G
Device Marking
5A6
Package
Shipping
3,000/Tape & Reel
3,000/Tape & Reel
10,000/Tape & Reel
3,000/Tape & Reel
3,000/Tape & Reel
3,000/Tape & Reel
3,000/Tape & Reel
3,000/Tape & Reel
3,000/Tape & Reel
10,000/Tape & Reel
3,000/Tape & Reel
3,000/Tape & Reel
3,000/Tape & Reel
10,000/Tape & Reel
3,000/Tape & Reel
MMQA6V2T1G
MMQA6V2T3G
MMQA6V8T1G
MMQA12VT1G
MMQA13VT1G
MMQA15VT1G
MMQA18VT1G
MMQA20VT1G
MMQA20VT3G
MMQA22VT1G
MMQA24VT1G
MMQA27VT1G
MMQA27VT3G
MMQA33VT1G
6A2
6A2
6A8
12A
13A
15A
SC−74
(Pb−Free)
18A
20A
20A
22A
24A
27A
27A
33A
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
*IncludeS SZ-prefix devices where applicable.
Mechanical Characteristics:
CASE: Void−free, Transfer−molded, Thermosetting Plastic Case.
FINISH: Corrosion resistant finish, easily solderable.
Package designed for optimal automated board assembly.
Small package size for high density applications.
Available in 8 mm Tape and Reel.
Use the Device Number to order the 7 inch/3,000 unit reel.
Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel.
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6
MMQA, SZMMQA Quad Common Anode Series
PACKAGE DIMENSIONS
SC−74
CASE 318F−05
ISSUE N
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. 318F−01, −02, −03, −04 OBSOLETE. NEW STANDARD
318F−05.
6
5
2
4
E
H
E
1
3
MILLIMETERS
INCHES
NOM
0.039
0.002
0.015
0.007
0.118
0.059
0.037
0.016
0.108
−
DIM
A
A1
b
c
D
E
e
L
H
E
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0°
NOM
1.00
0.06
0.37
0.18
3.00
1.50
0.95
0.40
2.75
−
MAX
MIN
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
0°
MAX
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
10°
1.10
0.10
0.50
0.26
3.10
1.70
1.05
0.60
3.00
10°
b
e
q
C
A
0.05 (0.002)
q
L
A1
STYLE 1:
PIN 1. CATHODE
2. ANODE
SOLDERING FOOTPRINT*
3. CATHODE
4. CATHODE
5. ANODE
2.4
6. CATHODE
0.094
0.95
0.037
1.9
0.074
0.95
0.037
0.7
0.028
1.0
0.039
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
MMQA/D
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