NC7ST02P5X [ONSEMI]
TinyLogic HST 2输入NOR门;型号: | NC7ST02P5X |
厂家: | ONSEMI |
描述: | TinyLogic HST 2输入NOR门 栅 光电二极管 逻辑集成电路 触发器 |
文件: | 总9页 (文件大小:378K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
MARKING
DIAGRAMS
TinyLogic HST 2-Input NOR
Gate
D9KK
XYZ
SIP6
CASE 127EB
NC7ST02
Pin 1
Description
The NC7ST02 is a single 2−Input high performance CMOS NOR
Gate, with TTL−compatible inputs. Advanced Silicon Gate CMOS
fabrication assures high speed and low power circuit operation. ESD
protection diodes inherently guard both inputs and output with respect
8S02MG
SC−74A
CASE 318BQ
G
to the V
and GND rails. High gain circuitry offers high noise
CC
immunity and reduced sensitivity to input edge rate. The
TTL−compatible inputs facilitate TTL to NMOS / CMOS interfacing.
SOT23−5
CASE 527AH
1
Device performance is similar to MM74HCT but with / the output
8S02M
2
current drive of HC / HCT.
Features
• Space Saving SOT23−5, SC−74A and SC−88A 5−Lead Package
• Ultra Small MicroPak™ Leadless Package
• High Speed: t < 7 ns Typ, V = 5 V, C = 15 pF
SC−88A
CASE 419A−02
T02MG
G
PD
CC
L
• Low Quiescent Power: I < 1 mA Typ, V = 5.5 V
CC
CC
• Balanced Output Drive: 2 mA I , −2 mA I
OL
OH
D9, 8S02, T02 = Specific Device Code
• TTL−compatible Inputs
KK
XY
Z
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Date Code*
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
M
IEEE / IEC
A
B
*Date Code orientation and/or position may
vary depending upon manufacturing location.
≥1
Y
Figure 1. Logic Symbol
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
June, 2022 − Rev. 4
NC7ST02/D
NC7ST02
Pin Configurations
A 1
B 2
6 V
CC
A
B
1
2
3
5
4
V
Y
CC
5 NC
4 Y
GND
GND 3
Figure 2. SOT23−5, SC−88A and SC−74A
Figure 3. MicroPak (Top Through View)
(Top View)
PIN DESCRIPTIONS
FUNCTION TABLE (Y = A + B)
Pin Name
Description
Inputs
Output
A, B
Y
Inputs
A
L
B
L
Y
H
L
Output
NC
No Connect
L
H
L
H
H
L
H
L
H = HIGH Logic Level
L = LOW Logic Level
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
−0.5
−
Max
6.5
Unit
V
V
CC
I
IK
Supply Voltage
DC Input Diode Current
V
V
< 0 V
−20
+20
mA
IN
> V
−
IN
CC
V
DC Input Voltage
−0.5
−
V
+ 0.5
CC
V
IN
I
DC Output Diode Current
V
V
< 0 V
−20
mA
OK
OUT
> V
−
+20
OUT
CC
V
Output Voltage
−0.5
−
V
+ 0.5
CC
V
mA
mA
°C
OUT
I
DC Output Source or Sink Current
12.5
25
OUT
I
or I
DC V or Ground Current per Supply Pin
−
CC
GND
CC
T
STG
Storage Temperature
−65
−
+150
+150
+260
390
T
J
Junction Temperature
°C
T
Lead Temperature (Soldering, 10 Seconds)
−
°C
L
P
Power Dissipation in Still Air
SC−74A / SOT23−5
SC−88A
−
−
−
mW
D
332
MicroPak−6
812
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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2
NC7ST02
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Supply Voltage
Conditions
Min
4.5
0
Max
Unit
V
V
CC
5.5
V
I
Input Voltage
V
CC
V
CC
V
V
O
Output Voltage
0
V
T
Operating Temperature
Input Rise and Fall Time
Thermal Resistance
−40
0
+85
10
°C
A
t , t
r
V = 5.0 V
CC
ns/V
°C/W
f
q
SC−74A / SOT23−5
SC−88A
−
320
377
154
JA
−
MicroPak−6
−
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
DC ELECTICAL CHARACTERISTICS
T
A
= +25°C
T = −40 to +85°C
A
Min
2.0
−
Typ
−
Max
−
Min
2.0
Max
−
Symbol
Parameter
V
(V)
Conditions
Unit
V
CC
V
IH
HIGH Level Input Voltage
LOW Level Input Voltage
HIGH Level Output Voltage
4.5 − 5.5
4.5 − 5.5
V
IL
−
0.8
−
−
0.8
−
V
V
OH
4.5
4.5
I
= –20 mA
4.4
4.18
4.5
4.35
4.4
4.13
V
OH
IN
V
= V or V
IH
IL
I
= –2 mA
OH
V
LOW Level Output Voltage
4.5
4.5
I
= 20 mA
IH
= 2 mA
−
0
0.1
−
0.1
V
OL
IN
OL
IN
V
= V or V
0.10
0.26
0.33
IL
I
OL
I
Input Leakage Current
5.5
5.5
5.5
0V ≤ V ≤ 5.5 V
−
−
−
−
−
−
0.1
1.0
2.0
−
−
−
1.0
10.0
2.9
mA
mA
IN
I
Quiescent Supply Current
V
= V or GND
IN CC
CC
I
I
per Input
One Input V = 0.5 V or
mA
CCT
CC
IN
2.4 V, Other Input V or
CC
GND
AC ELECTRICAL CHARACTERISTICS
T
A
= +25°C
Typ
3.5
T = −40 to +85°C
A
Min
−
Max
12
17
16
27
14
26
10
25
21
10
−
Min
Max
−
Symbol
, t
Parameter
V
(V)
Conditions
C = 15 pF
Unit
CC
t
Propagation Delay (Figure 4, 6)
5.0
−
−
−
−
−
−
−
−
−
−
−
ns
PLH PHL
L
−
6.3
−
4.5
5.5
C = 50 pF
L
−
6.1
20
31
18
30
−
−
11.7
4.2
−
−
11.4
4
t
, t
Output Transition Time
(Figure 4, 6)
5.0
4.5
5.5
C = 15 pF
−
ns
TLH THL
L
C = 50 pF
L
−
11
31
26
−
−
10
C
Input Capacitance
Open
5.0
−
2
6
pF
pF
IN
C
Power Dissipation Capacitance
(Figure 5)
(Note 2)
−
−
PD
2. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current. Current consumption
PD
CCD
expression: I
(I
) at no output loading and operating at 50% duty cycle. (See Figure 5).C
is related to I
dynamic operating current by the
PD
CCD
= (C ) (V ) (f ) + (I
).
CCD
PD
CC
IN
CCstatic
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3
NC7ST02
AC Loading and Waveforms
V
CC
INPUT
OUTPUT
CL
C includes load and stray capacitance
L
Input PRR = 1.0 MHz; t = 500 ns
W
Figure 4. AC Test Circuit
Figure 6. AC Waveforms
V
CC
A
INPUT
Input = AC Waveform;
PRR = Variable; Duty Cycle = 50%.
Figure 5. ICCD Test Circuit
ORDERING INFORMATION
†
Order Number
NC7ST02M5X
Top Mark
8S02
8S02
T02
Package Description
Shipping
SC−74A
SOT23−5
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
NC7ST02M5X−L22090
NC7ST02P5X
SC−88A
NC7ST02P5X−L22057
NC7ST02L6X
T02
SC−88A
D9
SIP6, MicroPak
SIP6, MicroPak
NC7ST02L6X−L22175
D9
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5
1
DATE 18 JAN 2018
SCALE 2:1
5X b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
0.20 C A B
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
M
5
4
E1
E
1
2
3
0.05
A1
L
B
e
DETAIL A
A
D
MILLIMETERS
DIM
A
A1
b
c
D
E
E1
e
MIN
0.90
0.01
0.25
0.10
2.85
2.50
1.35
MAX
1.10
0.10
0.50
0.26
3.15
3.00
1.65
TOP VIEW
SIDE VIEW
A
DETAIL A
c
0.95 BSC
SEATING
PLANE
END VIEW
C
L
M
0.20
0
0.60
10
_
_
RECOMMENDED
GENERIC
SOLDERING FOOTPRINT*
MARKING DIAGRAM*
0.95
PITCH
XXX MG
G
XXX
M
= Specific Device Code
= Date Code
2.40
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE M
SCALE 2:1
DATE 11 APR 2023
GENERIC MARKING
DIAGRAM*
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
XXXMG
G
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
STYLE 1:
STYLE 2:
STYLE 3:
PIN 1. ANODE 1
2. N/C
STYLE 4:
STYLE 5:
PIN 1. BASE
PIN 1. ANODE
2. EMITTER
3. BASE
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
4. COLLECTOR
5. CATHODE
4. CATHODE 3
5. CATHODE 4
5. GATE 2
STYLE 9:
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
STYLE 7:
STYLE 8:
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
PIN 1. BASE
2. EMITTER
3. BASE
PIN 1. CATHODE
2. COLLECTOR
3. N/C
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
4. COLLECTOR
5. COLLECTOR
4. BASE
5. EMITTER
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42984B
SC−88A (SC−70−5/SOT−353)
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−23, 5 Lead
CASE 527AH
ISSUE A
DATE 09 JUN 2021
q
q
q
q
q
q1
q2
GENERIC
MARKING DIAGRAM*
XXXM
XXX = Specific Device Code
M
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34320E
SOT−23, 5 LEAD
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
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