NC7S32L6X [ONSEMI]
TinyLogic HS 2 输入 OR 门极;
| 型号： | NC7S32L6X |
| 厂家： | 
ONSEMI |
| 描述： | TinyLogic HS 2 输入 OR 门极 栅 光电二极管 逻辑集成电路 触发器 |
| 文件： | 总9页 (文件大小：317K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
MARKING
DIAGRAMS
TinyLogic HS 2-Input OR
Gate
TTKK
XYZ
SIP6
CASE 127EB
NC7S32
Pin 1
Description
The NC7S32 is a single 2−Input high performance CMOS OR Gate.
Advanced Silicon Gate CMOS fabrication assures high speed and low
SC−74A
CASE 318BQ
7S32MG
power circuit operation over a broad V
range. ESD protection
CC
G
diodes inherently guard both inputs and output with respect to the V
CC
and GND rails. Three stages of gain between inputs and outputs
assures high noise immunity and reduced sensitivity to input edge rate.
SOT23−5
CASE 527AH
Features
7S32M
• Space Saving SOT23−5, SC−74A and SC−88A 5−Lead Packages
• Ultra Small MicroPak™ Leadless Package
• High Speed: t = 3.5 ns Typ
PD
• Low Quiescent Power: I < 1 mA
SC−88A
CASE 419A−02
CC
S32MG
• Balanced Output Drive: 2 mA I , −2 mA I
G
OL
OH
• Broad V Operating Range: 2 V – 6 V
CC
• Balanced Propagation Delays
• Specified for 3 V Operation
TT, 7S32, S32 = Specific Device Code
KK
XY
Z
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Date Code*
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
M
*Date Code orientation and/or position may
vary depending upon manufacturing location.
IEEE / IEC
A
B
≥1
Y
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
Figure 1. Logic Symbol
© Semiconductor Components Industries, LLC, 2003
1
Publication Order Number:
April, 2023 − Rev. 7
NC7S32/D
NC7S32
Pin Configurations
A 1
B 2
6 V
CC
A
B
1
2
3
5
4
V
Y
CC
5 NC
4 Y
GND
GND 3
Figure 2. SOT23−5, SC−88A and SC−74A
Figure 3. MicroPak (Top Through View)
(Top View)
PIN DESCRIPTIONS
FUNCTION TABLE (Y = A + B)
Pin Name
Description
Inputs
Output
A, B
Y
Inputs
A
L
B
L
Y
L
Output
NC
No Connect
L
H
L
H
H
H
H
H
H
H = HIGH Logic Level
L = LOW Logic Level
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
−0.5
−
Max
6.5
Unit
V
V
CC
I
IK
Supply Voltage
DC Input Diode Current
V
V
< 0 V
−20
+20
mA
IN
> V
−
IN
CC
V
DC Input Voltage
−0.5
−
V
+ 0.5
CC
V
IN
I
DC Output Diode Current
V
V
< 0 V
−20
mA
OK
OUT
> V
−
+20
OUT
CC
V
DC Output Voltage
−0.5
−
V
+ 0.5
CC
V
mA
mA
°C
OUT
I
DC Output Source or Sink Current
12.5
25
OUT
I
or I
DC V or Ground Current per Output Pin
−
CC
GND
CC
T
STG
Storage Temperature
−65
−
+150
+150
+260
390
T
J
Junction Temperature
°C
T
Lead Temperature (Soldering, 10 Seconds)
−
°C
L
P
Power Dissipation in Still Air
SC−74A / SOT23−5
SC−88A
−
−
−
mW
D
332
MicroPak−6
812
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
www.onsemi.com
2
NC7S32
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Supply Voltage
Conditions
Min
2.0
0
Max
Unit
V
V
CC
6.0
V
IN
Input Voltage
V
CC
V
CC
V
V
OUT
Output Voltage
0
V
T
Operating Temperature
Input Rise and Fall Times
−40
0
+85
20
°C
ns/V
A
t , t
r
V
CC
V
CC
V
CC
V
CC
at 2.0 V
f
at 3.0 V
at 4.5 V
at 6.0 V
0
20
0
10
0
5
q
Thermal Resistance
SC−74A / SOT23−5
SC−88A
−
320
377
154
°C/W
JA
−
MicroPak−6
−
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
DC ELECTICAL CHARACTERISTICS
T
A
= +25°C
T = −40 to +85°C
A
Min
Typ
Max
Min
Max
Symbol
Parameter
V
CC
(V)
Conditions
Unit
V
IH
HIGH Level Input Voltage
2.0
3.0 − 6.0
1.50
−
−
−
−
1.50
−
−
V
0.7 V
0.7 V
CC
CC
V
LOW Level Input Voltage
HIGH Level Output Voltage
2.0
−
−
−
−
0.50
−
−
0.50
V
V
IL
3.0 − 6.0
0.3 V
0.3 V
CC
CC
V
OH
2.0
3.0
4.5
6.0
I
= −20 mA
= V or V
IH
1.90
2.90
4.40
5.90
2.0
3.0
4.5
6.0
−
−
−
−
1.90
2.90
4.40
5.90
−
−
−
−
OH
IN
V
IL
V
OH
= V or V
V
V
V
IN
IH
IL
3.0
4.5
6.0
I
= −1.3 mA
= −2.0 mA
= −2.6 mA
2.68
4.18
5.68
2.85
4.35
5.85
−
−
−
2.63
4.13
5.63
−
−
−
I
I
OH
OH
V
OL
LOW Level Output Voltage
2.0
3.0
4.5
6.0
I
= 20 mA
−
−
−
−
0.0
0.0
0.0
0.0
0.10
0.10
0.10
0.10
−
−
−
−
0.10
0.10
0.10
0.10
OL
IN
V
= V or V
IH
IL
V
= V or V
IN
OL
OL
OL
IH
IL
3.0
4.5
6.0
I
I
I
= 1.3 mA
= 2.0 mA
= 2.6 mA
−
−
−
0.1
0.1
0.1
0.26
0.26
0.26
−
−
−
0.33
0.33
0.33
I
Input Leakage Current
6.0
6.0
V
V
= V , GND
−
−
−
−
0.1
1.0
−
−
1.0
mA
mA
IN
IN
CC
I
Quiescent Supply Current
= V , GND
10.0
CC
IN
CC
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3
NC7S32
AC ELECTRICAL CHARACTERISTICS
T
A
= +25°C
Typ
T = −40 to +85°C
A
Min
Max
Min
Max
Symbol
Parameter
V
(V)
Conditions
Unit
ns
CC
t
,
Propagation Delay (Figure 4, 6)
5.0
C = 15 pF
L
−
3.5
15
−
−
PLH
t
PHL
2.0
3.0
4.5
6.0
C = 50 pF
L
−
−
−
−
20
12
8
100
27
20
17
−
−
−
−
125
35
25
21
ns
7
t
,
Output Transition Time
(Figure 4, 6)
5.0
C = 15 pF
−
3.0
10
−
−
ns
ns
TLH
L
t
THL
2.0
3.0
4.5
6.0
C = 50 pF
L
−
−
−
−
25
16
11
9
125
35
25
21
−
−
−
−
155
45
30
26
C
Input Capacitance
Open
5.0
−
−
2
6
10
−
−
10
pF
pF
IN
C
Power Dissipation Capacitance
(Figure 5)
(Note 2)
−
−
PD
2. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I
) at
PD
CCD
no output loading and operating at 50% duty cycle. C is related to I
dynamic operating current by the expression:
PD
CCD
I
= (C ) (V ) (f ) + (I static).
CCD
PD CC IN CC
AC Loading and Waveforms
V
CC
INPUT
OUTPUT
C
L
C includes load and stray capacitance
L
Input PRR = 1.0 MHz; t = 500 ns
W
Figure 4. AC Test Circuit
Figure 6. AC Waveforms
V
CC
A
INPUT
Input = AC Waveforms;
PRR = Variable; Duty Cycle = 50%.
Figure 5. ICCD Test Circuit
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4
NC7S32
ORDERING INFORMATION
Part Number
†
Top Mark
7S32
7S32
S32
Package Description
Shipping
NC7S32M5X
SC−74A
SOT23−5
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
NC7S32M5X−L22090
NC7S32P5X
SC−88A
NC7S32L6X
TT
SIP6, MicroPak
SIP6, MicroPak
NC7S32L6X−L22175
TT
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
www.onsemi.com
5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5
1
DATE 18 JAN 2018
SCALE 2:1
5X b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
0.20 C A B
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
M
5
4
E1
E
1
2
3
0.05
A1
L
B
e
DETAIL A
A
D
MILLIMETERS
DIM
A
A1
b
c
D
E
E1
e
MIN
0.90
0.01
0.25
0.10
2.85
2.50
1.35
MAX
1.10
0.10
0.50
0.26
3.15
3.00
1.65
TOP VIEW
SIDE VIEW
A
DETAIL A
c
0.95 BSC
SEATING
PLANE
END VIEW
C
L
M
0.20
0
0.60
10
_
_
RECOMMENDED
GENERIC
SOLDERING FOOTPRINT*
MARKING DIAGRAM*
0.95
PITCH
XXX MG
G
XXX
M
= Specific Device Code
= Date Code
2.40
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE M
SCALE 2:1
DATE 11 APR 2023
GENERIC MARKING
DIAGRAM*
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
XXXMG
G
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
STYLE 1:
STYLE 2:
STYLE 3:
PIN 1. ANODE 1
2. N/C
STYLE 4:
STYLE 5:
PIN 1. BASE
PIN 1. ANODE
2. EMITTER
3. BASE
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
4. COLLECTOR
5. CATHODE
4. CATHODE 3
5. CATHODE 4
5. GATE 2
STYLE 9:
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
STYLE 7:
STYLE 8:
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
PIN 1. BASE
2. EMITTER
3. BASE
PIN 1. CATHODE
2. COLLECTOR
3. N/C
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
4. COLLECTOR
5. COLLECTOR
4. BASE
5. EMITTER
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42984B
SC−88A (SC−70−5/SOT−353)
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
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