NC7SZ19FHX [ONSEMI]
TinyLogic UHS 1/2 解码器/信号分离器;
| 型号： | NC7SZ19FHX |
| 厂家： | 
ONSEMI |
| 描述： | TinyLogic UHS 1/2 解码器/信号分离器 驱动 光电二极管 逻辑集成电路 解码器 |
| 文件： | 总10页 (文件大小：369K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
TinyLogic UHS 1-of-2
Decoder / Demultiplexer
MARKING
DIAGRAMS
B4KK
XYZ
SIP6 1.45x1.0
CASE 127EB
NC7SZ19
Pin 1
Description
The NC7SZ19 is a 1−of−2 decoder with a common output enable.
The device is fabricated with advanced CMOS technology to achieve
ultra−high speed with high output drive while maintaining low static
B4KK
XYZ
UDFN6
1.0X1.0, 0.35P
CASE 517DP
power dissipation over a broad V operating range. The device is
CC
Pin 1
6
specified to operate over the 1.65 V to 5.5 V V range. The inputs
CC
and outputs are high impedance when V is 0 V. Inputs tolerate
CC
voltages up to 5.5 V independent of V operating voltage.
CC
SC−88
CASE 419B−02
Z19M G
Features
G
• Ultra High−Speed: t = 2.7 ns Typical at 5 V V
PD
CC
1
• Broad V Operating Range: 1.65 V to 5.55 V
CC
• Power Down High Impednce Inputs / Outputs
B4, Z19
= Specific Device Code
• Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
• Proprietary Noise / EMI Reduction Circuitry
• Ultra−Small MicroPak™ Packages
• Space Saving SC−88 6−Lead Package
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
KK
XY
Z
M
G
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Data Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 1999
1
Publication Order Number:
June, 2022 − Rev. 4
NC7SZ19/D
NC7SZ19
Pin Configurations
A
GND
E
1
6
5
4
Y
V
Y
0
A 1
GND 2
E 3
6 Y
5 V
4 Y
0
2
3
CC
1
CC
1
Figure 1. SC−88 (Top View)
Figure 2. MicroPak (Top Through View)
(Top View)
AAA
Pin One
NOTES:
1. AAA represents product code top mark (see Ordering Information).
2. Orientation of top mark determines pin one location.
3. Reading the top mark left to right, pin one is the lower left pin.
Figure 3. Pin 1 Orientation
PIN DEFINITIONS
FUNCTION TABLE
Pin # SC−88 Pin # MicroPak Name
Description
Inputs
Output
1
1
A
Decoder Address /
A
L
E
L
Y = A + E
Y = A + E
0
1
Demultiplexer Select
L
H
H
H
L
2
3
2
3
GND Ground
Decoder Output Enable /
H
X
L
E
H
H
Demultiplexer Data
H = HIGH Logic Level
L = LOW Logic Level
X = 3−STATE
4
5
6
4
5
6
Y
1
Output
V
CC
Supply Voltage
Output
Y
0
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2
NC7SZ19
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
−0.5
−0.5
−0.5
−
Max
6.5
Unit
V
V
CC
Supply Voltage
V
IN
DC Input Voltage
6.5
V
V
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Current
6.5
V
OUT
I
V
V
< 0 V
−50
−50
50
mA
mA
mA
mA
°C
IK
IN
I
< 0 V
−
OK
OUT
I
−
OUT
I
or I
DC V or Ground Current
−
50
CC
GND
CC
T
STG
Storage Temperature Range
−65
−
+150
+150
+260
332
812
812
4000
2000
T
J
Junction Temperature Under Bias
°C
T
L
Junction Lead Temperature (Soldering, 10 Seconds)
−
°C
P
D
Power Dissipation in Still Air
SC−88
−
mW
MicroPak−6
MicroPak2ꢀ−6
−
−
ESD
Human Body Model, JEDEC: JESD22−A114
Charge Device Model, JEDEC: JESD22−C101
−
V
−
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Supply Voltage Operating
Supply Voltage Data Retention
Input Voltage
Conditions
Min
1.65
1.5
0
Max
5.50
5.5
Unit
V
CC
V
V
IN
5.5
V
V
V
OUT
Output Voltage
0
V
CC
t , t
Input Rise and Fall Times
V
CC
V
CC
V
CC
at 1.8 V 0.15 V, 2.5 V 0.2 V
at 3.3 V 0.3 V
0
20
ns/V
r
f
0
10
5
at 5.0 V 0.5 V
0
T
Operating Temperature
Thermal Resistance
−40
−
+85
377
154
154
°C
A
q
SC−88
°C/W
JA
MicroPak−6
MicroPak2−6
−
−
°C/W
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
www.onsemi.com
3
NC7SZ19
DC ELECTICAL CHARACTERISTICS
T
A
= +25°C
T = −40 to +85°C
A
Min
0.65 V
0.70 V
−
Typ
−
Max
−
Min
Max
−
Symbol
Parameter
V
(V)
Conditions
Unit
CC
V
IH
HIGH Level Input Voltage
1.65 to 1.95
2.30 to 5.50
1.65 to 1.95
2.30 to 5.50
1.65
0.65 V
V
CC
CC
CC
CC
−
−
0.70 V
−
V
IL
LOW Level Input Voltage
HIGH Level Output Voltage
−
0.35 V
−
−
0.35 V
V
V
CC
CC
−
−
0.30 V
0.30 V
CC
CC
V
OH
V
OH
= V , or V ,
1.55
2.20
2.90
4.40
1.29
1.90
2.40
2.30
3.80
−
1.65
2.30
3.00
4.50
1.52
2.15
2.80
3.68
4.20
0.00
0.00
0.00
0.00
0.08
0.10
0.15
0.22
0.22
−
−
−
−
−
−
−
−
−
−
1.55
2.20
2.90
4.40
1.29
1.90
2.40
2.30
3.80
−
−
−
−
−
−
−
−
−
−
IN
IH
IL
I
= −100 mA
2.30
3.00
4.50
1.65
I
I
I
I
I
= −4 mA
= −8 mA
= −16 mA
= −24 mA
= −32 mA
OH
OH
OH
OH
OH
2.30
3.00
3.00
4.50
V
OL
LOW Level Output Voltage
1.65
V
OL
= V , or V
0.10
0.10
0.10
0.10
0.24
0.30
0.40
0.55
0.55
0.1
0.10
0.10
0.10
0.10
0.24
0.30
0.40
0.55
0.55
1.0
V
IN
IH
IL,
I
= 100 mA
2.30
−
−
3.00
−
−
4.50
−
−
1.65
I
OL
I
OL
I
OL
I
OL
I
OL
= 4 mA
−
−
2.30
= 8 mA
−
−
3.00
= 16 mA
= 24 mA
= 32 mA
−
−
3.00
−
−
4.50
−
−
I
IN
Input Leakage Current
1.65 to 5.5
0
V
IN
V
IN
V
IN
= 5.5 V, GND
−
−
mA
mA
mA
I
Power Off Leakage Current
Quiescent Supply Current
or V
= 5.5 V
−
−
1
−
10
OFF
OUT
I
1.65 to 5.50
= 5.5 V, GND
−
−
1
−
10
CC
AC ELECTRICAL CHARACTERISTICS
T
A
= +25°C
T = −40 to +85°C
A
Min
−
Typ
5.9
Max
Min
Max
11.0
6.4
4.5
3.5
5.4
4.3
−
Symbol
Parameter
V
(V)
Conditions
Unit
CC
t
, t
Propagation Delay A or /E to Output
(Figure 5, 6)
ns
1.80 0.15 C = 15 pF,
10.5
6.0
4.1
3.2
5.1
4.0
−
−
−
−
−
−
−
−
−
−
PLH PHL
L
R = 1 MW
L
2.50 0.20
3.30 0.30
5.00 0.50
3.30 0.30
5.00 0.50
0
−
3.5
−
2.7
−
2.1
−
3.2
ns
C = 50 pF,
L
R = 500 W
L
−
2.7
C
C
Input Capacitance
−
2.3
pF
pF
IN
Power Dissipation Capacitance
(Note 4) (Figure 5)
3.30
−
10.5
12.8
−
−
PD
5.00
−
−
−
4. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I
) at
PD
CCD
no output loading and operating at 50% duty cycle. C is related to I
dynamic operating current by the expression:
PD
CCD
I
= (C ) (V ) (f ) + (I static).
CCD
PD CC IN CC
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4
NC7SZ19
AC Loading and Waveforms
V
CC
INPUT
OUTPUT
C
R
L
L
t = 3 ns
t = 3 ns
f
r
V
NOTES:
CC
90%
50%
90%
50%
5. C includes load and stray capacitance.
L
6. Input PRR = 1.0 MHz, t = 500 ns.
W
INPUT
10%
10%
Figure 4. AC Test Circuit
GND
t
W
V
CC
t
t
t
t
PHL
PLH
V
OH
A
50%
50%
50%
Out of Phase
OUTPUT
A
V
V
OL
INPUT
OUTPUT
PLH
PHL
OH
NOTE:
7. Input = AC Waveform; t = t = 1.8 ns.
8. PRR = 10 MHz; Duty Cycle = 50%.
9. /E Input = GND.
50%
In Phase
OUTPUT
r
f
V
OL
Figure 5. ICCD Test Circuit
Figure 6. AC Waveforms
ORDERING INFORMATION
†
Device
Top Mark
Z19
Z19
B4
Packages
Shipping
NC7SZ19P6X
6−Lead SC70, EIAJ SC88, 1.25 mm Wide
6−Lead SC70, EIAJ SC88, 1.25 mm Wide
6−Lead MicroPak, 1.00 mm Wide
3000 / Tape & Reel
3000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
NC7SZ19P6X−L22347
NC7SZ19L6X
NC7SZ19L6X−L22175
NC7SZ19FHX
B4
6−Lead MicroPak, 1.00 mm Wide
B4
6−Lead, MicroPak2, 1x1 mm Body, .35 mm Pitch
6−Lead, MicroPak2, 1x1 mm Body, .35 mm Pitch
NC7SZ19FHX−L22175
B4
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United
States and/or other countries.
www.onsemi.com
5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
1
DATE 11 DEC 2012
SCALE 2:1
2X
aaa H
D
NOTES:
D
H
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
A
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-
SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-
TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
D
GAGE
PLANE
6
1
5
2
4
3
L
L2
E1
E
DETAIL A
aaa
C
2X
2X 3 TIPS
bbb H
D
e
MILLIMETERS
DIM MIN NOM MAX
−−−
INCHES
MIN
−−−
NOM MAX
−−− 0.043
−−− 0.004
6X b
B
TOP VIEW
A
−−−
−−−
1.10
A1 0.00
A2 0.70
0.10 0.000
M
ddd
C A-B D
0.90
0.20
0.15
2.00
2.10
1.25
0.65 BSC
0.36
1.00 0.027 0.035 0.039
0.25 0.006 0.008 0.010
0.22 0.003 0.006 0.009
2.20 0.070 0.078 0.086
2.20 0.078 0.082 0.086
1.35 0.045 0.049 0.053
0.026 BSC
b
C
D
E
0.15
0.08
1.80
2.00
A2
DETAIL A
A
E1 1.15
e
L
0.26
0.46 0.010 0.014 0.018
0.006 BSC
L2
0.15 BSC
0.15
aaa
bbb
ccc
ddd
0.006
0.012
0.004
0.004
0.30
0.10
0.10
6X
ccc C
A1
SEATING
PLANE
c
C
SIDE VIEW
END VIEW
GENERIC
MARKING DIAGRAM*
RECOMMENDED
SOLDERING FOOTPRINT*
6
6X
0.30
XXXMG
6X
0.66
G
1
2.50
XXX = Specific Device Code
M
= Date Code*
G
= Pb−Free Package
0.65
(Note: Microdot may be in either location)
PITCH
*Date Code orientation and/or position may
vary depending upon manufacturing location.
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
STYLES ON PAGE 2
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42985B
SC−88/SC70−6/SOT−363
PAGE 1 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
DATE 11 DEC 2012
STYLE 1:
PIN 1. EMITTER 2
2. BASE 2
STYLE 2:
CANCELLED
STYLE 3:
CANCELLED
STYLE 4:
STYLE 5:
STYLE 6:
PIN 1. ANODE 2
2. N/C
PIN 1. CATHODE
2. CATHODE
3. COLLECTOR
4. EMITTER
5. BASE
PIN 1. ANODE
2. ANODE
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
3. COLLECTOR
3. CATHODE 1
4. ANODE 1
5. N/C
4. EMITTER
5. BASE
6. COLLECTOR 2
6. ANODE
6. CATHODE
6. CATHODE 2
STYLE 7:
STYLE 8:
CANCELLED
STYLE 9:
STYLE 10:
STYLE 11:
STYLE 12:
PIN 1. SOURCE 2
2. DRAIN 2
3. GATE 1
PIN 1. EMITTER 2
2. EMITTER 1
3. COLLECTOR 1
4. BASE 1
PIN 1. SOURCE 2
2. SOURCE 1
3. GATE 1
PIN 1. CATHODE 2
2. CATHODE 2
3. ANODE 1
PIN 1. ANODE 2
2. ANODE 2
3. CATHODE 1
4. ANODE 1
5. ANODE 1
6. CATHODE 2
4. SOURCE 1
5. DRAIN 1
6. GATE 2
4. DRAIN 1
5. DRAIN 2
6. GATE 2
4. CATHODE 1
5. CATHODE 1
6. ANODE 2
5. BASE 2
6. COLLECTOR 2
STYLE 13:
PIN 1. ANODE
2. N/C
STYLE 14:
PIN 1. VREF
2. GND
STYLE 15:
STYLE 16:
STYLE 17:
STYLE 18:
PIN 1. VIN1
2. VCC
PIN 1. ANODE 1
2. ANODE 2
PIN 1. BASE 1
2. EMITTER 2
3. COLLECTOR 2
4. BASE 2
PIN 1. BASE 1
2. EMITTER 1
3. COLLECTOR 2
4. BASE 2
3. COLLECTOR
4. EMITTER
5. BASE
3. GND
3. ANODE 3
3. VOUT2
4. VIN2
5. GND
6. VOUT1
4. IOUT
5. VEN
6. VCC
4. CATHODE 3
5. CATHODE 2
6. CATHODE 1
5. EMITTER 1
6. COLLECTOR 1
5. EMITTER 2
6. COLLECTOR 1
6. CATHODE
STYLE 19:
PIN 1. I OUT
2. GND
STYLE 20:
STYLE 21:
PIN 1. ANODE 1
2. N/C
STYLE 22:
PIN 1. D1 (i)
2. GND
STYLE 23:
PIN 1. Vn
2. CH1
3. Vp
STYLE 24:
PIN 1. CATHODE
2. ANODE
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
3. GND
3. ANODE 2
4. CATHODE 2
5. N/C
3. D2 (i)
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
4. V CC
4. EMITTER
5. COLLECTOR
6. COLLECTOR
4. D2 (c)
5. VBUS
6. D1 (c)
4. N/C
5. V EN
5. CH2
6. N/C
6. V REF
6. CATHODE 1
STYLE 30:
STYLE 25:
STYLE 26:
PIN 1. SOURCE 1
2. GATE 1
STYLE 27:
PIN 1. BASE 2
2. BASE 1
STYLE 28:
PIN 1. DRAIN
2. DRAIN
3. GATE
STYLE 29:
PIN 1. ANODE
2. ANODE
PIN 1. SOURCE 1
2. DRAIN 2
3. DRAIN 2
4. SOURCE 2
5. GATE 1
PIN 1. BASE 1
2. CATHODE
3. COLLECTOR 2
4. BASE 2
3. DRAIN 2
4. SOURCE 2
5. GATE 2
3. COLLECTOR 1
4. EMITTER 1
5. EMITTER 2
6. COLLECTOR 2
3. COLLECTOR
4. EMITTER
5. BASE/ANODE
6. CATHODE
4. SOURCE
5. DRAIN
6. DRAIN
5. EMITTER
6. COLLECTOR 1
6. DRAIN 1
6. DRAIN 1
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42985B
SC−88/SC70−6/SOT−363
PAGE 2 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13593G
UDFN6 1.0X1.0, 0.35P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
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