NC7ST02M5X-L22090 [ONSEMI]

TinyLogic HST 2输入NOR门;
NC7ST02M5X-L22090
型号: NC7ST02M5X-L22090
厂家: ONSEMI    ONSEMI
描述:

TinyLogic HST 2输入NOR门

文件: 总9页 (文件大小:378K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
MARKING  
DIAGRAMS  
TinyLogic HST 2-Input NOR  
Gate  
D9KK  
XYZ  
SIP6  
CASE 127EB  
NC7ST02  
Pin 1  
Description  
The NC7ST02 is a single 2Input high performance CMOS NOR  
Gate, with TTLcompatible inputs. Advanced Silicon Gate CMOS  
fabrication assures high speed and low power circuit operation. ESD  
protection diodes inherently guard both inputs and output with respect  
8S02MG  
SC74A  
CASE 318BQ  
G
to the V  
and GND rails. High gain circuitry offers high noise  
CC  
immunity and reduced sensitivity to input edge rate. The  
TTLcompatible inputs facilitate TTL to NMOS / CMOS interfacing.  
SOT235  
CASE 527AH  
1
Device performance is similar to MM74HCT but with / the output  
8S02M  
2
current drive of HC / HCT.  
Features  
Space Saving SOT235, SC74A and SC88A 5Lead Package  
Ultra Small MicroPakLeadless Package  
High Speed: t < 7 ns Typ, V = 5 V, C = 15 pF  
SC88A  
CASE 419A02  
T02MG  
G
PD  
CC  
L
Low Quiescent Power: I < 1 mA Typ, V = 5.5 V  
CC  
CC  
Balanced Output Drive: 2 mA I , 2 mA I  
OL  
OH  
D9, 8S02, T02 = Specific Device Code  
TTLcompatible Inputs  
KK  
XY  
Z
= 2Digit Lot Run Traceability Code  
= 2Digit Date Code Format  
= Assembly Plant Code  
= Date Code*  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
M
IEEE / IEC  
A
B
*Date Code orientation and/or position may  
vary depending upon manufacturing location.  
1  
Y
Figure 1. Logic Symbol  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 4 of this data sheet.  
© Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
June, 2022 Rev. 4  
NC7ST02/D  
NC7ST02  
Pin Configurations  
A 1  
B 2  
6 V  
CC  
A
B
1
2
3
5
4
V
Y
CC  
5 NC  
4 Y  
GND  
GND 3  
Figure 2. SOT235, SC88A and SC74A  
Figure 3. MicroPak (Top Through View)  
(Top View)  
PIN DESCRIPTIONS  
FUNCTION TABLE (Y = A + B)  
Pin Name  
Description  
Inputs  
Output  
A, B  
Y
Inputs  
A
L
B
L
Y
H
L
Output  
NC  
No Connect  
L
H
L
H
H
L
H
L
H = HIGH Logic Level  
L = LOW Logic Level  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Min  
0.5  
Max  
6.5  
Unit  
V
V
CC  
I
IK  
Supply Voltage  
DC Input Diode Current  
V
V
< 0 V  
20  
+20  
mA  
IN  
> V  
IN  
CC  
V
DC Input Voltage  
0.5  
V
+ 0.5  
CC  
V
IN  
I
DC Output Diode Current  
V
V
< 0 V  
20  
mA  
OK  
OUT  
> V  
+20  
OUT  
CC  
V
Output Voltage  
0.5  
V
+ 0.5  
CC  
V
mA  
mA  
°C  
OUT  
I
DC Output Source or Sink Current  
12.5  
25  
OUT  
I
or I  
DC V or Ground Current per Supply Pin  
CC  
GND  
CC  
T
STG  
Storage Temperature  
65  
+150  
+150  
+260  
390  
T
J
Junction Temperature  
°C  
T
Lead Temperature (Soldering, 10 Seconds)  
°C  
L
P
Power Dissipation in Still Air  
SC74A / SOT235  
SC88A  
mW  
D
332  
MicroPak6  
812  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
www.onsemi.com  
2
NC7ST02  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Supply Voltage  
Conditions  
Min  
4.5  
0
Max  
Unit  
V
V
CC  
5.5  
V
I
Input Voltage  
V
CC  
V
CC  
V
V
O
Output Voltage  
0
V
T
Operating Temperature  
Input Rise and Fall Time  
Thermal Resistance  
40  
0
+85  
10  
°C  
A
t , t  
r
V = 5.0 V  
CC  
ns/V  
°C/W  
f
q
SC74A / SOT235  
SC88A  
320  
377  
154  
JA  
MicroPak6  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
1. Unused inputs must be held HIGH or LOW. They may not float.  
DC ELECTICAL CHARACTERISTICS  
T
A
= +25°C  
T = 40 to +85°C  
A
Min  
2.0  
Typ  
Max  
Min  
2.0  
Max  
Symbol  
Parameter  
V
(V)  
Conditions  
Unit  
V
CC  
V
IH  
HIGH Level Input Voltage  
LOW Level Input Voltage  
HIGH Level Output Voltage  
4.5 5.5  
4.5 5.5  
V
IL  
0.8  
0.8  
V
V
OH  
4.5  
4.5  
I
= –20 mA  
4.4  
4.18  
4.5  
4.35  
4.4  
4.13  
V
OH  
IN  
V
= V or V  
IH  
IL  
I
= –2 mA  
OH  
V
LOW Level Output Voltage  
4.5  
4.5  
I
= 20 mA  
IH  
= 2 mA  
0
0.1  
0.1  
V
OL  
IN  
OL  
IN  
V
= V or V  
0.10  
0.26  
0.33  
IL  
I
OL  
I
Input Leakage Current  
5.5  
5.5  
5.5  
0V V 5.5 V  
0.1  
1.0  
2.0  
1.0  
10.0  
2.9  
mA  
mA  
IN  
I
Quiescent Supply Current  
V
= V or GND  
IN CC  
CC  
I
I
per Input  
One Input V = 0.5 V or  
mA  
CCT  
CC  
IN  
2.4 V, Other Input V or  
CC  
GND  
AC ELECTRICAL CHARACTERISTICS  
T
A
= +25°C  
Typ  
3.5  
T = 40 to +85°C  
A
Min  
Max  
12  
17  
16  
27  
14  
26  
10  
25  
21  
10  
Min  
Max  
Symbol  
, t  
Parameter  
V
(V)  
Conditions  
C = 15 pF  
Unit  
CC  
t
Propagation Delay (Figure 4, 6)  
5.0  
ns  
PLH PHL  
L
6.3  
4.5  
5.5  
C = 50 pF  
L
6.1  
20  
31  
18  
30  
11.7  
4.2  
11.4  
4
t
, t  
Output Transition Time  
(Figure 4, 6)  
5.0  
4.5  
5.5  
C = 15 pF  
ns  
TLH THL  
L
C = 50 pF  
L
11  
31  
26  
10  
C
Input Capacitance  
Open  
5.0  
2
6
pF  
pF  
IN  
C
Power Dissipation Capacitance  
(Figure 5)  
(Note 2)  
PD  
2. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current. Current consumption  
PD  
CCD  
expression: I  
(I  
) at no output loading and operating at 50% duty cycle. (See Figure 5).C  
is related to I  
dynamic operating current by the  
PD  
CCD  
= (C ) (V ) (f ) + (I  
).  
CCD  
PD  
CC  
IN  
CCstatic  
www.onsemi.com  
3
 
NC7ST02  
AC Loading and Waveforms  
V
CC  
INPUT  
OUTPUT  
CL  
C includes load and stray capacitance  
L
Input PRR = 1.0 MHz; t = 500 ns  
W
Figure 4. AC Test Circuit  
Figure 6. AC Waveforms  
V
CC  
A
INPUT  
Input = AC Waveform;  
PRR = Variable; Duty Cycle = 50%.  
Figure 5. ICCD Test Circuit  
ORDERING INFORMATION  
Order Number  
NC7ST02M5X  
Top Mark  
8S02  
8S02  
T02  
Package Description  
Shipping  
SC74A  
SOT235  
3000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
5000 / Tape & Reel  
5000 / Tape & Reel  
NC7ST02M5XL22090  
NC7ST02P5X  
SC88A  
NC7ST02P5XL22057  
NC7ST02L6X  
T02  
SC88A  
D9  
SIP6, MicroPak  
SIP6, MicroPak  
NC7ST02L6XL22175  
D9  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.  
www.onsemi.com  
4
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SIP6 1.45X1.0  
CASE 127EB  
ISSUE O  
DATE 31 AUG 2016  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13590G  
SIP6 1.45X1.0  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SC74A  
CASE 318BQ  
ISSUE B  
5
1
DATE 18 JAN 2018  
SCALE 2:1  
5X b  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
0.20 C A B  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH  
THICKNESS. MINIMUM LEAD THICKNESS IS THE  
MINIMUM THICKNESS OF BASE MATERIAL.  
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD  
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT  
EXCEED 0.15 PER SIDE.  
M
5
4
E1  
E
1
2
3
0.05  
A1  
L
B
e
DETAIL A  
A
D
MILLIMETERS  
DIM  
A
A1  
b
c
D
E
E1  
e
MIN  
0.90  
0.01  
0.25  
0.10  
2.85  
2.50  
1.35  
MAX  
1.10  
0.10  
0.50  
0.26  
3.15  
3.00  
1.65  
TOP VIEW  
SIDE VIEW  
A
DETAIL A  
c
0.95 BSC  
SEATING  
PLANE  
END VIEW  
C
L
M
0.20  
0
0.60  
10  
_
_
RECOMMENDED  
GENERIC  
SOLDERING FOOTPRINT*  
MARKING DIAGRAM*  
0.95  
PITCH  
XXX MG  
G
XXX  
M
= Specific Device Code  
= Date Code  
2.40  
G
= PbFree Package  
(Note: Microdot may be in either location)  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”,  
may or may not be present. Some products  
may not follow the Generic Marking.  
5X  
1.00  
5X  
0.70  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON66279G  
SC74A  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SC88A (SC705/SOT353)  
CASE 419A02  
ISSUE M  
SCALE 2:1  
DATE 11 APR 2023  
GENERIC MARKING  
DIAGRAM*  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
XXXMG  
G
XXX = Specific Device Code  
M
= Date Code  
G
= PbFree Package  
(Note: Microdot may be in either location)  
STYLE 1:  
STYLE 2:  
STYLE 3:  
PIN 1. ANODE 1  
2. N/C  
STYLE 4:  
STYLE 5:  
PIN 1. BASE  
PIN 1. ANODE  
2. EMITTER  
3. BASE  
PIN 1. SOURCE 1  
2. DRAIN 1/2  
3. SOURCE 1  
4. GATE 1  
PIN 1. CATHODE  
2. COMMON ANODE  
3. CATHODE 2  
2. EMITTER  
3. BASE  
4. COLLECTOR  
5. COLLECTOR  
3. ANODE 2  
4. CATHODE 2  
5. CATHODE 1  
4. COLLECTOR  
5. CATHODE  
4. CATHODE 3  
5. CATHODE 4  
5. GATE 2  
STYLE 9:  
STYLE 6:  
PIN 1. EMITTER 2  
2. BASE 2  
STYLE 7:  
STYLE 8:  
Note: Please refer to datasheet for  
style callout. If style type is not called  
out in the datasheet refer to the device  
datasheet pinout or pin assignment.  
PIN 1. ANODE  
2. CATHODE  
3. ANODE  
4. ANODE  
5. ANODE  
PIN 1. BASE  
2. EMITTER  
3. BASE  
PIN 1. CATHODE  
2. COLLECTOR  
3. N/C  
3. EMITTER 1  
4. COLLECTOR  
5. COLLECTOR 2/BASE 1  
4. COLLECTOR  
5. COLLECTOR  
4. BASE  
5. EMITTER  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98ASB42984B  
SC88A (SC705/SOT353)  
PAGE 1 OF 1  
onsemi and  
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves  
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular  
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation  
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOT23, 5 Lead  
CASE 527AH  
ISSUE A  
DATE 09 JUN 2021  
q
q
q
q
q
q1  
q2  
GENERIC  
MARKING DIAGRAM*  
XXXM  
XXX = Specific Device Code  
M
= Date Code  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON34320E  
SOT23, 5 LEAD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
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ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
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