NCP153MX330180TCG [ONSEMI]
LDO Regulator, 130 mA, Dual Output, Low Iq, High PSRR, with Foldback;
| 型号： | NCP153MX330180TCG |
| 厂家： | 
ONSEMI |
| 描述： | LDO Regulator, 130 mA, Dual Output, Low Iq, High PSRR, with Foldback 光电二极管 输出元件 调节器 |
| 文件： | 总15页 (文件大小：804K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCP153
LDO Regulator - Dual,
Low IQ
130 mA
The NCP153 is 130 mA, Dual Output Linear Voltage Regulator that
provides a very stable and accurate voltage with very low noise and
high Power Supply Rejection Ratio (PSRR) suitable for RF
applications. In order to optimize performance for battery operated
portable applications, the NCP153 employs the Adaptive Ground
Current Feature for low ground current consumption during light−load
conditions. Device also incorporates foldback current protection to
reduce short circuit current and protect powered devices.
www.onsemi.com
MARKING
DIAGRAM
GA M
XDFN6, 1.2x1.2
CASE 711AT
Features
GA = Specific Device Code
= Date Code
• Operating Input Voltage Range: 1.9 V to 5.25 V
• Two Independent Output Voltages:
M
(for details please refer to the Ordering Information section)
• Very Low Dropout: 130 mV Typical at 130 mA
PIN CONNECTIONS
• Low IQ of typ. 50 mA per Channel
• High PSRR: 75 dB at 1 kHz
• Two Independent Enable Pins
• Over Current Protection: 165 mA Typical
• Foldback Short Circuit Protection
• Thermal Shutdown
OUT1
1
2
3
6
5
4
EN1
IN
OUT2
GND
EN2
• Stable with a 0.22 mF Ceramic Output Capacitor
• Available in XDFN6 1.2 x 1.2 mm Package
• Active Output Discharge for Fast Output Turn−Off
• These are Pb−Free Devices
XDFN6
(Top view)
Typical Applications
• Smartphones, Tablets, Wireless Handsets
• Wireless LAN, Bluetooth , ZigBee Interfaces
• Other Battery Powered Applications
ORDERING INFORMATION
See detailed ordering and shipping information on page 13 of
this data sheet.
®
®
NCP153
V
IN1
V
OUT2
IN
OUT2
OUT1
EN1
EN2
V
OUT1
GND
C
IN1
C
OUT2
0.22 mF
C
OUT1
0.22 mF
0.22 mF
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
September, 2019 − Rev. 2
NCP153/D
NCP153
ENABLE
LOGIC
THERMAL
SHUTDOWN
EN1
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT1
ACTIVE
DISCHARGE
EN1
EN2
GND
IN
ACTIVE
DISCHARGE
BANDGAP
REFERENCE
OUT2
MOSFET
DRIVER WITH
CURRENT LIMIT
THERMAL
SHUTDOWN
ENABLE
LOGIC
EN2
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
XDFN6
Pin
Name
Description
1
OUT1
Regulated output voltage of the first channel. A small 0.22 mF ceramic capacitor is needed from this pin to
ground to assure stability.
2
OUT2
Regulated output voltage of the second channel. A small 0.22 mF ceramic capacitor is needed from this pin
to ground to assure stability.
3
4
GND
EN2
Power supply ground. Soldered to the copper plane allows for effective heat dissipation.
Driving EN2 over 0.9 V turns−on OUT2. Driving EN below 0.4 V turns−off the OUT2 and activates the active
discharge.
5
6
IN
Input pin common for both channels. It is recommended to connect 0.22 mF ceramic capacitor close to the
device pin.
EN1
Driving EN1 over 0.9 V turns−on OUT1. Driving EN below 0.4 V turns−off the OUT1 and activates the active
discharge.
−
EP
Exposed pad must be tied to ground. Soldered to the copper plane allows for effective thermal dissipation.
www.onsemi.com
2
NCP153
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
V
Input Voltage (Note 1)
Output Voltage
VIN
−0.3 V to 6 V
V
,
−0.3 V to VIN + 0.3 V or 6 V
V
OUT1
V
OUT2
Enable Inputs
V
,
−0.3 V to 6 V
V
EN1
V
EN2
Output Short Circuit Duration
t
Indefinite
150
s
°C
°C
V
SC
Maximum Junction Temperature
Storage Temperature
T
J(MAX)
T
STG
−55 to 150
2000
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Model (Note 2)
ESD
HBM
ESD
200
V
MM
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS (Note 3)
Rating
Symbol
Value
Unit
Thermal Characteristics, XDFN6 1.2 x 1.2 mm,
Thermal Resistance, Junction−to−Air
°C/W
q
q
170
JA
JL
Thermal Characterization Parameter, Junction−to−Lead (Pin 2)
3. Single component mounted on 1 oz, FR4 PCB with 645mm2 Cu area.
www.onsemi.com
3
NCP153
ELECTRICAL CHARACTERISTIC
−40°C ≤ T ≤ 85°C; V = V
+ 1 V or 2.5 V, whichever is greater; V = 0.9 V, I
= 1 mA, C = C
= 0.22 mF. Typical
J
IN
OUT(NOM)
EN
OUT
IN
OUT
values are at T = +25°C. Min/Max values are specified for T = −40°C and T = 85°C respectively. (Note 4)
J
J
J
Parameter
Test Conditions
Symbol Min
1.9
Typ
Max
5.25
+2
Unit
V
Operating Input Voltage
Output Voltage Accuracy
V
IN
V
V
> 2 V
V
OUT
−2
%
OUT
−40°C ≤ T ≤ 85°C
J
≤ 2 V
−60
+60
0.1
mV
%/V
mV
OUT
Line Regulation
Load Regulation
V
+ 0.5 V or 2.5 V ≤ V ≤ 5 V
Reg
0.02
15
OUT
IN
LINE
I
= 1 mA to 130 mA, T = +25°C
Reg
50
OUT
J
LOAD
V
= 1.8 V
= 3.3 V
265
130
280
150
OUT(nom)
OUT(nom)
Dropout Voltage (Note 5)
I
= 130 mA, T = +25°C
V
DO
mV
OUT
J
V
Output Current
OCP Level
T = +25°C
I
130
135
mA
mA
mA
mA
J
OUT
V
OUT
V
OUT
I
= 90% V
, T = +25°C
I
OCP
165
55
195
100
OUT(nom)
J
Short Circuit Current
Quiescent Current
= 0 V, T = +25°C
I
SC
J
= 0 mA, EN1 = V , EN2 = 0 V or EN2 = V
,
I
Q
50
OUT
EN1 = 0 V
IN
IN
I
= I
= 0 mA, V
= V
= V
IN
I
85
200
1
mA
mA
V
OUT1
OUT2
EN1
EN2
Q
Shutdown Current (Note 6)
V
≤ 0.4 V, V = 5.25 V
I
DIS
0.1
EN
IN
EN Pin Threshold Voltage
High Threshold
Low Threshold
V
V
Voltage increasing
Voltage decreasing
V
V
0.9
EN
EN
EN_HI
EN_LO
0.4
1.0
EN Pin Input Current
V
V
= V = 5.25 V
I
EN
0.3
75
mA
EN
IN
Power Supply Rejection Ratio
= V
+1 V for V
OUT
> 2 V, V =
IN
= 10 mA
f = 1 kHz PSRR
dB
IN
OUT
OUT
OUT
2.5 V, for V
≤ 2 V, I
Output Noise Voltage
f = 10 Hz to 100 kHz
= 4 V, V < 0.4 V
V
75
50
mV
rms
N
Active Discharge Resistance
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
V
IN
R
DIS
W
EN
Temperature increasing from T = +25°C
T
SD
160
20
°C
°C
J
Temperature falling from T
T
SDH
−
−
SD
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at T = T
J
A
= 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Characterized when V
falls 100 mV below the regulated voltage at V = V
+ 1 V.
OUT
IN
OUT(NOM)
6. Shutdown Current is the current flowing into the IN pin when the device is in the disable state.
www.onsemi.com
4
NCP153
TYPICAL CHARACTERISTICS
1.85
1.84
1.83
1.82
1.81
1.80
1.79
1.78
1.77
3.35
3.34
3.33
3.32
I
= 1 mA
OUT
3.31
3.30
3.29
3.28
3.27
I
= 1 mA
OUT
I
= 130 mA
I
= 130 mA
OUT
OUT
V
V
C
C
= 4.3 V
V
V
C
C
= 2.8 V
IN
IN
= 3.3 V
= 0.22 mF
= 0.22 mF
= 1.8 V
= 0.22 mF
= 0.22 mF
OUT
OUT
IN
IN
3.26
3.25
1.76
1.75
OUT
OUT
−40 −25 −10
5
20
35
50
65
80
95
−40 −25 −10
5
20
35
50
65
80 95
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 3. Output Voltage vs. Temperature –
OUT = 1.8 V
Figure 4. Output Voltage vs. Temperature –
VOUT = 3.3 V
V
450
400
350
300
250
200
150
100
750
675
600
525
450
375
V
= V
OUT1−LOAD
OUT2−LOAD
= V ,
V
V
V
C
C
= 4.3 V
V
= 4.3 V
IN
EN1
EN2 IN
IN
T = 85°C
J
= 3.3 V
V
OUT
= 3.3 V
= 0.22 mF
= 0.22 mF
OUT
OUT
= V
= V
C
C
EN1
EN2
IN
IN
T = 25°C
= 0.22 mF
J
IN
= 0.22 mF
OUT
V
= V
= V ,
EN2 IN
EN1
OUT1−LOAD
300
225
150
T = −40°C
J
V
= 0 V, V
OUT1−LOAD
= V ,
EN2 IN
EN1
50
0
75
0
0.001 0.01
0.1
1
10
100
1000
0
13 26 39 52 65 78 91 104 117 130
, OUTPUT CURRENT (mA)
I
, OUTPUT CURRENT (mA)
I
OUT
OUT
Figure 5. Ground Current vs. Output Current –
One Output Load
Figure 6. Ground Current vs. Output Current –
Different Load Combinations
100
90
80
70
60
50
40
30
20
0.05
0.04
0.03
0.02
0.01
0
85°C
−40°C
25°C
−0.01
−0.02
−0.03
V
V
I
C
C
= 2.5 V to 5.25 V
IN
V
V
C
C
= 4.3 V
= 3.3 V
= 0.22 mF
= 0.22 mF
IN
= 1.8 V
OUT
OUT
= 1 mA
OUT
IN
= 0.22 mF
IN
−0.04
−0.05
10
0
OUT
= 0.22 mF
OUT
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
, INPUT VOLTAGE (V)
−40 −25 −10
5
20
35
50
65
80 95
V
IN
T , JUNCTION TEMPERATURE (°C)
J
Figure 7. Quiescent Current vs. Input Voltage
– Both Outputs ON
Figure 8. Line Regulation vs. Temperature −
V
OUT = 1.8 V
www.onsemi.com
5
NCP153
TYPICAL CHARACTERISTICS
0.05
0.04
0.03
0.02
0.01
0
10
V
V
= 2.5 V
9
8
7
6
5
4
3
2
IN
= 3.3 V
OUT
I
= 1 mA to 130 mA
= 0.22 mF
OUT
C
C
IN
= 0.22 mF
OUT
−0.01
−0.02
−0.03
V
V
I
C
C
= 4.3 V to 5.25 V
IN
= 3.3 V
OUT
= 1 mA
OUT
= 0.22 mF
IN
−0.04
−0.05
1
0
= 0.22 mF
OUT
−40 −25 −10
5
20
35
50
65
80
95
−40 −25 −10
5
20
35
50
65
80 95
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 9. Line Regulation vs. Temperature −
Figure 10. Load Regulation vs. Temperature −
V
OUT = 3.3 V
VOUT = 1.8 V
300
270
240
210
180
150
120
90
10
9
V
V
C
C
= 2.8 V
IN
T = 85°C
= 1.8 V
= 0.22 mF
= 0.22 mF
J
OUT
8
IN
T = 25°C
J
7
OUT
6
5
T = −40°C
J
4
V
V
= 4.3 V
IN
= 3.3 V
3
OUT
I
= 1 mA to 130 mA
= 0.22 mF
OUT
2
60
C
C
IN
1
0
= 0.22 mF
30
0
OUT
−40 −25 −10
5
20
35
50
65
80
95
0
13 26 39
52 65 78 91 104 117 130
T , JUNCTION TEMPERATURE (°C)
J
I , OUTPUT CURRENT (mA)
OUT
Figure 11. Load Regulation vs. Temperature −
OUT = 3.3 V
Figure 12. Dropout Voltage vs. Output Current
– VOUT = 1.8 V
V
200
180
160
140
120
100
80
350
315
280
245
210
175
140
105
70
V
V
C
C
= 2.8 V
V
V
C
C
= 4.3 V
IN
IN
= 1.8 V
= 3.3 V
= 0.22 mF
= 0.22 mF
OUT
OUT
T = 85°C
J
= 0.22 mF
IN
I
= 130 mA
= 75 mA
IN
OUT
= 0.22 mF
OUT
OUT
T = 25°C
J
I
OUT
T = −40°C
J
60
40
I
= 0 mA
50
OUT
20
0
35
0
0
13 26 39
52 65 78 91 104 117 130
−40 −25 −10
5
20
35
65
80 95
I , OUTPUT CURRENT (mA)
OUT
T , JUNCTION TEMPERATURE (°C)
J
Figure 13. Dropout Voltage vs. Output Current
– VOUT = 3.3 V
Figure 14. Dropout Voltage vs. Temperature –
VOUT = 1.8 V
www.onsemi.com
6
NCP153
TYPICAL CHARACTERISTICS
200
180
160
140
120
100
80
300
270
240
V
V
C
C
= 4.3 V
IN
= 3.3 V
OUT
= 0.22 mF
IN
= 0.22 mF
OUT
210
I
= 130 mA
OUT
180
150
I
= 75 mA
OUT
120
V
V
C
C
= 4.3 V
60
90
IN
= 3.3 V
I
= 0 mA
OUT
OUT
40
60
= 0.22 mF
IN
30
0
20
0
= 0.22 mF
OUT
−40 −25 −10
5
20
35
50
65
80
95
−40 −25 −10
5
20
35
50
65
80 95
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 15. Dropout Voltage vs. Temperature –
OUT = 3.3 V
Figure 16. Current Limit vs. Temperature
V
4.0
3.6
3.2
2.8
2.4
2.0
1.6
1.2
0.8
100
90
80
70
60
50
40
30
20
T = −40°C
J
T = 25°C
J
T = 85°C
J
V
V
C
C
= 4.3 V
= 0 V
V
V
C
C
= 4.3 V
IN
IN
= 3.3 V
= 0.22 mF
= 0.22 mF
OUT
OUT
= 0.22 mF
= 0.22 mF
IN
IN
0.4
0
10
0
OUT
OUT
−40 −25 −10
5
20
35
50
65
80
95
0
20 40 60
80 100 120 140 160 180 200
T , JUNCTION TEMPERATURE (°C)
J
I , OUTPUT CURRENT (mA)
OUT
Figure 17. Short Circuit Current vs.
Temperature
Figure 18. Current Foldback Protection − 3.3 V
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
200
180
160
140
120
100
80
T = −40°C
J
T = 25°C
J
T = 85°C
J
V
V
C
C
= 5.5 V
60
IN
V
V
= 2.8 V
IN
= 3.3 V
OUT
= 1.8 V
OUT
40
= 0.22 mF
IN
C
C
= 0.22 mF
IN
0.2
0
20
0
= 0.22 mF
OUT
= 0.22 mF
OUT
0
20 40 60
80 100 120 140 160 180 200
−40 −25 −10
5
20
35
50
65
80
95
I , OUTPUT CURRENT (mA)
OUT
T , JUNCTION TEMPERATURE (°C)
J
Figure 19. Current Foldback Protection − 1.8 V
Figure 20. Disable Current vs. Temperature
www.onsemi.com
7
NCP153
TYPICAL CHARACTERISTICS
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Unstable Operation
10
1
OFF −> ON
ON −> OFF
V
OUT
= 3.3 V
V
OUT
= 1.8 V
Stable Operation
V
V
C
C
= 4.3 V
IN
0.1
= 3.3 V
OUT
= 0.22 mF
IN
0.1
0
= 0.22 mF
OUT
0.01
0
13 26 39
52 65 78 91 104 117 130
−40 −25 −10
5
20
35
50
65
80 95
I , OUTPUT CURRENT (mA)
OUT
T , JUNCTION TEMPERATURE (°C)
J
Figure 22. Stability vs. ESR
Figure 21. Enable Voltage Threshold vs.
Temperature
500
450
400
350
300
250
200
150
100
50
45
40
35
30
25
20
15
10
V
V
C
C
= 4.3 V
V
V
C
C
= 4.3 V
IN
IN
= 3.3 V
= 0.22 mF
= 0.22 mF
= 3.3 V
= 0.22 mF
= 0.22 mF
OUT
OUT
OUT
IN
IN
50
0
5
0
OUT
−40 −25 −10
5
20
35
50
65
80
95
−40 −25 −10
5
20
35
50
65
80 95
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 23. Current To Enable Pin vs.
Temperature
Figure 24. Discharge Resistance vs.
Temperature
100
90
100
90
80
70
60
80
1 mA
1 mA
70
10 mA
10 mA
60
50
40
30
20
50
40
30
20
V
V
C
C
= 2.8 V
V
V
C
C
= 4.3 V
IN
IN
= 1.8 V
= none
= 3.3 V
= none
OUT
OUT
IN
IN
100 mA
10M
100 mA
1M 10M
= 0.22 mF
= 0.22 mF
10
0
10
0
OUT
OUT
100
1K
10K
100K
1M
100
1K
10K
100K
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 25. Power Supply Rejection Ratio,
OUT = 1.8 V, COUT = 0.22 mF
Figure 26. Power Supply Rejection Ratio,
V
VOUT = 3.3 V, COUT=0.22 mF
www.onsemi.com
8
NCP153
TYPICAL CHARACTERISTICS
10K
1K
10 mA
RMS Output Noise (mV)
10 Hz − 100 kHz 100 Hz − 100 kHz
100 mA
I
OUT
1 mA
10 mA
100 mA
68.07
67.30
68.31
67.07
66.31
67.35
100
V
V
C
C
= 2.8 V
IN
= 1.8 V
OUT
= 0.22 mF
IN
1 mA
10
1
= 0.22 mF
OUT
MLCC, X7R,
1206 size
10
100
1K
10K
100K
1M
FREQUENCY (Hz)
Figure 27. Output Voltage Noise Spectral
Density for VOUT = 1.8 V, COUT = 220 nF
10K
1K
10 mA
100 mA
RMS Output Noise (mV)
10 Hz − 100 kHz 100 Hz − 100 kHz
I
OUT
100
1 mA
10 mA
100 mA
108.34
107.18
109.12
106.75
105.56
107.54
V
V
C
C
= 4.3 V
IN
= 3.3 V
OUT
= 0.22 mF
IN
10
1
1 mA
= 0.22 mF
OUT
MLCC, X7R,
1206 size
10
100
1K
10K
100K
1M
FREQUENCY (Hz)
Figure 28. Output Voltage Noise Spectral
Density for VOUT = 3.3 V, COUT = 220 nF
www.onsemi.com
9
NCP153
TYPICAL CHARACTERISTICS
V
I
V
V
= 4.3 V
V
EN
IN
EN
= 3.3 V
OUT1
I
IN
IN
V
V
V
= 3.8 V
IN
V
= 1.8 V
OUT2
= 3.3 V
= disable
OUT1
OUT2
I
= 10 mA
= 1 mA
OUT1
V
V
V
V
OUT1
OUT1
I
= 10 mA
= C
OUT1
C
= 1 mF
OUT2
I
OUT1
OUT2
OUT2
OUT2
C
= C
= 1 mF
OUT1
OUT2
40 ms/div
40 ms/div
Figure 29. Enable Turn−on Response –
Figure 30. Enable Turn−on Response –
VR1 = 10 mA, VR2 = Off
VR1 = 10 mA, VR2 = 1 mA
V
IN
t
= 1 ms
FALL
t
= 1 ms
V
IN
RISE
V
OUT2
V
V
OUT2
V
= 3.8 V to 4.8 V
= 10 mA
V
= 4.8 V to 3.8 V
= 10 mA
IN
IN
V
OUT1
I
I
OUT2
OUT1
OUT2
C
C
= 220 nF
= 220 nF
C
C
= 220 nF
= 220 nF
OUT1
OUT2
OUT1
OUT2
2 ms/div
2 ms/div
Figure 31. Line Transient Response – Rising
Edge, VEN1 = VEN2 = VIN, VOUT1 = 3.3 V,
IOUT1 = 10 mA
Figure 32. Line Transient Response – Falling
Edge, VEN1 = VEN2 = VIN, VOUT1 = 3.3 V,
IOUT1 = 10 mA
I
OUT1
t
= 1 ms
t
= 1 ms
RISE
FALL
I
OUT1
V
V
= 4.3 V
V
= 4.3 V
IN
IN
V
V
= 3.3 V
V
OUT1
= 3.3 V
OUT1
V
V
OUT1
OUT1
V
OUT2
I
= 1.8 V
= 0 mA
V
I
= 1.8 V
= 0 mA
OUT2
OUT2
OUT2
OUT2
OUT2
C
C
= 220 nF
= 220 nF
C
C
= 220 nF
= 220 nF
OUT1
OUT2
OUT1
OUT2
4 ms/div
4 ms/div
Figure 33. Load Transient Response – Rising
Edge, IOUT = 1 mA to 130 mA – 3.3 V
Figure 34. Load Transient Response– Falling
Edge, IOUT = 130 mA to 1 mA – 3.3 V
www.onsemi.com
10
NCP153
TYPICAL CHARACTERISTICS
V
V
V
= 4.3 V
I
IN
OUT2
= 3.3 V
= 1.8 V
OUT1
OUT2
t
= 1 ms
FALL
I
= 0 mA
OUT1
t
= 1 ms
RISE
I
OUT2
V
V
= 4.3 V
V
V
IN
OUT1
V
V
= 3.3 V
OUT1
OUT1
C
C
= 220 nF
= 220 nF
OUT1
OUT2
V
OUT2
I
= 1.8 V
= 0 mA
OUT2
OUT2
OUT1
C
C
= 220 nF
= 220 nF
OUT1
OUT2
4 ms/div
4 ms/div
Figure 35. Load Transient Response – Rising
Edge, IOUT = 1 mA to 130 mA – 1.8 V
Figure 36. Load Transient Response – Falling
Edge, IOUT = 130 mA to 1 mA – 1.8 V
V
V
V
I
= 4.3 V
I
IN
OUT2
= 3.3 V
= 1.8 V
OUT1
OUT2
t
= 1 ms
FALL
= 0 mA
t
= 1 ms
OUT1
RISE
I
OUT2
V
V
V
I
= 4.3 V
IN
= 3.3 V
OUT1
C
C
= 220 nF
= 220 nF
OUT1
OUT2
= 1.8 V
OUT2
V
V
OUT1
= 0 mA
V
V
OUT1
OUT1
OUT2
OUT2
C
C
= 220 nF
= 220 nF
OUT1
OUT2
4 ms/div
4 ms/div
Figure 37. Load Transient Response – Rising
Edge, IOUT = 0.1 mA to 130 mA
Figure 38. Load Transient Response – Falling
Edge, IOUT = 130 mA to 0.1 mA
V
V
V
= 4.3 V
IN
V
IN
= 3.3 V
= 1.8 V
OUT1
OUT2
V
EN
t
= 1 ms
FALL
V
V
OUT1
OUT2
V
V
V
= 4.3 V
V
OUT1
IN
C
= 4.7 mF
OUT
= 3.3 V
= 1.8 V
OUT1
OUT2
C
= 1 mF
OUT
I
I
= 10 mA
= 10 mA
OUT1
OUT2
C
C
= C
=
IN
OUT1
= 220 nF
OUT1
20 ms/div
200 ms/div
Figure 39. Turn−on/off − Slow Rising VIN
Figure 40. Enable Turn−off
www.onsemi.com
11
NCP153
APPLICATIONS INFORMATION
General
disable state the device consumes as low as typ. 10 nA from
the V .
The NCP153 is a dual output high performance 130 mA
IN
Low Dropout Linear Regulator. This device delivers very
high PSRR (75 dB at 1 kHz) and excellent dynamic
performance as load/line transients. In connection with low
quiescent current this device is very suitable for various
battery powered applications such as tablets, cellular
phones, wireless and many others. Each output is fully
protected in case of output overload, output short circuit
condition and overheating, assuring a very robust design.
The NCP153 device is housed in XDFN−6 1.2 mm x
1.2 mm package which is useful for space constrains
application.
If the EN pin voltage >0.9 V the device is guaranteed to
be enabled. The NCP153 regulates the output voltage and
the active discharge transistor is turned−off.
The both EN pin has internal pull−down current source
with typ. value of 300 nA which assures that the device is
turned−off when the EN pin is not connected. In the case
where the EN function isn’t required the EN should be tied
directly to IN.
Foldback Short Circuit Protection
The internal foldback limits short circuit current to typical
55 mA and protects powered device against overheating.
Maximum output current is internaly limited to 165 mA
(typ). The current limit and short circuit protection will work
properly over whole temperature range and also input
voltage range. There is no limitation for the short circuit
duration. Thess protections are independent for each
channel. Short circuit on the one channel do not influence
second channel which will work according to specification.
Input Capacitor Selection (CIN)
It is recommended to connect at least a 0.22 mF Ceramic
X5R or X7R capacitor as close as possible to the IN pin of
the device. Thiscapacitor will provide a low impedance path
for unwanted AC signals or noise modulated onto constant
input voltage. There is no requirement for the min. or max.
ESR of the input capacitor but it is recommended to use
ceramic capacitors for their low ESR and ESL. A good input
capacitor will limit the influence of input trace inductance
and source resistance during sudden load current changes.
Larger input capacitor may be necessary if fast and large
load transients are encountered in the application.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (T − 160°C typical), Thermal Shutdown event
SD
is detected and the affected channel is turn−off. Second
channel still working. The channel which is overheated will
remain in this state until the die temperature decreases below
Output Decoupling (COUT
)
The NCP153 requires an output capacitor for each output
connected as close as possible to the output pin of the
regulator. The recommended capacitor value is 0.22 mF and
X7R or X5R dielectric due to its low capacitance variations
over the specified temperature range. The NCP153 is
designed to remain stable with minimum effective
capacitance of 0.15 mF to account for changes with
temperature, DC bias and package size. Especially for small
package size capacitors such as 0201 the effective
capacitance drops rapidly with the applied DC bias.
the Thermal Shutdown Reset threshold (T
typical). Once the device temperature falls below the 140°C
the appropriate channel is enabled again. The thermal
− 140°C
SDU
shutdown feature provides the protection from
a
catastrophic device failure due to accidental overheating.
This protection is not intended to be used as a substitute for
proper heat sinking. The long duration of the short circuit
condition to some output channel could cause turn−off other
output when heat sinking is not enough and temperature of
the other output reach T temperature.
SD
There is no requirement for the minimum value of
Power Dissipation
Equivalent Series Resistance (ESR) for the C
but the
OUT
As power dissipated in the NCP153 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part.
maximum value of ESR should be less than 2 W. Larger
output capacitors and lower ESR could improve the load
transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
The maximum power dissipation the NCP153 can handle
is given by:
Enable Operation
The NCP153 uses the dedicated EN pin for each output
channel. This feature allows driving outputs separately.
If the EN pin voltage is <0.4 V the device is guaranteed to
be disabled. The pass transistor is turned−off so that there is
virtually no current flow between the IN and OUT. The
active discharge transistor is active so that the output voltage
ƪ
ƫ
125° C * TA
(eq. 1)
PD(MAX)
+
qJA
The power dissipated by the NCP153 for given
application conditions can be calculated from the following
equations:
V
OUT
is pulled to GND through a 50 W resistor. In the
www.onsemi.com
12
NCP153
ǒV Ǔ
D [ VIN IGND ) IOUT1 IN * VOUT1
P
(eq. 2)
ǒV
Ǔ
) IOUT2 IN * VOUT2
240
220
200
180
160
140
120
100
80
1.25
1.00
0.75
0.50
0.25
P
, T = 25°C, 2 oz Cu
A
D(MAX)
P , T = 25°C, 1 oz Cu
D(MAX) A
q
, 1 oz Cu
JA
q
, 2 oz Cu
JA
60
0
100
200
300
400
500
600
700
2
COPPER HEAT SPREADER AREA (mm )
Figure 41. qJA vs. Copper Area (XDFN−6)
Reverse Current
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that V > V .
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
nominal value. This time is dependent on various
application conditions such as V , C , T .
OUT(NOM) OUT
A
OUT
IN
PCB Layout Recommendations
To obtain good transient performance and good regulation
characteristics place input and output capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 capacitors. Larger
copper area connected to the pins will also improve the
device thermal resistance. The actual power dissipation can
be calculated from the equation above (Equation 2). Expose
pad should be tied the shortest path to the GND pin.
Power Supply Rejection Ratio
The NCP153 features very good Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
100 kHz − 10 MHz can be tuned by the selection of C
capacitor and proper PCB layout.
OUT
Turn−On Time
The turn−on time is defined as the time period from EN
assertion to the point in which V
will reach 98% of its
OUT
ORDERING INFORMATION
Voltage Option*
(OUT1/OUT2)
Marking
Rotation
†
Device
Marking
Package
Shipping
NCP153MX330180TCG
3.3 V/1.8 V
GA
0°
XDFN-6
(Pb-Free)
5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*Contact factory for other voltage options. Output voltage range 1.0 V to 3.3 V with step 50 mV.
ZigBee is a registered trademark of ZigBee Alliance.
Bluetooth is a registered trademark of Bluetooth SIG.
www.onsemi.com
13
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN6 1.20x1.20, 0.40P
CASE 711AT
ISSUE C
SCALE 4:1
DATE 04 DEC 2015
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO THE PLATED
TERMINALS.
D
A
B
4. COPLANARITY APPLIES TO THE PAD AS
WELL AS THE TERMINALS.
PIN ONE
MILLIMETERS
E
REFERENCE
DIM
A
MIN
0.30
0.00
0.13
1.15
0.84
1.15
0.20
TYP
0.37
0.03
0.18
1.20
0.94
1.20
MAX
0.45
0.05
0.23
1.25
1.04
1.25
0.40
A1
b
D
L
D2
E
TOP VIEW
DETAIL A
0.30
0.40 BSC
E2
e
OPTIONAL
A
CONSTRUCTION
L
0.15
0.00
0.20
0.05
0.25
0.10
0.05
0.05
C
C
L1
A1
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
NOTE 4
C
SIDE VIEW
D2
XX M
6X
L1
E2
XX = Specific Device Code
1
3
M
= Date Code
*This information is generic. Please refer
to device data sheet for actual part mark-
ing. Pb−Free indicator, “G” or microdot “
G”, may or may not be present.
6X
L
6
4
DETAIL A
RECOMMENDED
MOUNTING FOOTPRINT*
6X b
e
M
0.10
C A B
6X
0.37
BOTTOM VIEW
NOTE 3
1.08
PACKAGE
OUTLINE
1.40
0.40
1
0.40
PITCH
6X
0.24
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON76141F
XDFN6, 1.20 X 1.20, 0.40P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
ADDITIONAL INFORMATION
TECHNICAL PUBLICATIONS:
Technical Library: www.onsemi.com/design/resources/technical−documentation
onsemi Website: www.onsemi.com
ONLINE SUPPORT: www.onsemi.com/support
For additional information, please contact your local Sales Representative at
www.onsemi.com/support/sales
相关型号：
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明