NC7WZ00L8X [ONSEMI]

TinyLogic UHS 双 2 输入 NAND 门极;
NC7WZ00L8X
型号: NC7WZ00L8X
厂家: ONSEMI    ONSEMI
描述:

TinyLogic UHS 双 2 输入 NAND 门极

栅 逻辑集成电路 触发器
文件: 总9页 (文件大小:422K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
MARKING  
DIAGRAMS  
TinyLogic UHS Dual  
2-Input NAND Gate  
UQFN8  
1.6X1.6, 0.5P  
CASE 523AY  
N6KK  
XYZ  
NC7WZ00  
Description  
The NC7WZ00 is a dual 2Input NAND Gate from onsemi’s Ultra  
High Speed Series of TinyLogic. The device is fabricated with  
advanced CMOS technology to achieve ultra high speed with high  
output drive while maintaining low static power dissipation over a  
WZ00  
ALYW  
US8  
CASE 846AN  
broad V operating range. The device is specified to operate over the  
CC  
1.65 V to 5.5 V V operating range. The inputs and output are high  
CC  
impedance when V is 0 V. Inputs tolerate voltages up to 5.5 V  
CC  
independent of V operating voltage.  
CC  
N6, WZ00 = Specific Device Code  
Features  
KK  
XY  
Z
= 2Digit Lot Run Traceability Code  
= 2Digit Date Code Format  
= Assembly Plant Code  
= Assembly Site  
Space Saving US8 Surface Mount Package  
MicroPakLeadless Package  
A
Ultra High Speed: t 2.4 ns Typ. into 50 pF at 5 V V  
PD  
CC  
L
= Wafer Lot Number  
High Output Drive: 24 mA at 3 V V  
CC  
YW  
= Assembly Start Week  
Broad V Operating Range: 1.65 V 5.5 V  
CC  
Matches the Performance of LCX when Operated at 3.3 V V  
Power Down High Impedance Inputs / Output  
CC  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 6 of this data sheet.  
Overvoltage Tolerant Inputs Facilitate 5 V to 3 V Translation  
Proprietary Noise / EMI Reduction Circuitry Implemented  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
IEEE/IEC  
A
B
&
1
1
Y
Y
1
A
B
&
2
2
2
Figure 1. Logic Symbol  
© Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
June, 2022 Rev. 5  
NC7WZ00/D  
NC7WZ00  
Pin Configurations  
A
1
1
8
V
CC  
A
1
B
1
Y
2
7
6
5
B
1
Y
2
2
3
7
6
Y
1
B
2
V
CC  
8
4 GND  
GND  
4
5
A
2
1
2
3
Y
1
B
2
A
2
Figure 2. Connection Diagram (Top View)  
Figure 4. Pad Assignments for MicroPak  
(Top Thru View)  
(Top View)  
Pin One  
AAA  
AAA represents Product Code Top Mark see ordering code  
NOTE: Orientation of Top Mark determines Pin One location.  
Read the top product code mark left to right, Pin One  
is the lower left pin (see diagram).  
Figure 3. Pin One Orientation Diagram  
PIN DESCRIPTION  
FUNCTION TABLE (Y = AB)  
Pin Names  
A , B  
Description  
Inputs  
Output  
Inputs  
A
L
B
L
Y
H
H
H
L
n
n
Y
n
Output  
L
H
L
H
H
H
H = HIGH Logic Level  
L = LOW Logic Level  
www.onsemi.com  
2
NC7WZ00  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Min  
0.5  
0.5  
0.5  
Max  
6.5  
Unit  
V
V
CC  
Supply Voltage  
V
IN  
DC Input Voltage  
6.5  
V
V
DC Output Voltage  
DC Input Diode Current  
DC Output Diode Current  
DC Output Current  
6.5  
V
OUT  
I
V
V
< 0 V  
50  
50  
50  
mA  
mA  
mA  
mA  
°C  
IK  
IN  
I
< 0 V  
OK  
OUT  
I
OUT  
I
/ I  
DC V / GND Current  
100  
+150  
150  
260  
CC GND  
CC  
T
STG  
Storage Temperature  
65  
T
Junction Temperature Under Bias  
°C  
J
L
T
Junction Lead Temperature (Soldering, 10 Seconds)  
Power Dissipation in Still Air  
°C  
P
D
US8  
MicroPak8  
500  
539  
mW  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
1.65  
1.5  
0
Max  
5.5  
5.5  
5.5  
Unit  
V
CC  
Supply Voltage Operating  
V
Supply Voltage Data Retention  
Input Voltage  
V
IN  
V
V
V
OUT  
Output Voltage  
0
V
CC  
T
Operating Temperature  
40  
0
+85  
20  
10  
5
°C  
A
t , t  
r
Input Rise and Fall Time  
Thermal Resistance  
V
CC  
V
CC  
V
CC  
= 1.65 V 0.15 V, 2.5 V 0.2 V  
= 3.3 V 0.3 V  
ns/V  
f
0
= 5.0 V 0.5 V  
0
q
US8  
MicroPak8  
250  
232  
°C/W  
JA  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
1. Unused inputs must be held HIGH or LOW. They may not float.  
www.onsemi.com  
3
NC7WZ00  
DC ELECTICAL CHARACTERISTICS  
T
A
= +25°C  
T = 40 to +85°C  
A
Min  
0.65 V  
0.70 V  
Typ  
Max  
Min  
Max  
Symbol  
Parameter  
V
(V)  
Conditions  
Unit  
CC  
V
IH  
HIGH Level Input  
Voltage  
1.65 1.95  
2.3 5.5  
1.65 1.95  
2.3 5.5  
1.65  
0.65 V  
V
CC  
CC  
CC  
CC  
0.70 V  
V
IL  
LOW Level Input  
Voltage  
0.35 V  
0.35 V  
V
V
CC  
CC  
0.30 V  
0.30 V  
CC  
CC  
V
OH  
HIGH Level Output  
Voltage  
V
= V  
I
= 100 mA  
1.55  
2.2  
2.9  
4.4  
1.29  
1.9  
2.4  
2.3  
3.8  
1.65  
2.3  
1.55  
2.2  
2.9  
4.4  
1.69  
1.9  
2.4  
2.3  
3.8  
IN  
IL  
OH  
2.3  
3.0  
3.0  
4.5  
4.5  
1.65  
I
I
I
I
I
I
= 4 mA  
= 8 mA  
= 16 mA  
= 24 mA  
= 32 mA  
= 100 mA  
1.52  
2.15  
2.80  
2.68  
4.20  
0.0  
OH  
OH  
OH  
OH  
OH  
OL  
2.3  
3.0  
3.0  
4.5  
V
OL  
LOW Level Output  
Voltage  
1.65  
V
IN  
= V  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
IH  
2.3  
0.0  
3.0  
0.0  
4.5  
0.0  
0.1  
1.65  
2.3  
3.0  
3.0  
4.5  
I
I
I
I
I
= 4 mA  
0.08  
0.10  
0.15  
0.22  
0.22  
0.24  
0.3  
0.4  
0.55  
0.55  
0.1  
1
0.24  
0.3  
0.4  
0.55  
0.55  
1
OL  
OL  
OL  
OL  
OL  
= 8 mA  
= 16 mA  
= 24 mA  
= 32 mA  
I
Input Leakage Current 1.65 5.5  
V
V
= 5.5 V, GND  
mA  
mA  
IN  
IN  
I
Power Off Leakage  
Current  
0.0  
or V  
= 5.5 V  
10  
OFF  
IN  
OUT  
I
Quiescent Supply  
Current  
1.65 5.5  
V
IN  
= 5.5 V, GND  
1
10  
mA  
CC  
www.onsemi.com  
4
NC7WZ00  
AC ELECTRICAL CHARACTERISTICS  
T
A
= +25°C  
T = 40 to +85°C  
A
Min  
Typ  
Max  
9.6  
5.3  
3.7  
2.9  
4.6  
3.6  
Min  
Max  
9.8  
5.7  
4.0  
3.2  
4.9  
3.9  
Symbol  
, t  
Parameter  
V
(V)  
Conditions  
Unit  
CC  
t
Propagation Delay  
(Figure 5, 7)  
ns  
1.8 0.15 C = 15 pF,  
5.3  
3.2  
2.4  
1.9  
3.0  
2.4  
2.5  
13  
PLH PHL  
L
R = 1 MW,  
L
2.5 0.2  
3.3 0.3  
5.0 0.5  
3.3 0.3  
5.0 0.5  
0
C = 50 pF,  
L
R = 500 W,  
L
C
C
Input Capacitance  
pF  
pF  
IN  
Power Dissipation Capacitance  
(Figure 6)  
3.3  
(Note 2)  
PD  
5.0  
17  
2. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I  
) at  
PD  
CCD  
no output loading and operating at 50% duty cycle. (see Figure 6) C is related to I  
dynamic operating current by the expression:  
PD  
CCD  
I
= (C ) (V ) (f ) + (I static).  
CCD  
PD CC IN CC  
AC Loading and Waveforms  
V
CC  
V
CC  
A
OUTPUT  
INPUT  
INPUT  
C
R
L
L
C includes load and stray capacitance  
L
Input = AC Waveform; t = t = 1.8 ns;  
r f  
Input PRR = 1.0 MHz, t = 500 ns  
PRR = 10 MHz; Duty Cycle = 50%.  
W
Figure 5. AC Test Circuit  
Figure 6. ICCD Test Circuit  
t = 3 ns  
t = 3 ns  
f
r
V
CC  
90%  
50%  
90%  
50%  
INPUT  
t
W
10%  
10%  
GND  
t
t
PHL  
PLH  
V
OH  
OL  
50%  
50%  
OUTPUT  
V
Figure 7. AC Waveforms  
www.onsemi.com  
5
 
NC7WZ00  
ORDERING INFORMATION  
Order Number  
Top Mark  
Package  
Shipping  
NC7WZ00K8X  
WZ00  
8Lead US8, JEDEC MO187, Variation CA  
3000 / Tape & Reel  
3000 / Tape & Reel  
3.1 mm Wide  
NC7WZ00K8XL22236  
WZ00  
8Lead US8, JEDEC MO187, Variation CA  
3.1 mm Wide  
NC7WZ00L8X  
N6  
N6  
8Lead MicroPak, 1.6 mm Wide  
8Lead MicroPak, 1.6 mm Wide  
5000 / Tape & Reel  
5000 / Tape & Reel  
NC7WZ00L8XL22185  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
3. All packages are lead free per JEDEC: JSTD020B standard.  
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.  
www.onsemi.com  
6
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
UQFN8 1.6X1.6, 0.5P  
CASE 523AY  
ISSUE O  
DATE 31 AUG 2016  
0.40  
(6X)  
1.60  
A
0.05  
C
1.60  
B
0.45  
(2X)  
2X  
1.60  
1.61  
0.05  
C
PIN#1 IDENT  
0.50  
TOP VIEW  
0.25  
(8X)  
RECOMMENDED  
LAND PATTERN  
0.50 0.05  
0.05  
0.05  
C
C
NOTES:  
SEATING  
PLANE  
A. PACKAGE CONFORMS TO JEDEC MO255  
C
VARIATION UAAD.  
0.025 0.025  
B. DIMENSIONS ARE IN MILLIMETERS.  
SIDE VIEW  
C. DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 2009.  
1.60 0.05  
D. LAND PATTERN RECOMMENDATION IS  
EXISTING INDUSTRY LAND PATTERN.  
(0.10)  
(0.20)3X  
(0.09)  
DETAIL A  
1
2
3
(0.20)  
4
8
1.60 0.05  
0.30 0.05  
0.30 0.05 (7X)  
0.50  
(0.15)  
7
6
5
0.20 0.05 (8X)  
0.30 0.05  
0.10  
0.05  
C
C
A
B
1.00 0.05  
DETAIL A  
SCALE : 2X  
BOTTOM VIEW  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13591G  
UQFN8 1.6X1.6, 0.5P  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
US8  
CASE 846AN  
ISSUE O  
DATE 31 DEC 2016  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13778G  
US8  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
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ONLINE SUPPORT: www.onsemi.com/support  
For additional information, please contact your local Sales Representative at  
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