NC7SZ157P6X-L22347 [ONSEMI]
TinyLogic UHS 2 输入非反向多路复用器;
| 型号： | NC7SZ157P6X-L22347 |
| 厂家： | 
ONSEMI |
| 描述： | TinyLogic UHS 2 输入非反向多路复用器 复用器 |
| 文件： | 总11页 (文件大小：377K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
TinyLogic UHS 2-Input
Non-Inverting Multiplexer
MARKING
DIAGRAMS
B9KK
XYZ
SIP6 1.45x1.0
CASE 127EB
NC7SZ157
Pin 1
Description
The NC7SZ157 is a single, high performance, 2−to−1 CMOS
non−inverting multiplexer from onsemi’s Ultra−High Speed series of
TinyLogic. The device is fabricated with advanced CMOS technology
to achieve ultra high speed with high output drive while maintaining
UDFN6
1.0X1.0, 0.35P
CASE 517DP
B9KK
XYZ
Pin 1
low static power dissipation over a broad V operating range. The
CC
device is specified to operate over the 1.65 V to 5.5 V V operating
CC
6
range. The inputs and outputs are high impedance when V is 0 V.
CC
SC−88
CASE 419B−02
Inputs tolerate voltages up to 5.5 V independent of V operating
CC
ZF7MG
range.
G
1
Features
• Broad V Operating Range: 1.65 V to 5.5 V
CC
B9, ZF7
= Specific Device Code
• Ultra High−Speed
KK
XY
Z
M
G
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Date Code*
• Power Down High−Impedance Inputs / Outputs
• Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
• Proprietary Noise / EMI Reduction Circuitry
• Ultra−Small MicroPak™ Packages
= Pb−Free Package
(Note: Microdot may be in either location)
• Space−Saving SC−88 Package
*Date Code orientation and/or position may
vary depending upon manufacturing location.
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
IEEC / IEC
S
I
I
0
1
MUX
0
Z
1
Figure 1. Logic Symbol
© Semiconductor Components Industries, LLC, 2000
1
Publication Order Number:
June, 2022 − Rev. 6
NC7SZ157/D
NC7SZ157
Pin Configurations
I
1
6 S
5 V
4 Z
1
I
1
2
3
6
5
4
S
V
Z
1
1
0
GND 2
CC
GND
CC
I
0
I
0
3
Figure 2. SC−88 (Top View)
Figure 3. MicroPak (Top Through View)
(Top View)
AAA
Pin One
NOTES:
1. AAA represents product code top mark (see Ordering Information).
2. Orientation of top mark determines pin one location.
3. Reading the top mark left to right, pin one is the lower left pin.
Figure 4. Pin 1 Orientation
PIN DEFINITIONS
FUNCTION TABLE
Pin # SC−88 Pin # MicroPak
Name
Description
Data Input
Ground
Inputs
Output
Z = (I ) · (S) + (I ) · (S)
1
2
3
4
5
6
1
2
3
4
5
6
I
1
S
L
I
1
I
0
0
1
GND
X
L
H
X
X
L
H
L
I
0
Data Input
Output
L
X
L
Z
H
H
V
CC
Supply Voltage
Control Input
H
H
S
H = HIGH Logic Level
L = LOW Logic Level
X = Don’t Care
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2
NC7SZ157
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
−0.5
−0.5
−0.5
−
Max
6.5
Unit
V
V
CC
Supply Voltage
V
IN
DC Input Voltage
6.5
V
V
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Current
6.5
V
OUT
I
V
V
< 0 V
−50
−50
50
mA
mA
mA
mA
°C
IK
IN
I
< 0 V
−
OK
OUT
I
−
OUT
I
or I
DC V or Ground Current
−
50
CC
GND
CC
T
STG
Storage Temperature Range
−65
−
+150
+150
+260
332
812
812
4000
2000
T
J
Junction Temperature Under Bias
°C
T
L
Junction Lead Temperature (Soldering, 10 Seconds)
−
°C
P
D
Power Dissipation in Still Air
SC−88
−
mW
MicroPak−6
MicroPak2ꢀ−6
−
−
ESD
Human Body Model, JEDEC: JESD22−A114
Charge Device Model, JEDEC: JESD22−C101
−
V
−
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Supply Voltage Operating
Supply Voltage Data Retention
Input Voltage
Conditions
Min
1.65
1.50
0
Max
5.5
5.5
5.5
Unit
V
CC
V
V
IN
V
V
V
OUT
Output Voltage
0
V
CC
T
Operating Temperature
Input Rise and Fall Times
−40
0
+85
20
°C
A
t , t
r
V
CC
V
CC
V
CC
at 1.8 V 0.15 V, 2.5 V 0.2 V
at 3.3 V 0.3 V
ns/V
f
0
10
at 5.0 V 0.5 V
0
5
q
Thermal Resistance
SC−88
−
377
154
154
°C/W
°C/W
JA
MicroPak−6
MicroPak2−6
−
−
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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3
NC7SZ157
DC ELECTRICAL CHARACTERISTICS
T
A
= +25°C
T = −40 to +85°C
A
Min
Typ
−
Max
−
Min
Max
−
Symbol
Parameter
V
(V)
Conditions
Unit
CC
V
IH
HIGH Level
Input Voltage
1.65 to 1.95
2.30 to 5.50
1.65 to 1.95
2.30 to 5.50
1.65
0.65 V
0.65 V
V
CC
CC
CC
0.70 V
−
−
0.70 V
−
CC
V
IL
LOW Level
Input Voltage
−
−
−
0.35 V
−
−
0.35 V
V
V
CC
CC
−
0.30 V
0.30 V
CC
CC
V
OH
HIGH Level
Output Voltage
V
= V
IL
I
= −100 mA
1.55
2.20
2.90
4.40
1.29
1.90
2.40
2.30
3.90
−
1.65
2.30
3.00
4.50
1.52
2.15
2.80
3.68
4.20
0
−
−
−
−
−
−
−
−
−
1.55
2.20
2.90
4.40
1.29
1.90
2.40
2.30
3.80
−
−
−
−
−
−
−
−
−
−
IN
IH
OH
or V
2.30
3.00
4.50
1.65
I
I
I
I
I
I
= −4 mA
= −8 mA
= −16 mA
= −24 mA
= −32 mA
= 100 mA
OH
OH
OH
OH
OH
OL
2.30
3.00
3.00
4.50
V
OL
LOW Level
Output Voltage
1.65
V
IN
= V
IH
0.10
0.10
0.10
0.10
0.24
0.30
0.40
0.55
0.55
0.1
0.10
0.10
0.10
0.10
0.24
0.30
0.40
0.55
0.55
1
V
or V
IL
2.30
−
0
−
3.00
−
0
−
4.50
−
0
−
1.65
I
I
I
I
I
= 4 mA
−
0.08
0.10
0.15
0.22
0.22
−
−
OL
OL
OL
OL
OL
2.30
= 8 mA
−
−
3.00
= 16 mA
= 24 mA
= 32 mA
= 5.5 V, GND
−
−
3.00
−
−
4.50
−
−
I
IN
Input Leakage
Current
1.65 to 5.5
V
−
−
mA
mA
mA
IN
I
Power Off
Leakage Current
0
V
V
or
OUT
−
−
−
−
1.0
1.0
−
−
10
10
OFF
IN
= 5.5 V
I
Quiescent
Supply Current
1.65 to 5.50
V
IN
= 5.5 V, GND
CC
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4
NC7SZ157
AC ELECTRICAL CHARACTERISTICS
T
A
= +25°C
T = −40 to +85°C
A
Symbol
Parameter
V
(V)
Conditions
Min
−
Typ
Max
11.5
6.1
Min
Max
12.0
6.5
Unit
CC
t
, t
Propagation Delay S to Z
(Figure 5, 6)
ns
1.80 0.15
2.50 0.20
3.30 0.30
5.00 0.50
1.80 0.15
5.00 0.50
3.30 0.30
5.00 0.50
3.30 0.30
5.00 0.50
3.30 0.30
5.00 0.50
0.00
C = 15 pF,
6.0
3.5
2.6
1.9
5.9
−
−
−
−
−
PLH PHL
L
R = 1 MW,
L
−
−
4.1
4.5
−
3.2
3.5
Propagation Delay I to Z
10.0
10.5
C = 15 pF,
−
n
L
(Figure 5, 6)
R = 1MW,
L
−
3.5
2.6
1.9
3.2
2.4
3.2
2.4
2
5.8
3.9
3.1
4.8
3.8
4.6
3.7
−
−
−
−
−
−
−
−
−
−
−
6.1
4.2
3.3
5.2
4.1
5.0
4.0
−
−
−
Propagation Delay S to Z
(Figure 5, 6)
C = 50 pF,
−
L
R = 500 W,
L
−
Propagation Delay I to Z
C = 50 pF,
−
n
L
(Figure 5, 6)
R = 500 W,
L
−
C
C
Input Capacitance
−
pF
pF
IN
Power Dissipation Capacitance
(Note 4) (Figure 7)
3.30
−
14
−
−
PD
5.00
−
17
−
−
4. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I
) at
PD
CCD
no output loading and operating at 50% duty cycle. C is related to I
dynamic operating current by the expression:
PD
CCD
I
= (C ) (V ) (f ) + (I static).
CCD
PD CC IN CC
t = 3 ns
t = 3 ns
f
V
r
CC
V
CC
90%
50%
90%
50%
INPUT
DUT
INPUT
OUTPUT
10%
10%
GND
t
W
C
R
L
L
t
t
t
t
PHL
PLH
NOTE:
V
OH
5. C includes load and stray capacitance;
L
inputs PRR = 1.0 MHz, t = 500 ns.
W
50%
50%
50%
Out of Phase
OUTPUT
Figure 5. AC Test Circuit
V
V
OL
V
CC
PLH
PHL
OH
A
50%
In Phase
OUTPUT
V
OL
DUT
INPUT
INPUT
Figure 6. AC Waveforms
NOTE:
6. Input = AC Waveform; PRR = Variable; Duty Cycle = 50%.
Figure 7. ICCD Test Circuit
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5
NC7SZ157
DEVICE ORDERING INFORMATION
†
Device
NC7SZ157P6X
Top Mark
ZF7
ZF7
B9
Packages
Shipping
6−Lead SC70, EIAJ SC−88, 1.25 mm Wide
6−Lead SC70, EIAJ SC−88, 1.25 mm Wide
6−Lead MicroPak, 1.00 mm Wide
3000 / Tape & Reel
3000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
NC7SZ157P6X−L22347
NC7SZ157L6X
NC7SZ157L6X−L22175
NC7SZ157FHX
B9
6−Lead MicroPak, 1.00 mm Wide
B9
6−Lead, MicroPak2, 1x1 mm Body, .35 mm Pitch
6−Lead, MicroPak2, 1x1 mm Body, .35 mm Pitch
NC7SZ157FHX−L22175
B9
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United
States and/or other countries.
www.onsemi.com
6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
1
DATE 11 DEC 2012
SCALE 2:1
2X
aaa H
D
NOTES:
D
H
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
A
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-
SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-
TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
D
GAGE
PLANE
6
1
5
2
4
3
L
L2
E1
E
DETAIL A
aaa
C
2X
2X 3 TIPS
bbb H
D
e
MILLIMETERS
DIM MIN NOM MAX
−−−
INCHES
MIN
−−−
NOM MAX
−−− 0.043
−−− 0.004
6X b
B
TOP VIEW
A
−−−
−−−
1.10
A1 0.00
A2 0.70
0.10 0.000
M
ddd
C A-B D
0.90
0.20
0.15
2.00
2.10
1.25
0.65 BSC
0.36
1.00 0.027 0.035 0.039
0.25 0.006 0.008 0.010
0.22 0.003 0.006 0.009
2.20 0.070 0.078 0.086
2.20 0.078 0.082 0.086
1.35 0.045 0.049 0.053
0.026 BSC
b
C
D
E
0.15
0.08
1.80
2.00
A2
DETAIL A
A
E1 1.15
e
L
0.26
0.46 0.010 0.014 0.018
0.006 BSC
L2
0.15 BSC
0.15
aaa
bbb
ccc
ddd
0.006
0.012
0.004
0.004
0.30
0.10
0.10
6X
ccc C
A1
SEATING
PLANE
c
C
SIDE VIEW
END VIEW
GENERIC
MARKING DIAGRAM*
RECOMMENDED
SOLDERING FOOTPRINT*
6
6X
0.30
XXXMG
6X
0.66
G
1
2.50
XXX = Specific Device Code
M
= Date Code*
G
= Pb−Free Package
0.65
(Note: Microdot may be in either location)
PITCH
*Date Code orientation and/or position may
vary depending upon manufacturing location.
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
STYLES ON PAGE 2
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42985B
SC−88/SC70−6/SOT−363
PAGE 1 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
DATE 11 DEC 2012
STYLE 1:
PIN 1. EMITTER 2
2. BASE 2
STYLE 2:
CANCELLED
STYLE 3:
CANCELLED
STYLE 4:
STYLE 5:
STYLE 6:
PIN 1. ANODE 2
2. N/C
PIN 1. CATHODE
2. CATHODE
3. COLLECTOR
4. EMITTER
5. BASE
PIN 1. ANODE
2. ANODE
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
3. COLLECTOR
3. CATHODE 1
4. ANODE 1
5. N/C
4. EMITTER
5. BASE
6. COLLECTOR 2
6. ANODE
6. CATHODE
6. CATHODE 2
STYLE 7:
STYLE 8:
CANCELLED
STYLE 9:
STYLE 10:
STYLE 11:
STYLE 12:
PIN 1. SOURCE 2
2. DRAIN 2
3. GATE 1
PIN 1. EMITTER 2
2. EMITTER 1
3. COLLECTOR 1
4. BASE 1
PIN 1. SOURCE 2
2. SOURCE 1
3. GATE 1
PIN 1. CATHODE 2
2. CATHODE 2
3. ANODE 1
PIN 1. ANODE 2
2. ANODE 2
3. CATHODE 1
4. ANODE 1
5. ANODE 1
6. CATHODE 2
4. SOURCE 1
5. DRAIN 1
6. GATE 2
4. DRAIN 1
5. DRAIN 2
6. GATE 2
4. CATHODE 1
5. CATHODE 1
6. ANODE 2
5. BASE 2
6. COLLECTOR 2
STYLE 13:
PIN 1. ANODE
2. N/C
STYLE 14:
PIN 1. VREF
2. GND
STYLE 15:
STYLE 16:
STYLE 17:
STYLE 18:
PIN 1. VIN1
2. VCC
PIN 1. ANODE 1
2. ANODE 2
PIN 1. BASE 1
2. EMITTER 2
3. COLLECTOR 2
4. BASE 2
PIN 1. BASE 1
2. EMITTER 1
3. COLLECTOR 2
4. BASE 2
3. COLLECTOR
4. EMITTER
5. BASE
3. GND
3. ANODE 3
3. VOUT2
4. VIN2
5. GND
6. VOUT1
4. IOUT
5. VEN
6. VCC
4. CATHODE 3
5. CATHODE 2
6. CATHODE 1
5. EMITTER 1
6. COLLECTOR 1
5. EMITTER 2
6. COLLECTOR 1
6. CATHODE
STYLE 19:
PIN 1. I OUT
2. GND
STYLE 20:
STYLE 21:
PIN 1. ANODE 1
2. N/C
STYLE 22:
PIN 1. D1 (i)
2. GND
STYLE 23:
PIN 1. Vn
2. CH1
3. Vp
STYLE 24:
PIN 1. CATHODE
2. ANODE
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
3. GND
3. ANODE 2
4. CATHODE 2
5. N/C
3. D2 (i)
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
4. V CC
4. EMITTER
5. COLLECTOR
6. COLLECTOR
4. D2 (c)
5. VBUS
6. D1 (c)
4. N/C
5. V EN
5. CH2
6. N/C
6. V REF
6. CATHODE 1
STYLE 30:
STYLE 25:
STYLE 26:
PIN 1. SOURCE 1
2. GATE 1
STYLE 27:
PIN 1. BASE 2
2. BASE 1
STYLE 28:
PIN 1. DRAIN
2. DRAIN
3. GATE
STYLE 29:
PIN 1. ANODE
2. ANODE
PIN 1. SOURCE 1
2. DRAIN 2
3. DRAIN 2
4. SOURCE 2
5. GATE 1
PIN 1. BASE 1
2. CATHODE
3. COLLECTOR 2
4. BASE 2
3. DRAIN 2
4. SOURCE 2
5. GATE 2
3. COLLECTOR 1
4. EMITTER 1
5. EMITTER 2
6. COLLECTOR 2
3. COLLECTOR
4. EMITTER
5. BASE/ANODE
6. CATHODE
4. SOURCE
5. DRAIN
6. DRAIN
5. EMITTER
6. COLLECTOR 1
6. DRAIN 1
6. DRAIN 1
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42985B
SC−88/SC70−6/SOT−363
PAGE 2 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DATE 31 AUG 2016
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98AON13593G
UDFN6 1.0X1.0, 0.35P
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