NCP1399BADR2G [ONSEMI]

High Performance Current Mode Resonant Controller;
NCP1399BADR2G
型号: NCP1399BADR2G
厂家: ONSEMI    ONSEMI
描述:

High Performance Current Mode Resonant Controller

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中文:  中文翻译
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NCP1399 Series  
High Performance Current  
Mode Resonant Controller  
with Integrated High-  
Voltage Drivers  
www.onsemi.com  
The NCP1399 is a high performance current mode controller for half  
bridge resonant converters. This controller implements 600 V gate  
drivers, simplifying layout and reducing external component count. The  
built−in Brown−Out input function eases implementation of the  
controller in all applications. In applications where a PFC front stage is  
needed, the NCP1399 features a dedicated output to drive the PFC  
controller. This feature together with dedicated skip mode technique  
further improves light load efficiency of the whole application. The  
NCP1399 provides a suite of protection features allowing safe operation  
in any application. This includes: overload protection, over−current  
protection to prevent hard switching cycles, brown−out detection, open  
optocoupler detection, automatic dead−time adjust, overvoltage (OVP)  
and overtemperature (OTP) protections.  
16  
1
SOIC−16 NB  
(LESS PINS 2 AND 13)  
D SUFFIX  
CASE 751DU  
MARKING DIAGRAM  
16  
NCP1399xy  
AWLYWWG  
Features  
High−Frequency Operation from 20 kHz up to 750 kHz  
Current Mode Control Scheme  
1
NCP1399= Specific Device Code  
Automatic Dead−time with Maximum Dead−time Clamp  
Dedicated Startup Sequence for Fast Resonant Tank Stabilization  
Skip Mode Operation for Improved Light Load Efficiency  
Off−mode Operation for Extremely Low No−load Consumption  
Latched or Auto−Recovery Overload Protection  
Latched or Auto−Recovery Output Short Circuit Protection  
Latched Input for Severe Fault Conditions, e.g. OVP or OTP  
Out of Resonance Switching Protection  
x
y
A
WL  
Y
= A or B  
= A, B, C, F, G H, I, J, K, L, M, N, P  
= Assembly Location  
= Wafer Lot  
= Year  
= Work Week  
WW  
G
= Pb−Free Package  
PIN CONNECTIONS  
Open Feedback Loop Protection  
1
HV  
16 VBOOT  
15 HB  
Precise Brown−Out Protection  
PFC Stage Operation Control According to Load Conditions  
Startup Current Source with Extremely Low Leakage Current  
Dynamic Self−Supply (DSS) Operation in Off−mode or Fault Modes  
Pin to Adjacent Pin / Open Pin Fail Safe  
14  
3
4
5
6
VBULK/PFCFB  
SKIP/REM  
LLCFB  
MUPPER  
12 MLOWER  
11  
LLCCS  
GND  
10 VCC  
PFCMODE  
These are Pb−Free Devices  
OVP/OTP  
PON/OFF  
7
8
Typical Applications  
9
Adapters and Offline Battery Chargers  
Flat Panel Display Power Converters  
Computing Power Supplies  
(Top View)  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 12 of  
Industrial and Medical Power Sources  
this data sheet.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
September, 2017 − Rev. 13  
NCP1399/D  
NCP1399 Series  
Figure 1. Typical Application Example without PFC Stage − WLLC Design (Active OFF off−mode)  
Figure 2. Typical Application Example with PFC Stage (Active OFF off−mode)  
www.onsemi.com  
2
NCP1399 Series  
Figure 3. Typical Application Example with PFC Stage (Active ON off−mode)  
PIN FUNCTION DESCRIPTION  
Pin No.  
Pin Name  
Function  
Pin Description  
1
HV  
High*voltage startup  
current source input  
Connects to rectified AC line or to bulk capacitor to perform functions of  
Start*up Current Source and Dynamic Self*Supply  
2
3
NC  
Not connected  
Increases the creepage distance  
VBULK /  
PFC FB  
Bulk voltage monitoring input Receives divided bulk voltage to perform Brown−out protection.  
4
SKIP/REM  
Skip threshold adjust /  
Off−mode control input  
Sets the skip in threshold via a resistor connected to ground – version  
NCP1399Ay. Activates off−mode (or Standby) when pulled−up by external  
auxiliary voltage source / deactivates off−mode when pull down by external  
off−mode control optocoupler – version NCP1399By.  
5
6
7
LLC FB  
LLC CS  
LLC feedback input  
Defines operating frequency based on given load conditions. Activates skip  
mode operation under light load conditions. Activates off−mode operation for  
NCP1399Ay version.  
LLC current sense input  
Senses divided resonant capacitor voltage to perform on−time modulation, out  
of resonant switching protection, over−current protection and secondary side  
short circuit protection.  
OTP / OVP  
Over−temperature and  
over−voltage protection input  
Implements over−temperature and over−voltage protection on single pin.  
8
9
P ON/OFF  
PFC turn−off FB level adjust Adjusts the FB pin to a level below which the PFC stage operation is disabled.  
PFC MODE  
PFC and external HV  
switch control output  
Provides supply voltage for PFC front stage controller and/or enables Vbulk  
sensing network HV switch.  
10  
11  
VCC  
GND  
Supplies the controller  
Analog ground  
The controller accepts up to 20 V on VCC pin  
Common ground connection for adjust components, sensing networks and  
DRV outputs.  
12  
13  
14  
15  
16  
MLOWER  
NC  
Low side driver output  
Not connected  
Drives the lower side MOSFET  
Increases the creepage distance  
Drives the higher side MOSFET  
MUPPER  
HB  
High side driver output  
Half*bridge connection  
Bootstrap pin  
Connects to the half*bridge output.  
The floating VCC supply for the upper stage  
VBOOT  
www.onsemi.com  
3
NCP1399 Series  
Figure 4. Internal Circuit Architecture  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
V
HV Startup Current Source HV Pin Voltage (Pin 1)  
VBULK/PFC FB Pin Voltage (Pin3)  
V
HV  
−0.3 to 600  
−0.3 to 5.5  
−0.3 to 5.5  
−0.3 to 10  
−0.3 to 5.5  
−5 to 5  
V
V
BULK/PFC FB  
SKIP/REM Pin Voltage (Pin 4) NCP1399Ay Revision Only  
SKIP/REM Pin Voltage (Pin 4) NCP1399By Revision Only  
LLC FB Pin Voltage (Pin 5)  
V
V
SKIP/REM  
V
V
SKIP/REM  
V
FB  
V
LLC CS Pin Voltage (Pin 6)  
V
CS  
V
PFC MODE Pin Output Voltage (Pin 9)  
VCC Pin Voltage (Pin 10)  
V
−0.3 to V + 0.3  
V
PFC MODE  
CC  
V
CC  
−0.3 to 20  
V
Low Side Driver Output Voltage (Pin 12)  
High Side Driver Output Voltage (Pin 14)  
V
−0.3 to V + 0.3  
V
DRV_MLOWER  
CC  
V
V
HB  
– 0.3 to  
V
DRV_MUPPER  
V
BOOT  
+ 0.3  
High Side Offset Voltage (Pin 15)  
V
V
V
−20 to  
V
V
HB  
Boot  
+0.3  
Boot  
High Side Floating Supply Voltage (Pin 16)  
T = −40°C to +125°C  
J
V
BOOT  
−0.3 to 620  
−0.3 to 618  
J
T = −55°C to −40°C  
High Side Floating Supply Voltage (Pin 15 and 16)  
Allowable Output Slew Rate on HB Pin (Pin 15)  
OVP/OTP Pin Voltage (Pin 7)  
V
−0.3 to 20.0  
50  
V
V/ns  
V
Boot–VHB  
dV/dt  
max  
V
−0.3 to 5.5  
−0.3 to 5.5  
−55 to 150  
−55 to 150  
130  
OVP/OTP  
P ON/OFF  
P ON/OFF Pin Voltage (Pin 8)  
V
V
Junction Temperature  
T
J
°C  
Storage Temperature  
T
STG  
°C  
Thermal Resistance Junction−to−air  
R
°C/W  
kV  
θ
JA  
Human Body Model ESD Capability per JEDEC JESD22−A114F (except HV Pin – Pin 1)  
Charged−Device Model ESD Capability per JEDEC JESD22−C101E  
4.5  
1
kV  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78.  
www.onsemi.com  
4
NCP1399 Series  
ELECTRICAL CHARACTERISTICS  
(For typical values T = 25°C, for min/max values T = −40°C to +125°C, V = 12 V unless otherwise noted.)  
J
J
CC  
Symbol  
HV Startup Current Source  
Rating  
Pin  
Min  
Typ  
Max  
Unit  
V
Minimum voltage for current source operation  
(V = V −0.5 V, I drops to 95 %)  
1
1
60  
60  
V
V
HV_MIN1  
CC  
CC_ON  
START2  
V
Minimum voltage for current source operation  
(V = V −0.5 V, I drops to 5 mA)  
HV_MIN2  
CC  
CC_ON  
START2  
I
I
Current flowing out of V pin (V = 0 V)  
1, 10  
1, 10  
1
0.2  
6
0.5  
9
0.8  
13  
10  
8
mA  
mA  
mA  
START1  
CC  
CC  
Current flowing out of V pin (V = V −0.5 V)  
CC_ON  
START2  
CC  
CC  
I
Off−state leakage current (V = 500 V, V = 15 V)  
START_OFF  
HV  
CC  
I
HV pin current when off−mode operation is active  
(V = 400 V)  
1
mA  
HV_OFF−MODE  
HV  
Supply Section  
V
Turn−on threshold level, V going up  
10  
10  
15.3  
11.5  
15.8  
12.0  
16.3  
12.3  
V
V
CC_ON  
CC_ON  
CC  
V
Turn−on threshold level, V going up  
CC  
(NCP1399AL, NCP1399AM)  
V
Minimum operating voltage after turn−on  
10  
10  
9.0  
5.8  
9.5  
6.6  
10  
7.2  
V
V
CC_OFF  
V
V
CC  
V
CC  
level at which the internal logic gets reset  
CC_RESET  
CC_INHIBIT  
V
level for I  
to I  
transition  
10  
0.40  
100  
10  
0.80  
125  
27  
1.25  
150  
40  
V
START1  
START2  
V
Delay to generate DRVs pulses after V is reached  
CC_ON  
10  
ms  
mA  
CC_ON_BLANK  
CC_OFF−MODE  
I
Controller supply current in off−mode,  
10, 11  
V
CC  
= V  
− 0.2 V (except NCP1399AG)  
CC_ON  
I
Controller supply current in skip−mode, V = 15 V  
10, 11  
mA  
CC_SKIP−MODE  
CC  
(NCP1399AA, BA, AC, AH, AI, AK, AM, AN, AP)  
(NCP1399AF, NCP1399AG, NCP1399AJ)  
(NCP1399AL)  
580  
500  
500  
750  
670  
710  
900  
820  
890  
I
Controller supply current in latch−off mode,  
10, 11  
10, 11  
10, 11  
330  
300  
4.0  
490  
490  
5.4  
600  
600  
7.0  
mA  
mA  
CC_LATCH  
V
CC  
= V  
− 0.2 V (except NCP1399AI, AN, AP)  
CC_ON  
I
Controller supply current in auto−recovery mode,  
= V − 0.2 V (except NCP1399AF)  
CC_AUTOREC  
V
CC  
CC_ON  
I
Controller supply current in normal operation,  
= 100 kHz, C = 1 nF, V = 15 V  
mA  
CC_OPERATION  
f
sw  
load  
CC  
Bootstrap Section  
V
Startup voltage on the floating section (Note 5)  
Cutoff voltage on the floating section  
16, 15  
16, 15  
16, 15  
16, 15  
8
9
10  
9.0  
V
V
BOOT_ON  
V
7.2  
30  
8.2  
75  
BOOT_OFF  
I
I
Upper driver consumption, no DRV pulses  
130  
2.00  
mA  
mA  
BOOT1  
BOOT2  
Upper driver consumption, C  
= 1 nF between Pins 13 &  
1.30  
1.65  
load  
15 f = 100 kHz, HB connected to GND  
sw  
HB Discharger  
I
HB sink current capability V = 30 V  
15  
15  
15  
5
1
mA  
mA  
V
DISCHARGE1  
DISCHARGE2  
HB  
I
HB sink current capability V = V  
HB  
HB_MIN  
V
HB voltage @ I  
changes from 2 to 0 mA  
10  
HB_MIN  
DISCHARGE  
Remote Input – NCP1399By  
Remote pin voltage below which off−mode is deactivated  
(V going down)  
V
4
4
1.0  
7.2  
1.5  
8.0  
2.0  
8.8  
V
V
REM_ON  
REM  
V
Remote pin voltage above which off−mode is activated  
(V going up)  
REM_OFF  
REM  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2. The NCP1399Ay version has skip adjustable externally.  
3. Guaranteed by design.  
4. Minimal impedance on P ON/OFF pin is 1 kW  
5. Minimal resistance connected in series with bootstrap diode is 3.3 W  
www.onsemi.com  
5
NCP1399 Series  
ELECTRICAL CHARACTERISTICS  
(For typical values T = 25°C, for min/max values T = −40°C to +125°C, V = 12 V unless otherwise noted.)  
J
J
CC  
Symbol  
Remote Input – NCP1399By  
Remote timer duration  
Remote input leakage current (V  
Rating  
Pin  
Min  
Typ  
Max  
Unit  
t
4
4
4
80  
100  
0.02  
120  
1.00  
7
ms  
mA  
kW  
REM_TIMER  
I
= 10 V)  
REM  
REM_LEAK  
R
Internal remote pull down switch resistance (V  
= 8 V)  
REM  
3
SW_REM  
Remote Control – NCP1399Ay (i.e. Off−mode is Sensed via FB Pin, except NCP1399AG)  
V
FB pin voltage above which off−mode is deactivated  
(V going up)  
FB  
5
5
5
1.5  
0.36  
1.0  
2.0  
0.40  
2.3  
2.5  
0.44  
4.0  
V
V
FB_REM_ON  
V
FB pin voltage below which off−mode is activated  
(V going down)  
FB  
FB_REM_OFF  
I
Pull−up FB pin bias current during off−mode  
mA  
FB_REM_BIAS  
Driver Outputs  
t
Output voltage rise−time @  
C = 1 nF, 10−90% of output signal  
L
12, 14  
12, 14  
20  
5
45  
30  
80  
50  
ns  
ns  
r
t
Output voltage fall−time @  
f
C = 1 nF, 10−90% of output signal  
L
R
Source resistance  
12, 14  
12, 14  
12, 14  
4
1
16  
5
32  
11  
W
W
A
OH  
R
Sink resistance  
OL  
DRVSOURCE  
I
Output high short circuit pulsed current  
0.5  
V
DRV  
= 0 V, PW 10 ms  
I
Output high short circuit pulsed current  
= VCC, PW 10 ms  
12, 14  
1
5
A
DRVSINK  
V
DRV  
I
Leakage current on high voltage pins to GND  
14, 15, 16  
mA  
HV_LEAK  
Dead−time Generation  
t
Maximum Dead−time value if no dV/dt falling/rising edge is  
received  
12, 14  
720  
800  
8
880  
ns  
DEAD_TIME_MAX  
N
Number of DT_MAX events to enters IC into fault  
(NCP1399AA, NCP1399BA, NCP1399AH, NCP1399AK,  
NCP1399AL)  
12, 14, 16  
DT_MAX  
Number of DT_MAX events to enters IC into fault  
(NCP1399AC, NCP1399AF, NCP1399AG, NCP1399AI,  
NCP1399AJ, NCP1399AM, NCP1399AN, NCP1399AP)  
12, 14, 16  
16  
dV/dt Detector  
P
Positive slew rate on V  
dead−time end is generated  
pin above which automatic  
16  
16  
210  
210  
V/ms  
V/ms  
dV/dt_th  
BOOT  
N
Negative slew rate on V  
pin above which automatic  
dV/dt_th  
BOOT  
dead−time end is generated  
PFC MODE Output and P ON/OFF Adjust  
V
V
PFC MODE output voltage when V < V  
P ON/OFF  
(sink 1 mA current from PFC MODE output)  
9
9
5.75  
6.00  
6.25  
V
V
PFC_M_BO  
PFC_M_ON  
PFC_M_LIM  
FB  
PFC MODE output voltage when V > V  
V
0.4  
FB  
P ON/OFF  
CC  
(sink 10 mA current from PFC MODE output)  
I
PFC MODE output current limit (V < 2 V)  
9
0.7  
9.4  
1.2  
1.85  
10.9  
mA  
s
PFC MODE  
t
Delay to transition PFC MODE from V  
to  
5, 8, 9  
P ON/OFF_TIMER  
PFC_M_ON  
after V drops below V  
FB P ON/OFF  
V
PFC_M_BO  
I
Pull−up current source (Note 4)  
8
18  
20  
22  
mA  
P ON/OFF  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2. The NCP1399Ay version has skip adjustable externally.  
3. Guaranteed by design.  
4. Minimal impedance on P ON/OFF pin is 1 kW  
5. Minimal resistance connected in series with bootstrap diode is 3.3 W  
www.onsemi.com  
6
NCP1399 Series  
ELECTRICAL CHARACTERISTICS  
(For typical values T = 25°C, for min/max values T = −40°C to +125°C, V = 12 V unless otherwise noted.)  
J
J
CC  
Symbol  
PFC MODE Output and P ON/OFF Adjust  
Rating  
Pin  
Min  
Typ  
Max  
Unit  
P ON/OFF  
P ON/OFF comparator hysteresis – percentage level of P  
ON/OFF pin voltage  
5, 8, 9  
80  
100  
120  
%
HYST  
OVP/OTP  
V
V
OVP threshold voltage (V  
OTP threshold voltage (V  
going up)  
7
7
7
2.35  
0.76  
90  
2.50  
0.80  
95  
2.65  
0.84  
100  
V
V
OVP  
OTP  
OTP  
OVP/OTP  
going down)  
OVP/OTP  
I
OTP/OVP pin source current for external NTC –  
during normal operation  
mA  
I
OTP/OVP pin source current for external NTC –  
during startup  
7
180  
190  
200  
mA  
OTP_BOOST  
t
Internal filter for OVP comparator  
Internal filter for OTP comparator  
7
7
7
32  
200  
7.3  
37  
330  
8.0  
44  
500  
8.7  
ms  
ms  
OVP_FILTER  
t
OTP_FILTER  
t
Blanking time for OTP input during startup (NCP1399AA,  
NCP1399BA, NCP1399AK)  
ms  
BLANK_OTP  
Blanking time for OTP input during startup (NCP1399AC,  
NCP1399AF, NCP1399AG, NCP1399AH, NCP1399AI,  
NCP1399AJ, NCP1399AL, NCP1399AM, NCP1399AN,  
NCP1399AP)  
7
14  
16  
18  
ms  
V
OVP/OTP pin clamping voltage @ I  
OVP/OTP pin clamping voltage @ I  
= 0 mA  
= 1 mA  
7
7
1.0  
1.8  
1.2  
2.4  
1.4  
3.0  
V
V
CLAMP_OVP/OTP_1  
OVP/OTP  
OVP/OTP  
V
CLAMP_ OVP/OTP_2  
Start−up Sequence Parameters  
t
Maximum on−time clamp (NCP1399AA, NCP1399BA,  
NCP1399AK, NCP1399AL)  
12, 14  
12, 14  
7.3  
7.7  
8.4  
ms  
ms  
TON_MAX  
Maximum on−time clamp (NCP1399AC, NCP1399AG,  
NCP1399AI, NCP1399AM, NCP1399AN, NCP1399AP)  
10.6  
11.2  
12.1  
Maximum on−time clamp (NCP1399AF, NCP1399AJ)  
Maximum on−time clamp (NCP1399AH)  
12, 14  
12, 14  
12  
15.2  
8.8  
16.3  
9.5  
17.8  
10.5  
5.4  
ms  
ms  
ms  
t
t
Initial Mlower DRV on−time duration (NCP1399AA,  
NCP1399BA, NCP1399AC, NCP1399AG, NCP1399AH,  
NCP1399AI, NCP1399AK, NCP1399AL, NCP1399AM,  
NCP1399AN, NCP1399AP)  
4.7  
4.9  
1st_MLOWER_TON  
Initial Mlower DRV on−time duration (NCP1399AF,  
NCP1399AJ)  
12  
9.3  
10  
11  
ms  
1st_MLOWER_TON  
t
Initial Mupper DRV on−time duration (NCP1399AM)  
14  
14  
0.44  
0.72  
0.50  
0.79  
0.57  
0.88  
ms  
ms  
1st_MUPPER_TON  
t
Initial Mupper DRV on−time duration (NCP1399AA,  
NCP1399BA, NCP1399AC, NCP1399AG, NCP1399AH,  
NCP1399AI, NCP1399AK, NCP1399AL, NCP1399AN,  
NCP1399AP)  
1st_MUPPER_TON  
t
Initial Mupper DRV on−time duration (NCP1399AF, NCP1399AJ)  
14  
0.99  
17  
1.10  
20  
1.21  
22  
ms  
1st_MUPPER_TON  
t
On−time period increment during soft−start (NCP1399AA,  
NCP1399BA, NCP1399AC, NCP1399AG, NCP1399AH,  
NCP1399AI, NCP1399AK, NCP1399AL, NCP1399AM,  
NCP1399AN, NCP1399AP)  
12, 14  
ns  
SS_INCREMENT  
t
On−time period increment during soft−start (NCP1399AF,  
NCP1399AJ)  
12, 14  
75  
80  
88  
ns  
SS_INCREMENT  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2. The NCP1399Ay version has skip adjustable externally.  
3. Guaranteed by design.  
4. Minimal impedance on P ON/OFF pin is 1 kW  
5. Minimal resistance connected in series with bootstrap diode is 3.3 W  
www.onsemi.com  
7
NCP1399 Series  
ELECTRICAL CHARACTERISTICS  
(For typical values T = 25°C, for min/max values T = −40°C to +125°C, V = 12 V unless otherwise noted.)  
J
J
CC  
Symbol  
Start−up Sequence Parameters  
Rating  
Pin  
Min  
Typ  
Max  
Unit  
K
Soft−Start increment division ratio (NCP1399AA,  
NCP1399BA, NCP1399AK)  
12, 14  
4
SS_INCREMENT  
Soft−Start increment division ratio (NCP1399AL)  
Soft−Start increment division ratio (NCP1399AC,  
12, 14  
12, 14  
2
8
NCP1399AF, NCP1399AG, NCP1399AH, Ncp1399AI,  
NCP1399AJ, NCP1399AM, NCP1399AN, NCP1399AP)  
t
Time duration to restart IC if start−up phase is not finished  
12, 14  
0.45  
0.50  
0.55  
ms  
WATCHDOG  
Feedback Section  
R
Internal pull−up resistor on FB pin  
5
5
5
5
15  
18  
25  
kW  
FB  
FB  
K
V
FB  
to internal current set point division ratio  
1.92  
4.60  
4.4  
2.00  
4.95  
4.6  
2.08  
5.30  
4.8  
V
Internal voltage reference on the FB pin  
V
FB_REF  
V
Internal clamp on FB input of On−time comparator referred  
to external FB pin voltage  
V
FB_CLAMP  
V
Feedback voltage thresholds to enters in skip mode for  
NCP1399By version (Note 2)  
5
5
0.44  
130  
0.50  
160  
0.56  
200  
V
FB_SKIP_IN  
V
mV  
Skip comparator hysteresis (NCP1399AA, NCP1399BA,  
NCP1399AC, NCP1399AG, NCP1399AH, NCP1399AK,  
NCP1399AM, NCP1399AP)  
FB_SKIP_HYST  
Skip comparator hysteresis (NCP1399AF, NCP1399AJ,  
NCP1399AL)  
5
105  
140  
175  
Skip comparator hysteresis (NCP1399AI, NCP1399AN)  
5
0
23  
50  
st  
t
On−time duration of 1 Mlower pulse when FB cross  
5, 12  
0.95  
1.05  
1.15  
ms  
ms  
1st_MLOWER_SKIP  
V
+ V  
threshold (NCP1399AA,  
FB_SKIP_IN  
FB_SKIP_HYST  
NCP1399BA, NCP1399AK, NCP1399AL)  
st  
On−time duration of 1 Mlower pulse when FB cross  
5, 12  
5, 12  
1.8  
1.9  
2.1  
V
+ V  
threshold (NCP1399AC,  
FB_SKIP_IN  
FB_SKIP_HYST  
NCP1399AG, NCP1399AI, NCP1399AM, NCP1399AN,  
NCP1399AP)  
st  
On−time duration of 1 Mlower pulse when FB cross  
1.08  
1.20  
1.32  
ms  
V
+ V  
threshold (NCP1399AF,  
FB_SKIP_IN  
FB_SKIP_HYST  
NCP1399AJ)  
st  
On−time duration of 1 Mlower pulse when FB cross  
5, 12  
2.1  
2.4  
2.7  
ms  
V
+ V  
threshold (NCP1399AH)  
FB_SKIP_IN  
FB_SKIP_HYST  
st  
V
Internal FB level reduction during 1 Mupper pulse when FB  
5, 6, 14  
150  
mV  
1st_MUPPER_SKIP  
cross V  
+ V  
threshold (NCP1399AA,  
FB_SKIP_IN  
FB_SKIP_HYST  
NCP1399BA, NCP1399AC, NCP1399AG, NCP1399AI,  
NCP1399AK, NCP1399AL, NCP1399AM, NCP1399AN,  
NCP1399AP) (Note 3)  
st  
Internal FB level reduction during 1 Mupper pulse when FB  
5, 6, 14  
5, 6, 14  
100  
0
mV  
mV  
cross V  
+ V  
threshold (NCP1399AF,  
FB_SKIP_IN  
FB_SKIP_HYST  
NCP1399AJ) (Note 3)  
st  
FB_SKIP_HYST  
Internal FB level reduction during 1 Mupper pulse when FB  
cross V + V threshold  
FB_SKIP_IN  
(NCP1399AH) (Note 3)  
Skip Input – NCP1399Ay version  
Internal Skip pin current source  
I
4
4
48  
50  
52  
10  
mA  
SKIP  
C
Maximum loading capacitance for skip pin voltage filtering  
(Note 3)  
nF  
SKIP_LOAD_MAX  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2. The NCP1399Ay version has skip adjustable externally.  
3. Guaranteed by design.  
4. Minimal impedance on P ON/OFF pin is 1 kW  
5. Minimal resistance connected in series with bootstrap diode is 3.3 W  
www.onsemi.com  
8
NCP1399 Series  
ELECTRICAL CHARACTERISTICS  
(For typical values T = 25°C, for min/max values T = −40°C to +125°C, V = 12 V unless otherwise noted.)  
J
J
CC  
Symbol  
Current Sense Input Section  
On−time comparator delay to Mupper driver turn off  
Rating  
Pin  
Min  
Typ  
Max  
Unit  
t
5, 6  
250  
ns  
pd_CS  
V
FB  
= 2.5 V, V goes up from –2.5 V to 2.5 V with rising  
CS  
edge of 100 ns  
I
Current sense input leakage current for V  
=
3 V  
6
6
1
mA  
CS_LEAKAGE  
CS  
V
Current sense input offset voltage (NCP1399AA,  
160  
200  
240  
mV  
CS_OFFSET  
NCP1399BA, NCP1399AC, NCP1399AG, NCP1399AH,  
NCP1399AI, NCP1399AK, NCP1399AL, NCP1399AM,  
NCP1399AN, NCP1399AP)  
Current sense input offset voltage (NCP1399AF, NCP1399AJ)  
Leading edge blanking time of the on−time comparator output  
6
110  
360  
150  
440  
190  
540  
mV  
ns  
t
5, 6, 14  
LEB  
Faults and Auto−Recovery Timer  
t
FB fault timer duration (NCP1399AA, NCP1399BA,  
NCP1399AK, NCP1399AL)  
160  
80  
200  
100  
240  
120  
ms  
ms  
FB_FAULT_TIMER  
FB fault timer duration (NCP1399AC, NCP1399AF,  
NCP1399AG, NCP1399AI, NCP1399AJ, NCP1399AM,  
NCP1399AN, NCP1399AP)  
FB fault timer duration (NCP1399AH)  
5
6
240  
300  
1000  
4.7  
5
360  
ms  
N
Number of DRV pulses to confirm FB fault  
FB voltage when FB fault is detected  
FB_FAULT_COUNTER  
V
4.5  
4.9  
V
FB_FAULT  
CS_FAULT_COUNTER  
N
Number of CS_fault cmp. pulses to confirm CS fault  
V
CS voltage when CS fault is detected (NCP1399AA,  
NCP1399BA, NCP1399AC, NCP1399AF, NCP1399AH,  
NCP1399AI, NCP1399AK, NCP1399AL, NCP1399AM,  
NCP1399AN, NCP1399AP)  
V
CS_FAULT  
2.5  
3.2  
2.7  
3.4  
2.9  
3.6  
(NCP1399AG)  
(NCP1399AJ)  
1.85  
2.00  
2.15  
t
s
Auto−recovery duration, common timer for all fault condition  
(NCP1399AA, NCP1399BA, NCP1399AC, NCP1399AG,  
NCP1399AH, NCP1399AJ, NCP1399AK, NCP1399AL,  
NCP1399AM, NCP1399AP)  
0.8  
1
1.2  
A−REC_TIMER  
Auto−recovery duration, common timer for all fault condition  
(NCP1399AI, NCP1399AN)  
1.6  
1.9  
2.4  
Brown−Out Protection  
V
Brown−out turn−off threshold  
3
3
3
3
3
0.965  
4.3  
5
1.000  
5.0  
12  
1.035  
5.4  
V
BO  
I
Brown−out hysteresis current, V  
< V  
mA  
mV  
mA  
ms  
BO  
VBULK/PFC_FB  
BO  
V
Brown*Out comparator hysteresis  
Brown*Out input bias current  
BO filter duration  
25  
BO_HYST  
BO_BIAS  
I
0.05  
30  
t
10  
20  
BO_FILTR  
Ramp Compensation  
RC  
Ramp compensation gain (NCP1399AA, NCP1399BA,  
NCP1399AC, NCP1399AF NCP1399AG, NCP1399AK,  
NCP1399AM)  
mV/ms  
GAIN  
58  
82  
108  
Ramp compensation gain (NCP1399AI, NCP1399AN)  
Ramp compensation gain (NCP1399AJ)  
Ramp compensation gain (NCP1399AH)  
Ramp compensation gain (NCP1399AL)  
82  
92  
107  
110  
125  
149  
166  
131  
150  
168  
185  
116  
t
Ramp compensation time shift  
0.6  
ms  
RC_SHIFT  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2. The NCP1399Ay version has skip adjustable externally.  
3. Guaranteed by design.  
4. Minimal impedance on P ON/OFF pin is 1 kW  
5. Minimal resistance connected in series with bootstrap diode is 3.3 W  
www.onsemi.com  
9
NCP1399 Series  
ELECTRICAL CHARACTERISTICS  
(For typical values T = 25°C, for min/max values T = −40°C to +125°C, V = 12 V unless otherwise noted.)  
J
J
CC  
Symbol  
Temperature Shutdown Protection  
Rating  
Pin  
Min  
Typ  
Max  
Unit  
T
TSD  
Temperature shutdown T going up (NCP1399AA,  
NCP1399BA, NCP1399AH, NCP1399AK)  
124  
137  
°C  
°C  
J
Temperature shutdown T going up (NCP1399AC,  
J
NCP1399AF, NCP1399AG, NCP1399AI, NCP1399AJ,  
NCP1399AL, NCP1399AM, NCP1399AN, NCP1399AP)  
T
Temperature shutdown hysteresis  
30  
°C  
TSD_HYST  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2. The NCP1399Ay version has skip adjustable externally.  
3. Guaranteed by design.  
4. Minimal impedance on P ON/OFF pin is 1 kW  
5. Minimal resistance connected in series with bootstrap diode is 3.3 W  
www.onsemi.com  
10  
NCP1399 Series  
IC Options  
Option  
Cumulative  
FB fault  
timer/  
Dedicated  
Soft_start_-  
seq  
FB fault  
source  
TON_MAX  
fault  
FB fault  
counter  
CS_FAULT  
OVP fault  
Latch  
OTP fault  
Auto−recovery  
Auto−recovery  
Latch  
NCP1399AA Auto−recovery  
NCP1399BA Auto−recovery  
NCP1399AC Auto−recovery  
Timer  
Timer  
Timer  
Timer  
Timer  
Timer  
Timer  
Timer  
Timer  
Timer  
Timer  
Timer  
Timer  
NO  
NO  
NO  
NO  
NO  
NO  
NO  
NO  
NO  
NO  
NO  
NO  
NO  
Auto−recovery Auto−recovery  
Auto−recovery Auto−recovery  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
Latch  
Auto−recovery  
Latch  
OFF  
Latch  
OFF  
Latch  
NCP1399AF  
Latch  
Latch  
Latch  
NCP1399AG Auto−recovery  
NCP1399AH Auto−recovery  
NCP1399AI Auto−recovery  
NCP1399AJ Auto−recovery  
NCP1399AK Auto−recovery  
NCP1399AL Auto−recovery  
NCP1399AM Auto−recovery  
NCP1399AN Auto−recovery  
NCP1399AP Auto−recovery  
Auto−recovery  
Latch  
Auto−recovery  
Auto−recovery  
Auto−recovery Auto−recovery  
Latch  
Auto−recovery Auto−recovery Auto−recovery Auto−recovery  
Auto−recovery Auto−recovery  
Auto−recovery Auto−recovery  
Auto−recovery Auto−recovery  
Latch  
Latch  
Latch  
Latch  
Latch  
Auto−recovery  
Auto−recovery  
Latch  
Auto−recovery  
Auto−recovery  
Auto−recovery  
OFF  
OFF  
OFF  
Auto−recovery Auto−recovery  
Auto−recovery Auto−recovery  
PFC_MODE Dead time  
Dead time  
fault  
OFF−mode  
version  
OFF−mode  
status  
Ramp comp P ON/OFF  
skip status  
control  
status  
pull−up  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
Option  
BO status  
ON  
NCP1399AA  
NCP1399BA  
NCP1399AC  
NCP1399AF  
NCP1399AG  
NCP1399AH  
NCP1399AI  
NCP1399AJ  
NCP1399AK  
NCP1399AL  
NCP1399AM  
NCP1399AN  
NCP1399AP  
ON  
Auto−recovery  
Auto−recovery  
Auto−recovery  
OFF  
Active OFF  
Active ON  
Active OFF  
Active OFF  
ON  
ON  
ON  
ON  
OFF  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
OFF  
OFF  
ON  
ON  
Auto−recovery  
OFF  
ON  
Active OFF  
Active OFF  
Active OFF  
Active OFF  
Active OFF  
Active OFF  
Active OFF  
Active OFF  
ON  
ZVS or  
DT_max  
Without ramp  
shift  
ON  
Auto−recovery  
OFF  
ON  
OFF  
OFF  
ON  
ON  
Auto−recovery  
OFF  
ON  
ON  
ON  
OFF  
ON  
ON  
OFF  
ON  
ON  
OFF  
ON  
www.onsemi.com  
11  
NCP1399 Series  
ORDERING INFORMATION  
Part Number  
Marking  
Package  
Shipping  
NCP1399AADR2G  
NCP1399BADR2G  
NCP1399ACDR2G  
NCP1399AFDR2G  
NCP1399AGDR2G  
NCP1399AHDR2G  
NCP1399AIDR2G  
NCP1399AJDR2G*  
NCP1399AKDR2G  
NCP1399ALDR2G*  
NCP1399AMDR2G  
NCP1399ANDR2G  
NCP1399APDR2G  
NCP1399AA  
NCP1399BA  
NCP1399AC  
NCP1399AF  
NCP1399AG  
NCP1399AH  
NCP1399AI  
NCP1399AJ  
NCP1399AK  
NCP1399AL  
NCP1399AM  
NCP1399AN  
NCP1399AP  
SOIC−16  
(Pb−Free)  
2500 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*Available upon request.  
www.onsemi.com  
12  
NCP1399 Series  
TYPICAL CHARACTERISTICS  
0.30  
0.25  
0.20  
0.15  
0.10  
1.05  
0.95  
0.85  
0.75  
0.65  
0.55  
0.45  
0.05  
0
−55  
−25  
5
35  
65  
95  
125  
125  
125  
−55  
−25  
5
35  
65  
95  
125  
125  
125  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 5. ISTART_OFF vs. Temperature  
Figure 6. VCC_INHIBIT vs. Temperature  
0.55  
0.54  
0.53  
0.52  
9.4  
9.3  
9.2  
9.1  
9.0  
8.9  
8.8  
0.51  
0.50  
8.7  
8.6  
−55  
−25  
5
35  
65  
95  
−55  
−25  
5
35  
65  
95  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 7. ISTART1 vs. Temperature  
Figure 8. ISTART2 vs. Temperature  
9.45  
9.43  
9.41  
15.85  
15.80  
15.75  
9.39  
9.37  
15.70  
15.65  
−55  
−25  
5
35  
65  
95  
−55  
−25  
5
35  
65  
95  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 9. VCC_OFF vs. Temperature  
Figure 10. VCC_ON vs. Temperature  
www.onsemi.com  
13  
NCP1399 Series  
TYPICAL CHARACTERISTICS  
6.48  
6.47  
6.46  
6.45  
820  
800  
780  
760  
740  
6.44  
6.43  
720  
700  
−55  
−25  
5
35  
65  
95  
125  
125  
125  
−55  
−25  
5
35  
65  
95  
125  
125  
125  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 11. VCC_RESET vs. Temperature  
Figure 12. ICC_SKIP−MODE vs. Temperature  
485  
465  
445  
425  
7.0  
6.8  
6.6  
6.4  
6.2  
6.0  
405  
385  
−55  
−25  
5
35  
65  
95  
−55  
−25  
5
35  
65  
95  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 13. ICC_AUTOREC vs. Temperature  
Figure 14. ICC_OPERATION vs. Temperature  
475  
455  
435  
35  
32  
29  
26  
415  
395  
23  
20  
−55  
−25  
5
35  
65  
95  
−55  
−25  
5
35  
65  
95  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 15. ICC_LATCH vs. Temperature  
Figure 16. ICC_OFF−MODE vs. Temperature  
www.onsemi.com  
14  
NCP1399 Series  
TYPICAL CHARACTERISTICS  
9.20  
9.15  
9.10  
9.05  
9.00  
8.4  
8.3  
8.2  
8.1  
8.0  
7.9  
8.95  
8.90  
−55  
−25  
5
35  
65  
95  
125  
−55  
−25  
5
35  
65  
95  
125  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 17. VBOOT_ON vs. Temperature  
Figure 18. VBOOT_OFF vs. Temperature  
1.72  
1.70  
1.202  
1.197  
1.192  
1.68  
1.66  
1.64  
1.62  
1.187  
1.182  
1.60  
1.58  
−55  
−25  
5
35  
65  
95  
125  
−55  
−25  
5
35  
65  
95  
125  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 19. IBOOT2 vs. Temperature  
Figure 20. VCLAMP_OVP/OTP_1 vs. Temperature  
0.804  
0.802  
0.800  
0.798  
0.796  
2.520  
2.515  
2.510  
2.505  
2.500  
2.495  
0.794  
0.792  
2.490  
2.485  
−55  
−25  
5
35  
65  
95  
125  
−55  
−25  
5
35  
65  
95  
125  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 21. VOTP vs. Temperature  
Figure 22. VOVP vs. Temperature  
www.onsemi.com  
15  
NCP1399 Series  
TYPICAL CHARACTERISTICS  
96.0  
95.5  
95.0  
94.5  
94.0  
22  
21  
20  
19  
18  
17  
16  
93.5  
93.0  
−55  
−25  
5
35  
65  
95  
125  
125  
125  
−55  
−25  
5
35  
65  
95  
125  
125  
125  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 23. IOTP vs. Temperature  
Figure 24. RFB vs. Temperature  
8.1  
8.0  
7.9  
204  
203  
202  
201  
7.8  
7.7  
200  
199  
7.6  
7.5  
−55  
−25  
5
35  
65  
95  
−55  
−25  
5
35  
65  
95  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 25. tON_MAX vs. Temperature  
Figure 26. VCS_OFFSET vs. Temperature  
185  
175  
165  
155  
2.72  
2.71  
2.70  
2.69  
145  
135  
2.68  
2.67  
−55  
−25  
5
35  
65  
95  
−55  
−25  
5
35  
65  
95  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 27. tpd_CS vs. Temperature  
Figure 28. VCS_FAULT vs. Temperature  
www.onsemi.com  
16  
NCP1399 Series  
TYPICAL CHARACTERISTICS  
1.010  
1.005  
1.000  
5.00  
4.95  
4.90  
4.85  
0.995  
0.990  
4.80  
4.75  
−55  
−25  
5
35  
65  
95  
125  
125  
125  
−55  
−25  
5
35  
65  
95  
125  
125  
125  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 29. VBO vs. Temperature  
Figure 30. IBO vs. Temperature  
4.70  
4.69  
4.68  
4.67  
4.66  
50.2  
50.0  
49.8  
49.6  
49.4  
4.65  
4.64  
49.2  
49.0  
−55  
−25  
5
35  
65  
95  
−55  
−25  
5
35  
65  
95  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 31. VFB_FAULT vs. Temperature  
Figure 32. ISKIP vs. Temperature  
78  
76  
74  
16  
14  
12  
72  
70  
10  
8
−55  
−25  
5
35  
65  
95  
−55  
−25  
5
35  
65  
95  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 33. RCGAIN vs. Temperature  
Figure 34. IDISCHARGE1 vs. Temperature  
www.onsemi.com  
17  
NCP1399 Series  
TYPICAL CHARACTERISTICS  
28  
24  
20  
16  
10  
8
6
4
2
12  
8
−55  
−25  
5
35  
65  
95  
125  
−55  
−25  
5
35  
65  
95  
125  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 35. ROH vs. Temperature  
Figure 36. ROL vs. Temperature  
www.onsemi.com  
18  
NCP1399 Series  
VCC Management with High−voltage Startup Current Source  
The NCP1399 controller features a HV startup current  
source that allows fast startup time and extremely low  
standby power consumption. Two startup current levels  
failure mode that may occur in the application. The HV  
startup current source is primarily enabled or disabled based  
on V level. The startup HV current source can be also  
CC  
(I  
and I  
) are provided by the system for safety in  
enabled by BO_OK rising edge, auto−recovery timer end,  
REMote and TSD end event. The HV startup current source  
charges the VCC capacitor before IC start−up.  
start1  
start2  
case of short circuit between VCC and GND pins. In  
addition, the HV startup current source features a dedicated  
over−temperature protection to prevent IC damage for any  
Figure 37. Internal Connection of the VCC Management Block  
The NCP1399 controller disables the HV startup current  
Figure 65 to find an illustration of the NCP1399 VCC  
management system under all operating conditions/modes.  
The HV startup current source features an independent  
source once the VCC pin voltage level reaches V  
CC_ON  
threshold – refer to Figure 37. The application then starts  
operation and the auxiliary winding maintains the voltage  
bias for the controller during normal and skip−mode  
operating modes. The IC operates in so called Dynamic Self  
Supply (DSS) mode when the bias from auxiliary winding  
over–temperature protection system to limit I  
current  
start2  
when the die temperature reaches 130°C. At this  
temperature, I will be progressively to prevent the die  
start2  
temperature from rising above 130°C.  
is not sufficient to keep the V voltage above V  
CC  
CC_OFF  
Brown−out Protection − VBULK/PFC FB Input  
threshold (i.e. V voltage is cycling between V  
and  
CC  
CC_ON  
Resonant tank of an LLC converter is always designed to  
operate within a specific bulk voltage range. Operation  
below minimum bulk voltage level would result in current  
and temperature overstress of the converter power stage.  
The NCP1399 controller features a VBULK/PFC FB input  
in order to precisely adjust the bulk voltage turn−ON and  
turn−OFF levels. This Brown−Out protection (BO) greatly  
simplifies application level design.  
V
thresholds with no driver pulses on the output  
CC_OFF  
during positive V ramp). The HV source is also operated  
in DSS mode when the low voltage controller enters  
off−mode or fault−mode operation. In this case the VCC pin  
CC  
voltage will cycle between V  
and V  
CC_ON  
CC_OFF  
thresholds and the controller will not deliver any driver  
pulse – waiting for return from the off−mode or latch mode  
operation. Please refer to figures Figure 61 through  
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19  
 
NCP1399 Series  
Figure 38. Internal Connection of the Brown−out Protection Block  
The internal circuitry shown in Figure 38 allows  
Note that the VBULK/PFC FB pin is pulled down by an  
internal switch when the controller is in startup phase − i.e.  
monitoring the high−voltage input rail (V ).  
A
bulk  
high−impedance resistive divider made of R  
and R  
when the V voltage ramps up from V < V  
upper  
lower  
CC CC CC_RESET  
resistors brings a portion of the V  
rail to the  
towards the V  
level on the VCC pin. This feature  
bulk  
CC_ON  
VBULK/PFC FB pin. The Current sink (I ) is active below  
assures that the VBULK/PFC FB pin voltage will not ramp  
BO  
the bulk voltage turn−on level (V  
). Therefore, the  
up before the IC operation starts. The I hysteresis current  
bulk_ON  
BO  
bulk voltage turn−on level is higher than defined by the  
division ratio of the resistive divider. To the contrary, when  
the internal BO_OK signal is high, i.e. the application is  
sink is activated and BO discharge switch is disabled once  
the  
V
CC  
voltage crosses  
V
CC_ON  
threshold. The  
VBULK/PFC FB pin voltage then ramps up naturally  
according to the BO divider information. The BO  
comparator then authorizes or disables the LLC stage  
running, the I sink is disabled. The bulk voltage turn−off  
BO  
threshold (V ) is then given by BO comparator  
bulk_OFF  
reference voltage directly on the resistor divider. The  
advantage of this solution is that the V threshold  
operation based on the actual V  
level.  
bulk  
The low I hysteresis current of the NCP1399 brown out  
bulk_OFF  
BO  
precision is not affected by I  
tolerance.  
hysteresis current sink  
protection system allows increasing the bulk voltage divider  
resistance and thus reduces the application power  
consumption during light load operation. On the other hand,  
the high impedance divider can be noise sensitive due to  
capacitive coupling to HV switching traces in the  
BO  
The V  
and V  
levels can be calculated  
bulk_ON  
bulk_OFF  
using equations below:  
The I is ON:  
BO  
application. This is why a filter (t  
) is added after the  
BO_FILTR  
(eq. 1)  
VBO ) VBOhyst  
+
BO comparator in order to increase the system noise  
immunity. Despite the internal filtering, it is also  
recommended to keep a good layout for BO divider resistors  
and use a small external filtering capacitor on the  
VBULK/PFC pin if precise BO detection wants to be  
achieved.  
The bulk voltage HV divider can be also used by a PFC  
front stage controller as a feedback sensing network (refer  
again to Figure 38). The shared bulk voltage resistor divider  
between PFC and LLC stage offers a way how to further  
reduce power losses during off−mode and no−load  
operation. The NCP1399 features a PFC MODE pin that  
disconnects bias of the PFC stage during light load,  
off−mode or fault mode operation. The signal from the PFC  
MODE pin can be also used to control an external HV switch  
in order to disconnect the bulk voltage divider from bulk  
during off−mode operation. This technique further reduces  
Rlower  
Rlower ) Rupper  
Rlower @ Rupper  
Rlower ) Rupper  
@ ǒ  
Ǔ
Vbulk_ON  
@
* IBO  
The I is OFF:  
BO  
Rlower  
Rlower ) Rupper  
VBO + Vbulk_OFF  
@
(eq. 2)  
One can extract R  
term from equation 2 and use it in  
lower  
equation 1 to get needed R  
value:  
upper  
Vbulk_ON@V  
BO * VBO * VBOhyst  
Vbulk_OFF  
Rlower  
+
(eq. 3)  
(eq. 4)  
VBO  
IBO  
@
ǒ
1 *  
Ǔ
Vbulk_OFF  
Vbulk_OFF * VBO  
Rupper + Rlower  
@
VBO  
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20  
 
NCP1399 Series  
the no−load power consumption down again since the power  
losses of voltage divider are not affected by the bulk voltage  
at all.  
Please refer to Figure 61 through Figure 65 for an  
illustration of NCP1399 Brown−out protection system in all  
operating conditions/modes.  
the operation, after filter time delay, when the OVP/OTP  
input voltage is out of the no−fault window. The controller  
then either latches−off or or starts an auto−recovery timer −  
depending on the IC version − and triggered the protection  
threshold (V  
or V ).  
OVP  
OTP  
The internal current source I  
allows a simple OTP  
OTP  
implementation by using a single negative temperature  
coefficient (NTC) thermistor. An active soft clamp  
Over−voltage and Over−temperature Protection  
The OVP/OTP pin is a dedicated input to allow for a  
simple and cost effective implementation of two key  
protection features that are needed in adapter applications:  
over−voltage (OVP) and over−temperature (OTP)  
protections. Both of these protections can be either latched  
or auto−recovery– depending on the version of NCP1399.  
The OVP/OTP pin has two voltage threshold levels of  
composed from V  
and R  
components prevents the  
clamp  
clamp  
OVP/OTP pin voltage from reaching the V  
threshold  
OVP  
when the pin is pulled up by the I  
current. An external  
OTP  
pull−up current, higher than the pull*down capability of  
the internal clamp (V  
pull the OVP/OTP pin above V  
), has to be applied to  
threshold to activate the  
CLAMP_OVP/OTP  
OVP  
OVP protection. The t  
and t  
filters  
OVP_FILTER  
OTP_FILTER  
detection (V  
and V ) that define a no−fault window.  
OTP  
OVP  
are implemented in the system to avoid any false triggering  
of the protections due to application noise and/or poor  
layout.  
The controller is allowed to run when OVP/OTP input  
voltage is within this working window. The controller stops  
Figure 39. Internal Connection of OVP/OTP Input  
The OTP protection could be falsely triggered during  
controller startup due to the external filtering capacitor  
IC returns to operation from skip−mode (V  
+
FB_SKIP_IN  
V
threshold was reached)  
FB_SKIP_HYST  
charging current. Thus the t  
period has been  
BLANK_OTP  
IC returns to operation from off−mode (V  
or  
REM_ON  
implemented in the system to overcome such behavior. The  
OTP comparator output is ignored during t  
V
signal is received by off−mode control  
FB_REM_ON  
BLANK_OTP  
block)  
period. In order to speed up the charging of the external  
filtering capacitor C connected to OVP/OTP pin,  
The I  
current source is disabled when:  
OTP  
OVP_OTP  
V falls below V  
threshold  
CC  
CC_OFF  
the I  
current has been doubled to I . The  
OTP_BOOST  
OTP  
BO OK signal goes to low state (i.e. Brown−out  
condition occurs on the mains)  
maximum value of filtering capacitor is 47 nF.  
The OVP/OTP ON signal is set after the following events:  
the V voltage exceeds the V threshold during  
Fault signal is activated (Auto−recovery timer starts  
counting or Latch fault is present)  
CC  
CC_ON  
first start−up phase (after VCC pin voltage was below  
threshold)  
IC goes into the skip−mode operation (V  
V
FB_SKIP_IN  
CC_RESET  
threshold was reached)  
BO OK signal is received from BO block  
Auto−recovery timer elapsed and a new restart occurs  
IC goes into the off−mode operation (V  
or  
REM_OFF  
) signal was reached)  
(V  
& V  
FB_REM_OFF  
CC_OFF  
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21  
NCP1399 Series  
The latched OVP or OTP versions of NCP1399 enters  
latched protection mode when V voltage cycles between  
Active OFF off−mode control − available on the  
CC  
NCP1399Ay device family  
V
CC_ON  
and V  
thresholds and no pulses are provided  
CC_OFF  
These two off−mode operation control techniques differ in  
the way the off−mode operation is started on the primary  
side controller. Both of these methods are described  
separately hereinafter.  
by drivers. The controller VCC pin voltage has to be cycled  
down below V threshold in order to restart  
CC_RESET  
operation. This would happen when the power supply is  
unplugged from the mains.  
Active ON Off−mode Control – NCP1399B Device  
Family  
SKIP/REM Input and Off−mode Control  
The NCP1399 implements an ultra−low power  
consumption mode of operation called off−mode. The  
application output voltage is cycled between the nominal  
and lower levels that are defined by the secondary side  
off−mode controller (like NCP435x secondary off−mode  
controller). The output voltage is thus not regulated to  
nominal level but is always kept at a high enough voltage  
level to provide bias for the necessary circuits in the target  
application – for example this could be the case of  
microcontroller with very low consumption that handles  
VCC management in a notebook or TV. The no−load input  
power consumption could be significantly reduced when  
using described technique. The NCP1399 implements two  
different off−mode control system approaches:  
The NCP1399B device family uses a SKIP/REM pin only  
for off−mode operation control– i.e. the pin is internally  
connected to the Active ON off−mode control block and the  
skip mode threshold level is not adjustable externally. The  
skip mode comparator threshold can be adjusted only  
internally (by IC option) in this package option. The  
SKIP/REM pin when used for off−mode control allows the  
user to activate the ultra−low consumption mode during  
which the IC consumption is reduced to only very low HV  
pin leakage current (I ) and very low VCC pin  
HV_OFF−MODE  
consumption (I  
). The off*mode is activated  
CC_OFF−MODE  
when SKIP/REM pin voltage exceeds V  
threshold.  
REM_OFF  
Normal operating mode is resumed when SKIP/REM pin  
voltage drops below V threshold – refer to  
REM_ON  
Active ON off−mode control − available on the  
Figure 40 for an illustration.  
NCP1399By device family  
Figure 40. SKIP/REM Input Internal Connection – Active ON Version  
The off−mode operation is activated by the secondary side  
off−mode controller. The auxiliary bias for primary side  
off−mode control is provided by a circuit composed from  
switching between ON−mode and OFF−mode states when  
off−mode control is implemented. The OFF mode period  
last significantly longer time (tens of seconds or more)  
compared to the secondary capacitor refilling period (few  
tens of milliseconds) – this explains why the no−load input  
power consumption can be drastically reduced. The  
auxiliary off−mode supply capacitor C1 can stay charged  
while the secondary bias is lost – this can happen during  
overload or other fault mode conditions. A REM TIMER is  
thus implemented in the system to allow fast application  
components D , C , R , R and C . The SKIP/REM pin is  
2
1
1
2
2
pulled up by this auxiliary supply circuit once the REM  
optocoupler (REM OK) is released. The application then  
operates in off−mode until the secondary side off−mode  
controller activates the REM optocoupler or until the  
auxiliary bias on C is lost. Normal operation mode is then  
1
recovered via power stage startup. The application is thus  
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22  
 
NCP1399 Series  
restart in such cases. The controller blanks the SKIP/REM  
input information and pulls down the SKIP/REM input for  
time during controller restart so that the  
secondary side bias can be restored and the secondary  
off−mode controller can activate the REM optocoupler. This  
REM TIMER blank sequence is activated each time the  
The bias on VCC pin needs to be assured when off−mode  
operation takes place. The auxiliary winding is no more able  
to provide any bias thus the HV startup current source is  
operated in DSS mode – i.e. the VCC pin voltage is cycling  
t
REM_TIMER  
between V  
and V  
thresholds. This approach  
CC_ON  
CC_OFF  
keeps IC biasing in order to memorize the current operation  
sate.  
VCC pin voltage reaches V  
threshold – except in the  
CC_ON  
situation when after IC left off−mode operation by standard  
Please refer to Figure 64 for an illustration on how the  
NCP1399 Active ON off−mode system works under all  
operating conditions/modes.  
way and V is restored – i.e. when the REM optocoupler  
CC  
is activated by the secondary off−mode controller.  
The SKIP/REM input blanking is activated in following  
cases:  
Active OFF Off−mode Control – NCP1399A Device  
Family  
The NCP1399A device family uses LLC FB pin voltage  
information for off−mode operation detection − refer to  
Figure 41. The SKIP/REM pin is internally connected to the  
VCC pin voltage reaches V  
threshold during first  
CC_ON  
start−up phase (i.e. when V was below V  
CC  
CC_RESET  
threshold before)  
Auto−recovery timer elapsed and new start is initiated  
skip mode block in this case and serves as a V  
FB_SKIP_IN  
threshold voltage adjust pin. The secondary off−mode  
controller reuses the LLC stage regulation optocoupler in  
order to reduce total system cost. The off−mode operation is  
initiated once the LLC FB pin is pulled down below  
The REM TIMER helps to assure fast application re−start  
from fault conditions by forcing controller operation after  
t
. However, the secondary controller drives the  
REM_TIMER  
remote pin via REM optocoupler during normal operating  
conditions in order to switch between ON and OFF  
operating modes. The controller is active for very short time  
during no−load conditions − just during the time needed to  
re−fill the secondary side capacitors to the nominal output  
voltage level. In this case we do not use REM TIMER  
because it would increase the no−load power consumption  
by forcing the application to run for a longer time than  
necessary. The REM TIMER blank period is thus not  
activated in no−load conditions.  
V
V
threshold and the VCC pin voltage drops below  
threshold in the same time. The optocoupler has to  
REM_ON  
CC_OFF  
be active at all time the application is held in off−mode. No  
biased is then provided by the secondary off−mode  
controller during normal operation – this is why this  
approach is called Active OFF off−mode operation. The  
application no−load input power consumption is slightly  
higher compared to Active ON off−mode solution,  
previously described, because the optocoupler needs to be  
biased during off mode operation  
Figure 41. Active OFF Off−mode Internal Detection Based on the LLC FB Pin Voltage  
The controller monitors the LLC FB pin voltage level and  
restarts via regular startup sequence (including VCC pin  
voltage is cycling between V  
and V  
CC_ON CC_OFF  
thresholds. This approach keeps IC biased so that the actual  
operation sate is memorized. The LLC FB pin pull−up  
resistor is disconnected when off−mode operation is  
activated in order to reduce IC power consumption and also  
needed current for optocoupler driving from secondary side.  
voltage ramp−up to V  
level and soft−start) once the  
CC_ON  
FB pin is released by the secondary off−mode controller.  
The HV startup current source is working in DSS mode  
during application off−mode operation – i.e. the VCC pin  
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23  
 
NCP1399 Series  
Please refer to Figure 65 for an illustration on how the  
NCP1399 active ON off−mode system works under all  
operating conditions/modes.  
P ON/OFF pin is 1 kW. The PFC stage operation can thus be  
disabled/enabled via external logic signal. This option  
should be used with the wide range input voltage LLC tank  
designed to assure correct operation of the LLC stage  
through whole bulk voltage range. The PFC MODE output  
pin can be used for two purposes:  
PFC MODE Output and P ON/OFF Control Pin  
The NCP1399 has two pins P ON/OFF and PFC MODE  
that can be used to disable or enable PFC stage operation  
based on actual application operating state – please refer to  
Figure 46. The PFC MODE pin voltage is changed  
1. to control the external small signal HV MOSFET  
switch that connects the bulk voltage divider to the  
VBULK/PFC FB input  
2. to control the PFC front stage controller operation  
via PFC controller supply pin  
(V  
or V  
) based on the actual P ON/OFF  
PFC_M_ON  
PFC_M_BO  
input logic signal state. Minimum impedance connected to  
5 V  
0.1 V  
Figure 42. Internal Connection of the PFC MODE and P ON/OFF Blocks  
There are three possible states of the PFC MODE output  
that can be placed by the controller based on the application  
operating conditions:  
connects VCC pin voltage to PFC MODE output  
with minimum dropout (V ). This state of  
the PFC MODE output appears in case an external  
signal on the P ON/OFF pin is at “low” state.  
PFC_M_ON  
1. The PFC MODE output pin is pulled−down by an  
internal MOSFET switch before controller startup.  
This technique ensures minimum VCC pin current  
The output power level is derived internally from the  
actual FB pin voltage. This information could be compared  
on external comparator with the reference level and control  
the P ON/OFF input, thus the user has possibility to adjust  
power below which the PFC stage is disabled in order to  
increase efficiency in light load conditions. The P ON/OFF  
consumption in order to ramp V voltage in a  
CC  
short time from the HV startup current source  
which speeds up the startup or restart process. The  
PFC MODE output pin is also pulled−down in  
off−mode or protection mode during which the HV  
startup current source is operated in DSS mode.  
This reduces the application power consumption in  
both cases.  
comparator features an hysteresis (P ON/OFF  
)
HYST  
proportional to the set P ON/OFF level in order to overcome  
PFC power stage oscillations (periodical ON/OFF  
2. The pull−down switch is disabled and the internal  
regulator enabled by the controller to provide  
operation). The P ON/OFF timer (t  
) is  
P ON/OFF_TIMER  
implemented to ensure a long enough propagation delay  
from the PFC turn OFF detection to PFC MODE output  
deactivation. This timer is unidirectional so that it resets  
immediately after PFC ON condition is detected by the  
P ON/OFF comparator. This technique is used in order to  
avoid a PFC stage deactivation during load or line transients.  
The PFC MODE pin output current is limited when the VCC  
to PFC MODE bypass switch is activated. The current  
limitation avoids bypass switch damage during PFC VCC  
decoupling capacitor charging process or short circuit. A  
minimum value PFC VCC decoupling capacitance should  
be used in order to speed up PFC stage startup after it is  
enabled by the NCP1399 controller.  
V
reference when an external logic  
PFC_M_BO  
signal on the P ON/OFF pin is at “high” state. An  
internal regulator includes current limitation for  
the PFC MODE output that is set to I  
PFC_M_LIM  
when V  
reference is provided. The PFC  
PFC_M_BO  
MODE pin drives external small signal HV  
MOSFET switch to keep bulk voltage divider  
connected. The LLC power stage Brown−out  
protection system thus works when the LLC stage  
is switching while PFC stage disabled.  
3. The pull−down switch is disabled and the internal  
regulator is switched to bypass mode in which it  
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24  
NCP1399 Series  
Please refer to Figure 61 through Figure 65 for an  
illustration of NCP1399 PFC operation control.  
2. Precise VCO (or CCO) is needed to assure  
frequency modulation with good reproducibility,  
f
and f  
clamps need to be adjusted for each  
min  
max  
ON−time Modulation and Feedback Loop Block  
Frequency modulation of today’s commercially available  
resonant mode controllers is based on the output voltage  
regulator feedback only. The feedback voltage (or current)  
of output regulator drives voltage (or current) controlled  
oscillator (VCO or CCO) in the controller. This method  
presents three main disadvantages:  
design need for an adjustment pin(s).  
3. Dedicated overload protection system, requiring  
an additional pin, is needed to assure application  
safety during overload and/or secondary short  
circuit events.  
The NCP1399 resolves all disadvantages mentioned  
above by implementing a current mode control scheme that  
ensures best transient response performance and provides  
inherent cycle−by−cycle over−current protection feature in  
the same time. The current mode control principle used in  
this device can be seen in Figure 43.  
nd  
1. The 2 order pole is present in small signal  
gain−phase characteristics the lower cross over  
frequency and worse transient response is imposed  
by the system when voltage mode control is used.  
There is no direct link to the actual primary current  
– i.e. no line feed forward mechanism which  
results in poor line transient response.  
Figure 43. Internal Connection of the NCP1399 Current Mode Control Scheme  
The basic principle of current mode control scheme  
implementation lies in the use of an ON−time comparator  
that defines upper switch on−time by comparing voltage  
ramp, derived from the current sense input voltage, to the  
divided feedback pin voltage. The upper switch on−time is  
then re−used for low side switch conduction period. The  
switching frequency is thus defined by the actual primary  
current and output load conditions. Digital processing with  
10 ns minimum on−time resolution is implemented to  
ensure high noise immunity. The ON−time comparator  
is divided down by capacitive divider (Ccs1, Ccs2, Rcs1,  
Rcs2) before it is provided to the CS input. The capacitive  
divider division ratio, which is fully externally adjustable,  
defines the maximum primary current level that is reached  
in case of maximum feedback voltage – i.e. the capacitive  
divider division ration defines the maximum output power  
of the converter for given bulk voltage. The CS is a bipolar  
input pin which an input voltage swing is restricted to 5 V.  
A fixed voltage offset is internally added to the CS pin signal  
in order to assure enough voltage margin for operation the  
feedback optocoupler − the FB optocoupler saturation voltage  
is ~ 0.15 V (depending on type). However, the CS pin useful  
signal for frequency modulation swings from 0 V, so current  
mode regulation would not work under light load conditions  
if no offset would be added to the CS pin before it is stabilized  
to the level of the on−time comparator input. The CS pin  
signal is also used for secondary side short circuit detection  
– please refer to chapter dedicated to short circuit protection.  
output is blanked by the leading edge blanking (t  
) after  
LEB  
the Mupper switch is turned−on. The ON−time comparator  
LEB period helps to avoid false triggering of the on−time  
modulation due to noise generated by the HB pin voltage  
transition.  
The voltage signal for current sense input is prepared  
externally via natural primary current integration by the  
resonant tank capacitor Cs. The resonant capacitor voltage  
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25  
 
NCP1399 Series  
The second input signal for the on−time comparator is  
passes through the FB processing block before it is brought  
to the ON−time comparator input. The FB processing block  
derived from the FB pin voltage. This internal FB pin signal  
is also used for the following purposes: skip mode operation  
detection, PFC MODE control, off−mode detection (in  
NCP1399A device family) and overload / open FB pin fault  
detection. The detailed description of these functions can be  
found in each dedicated chapters. The internal pull−up  
resistor assures that the FB pin voltage increases when the  
optocoupler LED becomes less biased – i.e. when output  
load is increased. The higher FB pin voltage implies a higher  
reference level for on−time comparator i.e. longer Mupper  
switch on−time and thus also higher output power. The FB  
pin features a precise voltage clamp which limits the internal  
FB signal during overload and startup. The FB pin signal  
scales the FB signal down by a K ratio in order to limit the  
FB  
CS input dynamic voltage range. The scaled FB signal is  
then further processed by subtraction of  
a ramp  
compensation generator signal in order to ensure stability of  
the current mode control scheme. The divided internal FB  
signal is overridden by a Soft−start generator output voltage  
during device starts−up.  
The actual operation frequency of the converter is defined  
based on the CS pin and FB pin input signals. Please refer to  
Figure 44 and below description for better understanding of  
the NCP1399 frequency modulation system.  
Figure 44. NCP1399 On−time Modulation Principle  
The Mupper switch is activated by the controller after  
dead−time (DT) period lapses in point A. The frequency  
processing block increments the ON−time counter with  
10 ns resolution until the internal CS signal crosses the  
internal FB set point for the ON−time comparator in point B.  
A DT period is then introduced by the controller to avoid any  
shoot−through current through the power stage switches.  
The DT period ends in point C and the controller activates  
the Mlower switch. The ON−time processing block  
decrements the ON_time counter down until it reaches zero.  
The Mlower switch is then turned−OFF at point D and the  
DT period is started. This approach results in perfect duty  
cycle symmetry for Mlower and Mupper switches. The  
Mupper switch on−time naturally increases and the  
operating frequency drops when the FB pin voltage is  
increased, i.e. when higher current is delivered by the  
converter output – sequence E.  
skip mode is not used or adjusted correctly. The current  
mode operation is not possible in such case because the  
ON−time comparator output stays active for several  
switching cycles. Thus a special logic has been implemented  
in NCP1399 in order to repeat the last valid on−time until the  
current mode operation recovers – i.e. until the CS pin signal  
balance is restored by the system.  
Overload and Open FB Protections  
The overload protection and open FB pin detection are  
implemented via FB pin voltage monitoring in this  
controller. The FB fault comparator is triggered once the FB  
pin voltage reaches its maximum level and the V  
FB_FAULT  
threshold is exceeded. The fault timer or counter (depending  
on IC option) is then enabled – refer to Figure 43. The time  
period to the FB fault event confirmation is defined by the  
preselected t  
parameter when the fault  
FB_FAULT_TIMER  
timer option is used. The FB fault counter, once selected as  
a FB fault confirmation period source, defines the fault  
confirmation period via Mupper DRV pulses counting. The  
The resonant capacitor voltage and thus also CS pin  
voltage can be out of balance in some cases – this is the case  
during transition from full load to no−load operation when  
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NCP1399 Series  
FB fault confirmation time is thus dependent on switching  
option is also available on request. The FB fault  
timer/counter is not reset when the FB fault condition  
diminishes in this case. The FB fault timer/counter is  
disabled and memorizes the fault period information. The  
cumulative FB fault timer/counter integrates all the FB fault  
events over the IC operation time. The Fault timer/counter  
can be reset via skip mode or VCC UVLO event.  
frequency. The fault timer/counter is reset once the FB fault  
condition diminishes. A digital noise filter has been added  
after the FB fault comparator to overcome false triggering of  
the FB fault timer/counter due to possible noise on the FB  
input. The noise filter has a period of 2 ms for FB fault  
timer/counter activation and 20 ms for reset/deactivation to  
assure high noise immunity. A cumulative timer/counter IC  
Figure 45. Internal FB Fault Management  
The controller disables driver pulses and enters protection  
mode once the FB fault event is confirmed by the FB fault  
timer or counter. Latched or auto−recovery operation is then  
triggered – depends on selected IC option. The controller  
primary current is naturally limited by the NCP1399  
on−time modulation principle in this case. But the primary  
current increases when the output terminals are shorted. The  
NCP1399 controller will maintain zero voltage switching  
operation in such case, however high currents will flow  
through the power MOSFETS, transformer winding and  
secondary side rectification. The NCP1399 implements a  
dedicated secondary side short circuit protection system that  
will shut down the controller much faster than the regular FB  
fault event in order to limit the stress of the power stage  
components. The CS pin signal is monitored by the  
dedicated CS fault comparator − refer to Figure 43. The CS  
fault counter is incremented each time the CS fault  
comparator is triggered. The controller enters  
auto−recovery or latched protection mode (depending on IC  
option) in case the CS fault counter overflows refer to  
Figure 46. The CS fault counter is then reset once the CS  
fault comparator is inactive for at least 50 Mupper upcoming  
pulses. This digital filtering improves CS fault protection  
system noise immunity.  
adds an auto−recovery off−time period (t ) and  
A−REC_TIMER  
restarts the operation via soft start in case of auto−recovery  
option. The application temperature runaway is thus  
avoided in case of overload while the automatic restart is still  
possible once the overload condition disappears. The IC  
with latched FB fault option stays latched−off, supplied by  
the HV startup current source working in DSS mode, until  
the V  
threshold is reached on the VCC pin – i.e.  
CC_RESET  
until user re−connects power supply mains.  
Please refer to Figure 61 and Figure 62 for an illustration  
of the NCP1399 FB fault detection block.  
Secondary Short Circuit Detection  
The protection system described previously, implemented  
via FB pin voltage level detection, prevents continuous  
overload operation and/or open FB pin conditions. The  
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27  
NCP1399 Series  
Figure 46. NCP1399 CS Fault Principle  
Dedicated Startup Sequence and Soft−Start  
Hard switching conditions can occur in a resonant SMPS  
application when the resonant tank operation is started with  
50% duty cycle symmetry – refer to Figure 47. This hard  
switching appears because the resonant tank initial  
conditions are not optimal for the clean startup.  
Figure 47. Hard switching cycle appears in the LLC application when resonant tank is  
excited by 50% duty cycle during startup  
The initial resonant capacitor voltage level can differ  
resonant tank is low when the output is loaded and/or the  
output voltage is low enough to made secondary rectifies  
conducting during first switching cycles of startup phase.  
The resonant frequency of the resonant tank is given by the  
resonant capacitor capacitance and resonant inductance  
−note that the magnetizing inductance does not participate  
in resonance in this case. However, if the application  
starts−up when the output capacitors is charged and there is  
no load connected to the output, the secondary rectification  
diodes is not conducting during each switching cycle of  
startup sequence and thus the resonant frequency of resonant  
tank is affected also by the magnetizing inductance. In this  
case, the resonant frequency is much lower than in case of  
startup into loaded/discharged output.  
depending on how long delay was placed before application  
operation restart. The resonant capacitor voltage is close to  
zero level when application restarts after very long delay –  
for example several seconds, when the resonant capacitor is  
discharged by leakage to the power stage. However, the  
resonant capacitor voltage value can be anywhere between  
Vbulk and 0 V when the application restarts operation after  
a short period of time – like during periodical SMPS  
turn−on/off. Another factor that plays significant role during  
resonant power supply startup is the actual load impedance  
seen by the power stage during the first pulses of startup  
sequence. This impedance is not only defined by resonant  
tank components but also by the output loading conditions  
and actual output voltage level. The load impedance of  
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NCP1399 Series  
These facts show that a clean, hard switching free and  
charged before the first high−side driver pulse is introduced  
by the controller. The first Mupper switch on−time Tup1  
period is fixed and depends on the application parameters.  
This period can be adjusted internally – various IC options  
parasitic oscillation free, startup of an LLC converter is not  
an easy task, and cannot be achieved by duty cycle imbalance  
and/or simple resonant capacitor pre−charge to Vbulk/2 level.  
These methods only work in specific startup conditions.  
This explains why the NCP1399 implements a proprietary  
startup sequence − see Figure 48 and Figure 49. The resonant  
capacitor is discharged down to 0 V before any application  
restart − except when restarting from skip mode.  
are available. The Mupper switch is released after T  
up1  
period and it is not followed by the Mlower switch  
activation. The controller waits for a new ZVS condition for  
Mupper switch instead and measures actual resonant tank  
conditions this way. The Mupper switch is then activated  
again after the Mlower blank period is used for measurment  
purposes. The second Mupper driver conduction period is  
then dependent on the previously measured conditions:  
1. The Mupper switch is activated for 3/2 of previous  
Mupper conduction period in case the measured  
time between previous Mupper turn−off event and  
upper ZVS condition detection is twice higher than  
the the previous Mupper pulse conduction period  
2. The Mupper switch is activated for previous  
Mupper conduction period in case the measured  
time between previous Mupper turn−off event and  
upper ZVS condition detection is twice lower than  
the previous Mupper pulse conduction period  
The startup period then depends on the previous  
condition. Another blank Mlower switch period is placed by  
the controller in case condition 1 occurred. A normal  
Mlower driver pulse, with DC of 50% to previous Mupper  
DRV pulse, is placed in case condition 2 is fulfilled.  
The dedicated startup sequence is placed after the  
resonant capacitor is discharged (refer to Figure 48 and  
Figure 49) in order to exclude any hard switching cycles  
during the startup sequence. The first Mupper switch cycle  
in startup phase is always non−ZVS cycle because there is  
no energy in the resonant tank to prepare ZVS condition.  
However, there is no energy in the resonant tank at this time,  
there is also no possibility that the power stage MOSFET  
body diodes conducts any current. Thus the hard  
commutation of the body diode cannot occur in this case.  
The IC will not start and provide regular driver output  
pulses until it is placed into the target application, because  
the startup sequence cannot be finished until HB pin signal  
is detected by the system. The IC features a startup watchdog  
Figure 48. Initial Resonant Capacitor Discharge  
before Dedicated Startup Sequence is Placed  
timer (t  
) which activates a dedicated startup  
WATCHDOG  
Figure 49. Dedicated Startup Sequence Detail  
sequence periodically in case the IC is powered without  
application (during bench testing) or in case the startup  
sequence is not finished correctly. The IC will provide the  
first Mlower and first Mupper DRV pulses with a  
The resonant capacitor discharging process is simply  
implemented by activating an internal current limited switch  
connected between the HB pin and IC ground – refer to  
Figure 48. This technique assures that the resonant capacitor  
energy is dissipated in the controller without ringing or  
oscillations that could swing the resonant capacitor voltage  
to a positive or negative level. The controller detects that the  
discharge process is complete via HB pin voltage level  
monitoring. The discharge switch is disabled once the HB  
t
off−time in−between startup attempts.  
WATCHDOG  
Soft−start  
The dedicated startup sequence is complete when  
condition 2 from previous chapter is fulfilled and the  
controller continues operation with the soft−start sequence.  
A fully digital non−linear soft−start sequence has been  
implemented in NCP1399 using a soft−start counter and  
D/A converter that are gradually incremented by the Mlower  
driver pulses. A block diagram of the NCP1399 soft−start  
system is shown in Figure 50.  
pin voltage drops below the V  
threshold.  
HB_MIN  
The dedicated startup sequence continues by activation of  
the Mlower driver output for Tl1 period (refer to Figure 49).  
This technique ensures that the bootstrap capacitor is fully  
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29  
 
NCP1399 Series  
Figure 50. Soft−start Block Internal Implementation  
The soft−start block subsystems and operation are  
described below:  
1. The Soft−Start counter is a unidirectional counter  
power switches as afore mentioned. The ON−time  
counter count−up mode can be switched to the  
count−down mode by either of two events: 1  
st  
that is loaded with the last Mupper on−time value  
that is reached at the dedicated startup sequence  
end (i.e. during condition b occurrence explained  
in previous chapter). The on−time period used in  
the initial period of the soft−start sequence is  
affected by the first Mupper on−time period  
selection and the dedicated startup sequence  
processing. The Soft−Start counter counts up from  
this initial on time period to its maximum value  
which corresponds to the IC maximum on−time.  
The Soft−Start counter is incremented by the  
when the ON−time counter value reaches the  
nd  
maximum on−time value (t  
) or 2 when  
TON_MAX  
the actual Mupper on−time is terminated based on  
the current sense input information.  
3. The Maximum ON−time comparator compares  
the actual ON−time counter value with the  
maximum on−time value (t  
) and  
TON_MAX  
immediately activates the latch (or auto−recovery)  
protection mode. The minimum operating  
frequency of the controller is defined the same  
way. The Maximum ON−time comparator  
soft−start increment number (t  
)
reference is loaded by the Soft−Start counter value  
on each switching cycle during soft−start. The  
Maximum ON−time fault signal is ignored during  
Soft−Start operation. The converter Mupper switch  
on−time (and thus operating frequency) is thus  
defined by the Soft−Start counter value indirectly  
– via Maximum ON−time comparator. The  
Mupper switch on−time is increased until the  
SS_INCREMENT  
during each Mlower switch on−time period. The  
soft−start start increment, selectable via IC option,  
thus affects the soft−start time duration. The  
Mlower clock signal for the Soft−Start counter can  
be divided down by the SS clock divider  
(K ) in case the soft−start period  
SS_INCREMENT  
needs to be prolonged further – this can be also  
done via IC option selection. The Soft−Start period  
is terminated (i.e. the counter is loaded to its  
maximum) when the FB pin voltage drops below  
Soft−Start counter reaches t  
period and  
TON_MAX  
Maximum on−time protection is activated, or until  
ON−time comparator takes action and overrides  
the Maximum ON−time comparator.  
V
level.  
FB_SKIP_IN  
2. The ON−time counter is a bidirectional counter  
that is used as a main system counter for on−time  
modulation during soft−start, normal operation or  
overload conditions. The ON−time counter  
4. The Soft−Start D/A converter generates a  
soft−start voltage ramp for ON−time comparator  
input synchronously with Soft−Start counter  
incrementing. The internal FB signal for ON−time  
comparator input is artificially pulled−down and  
then ramped−up gradually when soft−start period  
is placed by the system – refer to Figure 51. The  
FB loop is supposed to take over at certain point  
counts−up during Mupper switch conduction  
period and then counts down to zero – defining  
Mlower switch conduction period. This technique  
assures perfect 50 % duty cycle symmetry for both  
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30  
NCP1399 Series  
when regulation loop is closed and output gets  
operating frequency. The Soft−Start period is  
regulated so that soft−start has no other effect on  
the on−time modulation. The Soft−Start counter  
continues counting−up until it reaches its  
terminated (i.e. counter is loaded to its maximum)  
when the FB pin voltage drops below V  
level. The D/A converter output evolve  
FB_SKIP_IN  
maximum value which corresponds to the IC  
maximum on−time value – i.e. the IC minimum  
accordingly to the Soft−Start counter as it is  
loaded from its output data bus.  
Figure 51. Soft Start Behavior  
The Controller Operation during Soft−start Sequence  
Evolves as Follows:  
ON−time comparator reference voltage. This reference  
voltage thus also increases non−linearly from initial zero  
level until the level at which the current mode regulation  
starts to work. The on−time of the Mupper and Mlower  
switch is then defined by the ON−time comparator action  
instead of the Maximum ON−time comparator. The  
soft−start then continues until the regulation loop is closed  
and the on−time is fully controlled by the secondary  
regulator. The Soft−Start counter then continues in counting  
and saturates at its maximum possible value which  
corresponds to IC minimum operating frequency. The  
maximum on−time fault detection system is enabled when  
The Soft−Start counter is loaded by last Mupper on−time  
value at the end of the dedicated startup sequence. The  
ON−time counter is released and starts count−up from zero  
until the value that is equal to the actual Soft−Start counter  
state. The Mupper switch is active during the time when  
ON−time counter counts−up. The Maximum ON−time  
comparator then changes counting mode of the ON−time  
comparator from count−up to count−down. A dead−time is  
placed and the Mlower switch is activated till the ON−time  
counter reaches zero value. The Soft−Start counter is  
incremented by selected increment during corresponding  
Mlower on−time period so that the following Mupper switch  
on−time is prolonged automatically – the frequency thus  
drops naturally. Because the operating frequency of the  
controller drops and Mlower DRV signal is used as a clock  
source for the Soft−start counter, the soft−start speed starts  
to decrease on each (or on each N−th) Mlower driver pulse  
Soft−Start counter value is equal to t  
value.  
TON_MAX  
The previous on−time repetition feature, described above  
in the ON−time modulation and feedback loop chapter, is  
disabled in the beginning of soft start period. This is because  
the ON−time comparator output stays high for several cycles  
of soft start period – until the current mode regulation takes  
over. The previous on−time repetition feature is enabled  
once the current modulation starts to work fully, i.e. in the  
time when the ON−time comparator output periodically  
drops to low state within actual Mupper switch on−time  
period. Typical startup waveform of the LLC application  
driven by NCP1399 controller can be seen in Figure 52.  
(where N is defined by K ) of switching cycle.  
SS_INCREMENT  
So we have non−linear soft−start that helps to speed up  
output charging in the beginning of the soft−start operation  
and reduces the output voltage slope when the output is close  
to the regulation level. The output bus of the Soft−Start  
counter addresses the D/A converter that defines the  
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31  
NCP1399 Series  
major primary current component during light load  
conditions, circulates in the resonant tank and creates power  
losses in the power switches despite minimum energy  
transfer to the secondary side. This is why the majority of  
resonant converter controllers implement skip mode  
operation under light load conditions.  
The NCP1399 controller implements a proprietary skip  
mode technique that assures maximum light−load efficiency  
and low acoustic noise. The FB pin voltage level below  
which the application enters skip mode operation is fully  
user adjustable for the NCP1399A device family − via  
SKIP/REM adjust pin or via IC option for the NCP1399B  
device family. The skip mode operation can be initiated by  
the skip comparator only during actual Mupper driver  
on−time period. This technique assures defined and  
synchronous transition from normal to skip mode operation.  
The SKIP/REM pin voltage (NCP1399Ay) or internal  
voltage level (NCP1399By) defines the FB pin voltage  
threshold under which is the skip mode initiated – the  
maximum operating frequency of the converter is thus  
defined indirectly.  
The Mlower switch is always activated for a defined  
on−time period at the beginning of each skip burst to  
re−charge the bootstrap capacitor and thus assure enough  
charge for high side driver powering during the following  
Mupper pulse. The resonant capacitor average voltage level  
is maintained below Vbulk/2 level during the skip mode  
operation. This technique helps to minimize power loses  
during the initial Mlower MOSFET switch activation – refer  
to Figure 53.  
Figure 52. Application Startup with NCP1399 −  
Primary Current − green, Vout − magenta  
Skip Mode Operation  
An LLC resonant converter efficiency reaches high values  
under medium and full load conditions thanks to ZVS  
operation for the primary MOSFETs and ZCS operation for  
the secondary rectifiers. The light−load and no−load  
efficiency however drops unacceptably when a normal  
frequency modulation control technique is used. This is  
because the converter operating frequency needs to be  
increased quite a lot compared to nominal load operating  
frequency in order to maintain regulation under light load  
conditions. High operating frequency increases driving  
losses in the controller and also losses in the converter power  
stage. Moreover, the magnetizing current that becomes  
Figure 53. The average voltage of resonant capacitor is maintained below Vbulk/2 during the skip mode operation  
to reduce turn−on losses during 1st Mlower skip burst pulse  
The first pulse in the skip burst is always non−ZVS  
because there is no magnetizing energy in the resonant tank  
that could prepare ZVS condition for lower MOSFET  
switch turn−on. The reduced resonant capacitor voltage thus  
helps to decrease C*V^2 losses related to the total HB line  
capacitance (composed from output capacitances of the  
power stage MOSFETs and stray capacitance seen by the  
HB line). However, too low of a resonant capacitor voltage,  
The reduced resonant capacitor average voltage  
requirement imposes a specific turn−off sequence to be used  
at the end of each skip burst and also during transition from  
normal operation mode to skip mode– refer to Figure 54.  
The Mlower driver is always activated the latest during  
transition to skip mode. However, the latest Mlower driver  
activation on−time is equal to 3/2 of previous Mupper pulse  
width when the skip mode is entered. This technique  
naturally imbalances the resonant tank so that the average  
resonant capacitor voltage stays below Vbulk/2 level. – i.e.  
application is prepared for optimal initialization of the  
following skip burst.  
st  
during 1 Mlower driver pulse initiation, would result in a  
too low resonant tank current at the end of the first Mlower  
switch conduction period and thus a non ZVS condition for  
the following Mupper switch turn−on process. This is why  
a full discharge of resonant capacitor is not needed before  
skip mode.  
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32  
 
NCP1399 Series  
Figure 54. Drivers turn−off sequence during transition to skip−mode from normal operation mode  
The voltage level across the resonant capacitor after the  
transition to skip mode depends on several factors:  
Actual previous Mupper switch on−time − i.e. actual  
operating frequency when skip mode comparator  
provides skip mode operation request to the internal  
logic via its output  
device family) and fixed hysteresis (V  
skip out level is thus given by  
). The  
FB_SKIP_HYST  
V
+
FB_SKIP_IN  
V
value – refer to Figure 55. The controller  
FB_SKIP_HYST  
disables drivers and enters a low consumption mode once  
the FB voltage drops below V threshold. The IC  
FB_SKIP_IN  
operation is restarted once the  
V
+
FB_SKIP_IN  
V
level is exceeded on the FB pin. As  
FB_SKIP_HYST  
Resonant tank components used in the application  
aforementioned, the controller then activates Mlower driver  
first for a predefined time (t ) to re−charge  
Actual current flowing through the resonant tank when  
1st_MLOWER_SKIP  
last Mlower driver pulse is initiated  
the bootstrap capacitor. The first Mupper driver pulse is then  
placed by the controller after DT period elapsed. The  
on−time of the first Mupper pulse is dictated by the ON−time  
comparator – i.e. the on−time depends on the actual FB pin  
voltage and CS pin input signal. The internal FB signal is  
It should be noted that the oscilloscope probe discharges the  
resonant capacitor by its resistance when connected to the  
HB pin! The probe discharge effect to the resonant capacitor  
is obvious when no−load is applied to the converter output  
and the application enters deep skip mode. This has to be  
taken into account when probing HB pin and operating  
application in skip mode.  
artificially reduced by V  
via the ramp  
1st_MUPPER_SKIP  
compensation block during this first Mupper driver pulse.  
This method helps reduce the primary current peak and  
acoustic noise during return from skip mode. The amount of  
internal FB signal and thus primary peak current  
compression is adjustable via IC option.  
The NCP1399 detects skip mode operation via FB voltage  
level. The skip comparator features an adjustable  
V
threshold (externally with the NCP1399A  
FB_SKIP_IN  
device family or internally by IC option with the NCP1399B  
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33  
NCP1399 Series  
Figure 55. NCP1399 Light−load Operating Modes versus Feedback Pin Voltage  
Detail Description of the Skip Mode Operation:  
b2) the second Mlower pulse with on−time longer  
than previous Mupper driver pulse period is placed in  
case that the ON−time comparator output is high in  
the end of regular Mlower period. The second  
Mlower pulse is prolonged in such case until the  
ON−time comparator output gets low. This technique  
ensures that the current mode operation is not lost due  
to resonant capacitor voltage imbalance that naturally  
occurs during burst operation. The application works  
with asymmetrical duty cycle in this case.  
During operation under certain load conditions in normal  
PFM mode (driving the resonant tank with 50% DC  
symmetry), if the load drops, then the load current is reduced  
and the converter operation evolves as follows:  
1. The FB voltage falls below the V  
FB_SKIP_IN  
threshold. This event can be detected by the system  
only during the Mupper switch on−time execution.  
The actual Mupper pulse on−time is stored into the  
dedicated t_Mu_on−time register. The last Mlower  
pulse with t_Ml_on−time = 3/2* t_Mu_on−time is  
introduced by the system to finish operation and  
will keep the resonant capacitor out of balance at a  
voltage below 1/2 of Vbulk. The controller then  
enters a low consumption mode in which all  
3. The dead time is placed by the system again and  
situation from point b) repeats. The b2) case  
repeats in a given skip burst pulse until the duty  
cycle symmetry of 50% is reached i.e. until the b1)  
case is reached by the system. The asymmetrical  
operation is then disabled until the new  
unnecessary blocks are turned off to reduce power  
consumption and the IC will waits as long as the  
V
threshold crossing event, i.e. until the  
FB_SKIP_IN  
feedback pin voltage stays above V  
+
application enters skip mode again.  
FB_SKIP_IN  
V
level.  
4. Application continues with given skip burst until  
FB_SKIP_HYST  
2. The FB pin voltage rises above V  
+
the V  
threshold is reached on the FB  
FB_SKIP_IN  
FB_SKIP_IN  
V
threshold. The first Mlower period  
pin. This situation is monitored during each  
Mupper driver period. The dead time is then  
placed by the driver followed by last Mlower  
driver pulse with on−time equal to 3/2 of previous  
Mupper driver period. The controller consumption  
is then minimized by turning−off all the blocks  
that are not needed. The skip comparator is  
FB_SKIP_HYST  
with pre−defined on−time width  
(t ) is placed in order to recharge  
1st_MLOWER_SKIP  
the bootstrap capacitor. The first Mupper pulse is  
then initiated after a dead−time period that lasts  
until termination by the CS comparator. The  
dead−time period is then followed by second  
Mlower pulse which on−time period could differ  
based on the actual application conditions:  
b1) the second Mlower pulse with on−time equal to  
previous Mupper driver pulse period is placed in  
case that the ON−time comparator output is low  
before end of regular Mlower period.  
monitoring FB pin voltage – waiting for new skip  
burst initialization.  
Example of imbalanced operation during the skip mode  
burst beginning can be seen in Figure 56. One can see that  
the ON−time comparator output (Yelow) is high while  
Mlower on−time is equal to the previous Mupper pulse  
width – thus the Mlower on−time period is prolonged until  
the ON−time comparator output drops.  
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34  
NCP1399 Series  
Figure 56. The on−time comparator prolongs Mlower periods in case it output is high after previous Mupper  
period is already exceeded on Mlower so imbalanced operation is placed by the system in order to keep current  
mode operation working. This functionality is active until the duty cycle symmetry reaches 50%.  
Fast transition to skip mode can occur when the load  
current diminishes abruptly and the application is working  
in full load. The frequency then quickly increases which can  
result in resonant capacitor imbalance that could lead to a  
loss of current mode operation – refer to Figure 57 for  
illustration. This is why the NCP1399 repeats previous  
Mupper on−time period in case the ON−time comparator  
output does not drop low within this time period (i.e. within  
the time equal to last Mupper on−time).  
Figure 57. Mupper on−time repetition in case of transient loading when resonant capacitor imbalance occurs and  
on−time comparator output stays high for several periods.  
Summary of the NCP1399 Skip Mode System Operation:  
When the load slowly diminishes and the operating  
frequency of the LLC converter increases, skip mode with  
wide skip bursts is naturally placed by the system first − refer  
to Figure 58. The off−time between skip bursts increases and  
the number of pulses in skip burst drops when load is  
reducing further i.e. FB voltage starts to trigger the  
V
+ V  
thresholds with lower  
FB_SKIP_IN  
FB_SKIP_HYST  
frequency. The single pulse burst operation could be reached  
under no load on the output in systems with very fast  
feedback loop response. The skip burst composes only from  
single Mupper and two Mlower pulses in such case. The  
initial Mlower pulse width of skip burst is defined by device  
option and is used for bootstrap capacitor pre−charge and  
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35  
 
NCP1399 Series  
ZVS condition preparation for following Mupper switch  
1. FB voltage skip in threshold adjust  
2. FB voltage skip hysteresis  
3. First Mlower DRV pulse width when IC is  
returning from skip mode  
4. First Mupper pulse internal FB voltage reduction  
factor when IC is returning from skip mode  
5. Actual bulk voltage value  
activation. The skip burst is always finished by the Mlower  
driver pulse with period prolonged to 3/2 of previous  
Mupper switch on time period in order to reduce resonant  
capacitor voltage and prepare system for another skip burst  
initialization.  
The overall skip mode operation of the application is  
affected by several factors:  
Figure 58. NCP1399 Operation when Load Current Drops Down to No−load Conditions  
The High Voltage Half−bridge Driver  
The driver features a traditional bootstrap circuitry,  
requiring an external high voltage diode with resistor in  
series for the capacitor refueling path. Minimum series  
resistor Rboot value is 3.3 W. Figure 59 shows the internal  
architecture of the drivers section. The device incorporates  
an upper UVLO circuitry that makes sure enough V is  
GS  
available for the upper side MOSFET.  
HV  
Vboot  
Pulse  
Trigger  
Internal Mupper  
Level  
Shifter  
S
R
Cboot  
Mupper  
HB  
Q
Q
dV/dt_P signal  
dV/dt_N signal  
dV/dt  
detector  
UVLO  
Rboot  
HB  
discharger  
HB disch. activation  
Dboot  
Vcc  
Mlower  
GND  
aux  
Vcc  
Fault  
Internal Mlower  
Delay  
Figure 59. The NCP1399 Internal DRVs Structure  
The internal dV/dt sensor, connected to the VBOOT pin,  
detects the HB pin voltage transitions in order to setup the  
optimum DT period – please refer to Dead−Time chapter.  
The internal HV discharge switch is connected to the HB pin  
and discharges resonant capacitor before application  
startup. The current through the switch is regulated to  
As stated in the maximum ratings section, the floating  
portion can go up to 620 VDC on the BOOT pin. This  
voltage range makes the IC perfectly suitable for offline  
applications featuring a 400 V PFC front stage.  
Automatic Dead−time Adjust  
The dead−time period between the Mupper and Mlower  
drivers is always needed in half bridge topologies to prevent  
any cross conduction through the power stage MOSFETs  
that would result in excessive current, high EMI noise  
I
level until the V  
threshold voltage is  
DISCHARGE  
HB_MIN  
reached on the HB pin. The discharge system assures always  
the same startup conditions for application – regardless of  
previous operating state.  
www.onsemi.com  
36  
 
NCP1399 Series  
generation or total destruction of the application. Fixed  
other protections would prevent such a situation. The  
NCP1399 implements maximum DT period clamp that  
dead−time period is often used in the resonant converters  
because this approach is simple to implement. However, this  
method does not ensure optimum operating conditions in  
resonant topologies because the magnetizing current is  
changing with line and load conditions. The optimum  
dead−time, under a given operating conditions, is equal to  
the time that is needed for bridge voltage to transition  
between upper and lower states and vice versa – refer to  
Figure 60.  
limits driver’s off−time period to the t  
DEAD_TIME_MAX  
value. The corresponding MOSFET driver is forced to  
turn−on by the internal logic regardless of missing dV/dt  
sensor signal. This situation does not occur during normal  
operation and will be considered a fault state by the device.  
There are several possibilities on how the controller  
continues operation after this event occurrence – depending  
on the IC option:  
1. The opposite MOSFET switch is forced to turn−on  
when t  
period elapses and no  
DEAD_TIME_MAX  
fault is generated  
2. The controller is latched−off in case the ZSV  
condition is not detected within selected  
t
period  
DEAD_TIME_MAX  
3. The controller stops operation and restarts  
operation after auto−recovery period in case the  
ZSV condition has not been detected within the  
selected t  
period  
DEAD_TIME_MAX  
A DT fault counter option is available. Selected number  
(N ) or DT fault events have to occur in order to  
DT_MAX  
confirm DT fault in this case.  
A fixed DT option is also available for this device. The  
internal dV/dt sensor signal is not used for this device option  
and the t  
period is used as a regular DT  
DEAD_TIME_MAX  
period instead. The DT fault detection is disabled in this  
case.  
Figure 60. Optimum Dead−time Period Adjust  
Temperature Shutdown  
The NCP1399 includes  
protection at 150°C. The typical TSD hysteresis is 30°C.  
When the temperature rises above the upper threshold, the  
controller stops switching instantaneously, and goes into the  
The MOSFET body diode conduction time is minimized  
when optimum dead−time period is used which results in  
maximum efficiency of a resonant converter power stage.  
There are several methods to determine the optimum  
dead−time period or to approximate it (for example using  
auxiliary winding on main transformer or modulating  
dead−time period with operating frequency of the  
converter). These approaches however require a dedicated  
pin for nominal dead−time adjust or auxiliary winding  
voltage sensing. The NCP1399 uses a dedicated method that  
senses the VBOOT pin voltage internally and adjusts the  
optimum dead−time period with respect to the actual  
operating conditions of the converter. The high−voltage  
dV/dt detector, connected to the VBOOT pin, delivers two  
internal digital signals that are indicating Mupper to Mlower  
and Mlower to Mupper transitions that occur on the HB and  
VBOOT pins after the corresponding MOSFET switch is  
turned−off. The controller enables the opposite MOSFET in  
the power stage once the corresponding dV/dt sensor output  
provides information about HB (or VBOOT) pin transition  
ends.  
a temperature shutdown  
off−mode with extremely low power consumption. The V  
CC  
supply is maintained (by operating the HV start−up in DSS  
mode) in order to memorize the TSD event information.  
When the temperature falls below the lower threshold, the  
full restart (including soft−start) is initiated by the controller.  
The HV startup current source features an independent  
over−temperature protection which limits its output current  
in case the DIE temperature exceeds 150°C to avoid damage  
to the HV startup silicon structure.  
APPLICATION INFORMATION  
Controller Operation Sequencing of NCP1399xy LLC  
Controller  
The paragraphs below describe controller operation  
sequencing under several typical cases as well as transitions  
between them. The NCP1399By version is used in the  
description of most operation sequences (except last  
paragraph, Figure 65 that describe NCP1399Ay version).  
The main behavior of NCP1399Ay is as same as  
NCP1399By version except for the off−mode behavior  
(REM pin function).  
The ZVS transition on the bridge pin (HB) could take a  
longer time or even does not finish in some cases – for  
example with extremely low bulk voltage or when some  
critical failure occurs. This situation should not occur  
normally in correctly designed application because several  
www.onsemi.com  
37  
 
NCP1399 Series  
1. Application start, Brown−out off and restart,  
OVP/OTP latch and then restart – Figure 61  
to hold the latch−up state memorized while the application  
remains plugged−in to the mains.  
Application is connected to the mains at point A thus the  
HV input of the controller becomes biased. The HV startup  
The power supply is removed from the mains at point H  
and the VCC voltage drops down below V  
level  
CC_RESET  
current source starts charged VCC capacitor until V  
CC  
thus the low voltage controller is released from latch. A new  
application start occurs when the user plugs the application  
the mains again.  
reaches V  
threshold.  
CC_ON  
The VCC pin voltage reached V  
threshold in point  
CC_ON  
B. The BO, FB, OVP/OTP and PFC MODE blocks are  
2. Application start, Brown−out off and restart, output  
short fault with auto−recovery restart – Figure 62  
Operating waveforms descriptions for this figure is  
similar to one for Figure 61 from point A till point G – with  
enabled. The REM input is internally pulled down for  
tREM_TIMER to assure that the secondary side will have enough  
time to recover normal operation and pulls down the remote  
optocoupler after the LLC stage restart. The VBULK/PFC  
FB pin starts to receive divided bulk voltage as the external  
HV switch is activated by PFC MODE output. The REM  
one difference. The skip mode operation (FB  
<
V
) blocks the IC startup after first V event  
FB_SKIP_IN  
CC_ON  
instead of BO_fault.  
timer is activated during each V  
event except during  
CC_ON  
The LLC converter operation is stopped in point G  
because the controller detects an overload condition (short  
circuit event in this case as the Vout drops abruptly). The  
controller disables all blocks except for the FB block and the  
fault logic. The HV startup DSS operation is initiated in  
order to keep enough VCC level for all internal blocks that  
need to be biased. Internal auto−recovery timer counts down  
the off−mode operation. The V blank is also activated  
CC  
during each V  
event to ensure that the internal logic  
CC_ON  
ignores all fault inputs until the internal blocks are fully  
biased and stabilized after a V event. The IC DRVs  
CC_ON  
were not enabled after first V blank period in this case as  
CC  
the voltage on VBULK/PFC FB is below V level. The IC  
BO  
keeps all internal blocks biased and operates in the DSS  
(Dynamic Self−Supply) mode as long as the fault conditions  
is still present.  
the recovery delay period t  
.
A−REC_TIMER  
The auto−recovery restart delay period lapses at point H.  
The HV startup current source is activated to recharge VCC  
capacitor before a new restart.  
The BO_OK condition is received (voltage on  
VBULK/PFC FB reach V level) at point C. The IC  
BO  
The V  
threshold is reached in point I and all the  
CC_ON  
activates the startup current source to refill VCC capacitor  
in order to assure sufficient energy for a new startup. The  
internal blocks are biased. The V blank, REM timer and  
CC  
OVP/OTP blank period are started at the same time. The  
LLC converter operation is enabled, including a dedicated  
startup and soft−start period. The output short circuit is  
removed in between thus the Vout ramped−up and the FB  
loop took over during the LLC converter soft−start period.  
VCC capacitor voltage reaches V  
level again and the  
CC_ON  
VCC blank period is started. The REM timer is activated  
again on this V event as well. The DRVs are enabled  
CC_ON  
and the application is started after V blank period lapses  
because there is no faults condition at that time.  
CC  
Line and also bulk voltage drops at point D so the BO_OK  
signal become low (voltage on VBULK/PFC FB drops  
3. Startup, skip−mode operation, low line detection  
and restart into skip−mode – Figure 63  
The application is plugged into the mains at point A thus  
the HV input of the controller becomes biased. The HV  
startup current source starts charging the VCC capacitor  
below V level). The LLC DRVs are disabled as well as  
BO  
OVP/OTP block bias. The PFC MODE output stay high to  
keep the bulk voltage divider connected, so the BO block  
still monitors the bulk voltage. The controller activates the  
HV startup current source into DSS mode to keep enough  
VCC voltage for operation of all blocks that are active while  
the IC is waiting for BO_OK condition.  
until V reaches the V  
threshold.  
CC  
CC_ON  
The VCC pin voltage reaches the V  
threshold at  
CC_ON  
point B. The BO, FB, OVP/OTP and PFC MODE blocks are  
enabled. The REM input is pulled down for t to  
REM_TIMER  
The line voltage and thus also bulk voltage increase at  
point E so the Brown−out block provide the BO_OK signal  
assure that the secondary side will have enough time to  
recover to normal operation and pulls down the remote  
optocoupler after the LLC stage restarts. The VBULK/PFC  
FB pin begins to receive divided bulk voltage as the external  
once the V level is reached. The startup current source is  
BO  
activated after BO_OK signal is received to charge the VCC  
capacitor for a new restart.  
HV switch is activated by the PFC MODE output. The V  
CC  
The V  
level is reached in point F. The OVP/OTP  
CC_ON  
blank period is activated during each V  
events. This  
CC_ON  
block is biased, REM timer and the VCC blank period is  
started at the same time. The controller restores operation  
via the regular startup sequence and soft−start after VCC  
blank period lapses since there is no fault condition detected.  
The application then operates normally until the  
OVP/OTP input is pulled−up at point G. The controller then  
enters latch−off mode in which all blocks are disabled except  
for the feedback block. The VCC management controls the  
HV startup in DSS mode in order to keep enough VCC level  
blank ensures that the internal logic ignores all fault inputs  
until the internal blocks are fully biased and stabilized after  
V
CC_ON  
event. The IC DRVs are not enabled even after V  
CC  
blank period ends because the OVP fault condition is  
present. The OVP fault condition disappears after some time  
so the HV startup current source is enabled to prepare  
enough V for a new startup attempt. The new V blank,  
CC  
CC  
OTP blank and REM timer periods are placed after the  
www.onsemi.com  
38  
NCP1399 Series  
V
event is detected. The controller authorizes DRVs  
detected. The application then enters skip mode again as the  
load current is low.  
CC_ON  
at point C as there are no faults conditions present after the  
blank period lapses.  
V
CC  
5. Start−up, normal operation, transition to off−mode  
operation and output re−charge in off−mode  
(NCP1399By versions) – Figure 64  
Application is connected to the mains at point A thus the  
HV input of the controller become biased. The HV startup  
The application is operating under certain load conditions  
between points C and D. The load current is reduced thus the  
FB loop reduces the primary controller FB pin voltage. The  
PFC controller is disabled (via reduced voltage on the PFC  
MODE pin to V  
value) in point D when the FB pin  
PFC_M_BO  
current source starts charging the VCC capacitor until V  
CC  
voltage drops below set voltage level on P ON/OFF pin.  
The load diminished further and the FB skip threshold is  
reached in point E. The controller turns−off all the blocks  
that are not essential for the controller operation during  
skip−mode – i.e. all blocks except FB block and VCC  
management. This technique is used to minimize the device  
consumption when there are no driver pulses during  
skip−mode operation. The output voltage then drops  
naturally and the FB loop reflects this change into the  
primary FB pin voltage that increases accordingly. The  
auxiliary winding is refilling VCC capacitor during each  
skip burst thus the controller is supplied from the application  
during the skip mode operation.  
The controller FB skip−out threshold is reached in point  
F; the controller enables all blocks and LLC DRVs to refill  
the output capacitor. The controller did not activate the HV  
startup current source because there is enough voltage  
present on the VCC pin during skip mode. The OTP blank  
periods is activated at the beginning of the skip burst to mask  
possible OTP faults.  
reaches V  
The VCC pin voltage reached V  
threshold.  
CC_ON  
threshold at point  
CC_ON  
B. The BO, FB, OVP/OTP and PFC MODE blocks are  
enabled. The REM input is pulled down for t to  
ensure that the secondary side has enough time to recover  
normal operation and pull down the remote optocoupler  
after LLC stage restarts. The VBULK/PFC FB pin starts to  
receive the divided bulk voltage as the external HV switch  
is activated by the PFC MODE output. The V blank  
period is activated during each V  
ensures that the internal logic ignores all fault inputs until the  
internal blocks is fully biased and stabilized after V  
event.  
REM_TIMER  
CC  
event. This blank  
CC_ON  
CC_ON  
The IC DRVs are enabled immediately after V blank  
CC  
period ends as there was no fault present at that time. The  
application is operating under certain load conditions  
between points C and D. The load current is reduced thus the  
FB loop lowers the primary controller FB pin level. The PFC  
controller is disabled (via reduced voltage on the PFC  
MODE pin to V  
voltage drops below the set voltage level on the P ON/OFF  
pin.  
value) at point D when the FB pin  
PFC_M_BO  
Note: The VCC capacitor needs to be chosen with a value  
high enough to ensure that V will not drop below the  
CC  
V
level during skip mode. The device would  
CC_OFF  
The secondary controller activates off−mode operation  
thus the REM input voltage exceeds the V  
otherwise restart operation via standard startup sequence in  
such a case (i.e. ramp−up the V to V level first and  
REM_OFF  
CC  
CC_ON  
threshold at point E. The controller turns−off all the blocks  
that are not essential for controller operation during  
off−mode – i.e. all blocks including FB block and a large  
portion of the VCC management. This technique is used to  
minimize device consumption when there are no driver  
pulses during off−mode operation. The output voltage is  
then dropped naturally due to secondary controller and  
resistive dividers consumption. The primary controller is  
supplied from the HV startup current source that is operated  
in DSS.  
enable drivers afterwards) for NCP1399By version or enters  
into off−mode for NCP1399Ay (refer to Figure 65).  
The line voltage drops in point G, but the bulk voltage is  
dropping slowly as there is nearly no consumption from the  
bulk capacitor during skip mode – only some refilling bursts  
are provided by the controller. The application thus  
continues in skip mode operation for several skip burst  
cycles.  
The bulk voltage level less than V threshold is detected  
BO  
by the controller in point H during one of the skip burst  
pulses. The controller thus disabled DRVs and enters DSS  
mode of operation in which the OVP/OTP block is disabled  
and the controller is waiting for BO_OK event. The PFC  
The secondary controller interrupts off−mode operation  
by activating a remote optocoupler and pulling down the  
REM pin at point F. The controller activates HV startup  
current source and recharges the VCC capacitor to prepare  
MODE provides the V  
voltage in this case to  
PFC_M_ON  
enough V voltage for new startup.  
CC  
allow the PFC stage to refill bulk capacitors.  
The V voltage reaches V  
threshold at point G  
CC  
CC_ON  
The line voltage is increased at point I thus the controller  
receives the BO_OK signal. The BO_OK signal is received  
during the period in which the HV startup current source is  
active and refills the VCC capacitor.  
and the LLC converter starts (including soft−start)  
immediately after a V blank period ends as there is no  
CC  
fault detected at the end of this period.  
The output voltage is ramped up while the FB loop is not  
This V  
threshold is reached by the VCC pin at point  
CC_ON  
closed yet as the V  
is still below regulation level. The  
OUT  
J. The V blank period, OVP/OTP blank and REM timer  
CC  
output voltage then reaches regulation level and the FB pin  
voltage drops abruptly on the primary – hitting the FB  
period are started at the same time. The full startup sequence  
is enabled at the end of the V blank period as no fault is  
CC  
www.onsemi.com  
39  
NCP1399 Series  
skip−in threshold at point H. The LLC drivers are thus  
all blocks including FB block and big portion of the VCC  
management. This technique is used to minimize device  
consumption when there are no drive pulses during  
off−mode operation. The output voltage is then dropped  
naturally due to secondary controller and resistive dividers  
consumption. The primary controller is supplied from the  
HV startup current source that operates in DSS mode.  
The secondary controller interrupts off−mode operation  
by releasing the optocoupler and allowing the voltage on FB  
pin to ramp−up by the internal pull−up current source at  
point G. The controller activates the HV startup current  
source and recharges the VCC capacitor to prepare enough  
disabled by skip comparator. The FB then increased  
naturally – calling for new skip burst (refer to skip mode  
operation description in previous part).  
Secondary controller activates the off−mode operation by  
releasing the remote optocoupler while the primary  
controller is operating in skip−mode. The REM pin voltage  
thus increases slowly up and hit the V  
threshold  
REM_OFF  
where the primary controller enters off−mode operation  
again at point I.  
6. Start−up, normal operation, transition to off−mode  
operation and output re−charge in off−mode  
(NCP1399Ay versions) – Figure 65  
Operating waveforms descriptions for this figure are the  
same as for Figure 64 from point A until point D – Please  
refer to Figure 64 for details regarding operation between  
these time events.  
V
CC  
voltage for a new startup.  
The V voltage reaches V  
threshold at point H  
CC_ON  
CC  
and the LLC converter starts (including soft−start)  
immediately after a V blank period ends as there is no  
CC  
fault detected at the end of the period.  
The output voltage is ramped up while the FB loop is not  
The secondary controller activates off−mode operation by  
closed yet as the V  
is still below regulation level. The  
OUT  
pulling FB pin below V  
level, thus the IC goes  
FB_REM_OFF  
output voltage then reaches regulation level and the FB pin  
voltage drops abruptly on the primary – hitting the FB  
skip−in threshold at point I. The LLC drivers are thus  
disabled by the skip comparator. The FB then increases  
naturally – calling for new skip burst (refer to skip mode  
operation description in previous text).  
into skip−mode for long time at point E. The controller  
turns−off all the blocks that are not essential for controller  
operation during skip−mode – i.e. all blocks except FB, BO  
and VCC management blocks. This technique is used to  
minimize device consumption when there are no driver  
pulses during skip−mode operation.  
The secondary controller activates off−mode operation by  
The V  
drops naturally by IC consumption below  
CC  
pulling−down FB pin and V  
voltage naturally drops  
CC  
V
threshold at point F – i.e. the off−mode is  
CC_OFF  
below V  
threshold. The primary controller enters  
CC_OFF  
confirmed. The controller turns−off all the blocks that are  
not essential for controller operation during off−mode – i.e.  
off−mode operation again at point J.  
www.onsemi.com  
40  
NCP1399 Series  
Figure 61. Application Start, Brown−out Off and Restart, OVP/OTP Latch and then Restart  
www.onsemi.com  
41  
NCP1399 Series  
Figure 62. Application Start, Brown−out Off and Restart,  
Output Short Fault with Auto−recovery Restart  
www.onsemi.com  
42  
NCP1399 Series  
Figure 63. Startup, Skip−mode Operation, Low Lone Detection and Restart into Skip  
www.onsemi.com  
43  
NCP1399 Series  
Figure 64. Start−up, Normal Operation, Transition to Off−mode Operation  
and Output Re−charge in Off−mode – NCP1399By Version  
www.onsemi.com  
44  
NCP1399 Series  
Figure 65. Start−up, Normal Operation, Transition to Off−mode Operation  
and Output Re−charge in Off−mode – NCP1399Ay Version  
www.onsemi.com  
45  
NCP1399 Series  
PACKAGE DIMENSIONS  
SOIC−16 NB MISSING PINS 2 AND 13  
CASE 751DU  
ISSUE O  
NOTE 5  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
D
A
2X  
16  
9
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.  
ALLOWABLE PROTRUSION SHALL BE 0.10 mm IN EXCESS OF  
MAXIMUM MATERIAL CONDITION.  
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS  
OR GATE BURRS SHALL NOT EXCEED 0.25 mm PER SIDE.  
DIMENSIONS D AND E ARE DETERMINED AT DATUM F.  
5. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM F.  
6. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING  
PLANE TO THE LOWEST POINT ON THE PACKAGE BODY.  
0.10 C D  
F
NOTE 4  
E
E1  
NOTE 6  
A1  
L
L2  
1
8
0.20 C  
SEATING  
PLANE  
C
MILLIMETERS  
B
NOTE 5  
14X b  
DETAIL A  
2X 4 TIPS  
DIM MIN  
MAX  
1.75  
0.25  
0.49  
0.25  
10.00  
M
0.25  
C A-B D  
A
A1  
b
1.35  
0.10  
0.35  
0.17  
9.80  
TOP VIEW  
2X  
c
0.10 C A-B  
0.10 C  
DETAIL A  
D
D
E
6.00 BSC  
0.10 C  
E1  
e
3.90 BSC  
1.27 BSC  
L
0.40  
1.27  
0.203 BSC  
L2  
e
END VIEW  
A
SEATING  
C
PLANE  
SIDE VIEW  
RECOMMENDED  
SOLDERING FOOTPRINT  
14X  
1.52  
16  
1
9
7.00  
8
14X  
0.60  
1.27  
PITCH  
DIMENSIONS: MILLIMETERS  
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NCP1399/D  

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SI9130DB

5- and 3.3-V Step-Down Synchronous Converters

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VISHAY

SI9135LG-T1

SMBus Multi-Output Power-Supply Controller

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VISHAY

SI9135LG-T1-E3

SMBus Multi-Output Power-Supply Controller

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SI9135_11

SMBus Multi-Output Power-Supply Controller

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VISHAY

SI9136_11

Multi-Output Power-Supply Controller

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SI9130CG-T1-E3

Pin-Programmable Dual Controller - Portable PCs

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VISHAY

SI9130LG-T1-E3

Pin-Programmable Dual Controller - Portable PCs

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VISHAY

SI9130_11

Pin-Programmable Dual Controller - Portable PCs

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VISHAY

SI9137

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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VISHAY

SI9137DB

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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VISHAY

SI9137LG

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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VISHAY

SI9122E

500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

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VISHAY