NCL30082B3_技术文档

NCL30082

Dimmable Quasi-Resonant

Primary Side Current-Mode

Controller for LED Lighting

with Thermal Fold-back

The NCL30082 is a PWM current mode controller targeting isolated

flyback and non−isolated constant current topologies. The controller

operates in a quasi−resonant mode to provide high efficiency. Thanks

to a novel control method, the device is able to precisely regulate a

constant LED current from the primary side. This removes the need

for secondary side feedback circuitry, biasing and an optocoupler.

The device is highly integrated with a minimum number of external

components. A robust suite of safety protection is built in to simplify

the design. This device supports analog/digital dimming as well as

thermal current fold−back. While the NCL30082 has integrated fixed

overvoltage protection, the designer has the flexibility to program a

lower OVP level.

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8

1

Micro8

DM SUFFIX

CASE 846A

SOIC−8

D SUFFIX

CASE 751

MARKING DIAGRAMS

8

AAx

AYWG

G

Features

• Quasi−resonant Peak Current−mode Control Operation

• Primary Side Sensing (no optocoupler needed)

1

AAx

x

= Specific Device Code

= C, D or H

= Assembly Location

= Year

• Wide V Range

CC

• Source 300 mA / Sink 500 mA Totem Pole Driver with 12 V Gate

Clamp

A

Y

W

G

= Work Week

= Pb−Free Package

(Note: Microdot may be in either location)

• Precise LED Constant Current Regulation 1% Typical

• Line Feed−forward for Enhanced Regulation Accuracy

• Low LED Current Ripple

8

• 250 mV 2% Guaranteed Voltage Reference for Current Regulation

• ~0.9 Power Factor with Valley Fill Input Stage

• Low Start−up Current (13 mA typ.)

L30082x

ALYW

G

1

• Analog or Digital Dimming

• Thermal Fold−back

L30082x = Specific Device Code

x

= B, B1, B2, B3, D

= Assembly Location

= Wafer Lot

= Year

= Work Week

• Wide Temperature Range of −40 to +125°C

• Pb−Free, Halide−Free MSL1 Product

A

L

Y

W

G

• Robust Protection Features

♦ Over Voltage / LED Open Circuit Protection

♦ Over Temperature Protection

= Pb−Free Package

♦ Secondary Diode Short Protection

♦ Output Short Circuit Protection

♦ Shorted Current Sense Pin Fault Detection

♦ Latched and Auto−recoverable Versions

♦ Brown−out

PIN CONNECTIONS

1

SD

ZCD

CS

DIM

VIN

VCC

DRV

GND

♦ V Under Voltage Lockout

CC

♦ Thermal Shutdown

(Top View)

• These Devices are Pb−Free and Halogen Free/BFR Free

Typical Applications

ORDERING INFORMATION

• Integral LED Bulbs

• LED Power Driver Supplies

• LED Light Engines

See detailed ordering and shipping information on page 33 of

this data sheet.

1

Publication Order Number:

January, 2015 − Rev. 5

NCL30082/D

NCL30082

.

Aux

.

V

8

7

6

5

DIM

1

2

3

4

Figure 1. Typical Application Schematic for NCL30082

Table 1. PIN FUNCTION DESCRIPTION

Pin No

Pin Name

Function

Pin Description

1

SD

Thermal Fold−back

and shutdown

Connecting an NTC to this pin allows reducing the output current down to 50%

of its fixed value before stopping the controller. A Zener diode can also be

used to pull−up the pin and stop the controller for adjustable OVP protection

2

3

4

5

ZCD

CS

Zero Crossing Detection

Current sense

−

Connected to the auxiliary winding, this pin detects the core reset event.

This pin monitors the primary peak current

The controller ground

GND

DRV

Driver output

The current capability of the totem pole gate drive (+0.3/−0.5 A) makes it suit-

able to effectively drive a broad range of power MOSFETs.

6

7

VCC

VIN

Supplies the controller

This pin is connected to an external auxiliary voltage.

Input voltage sensing

Brown−Out

This pin observes the HV rail and is used in valley selection. This pin also

monitors and protects for low mains conditions.

8

DIM

Analog / PWM dimming

This pin is used for analog or PWM dimming control. An analog signal than

can be varied between V

and V

can be used to vary the current,

DIM(EN)

DIM100

or a PWM signal with an amplitude greater than V

.

DIM100

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2

NCL30082

CS_shorted

Enable

V

REF

V

DD

STOP

Over Voltage

Protection

Aux_SCP

OFF

VCC

UVLO

Latch

Fault

Management

VCC Management

Over Temperature

Protection

Internal

Thermal

Shutdown

VCC_max

VCC Over Voltage

Protection

SD

Ipkmax

Thermal

Foldback

V

TF

WOD_SCP

BO_NOK

Qdrv

V

VIN

V

REF

V

CC

Clamp

Circuit

Zero Crossing Detection

offset_OK

ZCD

Valley Selection

Aux. Winding

DRV

Short Circuit Prot.

S

R

Qdrv

Aux_SCP

Q

V

VIN

offset_OK

V

VLY

Line

Feedforward

V

STOP

V

TF

REF

DIM

Dimming

Type

Detection

CS

Leading

Edge

Blanking

CS_reset

V

DIMA

Constant−Current

Control

Ipkmax

STOP

Enable

V

DIMA

Max. Peak

Current

Limit

V

VIN

Ipkmax

VIN

Brown−Out

BO_NOK

CS Short

Protection

CS_shorted

V

VIN

Winding and

Output diode

Short Circuit

Protection

WOD_SCP

Note: CS Short Protection is disabled

Note: for NCL30082B1

GND

Figure 2. Internal Circuit Architecture

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NCL30082

Table 2. MAXIMUM RATINGS TABLE

Symbol

Rating

Value

Unit

V

I

Maximum Power Supply voltage, VCC pin, continuous voltage

Maximum current for VCC pin

−0.3, +35

Internally limited

V

mA

CC(MAX)

V

I

Maximum driver pin voltage, DRV pin, continuous voltage

Maximum current for DRV pin

−0.3, V

(Note 1)

V

mA

DRV(MAX)

DRV

−500, +800

V

I

Maximum voltage on low power pins (except pins ZCD, DIM, DRV and VCC)

Current range for low power pins (except pins ZCD, DRV and VCC)

−0.3, +5.5

−2, +5

V

mA

MAX

V

I

Maximum voltage for ZCD pin

Maximum current for ZCD pin

−0.3, +10

−2, +5

V

mA

ZCD(MAX)

V

Maximum voltage for DIM pin

−0.3, +10

V

DIM(MAX)

R

Thermal Resistance, Junction−to−Ambient (Note 4)

Micro8 version

°C/W

θ

JA

228

180

SOIC−8 version

Thermal Characterization Parameter, Junction−to−Case Top

Micro8 version

SOIC−8 version

50

45

Y

JC

°C/W

T

Maximum Junction Temperature

Operating Temperature Range

Storage Temperature Range

150

−40 to +125

−60 to +150

4

°C

kV

V

J(MAX)

ESD Capability, HBM model (Note 2)

ESD Capability, MM model (Note 2)

200

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. V

is the DRV clamp voltage V

when V is higher than V

. V

is V unless otherwise noted.

DRV

DRV(high)

CC

DRV(high) DRV CC

2. This device series contains ESD protection and exceeds the following tests: Human Body Model 4000 V per JEDEC JESD22−A114−F and

Machine Model Method 200 V per JEDEC JESD22−A115−A.

3. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78 except for VIN pin which passes 60 mA.

2

4. With a 100 mm , 2 oz copper area based on JEDEC EIA/JESD51-3 board design.

Table 3. ELECTRICAL CHARACTERISTICS (Unless otherwise noted: For typical values T = 25°C, V = 12 V;

J

CC

For min/max values T = −40°C to +125°C, Max T = 150°C, V = 12 V)

J

CC

Description

Test Condition

Symbol

Min

Typ

Max

Unit

STARTUP AND SUPPLY CIRCUITS

Supply Voltage

V

Startup Threshold

V

increasing

decreasing

V

16

8.2

8

18

8.8

–

20

9.4

–

CC

CC(on)

Minimum Operating Voltage

V

CC

V

CC

CC(off)

Hysteresis V

– V

V

CC(on)

CC(off)

CC(HYS)

CC(reset)

Internal logic reset

V

3.5

4.5

5.5

Over Voltage Protection

VCC OVP threshold

V

26

28

30

V

CC(OVP)

V

noise filter

t

–

5

–

ms

CC(off)

VCC(off)

noise filter−

t

I

20

CC(reset)

VCC(reset)

Startup current

I

–

13

46

30

60

mA

CC(start)

Startup current in fault mode

CC(sFault)

Supply Current

mA

Device Disabled/Fault

V

> V

I

0.8

–

1.2

2.3

2.7

1.4

4.0

5.0

CC

CC(off)

CC1

CC2

CC3

Device Enabled/No output load on pin 5

F

= 65 kHz

sw

Device Switching (F = 65 kHz)

C

= 470 pF,

= 65 kHz

–

sw

DRV

F

sw

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

6. Guaranteed by design.

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4

NCL30082

Table 3. ELECTRICAL CHARACTERISTICS (Unless otherwise noted: For typical values T = 25°C, V = 12 V;

J

CC

For min/max values T = −40°C to +125°C, Max T = 150°C, V = 12 V)

J

CC

Description

Test Condition

Symbol

Min

Typ

Max

Unit

CURRENT SENSE

Maximum Internal current limit

V

0.95

250

1

1.05

350

V

ILIM

Leading Edge Blanking Duration for V

t

300

ns

ILIM

LEB

(T = −25°C to 125°C) (Not applicable for NCL30082D)

j

Leading Edge Blanking Duration for V

t

240

300

350

ns

ILIM

LEB

(T = −40°C to 125°C)

j

Input Bias Current

DRV high

I

–

0.02

50

–

150

1.65

–

mA

ns

V

bias

Propagation delay from current detection to gate off−state

Threshold for immediate fault protection activation

t

ILIM

V

1.35

–

1.5

120

–

CS(stop)

Leading Edge Blanking Duration for V

t

ns

ms

CS(stop)

BCS

Blanking time for CS to GND short detection V

= 1 V

t

6

12

pinVIN

CS(blank1)

Blanking time for CS to GND short detection V

NCL30082D

t

8

10.7

14

CS(blank1)D

Blanking time for CS to GND short detection V

= 3.3 V

t

2

–

4

ms

pinVIN

CS(blank2)

Blanking time for CS to GND short detection V

NCL30082D

2.6

3.6

4.6

pinVIN

CS(blank2)D

GATE DRIVE

Drive Resistance

DRV Sink

DRV Source

W

R

SNK

R

SRC

–

13

30

–

Drive current capability

DRV Sink (Note 6)

DRV Source (Note 6)

mA

I

–

500

300

–

SNK

SRC

Rise Time (10% to 90%)

Fall Time (90% to 10%)

DRV Low Voltage

C

= 470 pF

t

–

8

40

30

–

ns

V

DRV

r

t

f

V

= V

+0.2 V

CC(off)

V

CC

DRV(low)

C

= 470 pF,

DRV

R

= 33 kW

DRV

DRV High Voltage

V

DRV

= 30 V

= 470 pF,

= 33 kW

V

10

12

14

V

CC

DRV(high)

C

R

DRV

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

6. Guaranteed by design.

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5

NCL30082

Table 3. ELECTRICAL CHARACTERISTICS (Unless otherwise noted: For typical values T = 25°C, V = 12 V;

J

CC

For min/max values T = −40°C to +125°C, Max T = 150°C, V = 12 V)

J

CC

Description

Test Condition

Symbol

Min

Typ

Max

Unit

ZERO VOLTAGE DETECTION CIRCUIT

ZCD threshold voltage

V

increasing

decreasing

increasing

V

25

5

45

25

–

65

45

–

mV

V

ZCD

ZCD(THI)

ZCD(THD)

ZCD(HYS)

ZCD(short)

ZCD threshold voltage (Note 6)

ZCD hysteresis (Note 6)

V

ZCD

V

ZCD

10

0.8

Threshold voltage for output short circuit or aux. winding

short circuit detection

V

1

1.2

Short circuit detection Timer

Auto−recovery timer duration

V

ZCD

< V

t

OVLD

70

3

90

4

110

5

ms

s

ZCD(short)

t

recovery

Input clamp voltage

High state

Low state

V

I

= 3.0 mA

= −2.0 mA

V

–

−0.9

9.5

−0.6

–

−0.3

pin1

CH

I

pin1

CL

Propagation Delay from valley detection to DRV high

Equivalent time constant for ZCD input (Note 6)

Blanking delay after on−time

V

ZCD

decreasing

t

–

20

3

150

–

ns

ms

DEM

t

PAR

t

2.25

1.2

3.75

2.0

BLANK

Blanking delay after on−time NCL30082B2 and

NCL30082B3

t

1.6

BLANKB2

Timeout after last demag transition

t

5

6.5

8

ms

TIMO

CONSTANT CURRENT CONTROL

Reference Voltage at T = 25°C

V

245

242.5

495

492

488

329

325

321

–

250

500

333

125

55

255

257.5

505

508

512

337

341

345

–

mV

J

REF

Reference Voltage T = −40°C to 125°C

J

REF

Reference Voltage NCL30082D (T = 25°C)

V

REFD

V

REFD

V

REFD

J

Reference Voltage NCL30082D (T = 0°C to 85°C)

J

Reference Voltage NCL30082D (T = −40°C to 125°C)

J

Reference Voltage NCL30082B3 (T = 25°C)

V

REFB3

V

REFB3

V

REFB3

J

Reference Voltage NCL30082B3 (T = 0°C to 85°C)

J

Reference Voltage NCL30082B3 (T = −40°C to 125°C)

J

50% reference voltage (for thermal foldback)

V

REF50

25% reference voltage (for thermal foldback) NCL30082D

V

−

REF25D

Current sense lower threshold for detection of the

leakage inductance reset time

V

30

80

CS(low)

LINE FEED−FORWARD

V

to I

conversion ratio

K

15

67.5

–

17

76.5

37.5

50

19

85.5

–

mA/V

mA

VIN

CS(offset)

LFF

I

offset(MAX)

Offset current maximum value

V

= 4.5 V

pinVIN

V

REF

V

REF

value below which the offset current source is turned off

value above which the offset current source is turned on

V

REF

decreases

increases

V

mV

REF(off)

REF(on)

V

REF

–

VALLEY SELECTION

Threshold for line range detection V increasing

V

increases

decreases

V

HL

2.28

2.18

15

2.4

2.3

25

2.52

2.42

35

V

in

VIN

st

nd

(1 to 2 valley transition for V

> 0.75 V)

REF

Threshold for line range detection V decreasing

V

VIN

V

LL

in

nd

st

(2 to 1 valley transition for V

> 0.75 V)

REF

Blanking time for line range detection

t

ms

HL(blank)

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

6. Guaranteed by design.

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6

NCL30082

Table 3. ELECTRICAL CHARACTERISTICS (Unless otherwise noted: For typical values T = 25°C, V = 12 V;

J

CC

For min/max values T = −40°C to +125°C, Max T = 150°C, V = 12 V)

J

CC

Description

Test Condition

Symbol

Min

Typ

Max

Unit

VALLEY SELECTION

Valley thresholds

mV

st

nd

rd

1

2

4

7

to 2 valley transition at LL and 2 to 3 valley HL

V

decreases

increases

decreases

increases

decreases

increases

decreases

increases

decreases

increases

V

177.5 187.5 197.5

185.0 195.0 205.0

117.5 125.0 132.5

125.0 132.5 140.0

REF

VLY1−2/2−3

VLY2−1/3−2

VLY2−4/3−5

VLY4−2/5−3

VLY4−7/5−8

VLY7−4/8−5

nd

th

st

rd

nd

to 1 valley transition at LL and 3 to 2 valley HL

V

REF

th

rd

th

to 4 valley transition at LL and 3 to 5 valley HL

nd

th

rd

to 2 valley transition at LL and 5 to 3 valley HL

V

REF

th

to 7 valley transition at LL and 5 to 8 valley HL

–

75.0

82.5

37.5

50.0

15.0

20.0

–

th

to 4 valley transition at LL and 8 to 5 valley HL

V

REF

th

to 11 valley transition at LL and 8 to 12 valley HL

V

VLY7−11/8−12

VLY11−7/12−8

th

11 to 7 valley transition at LL and 12 to 8 valley HL

V

REF

th

11 to 13 valley transition at LL and 12 to 15 valley HL

V

VLY11−13/12−15

VLY13−11/15−12

th

13 to 11 valley transition at LL and 15 to 12 valley HL

V

REF

DIMMING SECTION

DIM pin voltage for zero output current (OFF voltage)

DIM pin voltage for maximum output current

Dimming range

V

0.66

2.25

–

0.7

2.45

1.75

7.8

0.74

2.65

–

V

DIM(EN)

V

DIM100

V

DIM(range)

Clamping voltage for DIM pin

V

–

V

DIM(CLP)

Dimming pin pull−up current source

I

–

280

–

nA

DIM(pullup)

THERMAL FOLD−BACK AND OVP

Reference current for direct connection of an NTC (Note 6)

SD pin voltage at which thermal fold−back starts

SD pin voltage at which thermal fold−back stops

I

80

0.9

85

1

90

1.1

OTP(REF)

V

TF(start)

0.64

0.68

0.72

TF(stop)

(I = 50% I

)

out

out(nom)

SD pin voltage at which thermal fold−back stops

NCL30082D (I = 25% I

V

0.86

0.90

0.94

V

TF(stop)D

)

out(nom)

out

Reference current for direct connection of an NTC

Fault detection level for OTP

I

80

85

90

mA

V

OTP(REF)

V

decreasing

increasing

V

0.47

0.81

0.64

0.5

0.53

0.89

0.72

SD

OTP(off)

Fault detection level for OTP NCL30082D

V

0.85

0.68

V

OTP(off)D

SD pin level at which controller re−start switching after OTP

detection

V

SD

OTP(on)

SD pin level at which controller re−start switching after OTP

detection NCL30082D

V

0.86

0.9

0.94

V

OTP(on)D

SD pin Over temperature Protection Hysteresis NCL30082D

V

15

10.8

7.4

5.4

7.4

9.9

9.4

9.9

50

11.7

8.0

100

12.6

8.6

mV

kW

OTP(hys)D

V

over I

ratio (Note 5)

T = +25°C to +125°C

R

TF(start)

TF(stop)

OTP(off)

OTP(on)

TF(stop)

OTP(off)

OTP(on)

OTP(REF)

J

TF(start)

TF(stop)

OTP(off)

OTP(on)

ratio (Note 5)

T = +25°C to +125°C

J

R

ratio (Note 5)

T = +25°C to +125°C

J

R

5.9

6.4

ratio (Note 5)

T = +25°C to +125°C

J

8.0

8.6

ratio NCL30082D (Note 5)

T = +25°C to +125°C

J

R

10.5

10.0

10.5

11.1

10.6

11.1

TF(stop)D

OTP(off)D

OTP(on)D

T = +25°C to +125°C

J

T = +25°C to +125°C

J

5. A NTC is generally placed between the SD and GND pins. Parameters R

, R

and R

give the resistance the

TF(start) TF(stop) OTP(off)

OTP(on)

NTC must exhibit to respectively, enter thermal foldback, stop thermal foldback, trigger the OTP limit and allow the circuit recovery after

an OTP situation.

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

6. Guaranteed by design.

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7

NCL30082

Table 3. ELECTRICAL CHARACTERISTICS (Unless otherwise noted: For typical values T = 25°C, V = 12 V;

J

CC

For min/max values T = −40°C to +125°C, Max T = 150°C, V = 12 V)

J

CC

Description

THERMAL FOLD−BACK AND OVP

Test Condition

Symbol

Min

Typ

Max

Unit

Timer duration after which the controller is allowed to start

pulsing

t

180

–

300

ms

OTP(start)

Clamped voltage (SD pin left open)

Clamp series resistor

SD pin open

V

1.13

–

1.35

1.6

2.5

30

1.57

–

V

kW

V

SD(clamp)

R

SD(clamp)

SD pin detection level for OVP

Delay before OVP or OTP confirmation (OVP and OTP)

THERMAL SHUTDOWN

V

SD

increasing

V

OVP

2.35

15

2.65

45

T

ms

SD(delay)

Thermal Shutdown (Note 6)

Device switching

around 65 kHz)

T

130

–

150

50

170

–

°C

SHDN

(F

SW

Thermal Shutdown Hysteresis (Note 6)

BROWN−OUT

T

SHDN(HYS)

Brown−Out ON level (IC start pulsing)

Brown−Out OFF level (IC shuts down)

BO comparators delay

V

increasing

decreasing

V

0.90

0.85

–

1

0.9

30

50

15

–

1.10

0.95

–

V

SD

BO(on)

V

SD

BO(off)

t

ms

nA

BO(delay)

BO(blank)

Brown−Out blanking time

t

35

65

Brown−Out blanking time NCL30082D

Brown−out pin bias current

t

10.5

−250

19.5

250

BO(blank)D

I

BO(bias)

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

6. Guaranteed by design.

www.onsemi.com

8

NCL30082

TYPICAL CHARACTERISTICS

18.20

18.15

18.10

18.05

18.00

8.90

8.85

8.80

8.75

8.70

17.95

17.90

8.65

8.60

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 3. V_CC(on)vs. Junction Temperature

Figure 4. V_CC(off)vs. Junction Temperature

27.80

27.75

18

17

16

15

14

13

12

27.70

27.65

27.60

27.55

27.50

11

10

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 5. V_CC(OVP)vs. Junction Temperature

Figure 6. I_CC(start)vs. Junction Temperature

52

50

48

46

44

1.30

1.28

1.26

1.24

1.22

1.20

1.18

1.16

42

40

1.14

1.12

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 7. I_CC(sFault)vs. Junction Temperature

Figure 8. I_CC1vs. Junction Temperature

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9

NCL30082

TYPICAL CHARACTERISTICS

2.40

2.35

2.30

2.25

2.20

2.85

2.80

2.75

2.70

2.65

2.60

2.55

2.15

2.10

2.50

2.45

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 9. I_CC2vs. Junction Temperature

Figure 10. I_CC3vs. Junction Temperature

1.000

0.995

1.495

1.490

1.485

0.990

0.985

0.980

1.480

1.475

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 11. V_ILIMvs. Junction Temperature

Figure 12. V_CS(stop)vs. Junction Temperature

305

303

1.010

1.005

1.000

0.995

0.990

301

299

297

295

293

291

289

0.985

0.980

287

285

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 13. t_LEBvs. Junction Temperature

Figure 14. V_ZCD(short)vs. Junction

Temperature

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10

NCL30082

TYPICAL CHARACTERISTICS

3.20

3.15

3.10

7.1

7.0

6.9

6.8

6.7

3.05

3.00

6.6

6.5

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 15. t_BLANKvs. Junction Temperature

Figure 16. t_TIMOvs. Junction Temperature

255

254

253

55.0

54.5

54.0

252

251

53.5

53.0

250

249

52.5

52.0

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 17. V_REFvs. Junction Temperature

Figure 18. V_CS(low)vs. Junction Temperature

16.60

16.55

16.50

16.45

16.40

37.6

37.5

37.4

37.3

37.2

16.35

16.30

37.1

37.0

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 19. K_LFFvs. Junction Temperature

Figure 20. V_REF(off)vs. Junction Temperature

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11

NCL30082

TYPICAL CHARACTERISTICS

49.0

48.5

48.0

47.5

47.0

46.5

46.0

45.5

45.0

2.400

2.395

2.390

2.385

2.380

2.375

2.370

44.5

44.0

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 21. V_REF(on)vs. Junction Temperature

Figure 22. V_HLvs. Junction Temperature

2.300

2.295

2.290

2.285

28.0

27.5

27.0

2.280

26.5

26.0

2.275

2.270

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 23. V_LLvs. Junction Temperature

Figure 24. t_HL(BLANK)vs. Junction Temperature

187.0

186.5

186.0

185.5

185.0

198

197

196

195

194

193

184.5

184.0

192

191

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 25. V_{VLY1−2/2−3}vs. Junction

Temperature

Figure 26. V_{VLY2−1/3−2}vs. Junction

Temperature

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12

NCL30082

TYPICAL CHARACTERISTICS

125.0

124.5

124.0

123.5

123.0

136

135

134

133

132

122.5

122.0

131

130

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 27. V_{VLY2−4/3−5}vs. Junction

Temperature

Figure 28. V_{VLY4−2/5−3}vs. Junction

Temperature

76.0

75.5

75.0

87

86

85

84

83

82

74.5

74.0

73.5

73.0

81

80

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 29. V_{VLY4−7/5−8}vs. Junction

Temperature

Figure 30. V_{VLY7−4/8−5}vs. Junction

Temperature

37.7

37.6

37.5

50

49

48

47

46

45

37.4

37.3

37.2

37.1

37.0

44

43

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 31. V_{VLY7−11/8−12}vs. Junction

Temperature

Figure 32. V_{VLY11−7/12−8}vs. Junction

Temperature

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13

NCL30082

TYPICAL CHARACTERISTICS

15.10

15.05

15.00

14.95

14.90

14.85

14.80

21.0

20.5

20.0

19.5

19.0

18.5

18.0

17.5

17.0

14.75

14.70

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 33. V_{VLY11−13/12−15}vs. Junction

Temperature

Figure 34. V_{VLY13−11/15−12}vs. Junction

Temperature

0.710

0.705

2.46

2.45

0.700

2.44

0.695

0.690

2.43

2.42

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 35. V_DIM(EN)vs. Junction Temperature

Figure 36. V_DIM(100)vs. Junction Temperature

88.0

87.5

87.0

86.5

86.0

85.5

85.0

4.55

4.50

4.45

4.40

4.35

4.30

84.5

84.0

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 37. t_OVLDvs. Junction Temperature

Figure 38. t_recoveryvs. Junction Temperature

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14

NCL30082

TYPICAL CHARACTERISTICS

2.500

2.495

2.490

2.485

2.480

86.5

86.0

85.5

85.0

84.5

84.0

2.475

2.470

83.5

83.0

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 39. V_OVPvs. Junction Temperature

Figure 40. I_OTP(ref)vs. Junction Temperature

0.690

0.688

0.686

0.684

0.997

0.995

0.993

0.991

0.989

0.682

0.680

0.987

0.985

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 41. V_OTP(on), V_TF(stop)vs. Junction

Temperature

Figure 42. V_TF(start)vs. Junction Temperature

0.994

0.992

0.990

0.988

0.986

0.906

0.904

0.902

0.900

0.898

0.896

0.984

0.982

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 43. V_BO(on)vs. Junction Temperature

Figure 44. V_BO(off)vs. Junction Temperature

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15

NCL30082

TYPICAL CHARACTERISTICS

504

503

502

501

130

129

128

127

126

125

124

123

122

500

499

498

497

496

121

120

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 45. V_REFDvs. Junction Temperature

Figure 46. V_REF25Dvs. Junction Temperature

0.900

0.898

0.896

0.894

0.892

0.890

0.850

0.848

0.846

0.844

0.842

0.840

0.888

0.886

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 47. V_OTP(off)Dvs. Junction Temperature

Figure 48. V_OTP(on)D, V_TF(stop)Dvs. Junction

Temperature

48.2

48.0

47.8

47.6

47.4

47.2

15.5

15.4

15.3

15.2

15.1

15.0

47.0

46.8

14.9

14.8

−40 −20

0

20

40

60

80

100 120

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

T , JUNCTION TEMPERATURE (°C)

J

Figure 49. V_OTP(HYS)Dvs. Junction

Temperature

Figure 50. t_BO(BLANK)Dvs. Junction

Temperature

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16

NCL30082

TYPICAL CHARACTERISTICS

56.0

55.5

55.0

54.5

54.0

53.5

53.0

52.5

−40 −20

0

20

40

60

80

100 120

T , JUNCTION TEMPERATURE (°C)

J

Figure 51. t_BO(BLANK)vs. Junction Temperature

APPLICATION INFORMATION

The NCL30082 implements a current−mode architecture

temperature exceeds a prescribed level. If the

temperature continues to increase, the current will be

further reduced until the controller is stopped. The

control will automatically restart if the temperature is

reduced. This pin can implement a programmable OVP

shutdown that can also auto−restart the device.

• Brown−Out: the controller includes a brown−out

circuit which safely stops the controller in case the

input voltage is too low. The device will automatically

restart if the line recovers.

operating in quasi−resonant mode. Thanks to proprietary

circuitry, the controller is able to accurately regulate the

secondary side current of the flyback converter without

using any opto−coupler or measuring directly the secondary

side current.

• Quasi−Resonance Current−Mode Operation:

implementing quasi−resonance operation in peak

current−mode control, the NCL30082 optimizes the

efficiency by switching in the valley of the MOSFET

drain−source voltage. Thanks to a smart control

algorithm, the controller locks−out in a selected valley

and remains locked until the input voltage or the output

current set point significantly changes.

• Cycle−by−cycle peak current limit: when the current

sense voltage exceeds the internal threshold V

, the

ILIM

MOSFET is turned off for the rest of the switching

cycle.

• Primary Side Constant Current Control: thanks to a

proprietary circuit, the controller is able to compensate

for the leakage inductance of the transformer and allow

accurate control of the secondary side current.

• Winding Short−Circuit Protection: an additional

comparator with a short LEB filter (t

) senses the CS

BCS

signal and stops the controller if V reaches 1.5 x

CS

V . For noise immunity reasons, this comparator is

ILIM

• Line Feed−forward: compensation for possible

variation of the output current caused by system slew

rate variation.

enabled only during the main LEB duration t

.

LEB

• Output Short−circuit protection: If a very low

voltage is applied on ZCD pin for 90 ms (nominal), the

controllers assume that the output or the ZCD pin is

shorted to ground and enters shutdown. The

• Open LED protection: if the voltage on the VCC pin

exceeds an internal limit, the controller shuts down and

waits 4 seconds before restarting switching.

• Thermal Fold−back / Over Temperature / Over

Voltage Protection: by combining a dual threshold on

the SD pin, the controller allows the direct connection

of an NTC to ground plus a Zener diode to a monitored

voltage. The temperature is monitored and the output

current is linearly reduced in the event that the

auto−restart version (B suffix) waits 4 seconds, then the

controller restarts switching. In the latched version (A

suffix), the controller is latched as long as V stays

CC

above the V

threshold.

CC(reset)

• Linear or PWM dimming: the DIM pin allows

implementing both analog and PWM dimming.

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17

NCL30082

Constant Current Control

Figure 53 portrays the primary and secondary current of

a flyback converter in discontinuous conduction mode

(DCM). Figure 52 shows the basic circuit of a flyback

converter.

Transformer

V

bulk

L

leak

N

sp

R

clp

V

out

C

clp

.

L

p

.

Clamping

network

DRV

C

lump

R

sense

Figure 52. Basic Flyback Converter Schematic

During the on−time of the MOSFET, the bulk voltage

is applied to the magnetizing and leakage inductors L

When the diode conducts, the secondary current decreases

linearly from I to zero. When the diode current has

V

bulk

p

D,pk

and L

and the current ramps up.

turned off, the drain voltage begins to oscillate because of

the resonating network formed by the inductors (L +L

leak

When the MOSFET is turned−off, the inductor current

first charges C . The output diode is off until the voltage

across L reverses and reaches:

)

leak

p

and the lump capacitor. This voltage is reflected on the

auxiliary winding wired in flyback mode. Thus, by looking

at the auxiliary winding voltage, we can detect the end of the

conduction time of secondary diode. The constant current

control block picks up the leakage inductor current, the end

of conduction of the output rectifier and controls the drain

current to maintain the output current constant.

lump

p

ǒ

Ǔ

N_spV_out) V_f

(eq. 1)

The output diode current increase is limited by the leakage

inductor. As a consequence, the secondary peak current is

reduced:

We have:

I_L,pk

I_D,pk

t

(eq. 2)

V_REF

2N_spR_sense

N_sp

(eq. 3)

I_out

+

The diode current reaches its peak when the leakage inductor

is reset. Thus, in order to accurately regulate the output

current, we need to take into account the leakage inductor

current. This is accomplished by sensing the clamping

network current. Practically, a node of the clamp capacitor

The output current value is set by choosing the sense

resistor:

V_ref

(eq. 4)

R_sense

+

2N_spI_out

is connected to R

Then, by reading the voltage on the CS pin, we have an

image of the primary current (red curve in Figure 53).

instead of the bulk voltage V

.

sense

bulk

From Equation 3, the first key point is that the output

current is independent of the inductor value. Moreover, the

leakage inductance does not influence the output current

value as the reset time is taken into account by the controller.

www.onsemi.com

18

NCL30082

I

L,pk

N

I

sp D,pk

I

pri

(t)

I

(t)

sec

time

t

1

t

2

t

on

t

demag

V

aux

(t)

time

Figure 53. Flyback Currents and Auxiliary Winding Voltage in DCM

Internal Soft−Start

At startup or after recovering from a fault, there is a small

internal soft−start of 40 ms.

In addition, during startup, as the output voltage is zero

volts, the demagnetization time is long and the constant

current control block will slowly increase the peak current

towards its nominal value as the output voltage grows.

Figure 54 shows a soft−start simulation example for a 9 W

LED power supply.

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19

NCL30082

16.0

12.0

8.00

4.00

0

V

out

1

800m

600m

400m

200m

0

I

2

out

800m

600m

400m

200m

0

V

4

3

Control

CS

604u

1.47m

2.34m

3.21m

4.07m

time in seconds

Figure 54. Startup Simulation Showing the Natural Soft−start

Cycle−by−Cycle Current Limit

Winding and Output Diode Short−Circuit Protection

When the current sense voltage exceeds the internal

In parallel with the cycle−by−cycle sensing of the CS pin,

threshold V , the MOSFET is turned off for the rest of the

ILIM

another comparator with a reduced LEB (t ) and a higher

BCS

switching cycle (Figure 55).

threshold (1.5 V typical) is able to sense winding

short−circuit and immediately stops the DRV pulses. The

controller goes into auto−recovery mode in version B, B1,

B2, B3 and D.

In version A, the controller is latched. In latch mode, the

DRV pulses stop and VCC ramps up and down. The circuit

un−latches when VCC pin voltage drops below V

threshold.

CC(reset)

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20

NCL30082

S

aux

DRV

Q

Vdd

Q

latch

VCC

CS

R

Vcc

management

LEB1

+

−

PWMreset

Ipkmax

Rsense

Vcontrol

VCCstop

UVLO

+

−

grand

reset

8_HICC

OVP

V

ILIMIT

OVP

STOP

LEB2

+

−

WOD_SCP

latch

S

OFF

WOD_SCP

S

R

V

Q

CS(stop)

Q

R

8_HICC

grand

reset

from Fault Management Block

Figure 55. Winding Short Circuit Protection, Max. Peak Current Limit Circuits

Thermal Fold−back and Over Voltage / Over

Temperature Protection

constant current control V

is decreased proportionally to

REF

V

. When V reaches V

, V

is clamped to

SD

TF(stop)

REF

The thermal fold−back circuit reduces the current in the

LED string when the ambient temperature exceeds a set

point. The current is gradually reduced to 50% of its nominal

value if the temperature continues to rise. (Figure 56). The

thermal foldback starting temperature depends of the

Negative Coefficient Temperature (NTC) resistor chosen by

the power supply designer.

, corresponding to 50% of the nominal output current

REF50

(versions A, B, B1, B2, B3). For the NCL30082D, the output

current is decreased to 25% of the nominal output current.

If V drops below V , the controller enters into the

SD

OTP

auto−recovery fault mode for version B, B1, B2, B3 and D

meaning that the 4−s timer is activated. The controller will

re−start switching after the 4−s timer has elapsed and when

Indeed, the SD pin allows the direct connection of an NTC

to sense the ambient temperature. When the SD pin voltage

V

> V

to provide some temperature hysteresis.

SD

OTP(on)

For version A, this protection is latched: reset occurs when

< V

V

SD

drops below V

, the internal reference for the

TF(start)

V

CC

.

CC(reset)

I

out

Temperature increases

Temperature decreases

Temperature increases

Temperature decreases

I

out

I

out(nom)

I

out(nom)

50% I

out(nom)

25% I

out(nom)

V

SD

V

SD

V

TF(start)

OTP(off)

V

TF(start)

V

OTP(off)

TF(stop)

OTP(on)

V

TF(stop)

OTP(on)

Figure 56. Output Current Reduction vs. SD Pin

Voltage for NCL30082 Versions A, B, B1, B2, B3

Figure 57. Output Current Reduction vs. SD Pin

Voltage for NCL30082D

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21

NCL30082

At startup, when V reaches V

not allowed to start pulsing for at least 180 ms in order to

, the controller is

filtering capacitor is connected to the SD pin. This is to avoid

flickering of the LED light in case of over temperature.

CC

CC(on)

allow the SD pin voltage to reach its nominal value if a

V

OVP

VCC

Vdd

noise delay

OVP

−

Dz

+

I

OTP(REF)

S

OFF

Q

SD

OTP_Timer end

Rclamp

Vclamp

noise delay

R

−

+

OTP

NTC

4−s Timer

(OTP latched for version A)

S

0.5 V if OTP low

0.7 V if OTP high

V

OTP

Latch

Q

V

TF

R

VCCreset

Figure 58. Thermal Fold−back and OVP/OTP Circuitry

In the case of excess voltage, the Zener diode starts to

conduct and inject current into the internal clamp resistor

this voltage reaches the OVP threshold (2.5 V typ.), the

controller shuts−down and waits for at least 4 seconds before

restarting switching.

R

clamp

thus causing the pin SD voltage to increase. When

www.onsemi.com

22

NCL30082

V

CC

V

CC(on)

CC(off)

V

CC

> V

:

CC(on)

DRV pulses restart

V

CC(reset)

V

DRV

4−s Timer

V

> V

:

SD

OVP

4−s timer has elapsed:

waiting for V > V

to restart DRV pulses

V

SD

controller stops

switching

CC

CC(on)

V

OVP

V

SD(clamp)

V

out

Figure 59. OVP with SD Pin Chronograms

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23

NCL30082

V

CC

V

CC(on)

V

CC(off)

V

CC(reset)

V

DRV

V

> V

and

TF(stop)

SD

4−s Timer

:

CC

CC(on)

DRV pulses restart

V

< V

:

4−s timer has elapsed

SD

OTP(off)

V

SD

controller stops

switching

but V < V

SD

TF(stop)

≥ no restart

V

TF(start)

V

TF(stop)

OTP(off)

V

I

out

Figure 60. Thermal Fold−back / OTP Chronograms

PWM or Linear Dimming Detection

The pin DIM allows implementing either linear dimming

or PWM dimming of the LED light.

If the power supply designer apply an analog signal

If a voltage lower than V

the DRV pulses are disabled. Thus, for PWM dimming, a

PWM signal with a low state value < V and a high

is applied to the DIM pin,

DIM(EN)

varying from V

to V

to the DIM pin, the

state value > V

should be applied.

DIM(EN)

DIM100

output current will increase or decrease proportionally to the

voltage applied. For V = V , the power supply

delivers the maximum output current.

The DIM pin is pulled up internally by a small current

source. Thus, if the pin is left open, the controller is able to

start.

DIM

DIM100

V

DIM

Analog dimming

PWM dimming

I

V

100%

0%

out

DIM100

I

DIM(EN)

out

Figure 61. Pin DIM Chronograms

Note:

• If a PWM voltage with a high state value < V

is

• Thermal Foldback and dimming: if the IC is in a

dimming state and the thermal foldback (TF) is

activated, the output current is further reduced to a

value equal to Dimming*TF.

DIM100

applied to the DIM pin, the product will still be in

PWM dimming mode, but the reference voltage will be

decreased according to V . This allows increased

DIM

dynamic range on the dimming control pin.

www.onsemi.com

24

NCL30082

V_CCOver Voltage Protection (Open LED Protection)

If no output load is connected to the LED power supply,

the controller must be able to safely limit the output voltage

excursion.

In the NCL30082, when the V voltage reaches the

CC

V

threshold, the controller stops the DRV pulses and

CC(OVP)

the 4−s timer starts counting. The IC re−start pulsing after

the 4−s timer has elapsed and when V ≥ V

.

CC

CC(on)

40.0

V

CC(OVP)

30.0

V

CC

1

V

CC(on)

20.0

10.0

0

V

CC(off)

40.0

30.0

20.0

10.0

0

V

2

out

800m

600m

400m

200m

0

I

3

4

out

8.00

6.00

4.00

2.00

0

OVP

1.38

3.96

6.54

9.11

11.7

time in seconds

Figure 62. Open LED Protection Chronograms

Valley Lockout

or the output current set−point varies significantly. This

avoids valley jumping and the inherent noise caused by this

phenomenon.

The input voltage is sensed by the VIN pin (line range

detection in Figure 63). The internal logic selects the

operating valley according to VIN pin voltage, SD pin

voltage and DIM pin voltage.

By default, when the output current is not dimmed, the

controller operates in the first valley at low line and in the

second valley at high line.

Quasi−square wave resonant systems have a wide

switching frequency excursion. The switching frequency

increases when the output load decreases or when the input

voltage increases. The switching frequency of such systems

must be limited.

The NCL30082 changes the valley as the input voltage

increases and as the output current set−point is varied

(dimming and thermal fold−back). This limits the switching

frequency excursion. Once a valley is selected, the

controller stays locked in the valley until the input voltage

www.onsemi.com

25

NCL30082

Vbulk

VIN

+

−

LLine

HLine

25−ms blanking time

2.4 V if LLine low

2.3 V if LLine high

Figure 63. Line Range Detector

VIN pin voltage for valley change

Table 4. VALLEY SELECTION

I

value at which the

I

value at which the

out

V

VIN

decreases

2.3 V

controller changes valley

(I decreasing)

out

(I increasing)

out

0

−LL−

−HL−

5 V

100%

75%

100%

st

nd

1

2

78%

nd

rd

2

3

50%

30%

15%

6%

53%

33%

20%

8%

th

4

5

th

7

8

th

11

12

th

13

15

0%

0

−LL−

2.4 V

−HL−

5 V

V

VIN

increases

VIN pin voltage for valley change

www.onsemi.com

26

NCL30082

Zero Crossing Detection Block

The ZCD pin allows detecting when the drain−source

voltage of the power MOSFET reaches a valley.

the valleys. To avoid such a situation, the NCL30082

features a Time−Out circuit that generates pulses if the

voltage on ZCD pin stays below the V

threshold

ZCD(THD)

A valley is detected when the voltage on pin 1 crosses

for 6.5 ms.

below the V

internal threshold.

The time−out also acts as a substitute clock for the valley

detection and simulates a missing valley in case of too

damped free oscillations.

ZCD(THD)

At startup or in case of extremely damped free

oscillations, the ZCD comparator may not be able to detect

V

ZCD

3

4

ZCD(THD)

The 3rd valley

is validated

high

low

14

12

2nd, 3rd

The 3rd valley is not detected

by the ZCD comp

The 2nd valley is detected

By the ZCD comparator

high

ZCD comp

TimeOut

low

15

16

high

low

Time−out circuit adds a pulse to

account for the missing 3rd valley

high

low

Clk

17

Figure 64. Time−out Chronograms

Normally with this type of time−out function, in the event

the ZCD pin or the auxiliary winding is shorted, the

controller could continue switching leading to improper

regulation of the LED current. Moreover during an output

short circuit, the controller will strive to maintain constant

current operation.

To avoid these scenarios, a protection circuit consisting of

a comparator and secondary timer starts counting when the

ZCD voltage is below the V

threshold. If this timer

ZCD(short)

reaches 90 ms, the controller detects a fault and shutdown.

The auto−restart version (B, B1, B2, D suffix) waits 4

seconds, then the controller restarts switching. In the latched

version (A suffix), the controller is latched as long as V

CC

stays above the V

threshold.

CC(reset)

www.onsemi.com

27

NCL30082

Tblank

Time−Out

ZCD

+

−

Clock

V

.

ZCD(TH)

Tblank

+

−

V

ZCD(short)

90−ms

Timer

Enable_b

S

R

Q

Aux_SCP

Q

4−s Timer

Figure 65. ZCD Block Schematic

Line Feed−Forward

(eq. 5)

Because of the propagation delays, the MOSFET is not

turned−off immediately when the current set−point is

reached. As a result, the primary peak current is higher than

expected and the output current increases. To compensate

the peak current increase brought by the propagation delay,

a positive voltage proportional to the line voltage is added

on the current sense signal. The amount of offset voltage can

V_CS(offset)+ K_LFFV_pinVINR_CS

The offset voltage is applied only during the MOSFET

on−time.

This offset voltage is removed at light load during

dimming when the output current drops below 15% of the

programmed output current.

be adjusted using the R resistor as shown in Figure 66.

CS

Bulk rail

V

I

DD

VIN

CS

R

CS(offset)

CS

R

sense

Q_drv

Offset_OK

Figure 66. Line Feed−Forward Schematic

www.onsemi.com

28

NCL30082

Brown−out

below 0.9 V for 50 ms nominal. For the NCL30082D, the

blanking time is reduced to 15 ms. Exiting a brown−out

In order to protect the supply against a very low input

voltage, the NCL30082 features a brown−out circuit with a

fixed ON/OFF threshold. The controller is allowed to start

if a voltage higher than 1 V is applied to the VIN pin and

shuts−down if the VIN pin voltage decreases and stays

condition overrides the hiccup on V (V does not wait

CC

to reach V ) and the IC immediately goes into startup

CC(off)

mode (I = I

).

CC

CC(start)

Vbulk

VIN

+

BO_NOK

Blanking time

−

1 V if BONOK high

0.9 V if BONOK low

Figure 67. Brown−out Circuit

160

120

80.0

40.0

0

V

Bulk

1

2

18.0

16.0

14.0

12.0

10.0

V

CC(on)

V

CC

V

CC(off)

1.10

900m

700m

500m

300m

V

BO(on)

BO(off)

V

pinVIN

3

8.00

6.00

4.00

2.00

0

BO Blanking Time

BO_NOK low

=> Startup mode

BO_NOK

4

46.1m

138m

231m

time in seconds

323m

415m

Figure 68. Brown−Out Chronograms (Valley Fill circuit is used)

www.onsemi.com

29

NCL30082

CS Pin Short Circuit Protection

Normally, if the CS pin or the sense resistor is shorted to

ground, the Driver will not be able to turn off, leading to

potential damage of the power supply. To avoid this, the

versions A, B, B1, B2, B3 and D feature a circuit to protect

the power supply against a short circuit of the CS pin. When

the MOSFET is on, if the CS voltage stays below VCS(low)

after the adaptive blanking timer has elapsed, the controller

shuts down and will attempt to restart on the next VCC

hiccup. In the NCL30082B1, this protection is disabled.

Adaptative

Blanking Time

V

VIN

Q_drv

CS

−

+

S

R

V

Q

CS_short

CS(low)

UVLO

BO_NOK

Figure 69. CS Pin Short Circuit Protection Schematic

Fault Management

In this mode, the DRV pulses are stopped. The VCC

voltage decrease through the controller own consumption

OFF Mode

(I ).

CC1

The circuit turns off whenever a major condition prevents

it from operating:

For the output diode short circuit protection, the CS pin

short circuit protection, the output / aux. winding short

circuit protection and the OVP2, the controller waits 4

seconds (auto−recovery timer) and then initiates a startup

• Incorrect feeding of the circuit: “UVLO high”. The

UVLO signal becomes high when V drops below

CC

V

CC(off)

and remains high until V exceeds V

.

CC

CC(on)

sequence (V ≥ V

) before re−starting switching.

CC

CC(on)

• OTP

Latch Mode

• V OVP

CC

This mode is activated by the output diode short−circuit

protection (WOD_SCP), the OTP and the Aux−SCP in

version A only.

• OVP2 (additional OVP provided by SD pin)

• Output diode short circuit protection: “WOD_SCP

high”

In this mode, the DRV pulses are stopped and the

• Output / Auxiliary winding Short circuit protection:

“Aux_SCP high”

controller is latched. There are hiccups on V

The circuit un−latches when V < V

.

CC

.

CC(reset)

CC

• Die over temperature (TSD)

• Brown−Out: “BO_NOK” high

• Pin CS short circuited to GND: “CS_short high”

www.onsemi.com

30

NCL30082

Reset

Timer has

finished

counting

V

CC

> V

CC(on)

V

CC

< V

CC(off)

or

BO_NOK ↓

OVP2 or

_OVP

BO_NOK high

or OTP

or TSD

V

CC

Stop

4−s

Timer

or CS_Short

V

CC

Disch.

BO_NOK high

or OTP

or TSD

or CS_Short

OVP2

or WOD_SCP

or Aux_SCP

or V _OVP

CC

Run

V

CC

< V

CC(off)

With states: Reset

→

Controller is reset, I = I

CC CC(start)

Controller is ON, DRV is not switching, t

Normal switching

Stop

Run

has elapsed

OTP(start)

V

CC

Disch.

No switching, I = I

, waiting for V to decrease to V

CC1 CC CC(off)

CC

4−s Timer

the auto−recovery timer is counting, V is ramping up and down between V

and V

CC(on) CC(off)

CC

Note: For the NCL30082B1, the CS pin short circuit Protection is disabled

Figure 70. State Diagram for B, B1, B2, B3 and D Version Faults

www.onsemi.com

31

NCL30082

Reset

Timer has

finished

counting

V

CC

> V

CC(on)

V

CC

< V

CC(off)

or

BO_NOK ↓

V

CC

< V

CC(reset)

OVP2 or

_OVP

BO_NOK high

or TSD

or CS_Short

V

4−s

Timer

CC

Stop

V

CC

Disch.

OTP

OVP2 or

V

CC

_OVP

BO_NOK high

or TSD

or CS_Short

Latch

Run

V

CC

< V

CC(off)

OTP or

WOD_SCP or

Aux_SCP

With states: Reset

→

Controller is reset, I = I

CC CC(start)

Controller is ON, DRV is not switching, t

Normal switching

Stop

Run

has elapsed

OTP(start)

V

CC

Disch.

No switching, I = I

, waiting for V to decrease to V

CC1 CC CC(off)

CC

4−s Timer

Latch

the auto−recovery timer is counting, V is ramping up and down between V

and V

CC

CC(on) CC(off)

Controller is latched off, V is ramping up and down between V

and V

,

CC

CC(on)

CC(off)

only V

can release the latch.

CC(reset)

Figure 71. State Diagram for A Version Faults

www.onsemi.com

32

NCL30082

OPTIONS

Winding/

Output

Diode SCP

Over

Temperature

Protection

CS Pin

Short

Protection

ZCD

Blanking

Brown-Out

blanking

Thermal

Foldback

Controller

Output SCP

V

REF

NCL30082A

Latched

Yes

No

250 mV

333 mV

250 mV

333 mV

500 mV

3 ms

50 ms

15 ms

Smooth output

current

decrease

NCL30082B

Auto-recovery Auto-recovery Auto-recovery

3 ms

Smooth output

current

decrease

NCL30082B1 Auto-recovery Auto-recovery Auto-recovery

NCL30082B2 Auto-recovery Auto-recovery Auto-recovery

NCL30082B3 Auto-recovery Auto-recovery Auto-recovery

NCL30082B4 Auto-recovery Auto-recovery Auto-recovery

NCL30082B5 Auto-recovery Auto-recovery Auto-recovery

3 ms

Smooth output

current

decrease

Yes

No

1.5 ms

3 ms

Smooth output

current

decrease

Smooth output

current

decrease

Smooth output

current

decrease

No

Smooth output

current

decrease

NCL30082D

Auto-recovery Auto-recovery Auto-recovery

Yes

Steep output

current

decrease

ORDERING INFORMATION

Device

†

Package Marking

Package Type

Shipping

NCL30082ADMR2G

AAC

Micro8

(Pb−Free, Halide−Free)

4000 / Tape & Reel

2500 / Tape & Reel

NCL30082BDMR2G

NCL30082B1DMR2G

NCL30082BDR2G

NCL30082B1DR2G

NCL30082B2DR2G

NCL30082B3DR2G

NCL30082B4DR2G

NCL30082B5DR2G

NCL30082DDR2G

AAD

Micro8

(Pb−Free, Halide−Free)

AAH

Micro8

(Pb−Free, Halide−Free)

L30082B

L30082B1

L30082B2

L30082B3

L30082B4

L30082B5

L30082D

SOIC−8

(Pb−Free)

SOIC−8

(Pb−Free)

SOIC−8

(Pb−Free)

SOIC−8

(Pb−Free)

SOIC−8

(Pb−Free)

SOIC−8

(Pb−Free)

SOIC−8

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

www.onsemi.com

33

NCL30082

PACKAGE DIMENSIONS

Micro8t

CASE 846A−02

ISSUE J

D

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE

BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED

0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.

H

E

MILLIMETERS

INCHES

NOM

−−

0.003

0.013

0.007

0.118

DIM

A

A1

b

c

D

MIN

−−

NOM

−−

MAX

MIN

−−

MAX

0.043

0.006

0.016

0.009

0.122

PIN 1 ID

e

1.10

0.15

0.40

0.23

3.10

b 8 PL

0.05

0.25

0.13

2.90

0.08

0.002

0.010

0.005

0.114

0.33

M

S

0.08 (0.003)

T B

A

0.18

3.00

E

3.00

0.118

e

L

H

E

0.65 BSC

0.55

4.90

0.026 BSC

0.021

0.193

SEATING

PLANE

0.40

4.75

0.70

5.05

0.016

0.187

0.028

0.199

−T−

A

0.038 (0.0015)

L

A1

c

RECOMMENDED

SOLDERING FOOTPRINT*

8X

0.48

0.80

5.25

0.65

PITCH

DIMENSION: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com

34

NCL30082

PACKAGE DIMENSIONS

SOIC−8 NB

CASE 751−07

ISSUE AK

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE

MOLD PROTRUSION.

−X−

A

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

8

5

4

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

6. 751−01 THRU 751−06 ARE OBSOLETE. NEW

STANDARD IS 751−07.

S

M

B

0.25 (0.010)

Y

1

K

−Y−

MILLIMETERS

DIM MIN MAX

INCHES

G

MIN

MAX

0.197

0.157

0.069

0.020

A

B

C

D

G

H

J

K

M

N

S

4.80

3.80

1.35

0.33

5.00 0.189

4.00 0.150

1.75 0.053

0.51 0.013

C

N X 45

_

SEATING

PLANE

1.27 BSC

0.050 BSC

−Z−

0.10

0.19

0.40

0

0.25 0.004

0.25 0.007

1.27 0.016

0.010

0.050

8

0.020

0.244

0.10 (0.004)

M

J

H

D

8

0

_

0.25

5.80

0.50 0.010

6.20 0.228

M

S

X

0.25 (0.010)

Z

Y

SOLDERING FOOTPRINT*

1.52

0.060

7.0

4.0

0.275

0.155

0.6

0.024

1.270

0.050

mm

inches

ǒ

Ǔ

SCALE 6:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and the

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.

SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed

at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation

or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and

specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets

and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each

customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,

or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which

the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or

unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and

expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim

alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable

copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

For additional information, please contact your local

Sales Representative

NCL30082/D

www.onsemi.com

35


型号：	NCL30082B3
厂家：	ONSEMI
描述：	Dimmable Quasi-Resonant Primary Side Current-Mode Primary Side Current-Mode
文件：	总35页 (文件大小：361K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

NCL30082B3 [ONSEMI]

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