MURA220T3G [ONSEMI]
Surface Mount Ultrafast Power Rectifiers; 表面贴装超快功率整流器
| 型号： | MURA220T3G |
| 厂家： | 
ONSEMI |
| 描述： | Surface Mount Ultrafast Power Rectifiers |
| 文件： | 总5页 (文件大小：129K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MURA215T3G,
SURA8215T3G,
MURA220T3G,
SURA8220T3G
Preferred Devices
Surface Mount
Ultrafast Power Rectifiers
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Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
ULTRAFAST RECTIFIERS
2 AMPERES, 150−200 VOLTS
Features
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
High Temperature Glass Passivated Junction
Low Forward Voltage Drop (0.77 V Max @ 2.0 A, T = 150C)
SMA
CASE 403D
PLASTIC
J
Low Forward Voltage Drop (0.71 V Max @ 1.0 A, T = 150C)
J
AEC−Q101 Qualified and PPAP Capable
SURA8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb-Free*
MARKING DIAGRAM
U5x
AYWW G
Mechanical Characteristics:
Case: Epoxy, Molded
Weight: 70 mg (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
U5x = Device Code
x = C for MURA215T3
= D for MURA220T3
A
Y
= Assembly Location
= Year
Polarity: Polarity Band Indicates Cathode Lead
WW = Work Week
ESD Protection:
G
= Pb−Free Package
Human Body Model > 4000 V (Class 3)
Machine Model > 400 V (Class C)
ORDERING INFORMATION
†
Device
Package
Shipping
MURA215T3G
SMA
5,000/Tape & Reel
(Pb−Free)
SURA8215T3G
MURA220T3G
SURA8220T3G
SMA
(Pb−Free)
5,000/Tape & Reel
SMA
(Pb−Free)
5,000/Tape & Reel
5,000/Tape & Reel
SMA
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
January, 2012 − Rev. 5
MURA215T3/D
MURA215T3G, SURA8215T3G, MURA220T3G, SURA8220T3G
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
MURA215T3G/SURA8215T3G
MURA220T3G/SURA8220T3G
V
V
RRM
RWM
R
V
V
150
200
Average Rectified Forward Current
I
A
F(AV)
@ T = 155C
1.0
2.0
L
@ T = 135C
L
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
I
A
FSM
40
Operating Junction Temperature Range
T
J
−65 to +175
C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Psi
Max
Unit
Thermal Resistance, Junction−to−Lead (T = 25C) (Note 1)
24
C/W
L
JL
(Note 2)
R
Thermal Resistance, Junction−to−Ambient (Note 1)
216
q
JA
1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4.
2. In compliance with JEDEC 51, these values (historically represented by R ) are now referenced as Psi
.
q
JL
JL
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Maximum Instantaneous Forward Voltage (Note 3)
v
V
F
(i = 2.0 A, T = 25C)
0.95
0.77
F
J
(i = 2.0 A, T = 150C)
F
J
Maximum Instantaneous Reverse Current (Note 3)
i
R
mA
(Rated DC Voltage, T = 25C)
2.0
50
J
(Rated DC Voltage, T = 150C)
J
Maximum Reverse Recovery Time
t
rr
ns
(i = 1.0 A, di/dt = 50 A/ms)
35
F
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.
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2
MURA215T3G, SURA8215T3G, MURA220T3G, SURA8220T3G
100
10
1
100
T = 175C
J
T = 175C
J
10
T = 100C
J
T = 100C
J
0.1
T = 25C
J
1
T = 25C
J
0.01
0.001
0.1
0
20 40
60 80 100 120 140 160 180 200
0
20 40
60
80 100 120 140 160 180 200
V , REVERSE VOLTAGE (VOLTS)
R
V , REVERSE VOLTAGE (VOLTS)
R
Figure 1. Typical Reverse Current
Figure 2. Maximum Reverse Current
10
1
10
1
100C
100C
T
C
= 175C
T
C
= 175C
25C
25C
0.1
0.1
0.01
0.01
0.3 0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
0.3 0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
V , INSTANTANEOUS VOLTAGE (VOLTS)
F
V , INSTANTANEOUS VOLTAGE (VOLTS)
F
Figure 4. Maximum Forward Voltage
Figure 3. Typical Forward Voltage
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3
MURA215T3G, SURA8215T3G, MURA220T3G, SURA8220T3G
50
45
40
35
30
25
20
15
10
50
NOTE: TYPICAL
CAPACITANCE AT
0 V = 45 pF
NOTE: MAXIMUM
CAPACITANCE AT
0 V = 47 pF
45
40
35
30
25
20
15
10
5
0
5
0
0
4
8
12 16
20 24 28 32 36
40
0
4
8
12
16
20 24
28 32
36 40
V , REVERSE VOLTAGE (VOLTS)
R
V , REVERSE VOLTAGE (VOLTS)
R
Figure 5. Typical Capacitance
Figure 6. Maximum Capacitance
5
4
3
2
1.5
1.25
1
dc
dc
SQUARE WAVE
0.75 SQUARE WAVE
0.5
1
0
0.25
0
80 90 100 110 120 130 140 150 160 170 180
0
20
40
60
80 100 120 140 160 180
T , LEAD TEMPERATURE (C)
L
T , AMBIENT TEMPERATURE (C)
A
Figure 8. Current Derating, Ambient
Figure 7. Current Derating, Lead
(FR−4 Board with Minimum Pad)
3
2.5
2
dc
SQUARE WAVE
1.5
1
0.5
0
0
0.5
1
1.5
2
2.5
3
3.5
I , AVERAGE FORWARD CURRENT (AMPS)
F(AV)
Figure 9. Power Dissipation
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4
MURA215T3G, SURA8215T3G, MURA220T3G, SURA8220T3G
PACKAGE DIMENSIONS
SMA
CASE 403D−02
ISSUE F
H
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02.
E
MILLIMETERS
INCHES
DIM
A
A1
b
c
D
E
H
E
L
MIN
1.97
0.05
1.27
0.15
2.29
4.06
4.83
0.76
NOM
2.10
0.10
1.45
0.28
2.60
4.32
5.21
1.14
MAX
MIN
NOM
0.083
0.004
0.057
0.011
0.103
0.170
0.205
0.045
MAX
0.087
0.006
0.064
0.016
0.115
0.180
0.220
0.060
2.20
0.15
1.63
0.41
2.92
4.57
5.59
1.52
0.078
0.002
0.050
0.006
0.090
0.160
0.190
0.030
b
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
A
A1
c
L
SOLDERING FOOTPRINT*
4.0
0.157
2.0
0.0787
2.0
0.0787
mm
inches
ǒ
Ǔ
SCALE 8:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
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Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
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Order Literature: http://www.onsemi.com/orderlit
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For additional information, please contact your local
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MURA215T3/D
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