NCL30486B2DR2G [ONSEMI]
Smart-Dimmable CC/CV PSR Controller;型号: | NCL30486B2DR2G |
厂家: | ONSEMI |
描述: | Smart-Dimmable CC/CV PSR Controller |
文件: | 总32页 (文件大小:289K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
Dimmable Power Factor
Corrected LED Driver
9
1
SOIC−9 NB
CASE 751BP
Product Preview
NCL30486B
MARKING DIAGRAM
The NCL30486B is a power factor corrected flyback controller
targeting isolated constant current LED drivers. The controller
operates in a quasi−resonant mode to provide high efficiency. Thanks
to a novel control method, the device is able to tightly regulate a
constant LED current from the primary side. This removes the need
for secondary side feedback circuitry, its biasing and for an
optocoupler.
10
L30486XX
ALYW
G
1
The device is highly integrated with a minimum number of external
components. A robust suite of safety protection is built in to simplify
the design. This device is specifically intended for very compact space
efficient designs and supports analog and digital dimming with two
dedicated dimming inputs control ideal for Smart LED Lighting
applications.
L30486
XX
A
= Specific Device Code
= Version
= Assembly Location
= Wafer Lot
= Assembly Start Week
= Pb−Free Package
L
YW
G
Features
• High Voltage Startup
PIN CONNECTIONS
• Quasi−resonant Peak Current−mode Control Operation
• Primary Side Feedback
ADIM
HV
1
2
3
4
5
10
• CC / CV Accurate Control V up to 320 V rms
in
• Tight LED Constant Current Regulation of 2% Typical
• Digital Power Factor Correction
• Analog and Digital Dimming
COMP
PDIM
VCC
DRV
ZCD
CS
8
7
6
• Dimming Standby Mode (Dim CV Mode)
• Standby Mode
• Cycle by Cycle Peak Current Limit
GND
• Wide Operating V Range
CC
• −40 to +125°C
• Robust Protection Features
♦ Brown−Out
♦ OVP on V
CC
♦ Constant Voltage / LED Open Circuit Protection
♦ Winding Short Circuit Protection
♦ Secondary Diode Short Protection
♦ Output Short Circuit Protection
♦ Thermal Shutdown
ORDERING INFORMATION
See detailed ordering and shipping information on page 30 of
this data sheet.
♦ Line over Voltage Protection
• This is a Pb−Free Device
Typical Applications
• Integral LED Bulbs
• LED Power Driver Supplies
• LED Light Engines
This document contains information on a product under development. onsemi reserves
the right to change or discontinue this product without notice.
© Semiconductor Components Industries, LLC, 2021
1
Publication Order Number:
December, 2021 − Rev. P1
NCL30486B/D
NCL30486B
.
.
Aux
.
VADIM
NCL30486
1
2
3
4
5
10
9
8
7
6
PWM signal
Figure 1. Typical Application Schematic for NCL30486B
PIN FUNCTION DESCRIPTION NCL30486B
Pin N5
1
Pin Name
Function
Pin Description
ADIM
Analog dimming
This pin is used for analog control of the output current. Applying a voltage varying
between V and V will dim the output current from 0% to 100%.
DIM(EN)
DIM100
2
3
COMP
ZCD
OTA output for CV loop This pin receives a compensation network to stabilize the constant voltage loop
Zero crossing Detection This pin connects to the auxiliary winding and is used to detect the core reset event.
V
sensing
This pin also senses the auxiliary winding voltage for accurate output voltage control
aux
4
5
6
7
8
CS
Current sense
−
This pin monitors the primary peak current.
GND
DRV
VCC
PDIM
The controller ground
Driver output
Supplies the controller
PWM dimming
The driver’s output to an external MOSFET
This pin is connected to an external auxiliary voltage.
This pin is used for PWM dimming control. An optocoupler can be connected directly
to the pin if the PWM control signal is from the secondary side
9
NC
HV
creepage
10
High Voltage sensing
This pin connects after the diode bridge to provide the startup current and internal
high voltage sensing function.
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2
NCL30486B
INTERNAL CIRCUIT ARCHITECTURE
STOP
L_OVP
VCC
COMP
Aux_SCP
Fast_OVP
Enable
Standby
VCV
OFF
Fault
Management
VCC Management
UVLO
Constant Voltage
Control
Slow_OVP
Fast_OVP
Thermal
Shutdown
VCC
OVP
HV
Startup
VCC_OVP
CS_short
HVdiv Slow_OVP
V
VREFX
dimCV_mode
HV
BO_NOK
L_OVP
Brown−Out
Line OVP
Zero crossing detection Logic
Z(CD blanking, Time−Out, ...)
ZCD
Valley Selection
Frequency foldback
Aux. Winding Short Circuit Prot.
Aux_SCP
VHVdiv
Q_drv
Q_drv
VHVdiv
Line
feed−forward
S
R
Q
Q
Standby VDIMA VHVdiv dc_DIM
DRV
Driver
and
Clamp
Enable
STOP
CS
VREFX
Leading
Edge
Blanking
Power factor and
Constant−current control
CS_reset
Ipk_max
Maximum
on−time
Max. Peak
Current Limit
STOP
Winding /
Output diode
ADIM
PDIM
WOD_SCP
Analog
Dimming
SCP
VDIMA
dimCV_mode
Enable
CS Short
Protection
CS_short
GND
PWM
Dimming
dc_DIM
dimCV_mode
Figure 2. Internal Circuit Architecture NCL30486B
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3
NCL30486B
MAXIMUM RATINGS TABLE
Symbol
Rating
Value
Unit
V
Maximum Power Supply Voltage, VCC Pin, Continuous Voltage
Maximum Current for VCC Pin
−0.3 to 30
Internally limited
V
mA
CC(MAX)
CC(MAX)
I
V
Maximum Driver Pin Voltage, DRV Pin, Continuous Voltage
Maximum Current for DRV Pin
−0.3, V
(Note 1)
V
mA
DRV(MAX)
DRV(MAX)
DRV
I
−300, +500
V
Maximum Voltage on HV Pin
Maximum Current for HV Pin (dc Current Self−limited if Operated within the Allowed Range)
−0.3, +700
V
mA
HV(MAX)
HV(MAX)
I
20
V
Maximum Voltage on Low Power Pins (Except Pins DRV and VCC)
Current Range for Low Power Pins (Except Pins DRV and VCC)
−0.3, 5.5 (Note 2)
−2, +5
V
mA
MAX
MAX
I
R
Thermal Resistance Junction−to−Air
Maximum Junction Temperature
210
°C/W
°C
q
J−A
T
150
J(MAX)
Operating Temperature Range
−40 to +125
°C
Storage Temperature Range
−60 to +150
°C
ESD Capability, HBM Model Except HV Pin (Note 3)
ESD Capability, HBM Model HV Pin
ESD Capability, CDM Model (Note 3)
4
1.5
1
kV
kV
kV
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. V
is the DRV clamp voltage V
when V is higher than V
. V
is V otherwise.
DRV
DRV(high)
CC
DRV(high) DRV CC
2. This level is low enough to guarantee not to exceed the internal ESD diode and 5.5 V ZENER diode. More positive and negative voltages
can be applied if the pin current stays within the −2 mA / 5 mA range.
3. This device series contains ESD protection and exceeds the following tests: Human Body Model 4000 V per Mil−Std−883, Method 3015.
Charged Device Model 1000 V per JEDEC Standard JESD22−C101D.
4. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78.
ELECTRICAL CHARACTERISTICS (Unless otherwise noted: For typical values T = 25°C, V = 12 V, V
= 0 V, V = 0 V.
CS
J
CC
ZCD
For min/max values T = −40°C to +125°C, Max T = 150°C, V = 12 V)
J
J
CC
Parameter
Test Condition
Symbol
Min
Typ
Max
Unit
HIGH VOLTAGE SECTION
High Voltage Current Source
High Voltage Current Source
V
V
= V
– 200 mV
I
3.4
−
4.6
300
0.8
15
6.2
−
mA
mA
CC
CC(on)
HV(start2)
I
HV(start1)
= 0 V
CC
V
CC
Level for I
to I
Transition
V
CC(TH)
−
−
V
HV(start1)
HV(start2)
Minimum Startup Voltage
HV Source Leakage Current
V
V
= 0 V
V
−
−
V
CC
HV(MIN)
HV(leak)
= 450 V
I
−
4.5
−
10
−
mA
HV
Maximum Input Voltage (rms) for Correct Operation of
the PFC Loop
V
320
V rms
HV(OL)
SUPPLY SECTION
Supply Voltage
V
Startup Threshold
V
CC
V
CC
V
CC
increasing
decreasing
decreasing
V
V
16
9.3
7.6
4
18
10.2
−
20
10.7
−
CC(on)
CC(off)
Minimum Operating Voltage
Hysteresis V
– V
V
CC(on)
CC(off)
CC(HYS)
CC(reset)
Internal Logic Reset
V
5
6
Over Voltage Protection
VCC OVP Threshold
V
25
26.5
28
V
CC(OVP)
V
V
Noise Filter (Note 5)
CC(reset)
t
−
−
5
20
−
−
ms
CC(off)
VCC(off)
nOise Filter (Note 5)
t
VCC(reset)
Supply Current
mA
Device Disabled/Fault
V
> V
I
I
I
I
1.1
–
1.4
3.3
3.6
1.7
1.7
3.9
4.3
2
CC
sw
CC(off)
CC1
CC2
CC3
CC4
Device Enabled/No Output Load on Pin 5
F
= 65 kHz
Device Switching (F = 65 kHz)
C
= 470 pF, F = 65 kHz
−
sw
sw
DRV
sw
Device Switching (F = 700 Hz)
V
COMP
≤ 0.9 V
−
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4
NCL30486B
ELECTRICAL CHARACTERISTICS (Unless otherwise noted: For typical values T = 25°C, V = 12 V, V
= 0 V, V = 0 V.
CS
J
CC
ZCD
For min/max values T = −40°C to +125°C, Max T = 150°C, V = 12 V) (continued)
J
J
CC
Parameter
Test Condition
Symbol
Min
Typ
Max
Unit
CURRENT SENSE
Maximum Internal Current Limit
V
1.28
240
−
1.40
300
50
1.50
360
150
V
ILIM
LEB
ILIM
Leading Edge Blanking Duration for V
t
ns
ns
ILIM
Propagation Delay from Current Detection to Gate
Off−state
t
Maximum On−time OPN1
Maximum On−time OPN2
t
t
10.5
16
14.0
20
17.5
24
ms
ms
ms
ms
V
on(MAX)1
on(MAX)2
Maximum On−time V
Maximum On−time V
< 0.15 V (OPN1)
< 0.15 V (OPN2)
t
5.3
8
7.0
10
8.7
12
REFX
REFX
on(MAX)12
on(MAX)22
t
Threshold for Immediate Fault Protection Activation
(140% of V
V
1.9
2.0
2.1
CS(stop)
)
ILIM
Leading Edge Blanking Duration for V
t
−
170
500
60
−
ns
mA
CS(stop)
BCS
Current Source for CS to GND Short Detection
I
400
20
600
90
CS(short)
Current Sense Threshold for CS to GND Short Detection
V
CS
rising
V
mV
mV
CS(low)
Maximum Peak Current in Standby Mode
V
CS(SBY)
Option 1
Option 2
Option 3
342
297
252
380
330
280
418
363
308
GATE DRIVE
Drive Resistance
DRV Sink
DRV Source
W
R
SNK
R
SRC
−
−
13
30
−
−
Drive Current Capability
DRV Sink (Note GBD)
DRV Source (Note GBD)
mA
I
−
−
500
300
−
−
SNK
SRC
I
Rise Time (10% to 90%)
Fall Time (90 %to 10%)
DRV Low Voltage
C
C
= 470 pF
= 470 pF
t
–
–
8
30
20
–
−
−
−
ns
ns
V
DRV
DRV
CC
r
t
f
V
= V
+0.2 V
V
CC(off)
DRV(low)
C
DRV
= 470 pF, R
= 33 kW
= 33 kW
DRV
DRV High Voltage
V
= V
V
10
12
14
V
CC
DRV
CC(MAX)
DRV(high)
C
= 470 pF, R
DRV
ZERO VOLTAGE DETECTION CIRCUIT
Upper ZCD Threshold Voltage
V
V
rising
falling
V
−
35
−
90
55
0.7
−
150
−
mV
mV
V
ZCD
ZCD(rising)
V
ZCD(falling)
Lower ZCD Threshold Voltage
ZCD
Threshold to Force V
ZCD Hysteresis
Maximum During Startup
V
−
REFX
ZCD(start)
ZCD(HYS)
ZCD(DEM)
V
15
−
−
mV
ns
ns
ms
ms
ms
ms
ms
ms
Propagation Delay from Valley Detection to DRV High
Equivalent Time Constant for ZCD Input (GBD)
Blanking Delay after On−time (option 1)
Blanking Delay after On−time (option 2)
Blanking Delay at Light Load (option 1)
Blanking Delay at Light Load (option 2)
Timeout after Last DEMAG Transition
V
ZCD
decreasing
t
−
150
−
t
−
20
1.5
1.0
0.8
0.6
6.5
50
PAR
V
REFX
V
REFX
V
REFX
V
REFX
> 0.35 V
> 0.35 V
< 0.25 V
< 0.25 V
t
t
t
t
1.1
0.75
0.6
0.45
5
1.9
1.25
1.0
0.75
8
ZCD(blank1)
ZCD(blank1)
ZCD(blank2)
ZCD(blank2)
t
TIMO
Time−out after Last DEMAG Transition V
(Note 5)
< V
t
TIMOstart
−
−
ZCD
ZCD(start)
Pulling−down Resistor
V
= V
R
−
200
165
−
kW
mA
ZCD
ZCD(falling)
ZCD(pd)
ZCD Pin Current Source for Forcing CV Mode when
Minimum Dimming
V
ADIM
= 0.5 V
I
140
190
ZCDdim
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5
NCL30486B
ELECTRICAL CHARACTERISTICS (Unless otherwise noted: For typical values T = 25°C, V = 12 V, V
= 0 V, V = 0 V.
CS
J
CC
ZCD
For min/max values T = −40°C to +125°C, Max T = 150°C, V = 12 V) (continued)
J
J
CC
Parameter
Test Condition
Symbol
Min
Typ
Max
Unit
CONSTANT CURRENT CONTROL
Reference Voltage
T = 25°C − 85°C
V
V
327.9 334.2 341.2
324.1 334.2 346.0
mV
mV
mV
mV
mV
mV
mV
j
REF/3
Reference Voltage
T = −40°C to 125°C
j
REF/3
10% Reference Voltage
10% Reference Voltage
5% Reference Voltage
5% Reference Voltage
T = 25°C − 85°C
j
V
V
V
V
30
33.33 36.66
REF10/3
REF10/3
REF05/3
REF05/3
T = −40°C to 125°C
j
27.33 33.33 39.33
T = 25°C − 85°C
j
14.17
13.34
20
17
17
50
19.17
20
T = −40°C to 125°C
j
Current Sense Lower Threshold for Detection of the
Leakage Inductance Reset Time
V
CS
falling
V
100
CS(low)
Blanking Time for Leakage Inductance Reset Detection
t
−
120
−
ns
CS(low)
POWER FACTOR CORRECTION
Clamping Value for V
T = 0°C to 125°C
V
REF(PFC)CLP
2.06
−
2.20
240
230
2.34
−
V
REF(PFC)
J
Line Range Detector for PFC Loop
Line Range Detector for PFC Loop
CONSTANT VOLTAGE SECTION
V
HV
HV
increases
decreases
V
Vdc
Vdc
HL(PFC)
V
V
−
−
LL(PFC)
Internal Voltage Reference for Constant Voltage
Regulation
V
3.41
3.52
3.63
V
REF(CV)
CV Error Amplifier Gain
G
40
−
50
60
60
−
mS
mA
V
EA
Error Amplifier Current Capability
V
= V
(no dimming)
I
EA
REFX
REF
COMP Pin Lower Clamp Voltage
V
−
0.6
−
CV(clampL)
CV(clampH)
CV(clampH)
COMP Pin Higher Clamp Voltage
T = 0°C to 125°C
J
V
4.05
4.01
4.12
4.12
4.25
4.25
V
COMP Pin Higher Clamp Voltage
T = −40°C to 125°C
J
V
V
Internal ZCD Voltage below which the CV OTA is Boosted
Threshold for Releasing the CV Boost
Error Amplifier Current Capability During Boost Phase
V
* 85%
* 90%
V
2.796 2.975 3.154
V
REF(CV)
REF(CV)
boost(CV)
V
V
2.96
3.15
140
3.34
V
boost(CV)RST
I
−
−
mA
V
EAboost
st
ZCD OVP 1 Level (Slow OVP) Option 1
V
V
* 115%
* 105%
V
OVP1
3.783 4.025 4.267
REF(CV)
ZCD Voltage at which Slow OVP is Exit (Option 1)
Switching Period During Slow OVP
ZCD Fast OVP Option 1
V
−
−
3.675
1.5
−
−
V
REF(CV)
OVP1rst
T
ms
V
sw(OVP1)
V
ref(CV)
* 125% + 150 mV
V
4.253 4.525 4.797
OVP2
OVP2_CNT
Number of Switching Cycles before Fast OVP
Confirmation
T
−
4
−
Duration for Disabling DRV Pulses During ZCD Fast OVP
T
−
−
4
−
−
s
recovery
COMP Pin Voltage below which Standby Mode is
Entered (Note 5)
V
V
decreasing
increasing
V
0.895
V
COMP
CMP(SBY)
COMP Standby Comparator Hysteresis (Note 5)
V
−
18
−
mV
COMP
CMP(SBY)HYS
LINE FEED FORWARD
V
HV
to I
Conversion Ratio
K
LFF
0.189 0.21 0.231 mA/V
CS(offset)
Offset Current Maximum Value
Line Feed−forward Current
V
> (450 V or 500 V)
I
76
35
95
40
114
45
mA
mA
HV
offset(MAX)
DRV high, V = 200 V
I
FF
HV
VALLEY LOCKOUT SECTION
Threshold for Line Range Detection V Increasing
V
increases
decreases
V
HL
228
218
15
240
230
25
252
242
35
V
V
HV
> 80% V
HV
HV
st
nd
(1 to 2 Valley Transition for V
)
REFX
REF
st
rd
(Prog. Option: 1 to 3 Valley Transition)
Threshold for Line Range Detection V Decreasing
V
V
LL
HV
nd
st
(2 to 1 Valley Transition for V
> 80% V
)
REFX
REF
rd
st
(Prog. Option: 3 to 1 Valley Transition)
Blanking Time for Line Range Detection
t
ms
HL(blank)
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NCL30486B
ELECTRICAL CHARACTERISTICS (Unless otherwise noted: For typical values T = 25°C, V = 12 V, V
= 0 V, V = 0 V.
CS
J
CC
ZCD
For min/max values T = −40°C to +125°C, Max T = 150°C, V = 12 V) (continued)
J
J
CC
Parameter
Test Condition
Symbol
Min
Typ
Max
Unit
VALLEY LOCKOUT SECTION
Valley Thresholds
V
st
nd
nd
rd
1
to 2 Valley Transition at LL and 2 to 3 Valley HL,
V
V
V
V
V
V
V
V
decreases
increases
decreases
increases
decreases
increases
decreases
increases
V
V
V
V
V
V
V
V
−
−
−
−
−
−
−
−
0.80
0.90
0.65
0.75
0.50
0.60
0.35
0.45
−
−
−
−
−
−
−
−
REF
REF
REF
REF
REF
REF
REF
REF
VLY1−2/2−3
VLY2−1/3−2
VLY2−3/3−4
VLY3−2/4−3
VLY3−4/4−5
VLY4−3/5−4
VLY4−5/5−6
VLY5−4/6−5
rd
th
V
Decr. (Prog. Option: 3 to 4 Valley HL)
REF
nd
st
rd
nd
2
to 1 Valley Transition at LL and 3 to 2 Valley HL,
th
rd
V
Incr. (Prog. Option: 4 to 3 Valley HL)
REF
nd
rd
rd
th
2
to 3 Valley Transition at LL and 3 to 4 Valley HL,
th
th
V
Decr. (Prog. Option: 4 to 5 Valley HL)
REF
rd
nd
th
rd
3
to 2 Valley Transition at LL and 4 to 3 Valley HL,
th
th
V
Incr. (Prog. Option: 5 to 4 Valley HL)
REF
rd
th
th
th
3
to 4 Valley Transition at LL and 4 to 5 Valley HL,
th
th
V
Decr. (Prog. Option: 5 to 6 Valley HL)
REF
th
th
th
th
4
to 3 Valley Transition at LL and 5 to 4 vAlley HL,
th
th
V
Incr. (Prog. Option: 6 to 5 Valley HL)
REF
th
th
th
th
4
to 5 Valley Transition at LL and 5 to 6 Valley HL,
th
th
V
Decr. (Prog. Option: 6 to 7 Valley HL)
REF
th
th
th
th
5
to 4 Valley Transition at LL and 6 to 5 Valley HL,
th
th
V
REF
V
REF
V
REF
Incr. (Prog. Option: 7 to 6 Valley HL)
Value at which the FF Mode is Activated
Value at which the FF Mode is Removed
V
V
decreases
increases
V
V
−
−
0.25
0.35
−
−
V
V
REF
FFstart
REF
FFstop
FREQUENCY FOLDBACK
Added Dead Time (Note 5)
V
REFX
V
REFX
V
REFX
V
REFX
V
REFX
V
REFX
= 0.25 V
= 0.08 V
< 3 mV
< 11.2 mV
= 0
t
−
−
−
−
−
−
2
−
−
−
−
−
−
ms
ms
ms
ms
ms
ms
FF1LL
Added Dead Time (Note 5)
t
35
FFchg
Dead−time Clamp (Option 1) (Note 5)
Dead−time Clamp (Option 2) (Note 5)
Minimum Added Dead−time in Standby (Note 5)
t
687
250
640
1.8
FFend1
FFend2
t
t
DT(min)SBY
Maximum Added Dead−time in Standby (Option 2)
(Note 5)
= 0, V
< 0.7 V
t
DT(max)SBY2
COMP
V
Threshold below which Valley Synchronization in
V
REFX
V
REFX
decreasing
increasing
V
REFXsyncD
0.14
0.15
0.16
V
V
REFX
Frequency Foldback is Turned Off (Note 5)
V
Threshold above which Valley Synchronization in
V
0.165 0.18 0.195
REFX
REFXsyncI
Frequency Foldback is Turned On (Note 5)
DIMMING SECTION
DIM Pin Voltage for Zero Output Current (OFF Voltage)
ADIM Pin Voltage for 1% Reference Voltage
Minimum Dimming Level (Option 1)
V
0.475
0.5
0.7
0
0.525
V
V
ADIM(EN)
V
0.668
0.732
ADIM(MIN)
K
−
−
−
−
−
−
−
%
%
%
%
V
DIM(MIN)1
DIM(MIN)2
DIM(MIN)3
DIM(MIN)4
Minimum Dimming Level (Option 2)
K
1
Minimum Dimming Level (Option 3)
K
K
5
−
Minimum Dimming Level (Option 4)
8
−
ADIM Pin Voltage for Maximum Output Current
V
3.0
3.1
ADIM100
(V
REFX
= 1 V)
Dimming Range
V
−
−
2.3
6.8
10
70
153
1080
3
−
−
V
V
ADIM(range)
Clamping Voltage for DIM Pin
V
ADIM(CLP)
Dimming Pin Pull−up Current Source
Current Comparator Low Threshold for PDIM
Current Comparator High Threshold for PDIM
Cascode Current Limit for PDIM
I
8
12
80
175
−
mA
mA
mA
mA
V
ADIM(pullup)1
I
I
60
131
−
PDIM(THR)
PDIM(THD)
I
PDIM(LIM)
PDIM Pin Voltage
V
PDIM
−
−
Maximum Period of the PWM Dimming Signal
Minimum On−time for PWM Signal Applied on PDIM
−
6
−
ms
ms
−
8
−
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7
NCL30486B
ELECTRICAL CHARACTERISTICS (Unless otherwise noted: For typical values T = 25°C, V = 12 V, V
= 0 V, V = 0 V.
CS
J
CC
ZCD
For min/max values T = −40°C to +125°C, Max T = 150°C, V = 12 V) (continued)
J
J
CC
Parameter
Test Condition
Symbol
Min
Typ
Max
Unit
FAULT PROTECTION
Thermal Shutdown (Note 5)
Device switching (F
65 kHz)
around
T
SHDN
130
150
170
°C
SW
Thermal Shutdown Hysteresis
T
−
20
–
°C
SHDN(HYS)
Threshold Voltage for Output Short Circuit or Aux.
Winding Short Circuit Detection
V
0.6
0.65
0.7
V
ZCD(short)
Short Circuit Detection Timer
V
ZCD
< V
t
OVLD
70
3
90
4
110
5
ms
s
ZCD(short)
Auto−recovery Timer
t
recovery
Line OVP Threshold
V
V
increasing
decreasing
V
457
430
210
469
443
340
485
465
470
Vdc
Vdc
ms
HV
HV(OVP)
HV Pin Voltage at which Line OVP is Reset
Blanking Time for Line OVP Reset
BROWN−OUT AND LINE SENSING
Brown−Out ON Level (IC Start Pulsing)
Brown−Out ON Level (IC Start Pulsing) Option 2
Brown−Out OFF Level (IC Stops Pulsing)
Brown−Out OFF Level (IC Stops Pulsing) Option 2
V
HV(OVP)RST
HV
T
LOVP(blank)
V
HV
V
HV
V
HV
V
HV
V
HV
increasing
increasing
decreasing
decreasing
V
101.5
129.7
92
108
138
99
114.5
146.3
106
137
−
Vdc
Vdc
Vdc
Vdc
V
HVBO(on)
V
HVBO(on)2
V
HVBO(off)
V
121
−
129
55
HVBO(off)2
HV Pin Voltage above which the Sampling of ZCD is
Enabled Low Line
decreasing, low line
decreasing, highline
increasing
V
sampENLL
HV Pin Voltage above which the Sampling of ZCD is
Enabled Highline
V
V
V
−
105
−
V
HV
sampENHL
ZCD Sampling Enable Comparator Hysteresis
BO Comparators Delay
V
−
−
5
−
−
V
HV
sampHYS
BO(delay)
BO(blank)
t
t
30
25
ms
ms
Brown−Out Blanking Time
15
35
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
5. Guaranteed by design.
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8
NCL30486B
TYPICAL CHARACTERISTICS
4,9
4,8
4,7
4,6
4,5
4,4
4,3
4,2
4,1
4
296
291
286
281
276
271
266
−50
−25
0
25
50
75
100
100
100
125
125
125
−50
−25
0
25
50
75
100
100
100
125
125
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 3. IHV(start2) vs. Temperature
Figure 4. IHV(start1) vs. Temperature
18,31
18,3
10,218
10,213
10,208
10,203
10,198
10,193
10,188
10,183
10,178
10,173
10,168
18,29
18,28
18,27
18,26
18,25
18,24
18,23
18,22
−50
−25
0
25
50
75
−50
−25
0
25
50
75
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 5. VCC(on) vs. Temperature
Figure 6. VCC(off) vs. Temperature
1,47
1,45
1,43
1,41
1,39
1,37
1,35
1,33
26,91
26,89
26,87
26,85
26,83
26,81
26,79
−50
−25
0
25
50
75
−50
−25
0
25
50
75
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 7. VCC(OVP) vs. Temperature
Figure 8. ICC1 vs. Temperature
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9
NCL30486B
TYPICAL CHARACTERISTICS (continued)
1,0505
1,0495
1,0485
1,0475
1,0465
1,0455
1,0445
1,0435
1,0425
1,0415
1,765
1,755
1,745
1,735
1,725
1,715
1,705
1,695
1,685
−50
−25
0
25
50
75
100
100
100
125
125
125
−50
−25
0
25
50
75
100
125
125
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 9. ICC4 vs. Temperature
Figure 10. tFF1LL vs. Temperature
358
357
356
355
354
353
352
351
350
2,214
2,209
2,204
2,199
2,194
2,189
2,184
2,179
2,174
2,169
2,164
−50
−25
0
25
50
75
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 11. VHV(OL) vs. Temperature
Figure 12. VREF(PFC)CLP vs. Temperature
1,3755
1,3735
1,3715
1,3695
1,3675
1,3655
1,3635
54,2
53,7
53,2
52,7
52,2
51,7
51,2
50,7
50,2
−50
−25
0
25
50
75
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 13. VILIM vs. Temperature
Figure 14. VCS(low)F vs. Temperature
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10
NCL30486B
TYPICAL CHARACTERISTICS (continued)
2,005
2,004
2,003
2,002
2,001
2
379
378,5
378
377,5
377
1,999
1,998
1,997
1,996
1,995
376,5
376
−50
−25
0
25
50
75
100
125
125
125
−50
−25
0
25
50
75
100
125
125
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 15. VCS(stop) vs. Temperature
Figure 16. VCS(SBY)_opn1 vs. Temperature
280,2
330,6
329,6
328,6
327,6
326,6
325,6
279,7
279,2
278,7
278,2
277,7
277,2
276,7
276,2
−50
−25
0
25
50
75
100
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 17. VCS(SBY)_opn2 vs. Temperature
Figure 18. VCS(SBY)_opn3 vs. Temperature
14,1
20,1
14,05
14
20,05
20
13,95
13,9
13,85
13,8
19,95
19,9
19,85
19,8
−50
−25
0
25
50
75
100
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 19. ton(MAX)1 vs. Temperature
Figure 20. ton(MAX)2 vs. Temperature
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11
NCL30486B
TYPICAL CHARACTERISTICS (continued)
183
182
181
180
179
178
177
176
310
308
306
304
302
300
298
296
294
292
−50
−25
0
25
50
75
100
100
100
125
125
125
−50
−25
0
25
50
75
100
100
100
125
125
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 21. tLEB vs. Temperature
Figure 22. tBCS vs. Temperature
49
47
45
43
41
39
37
11
10
9
8
7
6
5
4
3
−50
−50
−25
0
25
50
75
−25
0
25
50
75
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 23. tILIM vs. Temperature
Figure 24. RSNK vs. Temperature
37
35
33
31
29
27
25
23
21
19
22
17
12
7
2
−50
−25
0
25
50
75
−50
−25
0
25
50
75
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 25. RSRC vs. Temperature
Figure 26. tr vs. Temperature
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12
NCL30486B
TYPICAL CHARACTERISTICS (continued)
86,2
86,1
86
22
20
18
16
14
12
85,9
85,8
85,7
−50
−25
0
25
50
75
100
125
125
125
−50
−25
0
25
50
75
100
125
125
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 27. tf vs. Temperature
Figure 28. VZCD(rising) vs. Temperature
0,6685
0,6675
0,6665
0,6655
0,6645
0,6635
0,6625
0,6615
0,6605
57,4
56,9
56,4
55,9
55,4
−50
−25
0
25
50
75
100
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 29. VZCD(falling) vs. Temperature
Figure 30. VZCD(short) vs. Temperature
121
116
111
106
101
96
1,63
1,62
1,61
1,6
1,59
1,58
1,57
1,56
91
86
81
76
−50
−25
0
25
50
75
100
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 31. tZCD(DEM) vs. Temperature
Figure 32. tZCD(blank1)OPN1 vs. Temperature
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13
NCL30486B
TYPICAL CHARACTERISTICS (continued)
0,876
0,871
0,866
0,861
0,856
0,851
0,846
0,841
0,836
1,084
1,079
1,074
1,069
1,064
1,059
1,054
1,049
1,044
−50
−25
0
25
50
75
100
125
125
125
−50
−25
0
25
50
75
100
125
125
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 33. tZCD(blank1)OPN2 vs. Temperature
Figure 34. tZCD(blank1)OPN1 vs. Temperature
6,895
0,584
6,875
6,855
6,835
6,815
6,795
0,579
0,574
0,569
0,564
−50
−25
0
25
50
75
100
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 35. tZCD(blank2)OPN2 vs. Temperature
Figure 36. tTIMO vs. Temperature
341
35
34,5
34
340,5
340
339,5
339
338,5
338
33,5
33
337,5
337
−50
−25
0
25
50
75
100
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 37. VREF/3 vs. Temperature
Figure 38. VREF10/3 vs. Temperature
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14
NCL30486B
TYPICAL CHARACTERISTICS (continued)
18,4
18,2
18
3,528
3,523
3,518
3,513
3,508
3,503
3,498
3,493
3,488
17,8
17,6
17,4
17,2
17
16,8
16,6
16,4
−50
−25
0
25
50
75
100
125
125
125
−50
−25
0
25
50
75
100
125
125
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 39. VREF5/3 vs. Temperature
Figure 40. VREF(CV) vs. Temperature
4,121
4,116
4,111
4,106
4,101
4,096
615,5
613,5
611,5
609,5
607,5
605,5
603,5
−50
−25
0
25
50
75
100
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 41. VCV(clampL) vs. Temperature
Figure 42. VCV(clampH) vs. Temperature
4,529
4,524
4,519
4,514
4,509
4,058
4,048
4,038
4,028
4,018
4,008
−50
−25
0
25
50
75
100
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 43. VOVP1 vs. Temperature
Figure 44. VOVP2 vs. Temperature
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15
NCL30486B
TYPICAL CHARACTERISTICS (continued)
102,7
102,2
101,7
101,2
100,7
100,2
99,7
0,2074
0,2064
0,2054
0,2044
0,2034
0,2024
99,2
−50
−25
0
25
50
75
100
100
100
125
125
125
−50
−25
0
25
50
75
100
125
125
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 45. KLFF vs. Temperature
Figure 46. Ioffset(MAX) vs. Temperature
41,6
41,4
41,2
41
470,2
469,7
469,2
468,7
468,2
467,7
467,2
466,7
466,2
465,7
465,2
40,8
40,6
40,4
40,2
40
−50
−25
0
25
50
75
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 47. IFF vs. Temperature
Figure 48. VHV(OVP) vs. Temperature
443,9
443,4
442,9
442,4
441,9
441,4
440,9
440,4
439,9
439,4
108,15
108,05
107,95
107,85
107,75
107,65
107,55
107,45
107,35
107,25
−50
−25
0
25
50
75
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 49. VHV(OVP)RST vs. Temperature
Figure 50. VHVBO(on)1 vs. Temperature
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16
NCL30486B
TYPICAL CHARACTERISTICS (continued)
99,15
99,05
98,95
98,85
98,75
98,65
98,55
98,45
98,35
98,25
138,45
138,25
138,05
137,85
137,65
137,45
−50
−25
0
25
50
75
100
125
125
125
−50
−25
0
25
50
75
100
125
125
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 51. VHVBO(off)1 vs. Temperature
Figure 52. VHVBO(on)2 vs. Temperature
127,4
127,2
127
0,5042
0,5037
0,5032
0,5027
0,5022
0,5017
0,5012
126,8
126,6
126,4
−50
−25
0
25
50
75
100
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 53. VHVBO(off)2 vs. Temperature
Figure 54. VADIM(EN) vs. Temperature
151,7
151,2
150,7
150,2
149,7
149,2
148,7
148,2
70,5
70
69,5
69
68,5
68
−50
−25
0
25
50
75
100
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 55. IPDIM(THR) vs. Temperature
Figure 56. IPDIM(THD) vs. Temperature
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NCL30486B
TYPICAL CHARACTERISTICS (continued)
1,077
1,072
1,067
1,062
1,057
1,052
3,003
3,001
2,999
2,997
2,995
2,993
−50
−25
0
25
50
75
100
125
125
125
−50
−25
0
25
50
75
100
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 57. IPDIM(LIM) vs. Temperature
Figure 58. VPDIM vs. Temperature
0,704
0,703
0,702
0,701
0,7
3,006
3,004
3,002
3
0,699
0,698
0,697
0,696
2,998
2,996
2,994
−50
−25
0
25
50
75
100
−50
−25
0
25
50
75
100
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 59. VADIM(MIN) vs. Temperature
Figure 60. VADIM100 vs. Temperature
168,5
166,5
164,5
162,5
160,5
158,5
156,5
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
Figure 61. IZCD(DIM) vs. Temperature
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18
NCL30486B
Application Information
The NCL30486B implements
if V reaches 1.5 x V
(after a reduced LEB of t ).
BCS
CS
ILIM
a
current−mode
This additional comparator is enabled only during the
main LEB duration t , for noise immunity reason.
architecture operating in quasi−resonant mode. Thanks to
proprietary circuitry, the controller is able to accurately
regulate the secondary side current and voltage of the
fly−back converter without using any opto−coupler or
measuring directly the secondary side current or voltage.
The controller provides near unity power factor correction
LEB
• Output Under Voltage Protection: If a too low voltage is
applied on ZCD pin for 90 ms time interval, the
controllers assume that the output or the ZCD pin is
shorted to ground and shutdown. After waiting 4 seconds,
the IC restarts switching.
• Analog Dimming: the ADIM pin is dedicated to analog
dimming. There are several options for the minimum
dimming level. Pulling the pin voltage lower than
• Quasi−Resonance
Current−Mode
Operation:
implementing quasi−resonance operation in peak
current−mode control, the NCL30486B optimizes the
efficiency by switching in the valley of the MOSFET
drain−source voltage. Thanks to an internal algorithm
control, the controller locks−out in a selected valley and
remains locked until the input voltage or the output
current set point significantly changes.
V
disables the controller.
ADIM(EN)
• PWM Dimming: the PDIM pin is dedicated to PWM
dimming. The controller measures the duty ratio of a
signal applied to the pin and reduces the output current
accordingly. If this pin is left open, the controller delivers
the maximum output current. If the pin is pulled down, the
controller is disabled.
• Thermal Shutdown: an internal circuitry disables the gate
drive when the junction temperature exceeds 150°C
(typically). The circuit resumes operation once the
temperature drops below approximately 100°C.
• Standby Mode: In order to decrease the power
consumption of the SMPS if no load conditions, the
controller features a standby mode, where its own
consumption is decreased.
• Dimming Standby Mode (dimCV Mode) Option: by
pulling ADIM or PDIM down, the controller goes in
constant voltage mode with a reduced regulation setpoint.
• Primary Side Constant Current Control: thanks to a
proprietary circuit, the controller is able to take into
account the effect of the leakage inductance of the
transformer and allows an accurate control of the
secondary side current regardless of the input voltage and
output load variation.
• Primary Side Constant Voltage Regulation: By
monitoring the auxiliary winding voltage, it is possible to
regulate accurately the output voltage. The output voltage
regulation is typically within 2%.
• Load Transient Compensation: Since PFC has low loop
bandwidth, abrupt changes in the load may cause
excessive over or under−shoot. The slow Over Voltage
Protection contains the output voltage when it tends to
become excessive. In addition, the NCL30486B speeds
up the constant voltage regulation loop when the output
voltage goes below 80% or 85% of its regulation level.
• Power Factor Correction: A proprietary concept allows
achieving high power factor correction and low THD
while keeping accurate constant current and constant
voltage control.
POWER FACTOR AND CONSTANT CURRENT
CONTROL
The NCL30486B embeds an analog/digital block to
control the power factor and regulate the output current by
monitoring the ZCD, CS and HV pin voltages (signals
V
, V
, V ). This circuit generates the current
HV_DIV CS
ZCD
setpoint signal and compares it to the current sense signal to
turn the MOSFET off. The HV pin provides the sinusoidal
reference necessary for shaping the input current. The
obtained current reference is further modulated so that when
averaged over a half line period, it is equal to the output
• Line Feed−forward: allows compensating the variation of
the output current caused by the propagation delay.
• V Over Voltage Protection: if the V pin voltage
CC
CC
exceeds an internal limit, the controller shuts down and
waits 4 seconds before restarting pulsing.
current reference (V
). The modulation and averaging
REFX
process is made internally by a digital circuit. If the HV pin
properly conveys the sinusoidal shape, power factor will be
close to 1. Also, the Total Harmonic Distortion (THD) will
be low especially if the output voltage ripple is small.
• Fast Over Voltage Protection: If the voltage of ZCD pin
exceeds 130% of its regulation level, the controller shuts
down and waits 4 s before trying to restart.
• Brown−Out: the controller includes a brown−out circuit
which safely stops the controller in case the input voltage
is too low. The device will automatically restart if the line
recovers.
VREF
(eq. 1)
IOUT
+
2NspRsense
Where:
• Cycle−by−cycle Peak Current Limit: when the current
• N is the secondary to primary transformer turns ratio:
sp
sense voltage exceeds the internal threshold V
, the
ILIM
N
• R
• V
= N / N
S P
sp
MOSFET is turned off for the rest of the switching cycle.
• Winding Short−Circuit Protection: an additional
comparator senses the CS signal and stops the controller
is the current sense resistor
sense
is the output current reference: V
= V
if
REFX
REFX
REF
no dimming
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19
NCL30486B
The output current reference (V
) is V
unless the
The sampled voltage is applied to the negative input of the
constant voltage (CV) operational transconductance
REFX
REF
constant voltage mode is activated or ADIM pin voltage is
below V or a PWM signal with a duty−cycle below
amplifier (OTA) and compared to V
.
ADIM(100)
REFCV
95% is applied on PDIM.
A type 2 compensator is needed at the CV OTA output to
stabilize the loop. The COMP pin voltage modify the the
output current internal reference in order to regulate the
output voltage.
PRIMARY SIDE CONSTANT VOLTAGE CONTROL
The auxiliary winding voltage is sampled internally
through the ZCD pin.
A precise internal voltage reference V
voltage target for the CV loop.
When V
When V
≥ 4 V, V
= V
.
COMP
COMP
REFX
< 0.9 V, V
REF
sets the
REF(CV)
= 0 V.
REFX
Gm
RZCDU
ZCD
V
ZCDsamp
ZCD & signal
sampling
COMP
.
R1
C1
R
OTA
ZCDL
VREF(CV)
C2
Aux.
Figure 62. Constant Voltage Feedback Circuit
STARTUP PHASE (HV STARTUP)
• At the beginning of each operating phase of a V cycle,
CC
It is generally requested that the LED driver starts to emit
light in less than 1 s and possibly within 300 ms. It is
challenging since the start−up consists of the time to charge
the digital OTA output is set to 0. Actually, the digital
OTA output is set to 0 in the case of a cold start−up or in
the case of a start−up sequence following an operation
the V capacitor and that necessary to charge the output
CC
interruption due to a fault. On the other hand, if the V
CC
capacitor until sufficient current flows into the LED string.
This second phase can be particularly long in dimming cases
where the secondary current is a portion of the nominal one.
The NCL30486B features a high voltage startup circuit
that allows charging VCC capacitor very fast.
hiccups just because the system fails to start−up in one
cycle, the digital OTA output is not reset to ease the
V
CC
second (or more) attempt. But, the digital OTA stops
integrating if V < V . The compensator output
CC
CC(off)
then restarts from its setpoint before the UVLO, thus
avoiding any output current overshoot if a resistor is
inserted in series with HV pin.
When the power supply is first connected to the mains
outlet, the internal current source is biased and charges up
the V capacitor. When the voltage on this V capacitor
CC
CC
• If the load is shorted, the circuit will operate in hiccup
reaches the V
level, the current source turns off. At this
CC(on)
mode with VCC oscillating between V
and V
CC(on)
CC(off)
time, the controller is only supplied by the V capacitor,
CC
until the output under voltage protection (UVP) trips.
UVP is triggered if the ZCD pin voltage does not exceed
and the auxiliary supply should take over before V
CC
collapses below V
.
CC(off)
V
within a 90 ms operation of time. This
ZCD(short)
The HV startup circuitry is made of two startup current
levels, I and I . This helps to protect the
indicates that the ZCD pin is shorted to ground or that an
excessive load prevents the output voltage from rising.
HV(start1)
HV(start2)
controller against short−circuit between V and GND. At
CC
power−up, as long as V is below V
, the source
CC
CC(TH)
HV Startup Power Dissipation
delivers I
(around 300 mA typical). Then, when
HV(start1)
At high line (305 V rms and above) the power dissipated
by the HV startup in case of fault or when the controller is
disabled with PDIM becomes high. Indeed, in case of fault,
the NCL30486B is directly supplied by the HV rail. When
the controller is disabled with PDIM, the optocoupler
collector current is also supplied by the controller, since the
NCL30486B allows directly connecting the optocoupler
transistor to PDIM pin. Thus, the HV startup circuit also
supplies the optocoupler transistor in case of faults. The
current flowing through the HV startup will heat the
controller. It is highly recommended adding enough copper
V
reaches V
, the source smoothly transitions to
CC
CC(TH)
I
and delivers its nominal value. As a result, in case
HV(start2)
of short−circuit between V and GND occurring at high
line (V = 305 V rms), the maximum power dissipation will
be 431 x 300 m = 130 mW instead of 1.5 W if there was only
one startup current level.
To speed−up the output voltage rise, the following is
implemented:
CC
in
• The digital OTA output is increased until V
REF(PFC)
signal reaches V
. Again, this is to speed−up the
REFX
control signal rise to their steady state value.
around the controller to decrease the R
of the controller.
qJA
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20
NCL30486B
2
Winding and Output Diode Short−Circuit Protection
In parallel to the cycle−by−cycle sensing of the CS pin,
Adding a minimum pad area of 215 mm of 35 mm copper
(1 oz) drops the R to around 120°C/W (no air flow, R
qJA
qJA
another comparator with a reduced LEB (t ) and a
measured at ADIM pin)
The PCB layout shown in Figure 63 is a layout example
to achieve low R
BCS
threshold of (V
= 140% x V
) monitors the CS pin
CS(stop)
ILIM
to detect a winding or an output diode short circuit. The
controller shuts down if it detects 4 consecutives pulses
.
qJA
during which the CS pin voltage exceeds V
CS(stop).
The controller goes into auto−recovery mode.
PWM Dimming
The NCL30486B has a dedicated pin for PWM dimming.
The controller directly measures the duty ratio of a PWM
signal applied to PDIM.
Two counters with a high frequency clock are used for this
purpose. A first counter measure the high state duration of
the PWM signal (t ) and the second counter measures
on_PDIM
its period (T
). A divider computes (t
/
sw_PDIM
on_PDIM
T
) and the result is directly the output current
sw_PDIM
setpoint (V
set point). A filter is added after the digital
REFX
divider to remove the ripple of the signal. A cascode
configuration on PDIM pin allows decreasing the fall time
of the signal.
Thanks to this circuit, the LED current is controlled in an
analog way, even if a PWM signal is used for dimming. This
allows having a good PF during dimming.
Figure 63. PCD Layout Example
The application note AND90120 gives more details about
strategies to decrease the power dissipation of the HV
startup circuit.
Cycle−by−Cycle Current Limit
When the current sense voltage exceeds the internal
threshold V , the MOSFET is turned off for the rest of the
ILIM
switching cycle.
VDIM_sec
IPDIM
IPDIM(THD)
IPDIM(THR)
VPDIM_int
Ton
Tsw
Figure 64. PDIM Internal Waveforms
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21
NCL30486B
Practically, the controller extracts the duty−cycle by
If a voltage lower than V
is applied to the DIM
ADIM(EN)
measuring the current inside PDIM pin which is directly the
opto coupler collector current.
pin, the DRV pulses are disabled for controllers without the
dimming CV mode option.
If PDIM pin is left open, the controller delivers 100% of
The DIM pin is pulled up internally by a small current
source or resistor. Thus, if the pin is left open, the controller
is able to start.
I
. If the pin is pulled down for longer than 25 ms, the
out
controller is disabled.
If the PWM dimming signal is removed during dimming,
NOTE:
the controller delivers 100% of I
.
out
• Interaction between ADIM and PDIM: if ADIM and
The NCL30486B set 100% of output current when the
duty−cycle of the signal applied on PDIM is above 93%.
PDIM are both used at the same time, the resulting
dimming set point if a multiplication of V
and the
ADIM
duty−ratio of PDIM signal.
Analog Dimming
• During dimming, when the “Enable” signal is OK, the
The pin ADIM pin allows implementing analog dimming
of the LED light.
controller starts pulsing after first valley, even if a higher
valley number is selected by V
. This is to avoid too
If the power supply designer applies an analog signal
REFX
varying from V
output current will increase or decrease proportionally to the
voltage applied. For V = V , the power supply
to V
to the DIM pin, the
long startup time while dimming at low output current
value. After ZCD voltage during DRV off time is higher
DIM(EN)
DIM100
than 0.65 V, the number of valley is selected by V
.
DIM
DIM100
REFX
delivers the maximum output current (V
= 1 V).
REFX
• In order to minimize discrete output current variation
caused by valley change in deep dimming, valley
synchronization is removed when the dimming setpoint is
below 15%.
If a voltage lower than V
is applied to ADIM
ADIM(MIN)
pin, the output current is clamped to the selected dimming
clamp value (see Dimming clamp section below)
VREF
100% VREF
8% V
REF
5% V
REF
1% VREF
VADIM(EN)
VADIM100
VADIM
VADIM(MIN)
Figure 65. ADIM Pin Dimming Curves
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22
NCL30486B
Dimming Clamp
For smart dimming applications, need to bias the
secondary−side MCU. This can be achieved by clamping
There are 4 options for the dimming clamp:
• No dimming clamp
• 1%
• 5%
• 8%
V
REFX
when the dimming setpoint is small.
V
REFX
(%)
100%
8%
5%
1%
0.01 0.05
1.0
0.08
Scaled dimming voltage or
dimming duty−ratio
Figure 66. Dimming Clamp Options
Dimming Curves
By default, there is a linear relationship between the
voltage applied on ADIM pin and V setpoint. In the
same way, there is a linear relationship between the
duty−ratio of the signal applied on PDIM and V
An internal memory allows selecting a root square
relationship between dimming and V
The square like curve is based on CIE 1931 lightness
formula.
.
REFX
REFX
REFX
setpoint.
Output Current vs. Dimming
100
90
80
70
60
50
40
30
20
10
0
linear
CIE 1931
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Scaled Dimming Voltage or Dimming Duty Ratio
Figure 67. Dimming Curves
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23
NCL30486B
Dimming Standby Mode (dimCV Mode)
• R
is the resistor connected between ZCD and GND
is the auxiliary winding voltage corresponding to
ZCDL
pins
The NCL30486B features an option to force constant
voltage regulation by pulling ADIM or PDIM pin down.
This can be useful to provide some energy to secondary side
circuitry while the LED are turned off. In this mode, the
regulation target is set lower than the regulation threshold is
normal CV mode.
• V
auxCV1
the nominal CV setpoint
• V
is the auxiliary winding voltage corresponding to
auxCV2
the CV setpoint in reduced CV mode: V
< V
auxCV2
auxCV1
Concretely, when V
internal PDIM signal on−time is below 10 ms during 20 ms,
the “dimCVmode” signal becomes high and the I
current source is applied to ZCD pin during the
demagnetization time only (this is to allow correct valley
detection). This current sources increases ZCD voltage and
consequently a new regulation point is set for the CV loop.
The ZCD pin resistors set directly the regulation threshold
in normal CV mode and in dimming CV mode.
< V
or when the
ADIM
ADIM(EN)
Valley Lockout
Quasi−Square wave resonant systems have a wide
switching frequency excursion. The switching frequency
increases when the output load decreases or when the input
voltage increases. The switching frequency of such systems
must be limited.
ZCD(dim)
The NCL30486B changes valley as V
decreases and
REFX
as the input voltage increases and as the output current
setpoint is varied during dimming. This limits the frequency
excursion.
By default, when the output current is not dimmed, the
controller operates in the first valley at low line and in the
second valley at high line.
There is an option to have the valley thresholds
incremented by 1 at high line for better I control at
305 V rms.
V
REF(CV) (VauxCV1 * VauxCV2)
(eq. 2)
RZCDL
+
I
ZCD(dim) (VauxCV1 * VREF(CV))
VauxCV1
ǒ Ǔ
(eq. 3)
RZCDU + RZCDL
* 1
VREF(CV)
out
Where:
• R
is the resistor from auxiliary winding to ZCD pin
ZCDU
Table 1. VALLEY SELECTION
V
Voltage for Valley Change
HV_DIV
V
REFX
Value at which the Controller
V
REFX
Value at which the Controller
0
−−LL−−
2.3 V
−−HL−−
5 V
Changes Valley (I
Decreasing)
Changes Valley (I
Increasing)
out
out
st
nd rd
100%
100%
1
2
3
4
5
6
(3 )
90%
75%
60%
45%
80%
65%
50%
35%
nd
rd th
2
(4 )
rd
th th
3
(5 )
th
th th
4
(6 )
th
th th
5
(7 )
25%
0%
35%
0%
FF mode
FF mode
0
−−LL−−
2.3 V
−−HL−−
5 V
Internal V
Voltage for Valley Change
HV_DIV
Zero Crossing Detection Block
the valleys. To avoid such a situation, NCL30486B features
a Time−Out circuit that generates pulses if the voltage on
ZCD pin stays below the 55 mV threshold for 6.5 ms.
The Time−out also acts as a substitute clock for the valley
detection and simulates a missing valley in case of too
damped free oscillations.
The ZCD pin allows detecting when the drain−source
voltage of the power MOSFET reaches a valley.
A valley is detected when the ZCD pin voltage crosses
below the 55 mV internal threshold.
At startup or in case of extremely damped free
oscillations, the ZCD comparator may not be able to detect
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24
NCL30486B
VZCD
VZCD(th)
low
3
4
high
14
12
I
decreases or V
out
in
high
increases
ZCD comp
high
low
15
low
TimeOut
16
17
2nd , 3 rd
high
VVIN
increases
Clock
low
Figure 68. Valley Detection and Time−out Chronograms
If the ZCD pin or the auxiliary winding happen to be
shorted the time−out function would normally make the
controller keep switching and hence lead to improper
regulation of the LED current.
The Under Voltage Protection (UVP) is implemented to
avoid these scenarios: a secondary timer starts counting
10 Hz, depending on power stage phase shift). Because the
loop is slow, the output voltage can reach high value during
startup or during an output load step. It is necessary to limit
the output voltage excursion. For this, the NCL30486B
features a slow OVP and a fast OVP on ZCD pin.
Slow OVP
when the ZCD voltage is below the V
threshold. If
ZCD(short)
If ZCD voltage exceeds V
for 4 consecutive
OVP1
this timer reaches 90 ms, the controller detects a fault and
enters the auto−recovery fault mode.
switching cycles, the controller stops switching during
1.4 ms. The PFC loop is not reset. After 1.4 ms, the
controller initiates a new DRV pulse to refresh ZCD
Minimum Off−time at Startup
At startup, the output voltage reflected on the auxiliary
winding is low. Thus, the voltage on the ZCD pin is very low
and the ZCD comparator might be unable to detect the
valleys. In this condition, setting the DRV latch with the
6.5−ms time−out leads to a continuous conduction mode
operation (CCM).
sampling voltage. If V
is still too high (V
> 115%
ZCD
ZCD
V
), the controller continues to switch with a 1.4 ms
REF(CV)
period. The controller resumes its normal operation when
< 105% V
V
ZCD
.
REF(CV)
During slow OVP, the peak current setpoint is COMP pin
voltage scaled down by a fixed ratio.
To avoid CCM pulses during startup, a minimum off time
Fast OVP
If ZCD voltage exceeds V
for 4 consecutive switching cycles (slow OVP not triggered)
or for 2 switching cycles if the slow OVP has already been
triggered, the controller detects a fault and starts the
auto−recovery fault mode (cf: Fault Management Section)
(typ. 50 ms) is forced when V
< V
during 8 ms.
ZCD
ZCD(short)
(130% of V
)
ZCD(OVP2)
REF(CV)
This minimum off time is also present when the controller
restart after a fault, if V < V
.
ZCD(short)
ZCD
ZCD Over Voltage Protection
Because of the power factor correction, it is necessary to
set the crossover frequency of the CV loop very low (target
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25
NCL30486B
HV
vDD
vVS
CS
RLFF
I CS(offset)
KLFF
Rsense
Q_drv
+
25 ms
BO_NOK
Blanking
−
1 V / 0.9 V
Figure 69. Line Feed−Forward and Brown−out Schematic
Line Feedforward
if a voltage higher than V
is applied to the HV pin
HVBO(on)
The line voltage is sensed by the HV pin and converted
into a current. By adding an external resistor in series
between the sense resistor and the CS pin, a voltage offset
proportional to the line voltage is added to the CS signal. The
offset is applied only during the MOSFET on−time in order
to not influence the detection of the leakage inductance
reset.
and shuts−down if the HV pin voltage decreases and stays
below V for 25 ms typical.
An option with higher brown−out levels is also available
HVBO(off)
(see ordering table and electricals parameters)
Line OVP
In order to protect the power supply in case of too high
input voltage, the NCL30486B features a line over voltage
The offset is always applied even at light load in order to
improve the current regulation at low output load.
protection. When the voltage on HV pin exceeds V
HV(OVP)
the controller stops switching; V hiccups.
CC
Brown−out
When V becomes lower than V
for more
HV
HV(OVP)RST
In order to protect the supply against a very low input
voltage, the controller features a brown−out circuit with a
fixed ON/OFF threshold. The controller is allowed to start
than 340 ms, the controller initiates a clean startup sequence
and re−starts switching.
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26
NCL30486B
VHV
VHV(OVP)
VHV(OVP)RST
t LOVP(blank)
VCC
VCC(on)
VCC(off)
VDRV
Iout
Figure 70. Line OVP Chronograms
Standby Mode
to keep the output voltage regulated (pink curve in
Figure 71).
In order to decrease the power consumption of the
converter when no output load is connected to its output, the
NCL30486B versions features a standby mode.
In standby mode, the current consumption of the
controller is reduced to I
The peak current is frozen to a fixed value V
The regulation of V is based on COMP pin voltage
out
varying between 700 mV to 913 mV.
Standby mode is entered if V
< 895 mV, V
COMP
COMP
(1.7 mA typ.)
decreasing and exit if V
> 913 mV, V
increasing.
CC4
COMP
COMP
(See AND90120 for more details concerning the standby
mode)
CS(STBY)
(27% or below of V
switching frequency, more specifically the dead−time (DT)
) and the controller adjust the
ILIMIT
DT (ms)
t
, 1800
DT(max)SBY2
Standby mode curve
t
, 687
FFend1
t , 640
DT(min)SBY
560
Simplified FF curve for 675 ms DT clamp
t
, 35
FFchg
t
, 2
FF1LL
700
895
913
1.758
250
VCOMP (V)
V
CMP(SBY)
0 5.848
VREFX (mV)
V
FFstart
Figure 71. Dead−time Setpoint as a Function of VCOMP
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27
NCL30486B
Variable Maximum On−time
Around line zero−crossing, the primary inductor slope is
too low to reach the peak current setpoint imposed by the CC
control. The DRV pulse is terminated by the max. on−time.
This creates sudden variation of the on−time and creates
an input current spike (EMI filter inductance responds to
rate of change of current).
Varying the maximum on−time with VREFX helps
decreasing this spike over the output load range. Figure 72
and Figure 73 shows the maximum on−time curve as a
function of VREFX.
T
(ms)
on,MAX
20
18
16
14
12
10
7
0.15
0.18 0.25
0.5
0.6
0.8
0.9
1
V
REFX
(V)
0.35
0.45
0.65
0.75
Figure 72. Variable Maximum On−time, 20−ms Option
T
(ms)
on,MAX
20
18
16
14
12
11
10
9
8
7
0.15
0.18 0.25 0.35
0.5
0.6
0.65
0.8
0.9
1
V
REFX
(V)
0.45
0.75
Figure 73. Variable Maximum On−time, 14−ms Option
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28
NCL30486B
Protections
• V Over Voltage Protection
CC
The circuit incorporates a large variety of protections to
make the LED driver very rugged.
Among them, we can list:
The circuit stops generating pulses if the V exceeds
CC
V
and enters auto−recovery mode. This feature
CC(OVP)
protects the circuit if output LEDs happen to be
disconnected.
• Fault of the GND connection
If the GND pin is properly connected, the supply current
• ZCD fast OVP
drawn from the positive terminal of the V capacitor,
flows out of the GND pin to return to the negative terminal
CC
If ZCD voltage exceeds V
for 4 consecutive
ZCD(OVP2)
switching cycles (slow OVP not triggered) or for 2
switching cycles if the slow OVP has already been
triggered, the controller detects a fault and enters
auto−recovery mode (4 s operation interruption between
active bursts).
of the V capacitor. If the GND pin is not connected, the
CC
circuit ESD diodes offer another return path. The
accidental non connection of the GND pin can hence be
detected by detecting that one of this ESD diode is
conducting. Practically, the ESD diode of CS pin is
monitored. If such a fault is detected for 200 ms, the circuit
stops generating DRV pin.
• Die Over Temperature (TSD)
The circuit stops operating if the junction temperature
(T ) exceeds 150°C typically. The controller remains off
J
• Output short circuit situation (Output Under Voltage
until T goes below nearly 130°C.
J
Protection)
• Brown−Out Protection (BO)
Overload is detected by monitoring the ZCD pin voltage:
if it remains below V
circuit is detected and the circuit stops generating pulses
for 4 s. When this 4 s delay has elapsed, the circuit
attempts to restart.
The circuit prevents operation when the line voltage is too
low to avoid an excessive stress of the LED driver.
Operation resumes as soon as the line voltage is high
for 90 ms, an output short
ZCD(short)
enough and V is higher than V
.
CC
CC(on)
• CS pin short to ground
• ZCD pin incorrect connection:
The CS pin is checked at start−up (cold start−up or after
♦ If the ZCD pin grounded, the circuit will detect an
output short circuit situation when 90 ms delay has
elapsed.
a brown−out event). A current source (I
) is applied
cs(short)
to the pin and no DRV pulse is generated until the CS pin
exceeds V . I and V are 500 mA and
cs(low) cs(short)
cs(low)
♦ A 200 kW resistor pulls down the ZCD pin so that
the output short circuit detection trips if the ZCD pin
is not connected (floating).
60 mV typically (V rising). The typical minimum
CS
impedance to be placed on the CS pin for operation is then
120 W. In practice, it is recommended to place more than
250W to take into account possible parametric deviations.
Also, along the circuit operation, the CS pin could happen
to be grounded. If it is grounded, the MOSFET
conduction time is limited by the 20 ms maximum
on−time. If such an event occurs, a new pin impedance
test is made.
• Winding or Output Diode Short Circuit protection
The circuit detects this failure when 4 consecutive DRV
pulses occur within which the CS pin voltage exceeds
(V
= 140% x V
). In this case, the controller
CS(stop)
ILIM
enters auto−recovery mode (4−s operation interruption
between active bursts).
• Line overvoltage protection
(see Line OVP section)
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29
NCL30486B
ORDERING TABLE OPTION
Valley
Transition
from LL to HL Standby Mode
Line Range
Detector
Dead−time Clamp
V
Max. On−time
20 ms 14 ms
ZCD Blanking
REF
st
st
OPN #
NCL30486_ _
1.4 ms 200 mV 333 mV
1
to
1
to
On
Off
On
Off
250 ms 687 ms
1 ms
1.5 ms
nd
rd
2
3
NCL30486B1
NCL30486B2
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Frozen Peak Current
During Standby Mode
Dimming
Line OVP
V
Brown−out Levels
Dimming Clamp
Curve
dimCV Mode
CS(SBY)
OPN #
NCL30486_ _
On
Off
380 mV 330 mV 280 mV On: 108 V On: 138 V
Off: 98 V Off: 129 V
0%
1%
5%
8%
Linear Square
On
Off
NCL30486B1
NCL30486B2
x
x
x
x
x
x
x
x
x
x
x
x
ORDERING INFORMATION
Device
†
Marking
L30486B1
L30486B2
Package Type
Shipping
NCL30486B1
SOIC9 – P7 COMP VHV PBFH
2500 / Tape & Reel
(Pb−Free)
NCL30486B2
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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30
NCL30486B
PACKAGE DIMENSIONS
SOIC−9 NB
CASE 751BP
ISSUE A
2X
NOTES:
0.10
C A-B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.10mm TOTAL IN EXCESS OF ’b’
AT MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15mm
PER SIDE. DIMENSIONS D AND E ARE DE-
TERMINED AT DATUM F.
D
H
A
2X
0.20
C
4 TIPS
0.10 C A-B
F
10
6
E
1
5. DIMENSIONS A AND B ARE TO BE DETERM-
INED AT DATUM F.
6. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
5
L2
A3
SEATING
PLANE
L
C
0.20
C
9X b
DETAIL A
B
5 TIPS
M
MILLIMETERS
0.25
C A-B D
DIM MIN
MAX
1.75
0.25
0.25
0.51
5.00
4.00
TOP VIEW
A
A1
A3
b
D
E
1.25
0.10
0.17
0.31
4.80
3.80
9X
h
X 45
_
0.10
C
0.10
C
M
e
1.00 BSC
H
h
L
5.80
0.37 REF
0.40
6.20
1.27
A
DETAIL A
e
SIDE VIEW
A1
SEATING
PLANE
L2
M
0.25 BSC
C
0
8
_
_
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
1.00
PITCH
9X
0.58
6.50
1
9X
1.18
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy
and soldering details, please download the
onsemi Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
31
NCL30486B
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
TECHNICAL SUPPORT
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Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
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Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
onsemi Website: www.onsemi.com
◊
www.onsemi.com
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