MSRF860G [ONSEMI]
SWITCHMODE Soft Recovery Power Rectifiers; 开关模式？软恢复电力整流器
| 型号： | MSRF860G |
| 厂家： | 
ONSEMI |
| 描述： | SWITCHMODE Soft Recovery Power Rectifiers |
| 文件： | 总6页 (文件大小：121K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MSR860, MSRF860
SWITCHMODEt Soft
Recovery Power Rectifiers
Plastic TO−220 Package
These state−of−the−art devices are designed for use as free wheeling
diodes in variable speed motor control applications and switching
power supplies.
http://onsemi.com
Features
SOFT RECOVERY
POWER RECTIFIER
8.0 AMPERES, 600 VOLTS
• Soft Recovery with Guaranteed Low Reverse Recovery Charge
(Q ) and Peak Reverse Recovery Current (I
)
RR
RRM
• 150°C Operating Junction Temperature
• Epoxy meets UL 94 V−0 @ 0.125 in
• Low Forward Voltage
• Low Leakage Current
• Pb−Free Package is Available
1
4
3
4
4
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 1.9 Grams (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads Readily Solderable
• Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
MAXIMUM RATINGS
1
1
3
3
TO−220AC
CASE 221B
STYLE 1
TO−220 FULLPAK
CASE 221E
Rating
Symbol
Value
Unit
STYLE 1
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
600
V
RRM
RWM
V
V
R
MARKING DIAGRAMS
Average Rectified Forward Current
I
8.0
16
A
A
A
O
(Rated V , T = 125°C)
R
C
Peak Repetitive Forward Current (Rated
V , Square Wave, 20 kHz, T = 125°C)
I
FRM
R
C
AY WWG
MSR860
KA
AY WWG
MSRF860
KA
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
I
100
FSM
Storage/Operating Case Temperature
Operating Junction Temperature
T
, T
−65 to +150
−65 to +150
°C
°C
stg
C
T
J
A
Y
= Assembly Location
= Year
THERMAL CHARACTERISTICS
WW
G
KA
= Work Week
= Pb−Free Package
= Diode Polarity
Parameter
Symbol
Value
Unit
MSR860
°C/W
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient
R
1.6
72.8
q
JC
JA
R
q
ORDERING INFORMATION
MSRF860
°C/W
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient
R
4.75
75
q
JC
JA
Device
MSR860
Package
Shipping
R
q
TO−220AC
50 Units/Rail
50 Units/Rail
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
MSR860G
TO−220AC
(Pb−Free)
MSRF860G
TO−220FP
(Pb−Free)
50 Units/Rail
©
Semiconductor Components Industries, LLC, 2008
1
Publication Order Number:
June, 2008 − Rev. 5
MSR860/D
MSR860, MSRF860
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
T = 25°C
T = 150°C
Maximum Instantaneous Forward Voltage (I = 8.0 A) (Note 1)
V
F
V
J
J
F
Maximum
Typical
1.7
1.4
1.3
1.1
T = 25°C
T = 150°C
Maximum Instantaneous Reverse Current (V = 600 V)
I
R
mA
J
J
R
Maximum
Typical
10
2.0
1000
80
T = 25°C
T = 125°C
Maximum Reverse Recovery Time (Note 2)
t
rr
ns
J
J
(V = 400 V, I = 8.0 A, di/dt = 200 A/ms)
Maximum
Typical
R
F
120
95
190
125
Typical Recovery Softness Factor
(V = 400 V, I = 8.0 A, di/dt = 200 A/ms)
s = t /t
2.5
5.8
350
3.0
8.3
700
b
a
R
F
Maximum Peak Reverse Recovery Current
(V = 400 V, I = 8.0 A, di/dt = 200 A/ms)
I
A
RRM
R
F
Maximum Reverse Recovery Charge
(V = 400 V, I = 8.0 A, di/dt = 200 A/ms)
Q
nC
RR
R
F
1. Pulse Test: Pulse Width ≤ 380 ms, Duty Cycle ≤ 2%
2. T measured projecting from 25% of I to zero current
RR
RRM
TYPICAL ELECTRICAL CHARACTERISTICS
100
100
10
1
T = 150°C
J
125°C
10
1
100°C
25°C
T = 150°C
J
0.1
100°C
100
200
300
400
500
600
V , REVERSE VOLTAGE (VOLTS)
R
25°C
Figure 2. Typical Reverse Current
14
12
10
8
dc
SQUARE WAVE
6
4
RATED V APPLIED
R
2
0
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
0
40
80
120
160
V , FORWARD VOLTAGE DROP (VOLTS)
F
T , CASE TEMPERATURE (°C)
C
Figure 1. Typical Forward Voltage
Figure 3. Current Derating, Case
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2
MSR860, MSRF860
TYPICAL ELECTRICAL CHARACTERISTICS
16
3.0
2.5
2.0
1.5
1.0
0.5
0
14
12
10
SQUARE WAVE
dc
dc
8
6
4
2
0
SQUARE WAVE
RATED V APPLIED
R
T = 150°C
J
0
40
80
120
160
500
500
0
2
I
4
6
8
10
12
14
T , AMBIENT TEMPERATURE (°C)
, AVERAGE FORWARD CURRENT (AMPS)
F(AV)
A
Figure 4. Current Derating, Ambient
Figure 5. Power Dissipation
250
200
150
100
160
140
120
100
80
T = 25°C
R
J
T = 125°C
J
V
= 400 V
V
= 400 V
R
I = 16 A
F
I = 16 A
F
8 A
4 A
8 A
4 A
60
40
50
0
20
0
100
200
300
400
100
200
300
400
500
dI /dt (A/mS)
F
dI /dt (A/mS)
F
Figure 7. Typical Reverse Recovery Time
Figure 6. Typical Reverse Recovery Time
14
12
10
8
8
I = 16 A
F
I = 16 A
F
6
4
8 A
4 A
8 A
4 A
6
4
2
0
T = 25°C
T = 125°C
J
J
2
V
R
= 400 V
V
= 400 V
R
0
100
200
300
dI /dt (A/mS)
400
100
200
300
400
500
dI /dt (A/mS)
F
F
Figure 9. Typical Peak Reverse Recovery
Current
Figure 8. Typical Peak Reverse Recovery
Current
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3
MSR860, MSRF860
TYPICAL ELECTRICAL CHARACTERISTICS
900
800
700
350
300
250
200
150
100
I = 16 A
F
I = 16 A
F
600
500
400
300
200
8 A
4 A
8 A
4 A
T = 125°C
R
T = 25°C
R
J
J
50
0
100
0
V
= 400 V
V
= 400 V
100
200
300
400
500
100
200
300
400
500
dI /dt (A/mS)
F
dI /dt (A/mS)
F
Figure 11. Typical Reverse Recovery Charge
Figure 10. Typical Reverse Recovery Charge
250
200
150
100
50
90
80
70
60
50
40
30
I = 16 A
F
I = 16 A
F
8 A
4 A
8 A
4 A
20
10
0
T = 25°C
R
T = 125°C
R
J
J
V = 400 V
V
= 400 V
0
100
200
300
400
500
100
200
300
dI /dt (A/mS)
400
500
dl /dt (A/mS)
F
F
Figure 13. Typical Switching Off Losses
Figure 12. Typical Switching Off Losses
1.0
D = 0.5
0.1
0.05
0.01
0.1
P
(pk)
Z
(t) = r(t) R
q
JC
q
JC
R
= 1.6°C/W MAX
q
JC
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
t
1
SINGLE PULSE
1
t
2
T
- T = P
C
Z
(t)
q
(pk) JC
J(pk)
DUTY CYCLE, D = t /t
1 2
0.01
0.01
0.1
1.0
10
100
1000
t, TIME (ms)
Figure 14. Thermal Response (MSR860)
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4
MSR860, MSRF860
10
D = 0.5
0.2
1.0
0.1
0.05
0.02
0.1
0.01
P
(pk)
Z
(t) = r(t) R
q q
JC JC
R
q
JC
= 1.6°C/W MAX
0.01
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
t
1
SINGLE PULSE
1
t
2
T
- T = P
C
Z
(t)
q
(pk) JC
J(pk)
DUTY CYCLE, D = t /t
1 2
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1.0
10
100
1000
t, TIME (s)
Figure 15. Thermal Response, (MSRF860) Junction−to−Case (RqJC
)
100
10
D = 0.5
0.2
0.1
0.05
0.02
1.0
0.1
0.01
P
(pk)
Z
(t) = r(t) R
q
JC
q
JC
R
= 1.6°C/W MAX
q
JC
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
t
0.01
1
SINGLE PULSE
0.00001
1
t
2
T
- T = P
C
Z
(t)
q
(pk) JC
J(pk)
DUTY CYCLE, D = t /t
1 2
0.001
0.000001
0.0001
0.001
0.01
0.1
1.0
10
100
1000
t, TIME (s)
Figure 16. Thermal Response, (MSRF860) Junction−to−Ambient (RqJA
)
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5
MSR860, MSRF860
PACKAGE DIMENSIONS
TO−220 TWO−LEAD
CASE 221B−04
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
C
B
F
T
S
Q
INCHES
DIM MIN MAX
MILLIMETERS
MIN
15.11
9.65
4.06
0.64
3.61
4.83
2.79
0.36
12.70
1.14
2.54
2.04
1.14
5.97
0.000
MAX
15.75
10.29
4.82
0.89
4.09
5.33
3.30
0.64
14.27
1.52
3.04
2.79
1.39
6.48
1.27
A
B
C
D
F
0.595
0.380
0.160
0.025
0.142
0.190
0.110
0.014
0.500
0.045
0.100
0.080
0.045
0.235
0.000
0.620
0.405
0.190
0.035
0.161
0.210
0.130
0.025
0.562
0.060
0.120
0.110
0.055
0.255
0.050
4
A
U
1
3
G
H
J
H
K
K
L
Q
R
S
T
STYLE 1:
PIN 1. CATHODE
2. N/A
L
R
D
3. ANODE
4. CATHODE
J
U
G
TO−220 FULLPAK, 2−LEAD
CASE 221E−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
−T−
−B−
C
INCHES
DIM MIN MAX
MILLIMETERS
F
MIN
15.67
9.96
4.50
0.60
3.08
MAX
16.07
10.36
4.90
S
A
B
C
D
F
0.617
0.392
0.177
0.024
0.121
0.633
0.408
0.193
0.039
0.129
Q
U
1.00
3.28
A
K
G
H
J
0.100 BSC
2.54 BSC
1
2
3
0.117
0.018
0.499
0.045
0.133
0.025
0.562
0.060
2.98
0.45
3.38
0.64
H
K
L
12.68
1.14
14.27
1.52
−Y−
N
Q
R
S
U
0.200 BSC
5.08 BSC
0.122
0.101
0.092
0.255
0.138
0.117
0.108
0.271
3.10
2.56
2.34
6.48
3.50
2.96
2.74
6.88
G
N
J
R
STYLE 1:
PIN 1. CATHODE
2. N/A
L
D2 PL
3. ANODE
M
M
0.25 (0.010)
B
Y
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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MSR860/D
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