MOCD223VM [ONSEMI]

8 引脚 SOIC 达灵顿输出光耦合器;
MOCD223VM
型号: MOCD223VM
厂家: ONSEMI    ONSEMI
描述:

8 引脚 SOIC 达灵顿输出光耦合器

输出元件 光电
文件: 总9页 (文件大小:219K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
8-pin SOIC Darlington  
Output Optocouplers  
MOC223M, MOCD223M  
Description  
SOIC8  
CASE 751DZ  
The MOC223M consists of a gallium arsenide infrared emitting  
diode optically coupled to a monolithic silicon photodarlington  
detector, in a surface mountable, small outline, plastic package.  
The MOCD223M is a dualchannel version of the MOC223M. They  
are ideally suited for high density applications, and eliminates the need  
for through the board mounting.  
MARKING DIAGRAMS  
8
1
8
Features  
$Y 223  
VXYYS  
$Y D223  
VXYYS  
High Current Transfer Ratio of 500% Minimum at I = 1 mA  
Minimum BV  
Convenient Plastic SOIC8 Surface Mountable Package Style, with  
0.050Lead Spacing  
F
of 30 V Guaranteed  
CEO  
1
(MOC223M)  
(MOCD223M)  
Safety and Regulatory Approvals:  
UL2688, 2,500 VAC  
for 1 Minute  
RMS  
$Y  
223/D223  
V
X
YY  
S
= onsemi Logo  
DINEN/IEC6074755, 565 V Peak Working Insulation Voltage  
= Specific Device Code  
= DIN EN/IEC6074755 Option  
= OneDigit Year Code  
= Digit Work Week  
These Devices are PbFree and Halogen Free  
Applications  
Low Power Logic Circuits  
= Assembly Package Code  
Interfacing and Coupling Systems of Different Potentials and  
Impedances  
Telecommunications Equipment  
Portable Electronics  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 7 of  
this data sheet.  
Solid State Relays  
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
November, 2022 Rev. 6  
MOCD223M/D  
MOC223M, MOCD223M  
SCHEMATICS  
Anode  
Cathode  
N/C  
LED 1 Anode  
LED 1 Cathode  
LED 2 Anode  
1
1
2
N/C  
8 Collector 1  
8
1
Emitter 1  
7
6
5
2
3
Base  
7
6
5
Collector 2  
Collector  
Emitter  
3
4
N/C  
LED 2 Cathode  
4
Emitter 2  
Figure 1. Schematic MOC223M  
Figure 2. Schematic MOCD223M  
SAFETY AND INSULATION RATINGS  
Parameter  
Characteristics  
Installation Classifications per DIN VDE  
0110/1.89 Table 1, For Rated Mains Voltage  
< 150 V  
I–IV  
I–III  
RMS  
RMS  
< 300 V  
Climatic Classification  
55/100/21  
2
Pollution Degree (DIN VDE 0110/1.89)  
Comparative Tracking Index  
175  
Symbol  
Parameter  
InputtoOutput Test Voltage, Method A, V  
Value  
Unit  
V
PR  
x 1.6 = V  
,
904  
V
peak  
IORM  
PR  
Type and Sample Test with t = 10 s, Partial Discharge < 5 pC  
m
InputtoOutput Test Voltage, Method B, V  
x 1.875 = V  
,
1060  
IORM  
PR  
100% Production Test with t = 1 s, Partial Discharge < 5 pC  
m
V
Maximum Working Insulation Voltage  
Highest Allowable OverVoltage  
External Creepage  
565  
4000  
4  
IORM  
V
IOTM  
mm  
External Clearance  
4  
DTI  
Distance Through Insulation (Insulation Thickness)  
Case Temperature (Note 1)  
Input Current (Note 1)  
0.4  
150  
200  
300  
T
S
C  
mA  
mW  
W
I
S,INPUT  
P
Output Power (Note 1)  
S,OUTPUT  
9
R
Insulation Resistance at T , V = 500 V (Note 1)  
> 10  
IO  
S
IO  
As per DIN EN/IEC 6074755, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data. Compliance with the  
safety ratings shall be ensured by means of protective circuits.  
1. Safety limit values maximum values allowed in the event of a failure.  
www.onsemi.com  
2
 
MOC223M, MOCD223M  
ABSOLUTE MAXIMUM RATINGS T = 25C unless otherwise specified.  
A
Symbol  
Parameter  
Value  
Unit  
TOTAL DEVICE  
T
Storage Temperature  
40 to +125  
40 to +100  
40 to +125  
260 for 10 s  
240  
C  
STG  
T
Ambient Operating Temperature  
Junction Temperature  
A
T
J
T
Lead Solder Temperature  
SOL  
P
Total Device Power Dissipation @ T = 25C  
mW  
D
A
Derate Above 25C  
2.94  
mW/C  
EMITTER  
I
Continuous Forward Current  
Forward Current Peak (PW = 100 ms, 120 pps)  
Reverse Voltage  
60  
1.0  
6.0  
90  
mA  
A
F
I (pk)  
F
V
P
V
R
D
LED Power Dissipation @ T = 25C  
mW  
mW/C  
A
Derate Above 25C  
0.8  
DETECTOR  
I
Continuous Collector Current  
CollectorEmitter Voltage  
150  
30  
mA  
V
C
V
V
V
CEO  
CBO  
ECO  
CollectorBase Voltage, MOC223M  
EmitterCollector Voltage  
70  
7
P
D
Detector Power Dissipation @ T = 25C  
150  
1.76  
mW  
A
Derate Above 25C  
mW/C  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
ELECTRICAL CHARACTERISTICS T = 25C unless otherwise specified.  
A
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
EMMITER  
V
Input Forward Voltage  
Reverse Leakage Current  
Input Capacitance  
I
= 1.0 mA  
1.08  
0.001  
18  
1.3  
100  
V
F
F
I
R
V
= 6.0 V  
mA  
pF  
R
C
IN  
DETECTOR  
I
CollectorEmitter Dark Current  
V
V
= 5.0 V, T = 25C  
1.0  
1.0  
100  
120  
10  
50  
nA  
mA  
V
CEO1  
CEO2  
CE  
A
I
= 5.0 V, T = 100C  
CE  
A
BV  
BV  
BV  
C
CollectorEmitter Breakdown Voltage  
CollectorBase Breakdown Voltage  
EmitterCollector Breakdown Voltage  
CollectorEmitter Capacitance  
I
C
I
C
I
E
= 100 mA  
= 100 mA  
= 100 mA  
30  
70  
7
CEO  
CBO  
ECO  
CE  
f = 1.0 MHz, V = 0  
5.5  
pF  
CE  
COUPLED  
CTR  
Current Transfer Ratio  
CollectorEmitter Saturation Voltage  
TurnOn Time  
I
I
= 1.0 mA, V = 5.0 V  
500  
1000  
1.0  
%
V
F
CE  
V
= 500 mA, I = 1.0 mA  
F
CE(sat)  
C
t
on  
t
off  
I
= 5.0 mA, V = 10 V,  
10  
55  
8
ms  
F
CC  
R = 100 W (Figure 8)  
L
TurnOff Time  
t
r
Rise Time  
t
f
Fall Time  
45  
www.onsemi.com  
3
MOC223M, MOCD223M  
ELECTRICAL CHARACTERISTICS T = 25C unless otherwise specified. (continued)  
A
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
ISOLATION CHARACTERISTICS  
V
ISO  
C
ISO  
R
ISO  
InputOutput Isolation Voltage  
Isolation Capacitance  
t = 1 min  
2500  
0.2  
VAC  
RMS  
V
IO  
V
IO  
= 0, f = 1 MHz  
pF  
11  
Isolation Resistance  
= 500 V , T = 25C  
10  
W
DC  
A
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
TYPICAL PERFORMANCE CURVES  
1.8  
1.7  
1.6  
10  
1.5  
1.4  
1.3  
1
T
A
= 55C  
1.2  
1.1  
1.0  
T
= 25C  
A
V
= 5 V  
CE  
T
A
= 100C  
Normalized to I = 1 mA  
F
0.1  
0.1  
1
10  
LED Forward Current (mA)  
100  
1
10  
100  
I
LED Input Current (mA)  
I
F,  
F,  
Figure 3. LED Forward Voltage vs. Forward Current  
Figure 4. Output Current vs. Input Current  
2.0  
1.8  
10  
1.6  
1.4  
1.2  
1.0  
0.8  
1
0.1  
0.6  
0.4  
0.2  
0
I
F
= 1 mA  
I
= 1 mA, V = 5 V  
CE  
F
Normalized to V = 5 V  
CE  
Normalized to T = 25C  
A
0.01  
80 60 40 20  
0
20  
40 60  
80 100 120  
0
1
2
3
4
5
6
7
8
9
10  
V
CE,  
CollectorEmitter Voltage (V)  
T
A,  
Ambient Temperature (5C)  
Figure 5. LED Forward Voltage vs. Forward  
Current  
Figure 6. Output Current vs. CollectorEmitter  
Voltage  
www.onsemi.com  
4
MOC223M, MOCD223M  
TYPICAL PERFORMANCE CURVES  
5
4
10  
10  
3
2
1
0
10  
10  
10  
10  
1  
10  
10  
V
= 10 V  
CE  
Normalized to T = 25C  
A
2  
0
20  
40  
60  
80  
100  
T
A,  
Ambient Temperature (5C)  
Figure 7. Dark Current vs. Ambient Temperature  
V
CC  
= 10 V  
Input Pulse  
I
C
I
F
R
L
10%  
90%  
Input  
Output  
Output Pulse  
R
BE  
tr  
tf  
ton  
toff  
Test Circuit  
Waveforms  
Figure 8. Switching Time Test Circuit and Waveforms  
www.onsemi.com  
5
MOC223M, MOCD223M  
REFLOW PROFILE  
260  
T
P
Max. Rampup Rate = 3C/s  
Max. Rampdown Rate = 6C/s  
240  
220  
200  
t
P
T
L
Tsmax  
t
L
180  
160  
140  
120  
Preheat Area  
Tsmin  
ts  
100  
80  
60  
40  
20  
0
120  
240  
360  
Time 25C to Peak  
Time (s)  
Figure 9. Reflow Profile  
REFLOW PROFILE  
Profile Feature  
PbFree Assembly Profile  
150C  
Temperature Min. (Tsmin)  
Temperature Max. (Tsmax)  
200C  
Time (t ) from (Tsmin to Tsmax)  
60120 s  
S
Rampup Rate (t to t )  
3°C/s max.  
217C  
L
P
Liquidous Temperature (T )  
L
Time (t ) Maintained Above (T )  
60150 s  
L
L
Peak Body Package Temperature  
Time (t ) within 5C of 260C  
260C +0C / 5C  
30 s  
P
Rampdown Rate (T to T )  
6C/s max.  
8 min max.  
P
L
Time 25C to Peak Temperature  
www.onsemi.com  
6
MOC223M, MOCD223M  
ORDERING INFORMATION  
Part Number  
Package  
Shipping  
MOC223M  
Small Outline 8Pin  
100 Units / Tube  
2500 Units / Tape and Reel  
100 Units / Tube  
MOC223R2M  
Small Outline 8Pin  
MOC223VM  
Small Outline 8Pin, DIN EN/IEC6074755 Option  
Small Outline 8Pin, DIN EN/IEC6074755 Option  
Small Outline 8Pin  
MOC223R2VM  
MOCD223M  
2500 Units / Tape and Reel  
100 Units / Tube  
MOCD223R2M  
MOCD223VM  
Small Outline 8Pin  
2500 Units / Tape and Reel  
100 Units / Tube  
Small Outline 8Pin, DIN EN/IEC6074755 Option  
Small Outline 8Pin, DIN EN/IEC6074755 Option  
MOCD223R2VM  
2500 Units / Tape and Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
7
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOIC8  
CASE 751DZ  
ISSUE O  
DATE 30 SEP 2016  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13733G  
SOIC8  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
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information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
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TECHNICAL PUBLICATIONS:  
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