NC7SZ02L6X [ONSEMI]

TinyLogic UHS双通道2输入NOR门;
NC7SZ02L6X
型号: NC7SZ02L6X
厂家: ONSEMI    ONSEMI
描述:

TinyLogic UHS双通道2输入NOR门

栅 光电二极管 逻辑集成电路 触发器
文件: 总12页 (文件大小:478K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
MARKING  
DIAGRAMS  
TinyLogic UHS Two-Input  
NOR Gate  
JJKK  
XYZ  
SIP6 1.45x1.0  
CASE 127EB  
NC7SZ02  
Pin 1  
Description  
The NC7SZ02 is a single twoinput NOR gate from onsemi’s  
UltraHigh Speed (UHS) series of TinyLogic. The device is fabricated  
with advanced CMOS technology to achieve ultrahigh speed with  
high output drive while maintaining low static power dissipation over  
JJKK  
XYZ  
UDFN6  
1.0X1.0, 0.35P  
CASE 517DP  
Pin 1  
a broad V operating range. The device is specified to operate over  
CC  
the 1.65 V to 5.5 V V operating range. The inputs and output are  
SC74A  
CASE 318BQ  
CC  
7Z02MG  
highimpedance when V is 0 V. Inputs tolerate voltages up to 5.5 V,  
CC  
G
independent of V operating range.  
CC  
Features  
UltraHigh Speed: t = 2.4 ns (Typical) into 50 pF at 5 V V  
PD  
CC  
SOT235  
CASE 527AH  
High Output Drive: 24 mA at 3 V V  
CC  
7Z02M  
Broad V Operating Range: 1.65 V to 5.5 V  
CC  
Matches Performance of LCX Operated at 3.3 V V  
CC  
Power Down HighImpedance Inputs / Outputs  
OverVoltage Tolerance Inputs Facilitate 5 V to 3 V Translation  
Proprietary Noise / EMI Reduction Circuitry  
SC88A  
CASE 419A02  
Z02MG  
G
UltraSmall MicroPakPackages  
SpaceSaving SOT235, SC74A and SC88A Packages  
JJ, 7Z02, Z02 = Specific Device Code  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
KK  
XY  
Z
M
G
= 2Digit Lot Run Traceability Code  
= 2Digit Date Code Format  
= Assembly Plant Code  
= Date Code*  
Compliant  
IEEE / IEC  
A
B
= PbFree Package  
1  
Y
(Note: Microdot may be in either location)  
*Date Code orientation and/or position may  
vary depending upon manufacturing location.  
Figure 1. Logic Symbol  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 6 of this data sheet.  
© Semiconductor Components Industries, LLC, 1996  
1
Publication Order Number:  
June, 2022 Rev. 4  
NC7SZ02/D  
NC7SZ02  
Pin Configurations  
A 1  
B 2  
6 V  
CC  
A
B
1
2
3
5
4
V
Y
CC  
5 NC  
4 Y  
GND  
GND 3  
Figure 2. SOT235, SC88A and SC74A  
Figure 3. MicroPak (Top Through View)  
(Top View)  
PIN DEFINITIONS  
FUNCTION TABLE  
Pin # SOT235,  
SC88A / SC74A  
Inputs  
Output  
Pin # MicroPak Name  
Description  
Input  
Input  
A
L
B
L
Y
H
L
1
2
3
4
5
1
2
3
4
6
5
A
B
L
H
L
GND Ground  
Output  
H
H
L
Y
H
L
V
CC  
Supply Voltage  
No Connect  
H = HIGH Logic Level  
L = LOW Logic Level  
NC  
www.onsemi.com  
2
NC7SZ02  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Min  
0.5  
0.5  
0.5  
Max  
6.5  
Unit  
V
V
CC  
Supply Voltage  
V
IN  
DC Input Voltage  
6.5  
V
V
DC Output Voltage  
DC Input Diode Current  
DC Output Diode Current  
DC Output Current  
6.5  
V
OUT  
I
V
V
< 0 V  
50  
50  
50  
mA  
mA  
mA  
mA  
°C  
IK  
IN  
I
< 0 V  
OK  
OUT  
I
OUT  
I
or I  
DC V or Ground Current  
50  
CC  
GND  
CC  
T
STG  
Storage Temperature Range  
65  
+150  
+150  
+260  
390  
332  
812  
812  
4000  
2000  
T
J
Junction Temperature Under Bias  
°C  
T
Junction Lead Temperature (Soldering, 10 Seconds)  
Power Dissipation in Still Air  
SC74A / SOT235  
°C  
L
P
D
mW  
SC88A  
MicroPak6  
MicroPak26  
ESD  
Human Body Model, JEDEC: JESD22A114  
Charge Device Model, JEDEC: JESD22C101  
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Supply Voltage Operating  
Supply Voltage Data Retention  
Input Voltage  
Conditions  
Min  
1.65  
1.5  
0
Max  
5.5  
5.5  
5.5  
Unit  
V
CC  
V
V
IN  
V
V
V
OUT  
Output Voltage  
0
V
CC  
T
Operating Temperature  
Input Rise and Fall Times  
40  
0
+85  
20  
°C  
A
t , t  
r
V
CC  
V
CC  
V
CC  
at 1.8 V, 2.5 V 0.2 V  
at 3.3 V 0.3 V  
ns/V  
f
0
10  
at 5.0 V 0.5 V  
0
5
q
Thermal Resistance  
SC74A / SOT235  
SC88A  
320  
377  
154  
154  
°C/W  
JA  
MicroPak6  
MicroPak26  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
1. Unused inputs must be held HIGH or LOW. They may not float.  
www.onsemi.com  
3
NC7SZ02  
DC ELECTICAL CHARACTERISTICS  
T
A
= +25°C  
T = 40 to +85°C  
A
Min  
0.65 V  
0.70 V  
Typ  
Max  
Min  
Max  
Symbol  
Parameter  
V
(V)  
Conditions  
Unit  
CC  
V
IH  
HIGH Level Input Voltage  
1.65 to 1.95  
2.30 to 5.50  
1.65 to 1.95  
2.30 to 5.50  
1.65  
0.65 V  
V
CC  
CC  
CC  
CC  
0.70 V  
V
IL  
LOW Level Input Voltage  
HIGH Level Output Voltage  
0.35 V  
0.35 V  
CC  
V
V
CC  
0.30 V  
0.30 V  
CC  
CC  
V
OH  
V
OH  
= V or V ,  
1.55  
1.70  
2.20  
2.90  
4.40  
1.29  
1.90  
2.40  
2.30  
3.80  
1.65  
1.80  
2.30  
3.00  
4.50  
1.52  
2.15  
2.80  
2.68  
4.20  
0.00  
0.00  
0.00  
0.00  
0.00  
0.08  
0.10  
0.15  
0.22  
0.22  
1.55  
1.70  
2.20  
2.90  
4.40  
1.29  
1.90  
2.40  
2.30  
3.80  
IN  
IH  
IL  
I
= 100 mA  
1.80  
2.30  
3.00  
4.50  
1.65  
I
I
I
I
I
= 4 mA  
= 8 mA  
= 16 mA  
= 24 mA  
= 32 mA  
OH  
OH  
OH  
OH  
OH  
2.30  
3.00  
3.00  
4.50  
V
OL  
LOW Level Output Voltage  
1.65  
V
OL  
= V or V ,  
0.10  
0.10  
0.10  
0.10  
0.10  
0.24  
0.30  
0.40  
0.55  
0.55  
1
0.10  
0.10  
0.10  
0.10  
0.10  
0.24  
0.30  
0.40  
0.55  
0.55  
10  
V
IN  
IH  
IL  
I
= 100 mA  
1.80  
2.30  
3.00  
4.50  
1.65  
I
OL  
I
OL  
I
OL  
I
OL  
I
OL  
= 4 mA  
2.30  
= 8 mA  
3.00  
= 16 mA  
= 24 mA  
= 32 mA  
3.00  
4.50  
I
IN  
Input Leakage Current  
1.65 to 5.50  
0
V
IN  
V
IN  
V
IN  
= 5.5 V, GND  
mA  
mA  
mA  
I
Power Off Leakage Current  
Quiescent Supply Current  
or V  
= 5.5 V  
1
10  
OFF  
OUT  
I
1.65 to 5.50  
= 5.5 V, GND  
2.0  
20  
CC  
www.onsemi.com  
4
NC7SZ02  
AC ELECTRICAL CHARACTERISTICS  
T
A
= +25°C  
Typ  
5.3  
T = 40 to +85°C  
A
Min  
Max  
11.5  
9.5  
6.5  
4.5  
3.9  
5.0  
4.3  
Min  
Max  
12.0  
10.0  
7.0  
4.7  
4.1  
5.2  
4.5  
Symbol  
, t  
Parameter  
V
(V)  
Conditions  
Unit  
CC  
t
Propagation Delay  
(Figure 4, 5)  
1.65  
1.80  
C = 15 pF,  
ns  
PLH PHL  
L
R = 1 MW  
L
4.4  
2.50 0.20  
3.30 0.30  
5.00 0.50  
3.30 0.30  
5.00 0.50  
0
2.9  
2.3  
1.9  
C = 50 pF,  
L
2.9  
L
R = 500 W  
2.4  
C
Input Capacitance  
4
pF  
pF  
IN  
C
Power Dissipation Capacitance  
(Note 2) (Figure 6)  
3.30  
23  
30  
PD  
5.00  
2. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I  
) at  
PD  
CCD  
no output loading and operating at 50% duty cycle. C is related to I  
dynamic operating current by the expression:  
PD  
CCD  
I
= (C ) (V ) (f ) + (I static).  
CCD  
PD CC IN CC  
t = 3 ns  
t = 3 ns  
f
r
V
CC  
90%  
50%  
90%  
50%  
INPUT  
V
CC  
10%  
10%  
GND  
t
W
t
t
PLH  
INPUT  
PHL  
OUTPUT  
V
OH  
OL  
C
R
L
50%  
50%  
OUTPUT  
L
V
Figure 4. AC Test Circuit  
Figure 5. AC Waveforms  
V
CC  
A
INPUT  
NOTE:  
3. Input = AC Waveform; t = t = 1.8 ns;  
r
f
PRR = 10 MHz; Duty Cycle = 50%.  
Figure 6. ICCD Test Circuit  
www.onsemi.com  
5
 
NC7SZ02  
ORDERING INFORMATION  
Part Number  
Top Mark  
7Z02  
7Z02  
Z02  
JJ  
Packages  
SC74A  
Shipping  
NC7SZ02M5X  
3000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
5000 / Tape & Reel  
5000 / Tape & Reel  
5000 / Tape & Reel  
5000 / Tape & Reel  
NC7SZ02M5XL22090  
NC7SZ02P5X  
SOT235  
SC88A  
NC7SZ02L6X  
SIP6, MicroPak  
SIP6, MicroPak  
NC7SZ02L6XL22175  
NC7SZ02FHX  
JJ  
JJ  
UDFN6, MicroPak2  
UDFN6, MicroPak2  
NC7SZ02FHXL22175  
JJ  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other  
countries.  
www.onsemi.com  
6
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SIP6 1.45X1.0  
CASE 127EB  
ISSUE O  
DATE 31 AUG 2016  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13590G  
SIP6 1.45X1.0  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SC74A  
CASE 318BQ  
ISSUE B  
5
1
DATE 18 JAN 2018  
SCALE 2:1  
5X b  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
0.20 C A B  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH  
THICKNESS. MINIMUM LEAD THICKNESS IS THE  
MINIMUM THICKNESS OF BASE MATERIAL.  
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD  
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT  
EXCEED 0.15 PER SIDE.  
M
5
4
E1  
E
1
2
3
0.05  
A1  
L
B
e
DETAIL A  
A
D
MILLIMETERS  
DIM  
A
A1  
b
c
D
E
E1  
e
MIN  
0.90  
0.01  
0.25  
0.10  
2.85  
2.50  
1.35  
MAX  
1.10  
0.10  
0.50  
0.26  
3.15  
3.00  
1.65  
TOP VIEW  
SIDE VIEW  
A
DETAIL A  
c
0.95 BSC  
SEATING  
PLANE  
END VIEW  
C
L
M
0.20  
0
0.60  
10  
_
_
RECOMMENDED  
GENERIC  
SOLDERING FOOTPRINT*  
MARKING DIAGRAM*  
0.95  
PITCH  
XXX MG  
G
XXX  
M
= Specific Device Code  
= Date Code  
2.40  
G
= PbFree Package  
(Note: Microdot may be in either location)  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”,  
may or may not be present. Some products  
may not follow the Generic Marking.  
5X  
1.00  
5X  
0.70  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON66279G  
SC74A  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SC88A (SC705/SOT353)  
CASE 419A02  
ISSUE M  
SCALE 2:1  
DATE 11 APR 2023  
GENERIC MARKING  
DIAGRAM*  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
XXXMG  
G
XXX = Specific Device Code  
M
= Date Code  
G
= PbFree Package  
(Note: Microdot may be in either location)  
STYLE 1:  
STYLE 2:  
STYLE 3:  
PIN 1. ANODE 1  
2. N/C  
STYLE 4:  
STYLE 5:  
PIN 1. BASE  
PIN 1. ANODE  
2. EMITTER  
3. BASE  
PIN 1. SOURCE 1  
2. DRAIN 1/2  
3. SOURCE 1  
4. GATE 1  
PIN 1. CATHODE  
2. COMMON ANODE  
3. CATHODE 2  
2. EMITTER  
3. BASE  
4. COLLECTOR  
5. COLLECTOR  
3. ANODE 2  
4. CATHODE 2  
5. CATHODE 1  
4. COLLECTOR  
5. CATHODE  
4. CATHODE 3  
5. CATHODE 4  
5. GATE 2  
STYLE 9:  
STYLE 6:  
PIN 1. EMITTER 2  
2. BASE 2  
STYLE 7:  
STYLE 8:  
Note: Please refer to datasheet for  
style callout. If style type is not called  
out in the datasheet refer to the device  
datasheet pinout or pin assignment.  
PIN 1. ANODE  
2. CATHODE  
3. ANODE  
4. ANODE  
5. ANODE  
PIN 1. BASE  
2. EMITTER  
3. BASE  
PIN 1. CATHODE  
2. COLLECTOR  
3. N/C  
3. EMITTER 1  
4. COLLECTOR  
5. COLLECTOR 2/BASE 1  
4. COLLECTOR  
5. COLLECTOR  
4. BASE  
5. EMITTER  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98ASB42984B  
SC88A (SC705/SOT353)  
PAGE 1 OF 1  
onsemi and  
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves  
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular  
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation  
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
UDFN6 1.0X1.0, 0.35P  
CASE 517DP  
ISSUE O  
DATE 31 AUG 2016  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13593G  
UDFN6 1.0X1.0, 0.35P  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOT23, 5 Lead  
CASE 527AH  
ISSUE A  
DATE 09 JUN 2021  
q
q
q
q
q
q1  
q2  
GENERIC  
MARKING DIAGRAM*  
XXXM  
XXX = Specific Device Code  
M
= Date Code  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON34320E  
SOT23, 5 LEAD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
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vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
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