NCP167BFCT330T2G [ONSEMI]
LDO Regulator - Ultra-Low Noise, High PSRR, RF and Analog Circuits 700 mA;
| 型号： | NCP167BFCT330T2G |
| 厂家： | 
ONSEMI |
| 描述： | LDO Regulator - Ultra-Low Noise, High PSRR, RF and Analog Circuits 700 mA |
| 文件： | 总13页 (文件大小：442K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCP167
LDO Regulator - Ultra-Low
Noise, High PSRR, RF and
Analog Circuits
700 mA
www.onsemi.com
The NCP167 is a linear regulator capable of supplying 700 mA
output current. Designed to meet the requirements of RF and analog
circuits, the NCP167 device provides low noise, high PSRR, low
quiescent current, and very good load/line transients. The device is
designed to work with a 1 mF input and a 1 mF output ceramic capacitor.
It is available in two thickness ultra−small 0.35P, 0.65 mm x 0.65 mm
Chip Scale Package (CSP) and XDFN4 0.65P, 1 mm x 1 mm.
MARKING
DIAGRAMS
X M
WLCSP4
CASE 567JZ
A1
Features
• Operating Input Voltage Range: 1.9 V to 5.5 V
• Available in Fixed Voltage Option: 1.8 V to 5.2 V
1
XX M
•
2% Accuracy Over Load/Temperature
XDFN4
CASE 711AJ
1
• Ultra Low Quiescent Current Typ. 12 mA
• Standby Current: Typ. 0.1 mA
• Very Low Dropout: 210 mV at 700 mA
• Ultra High PSRR: Typ. 85 dB at 20 mA, f = 1 kHz
X or XX = Specific Device Code
M
= Date Code
• Ultra Low Noise: 8.5 mV
RMS
• Stable with a 1 mF Small Case Size Ceramic Capacitors
PIN CONNECTIONS
• Available in −WLCSP4 0.65 mm x 0.65 mm x 0.33 mm
IN
OUT
−XDFN4 1 mm x 1 mm x 0.4 mm
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
A2
A1
B1
B2
Typical Applications
• Battery−powered Equipment
• Wireless LAN Devices
EN
GND
(Top View)
• Smartphones, Tablets
• Cameras, DVRs, STB and Camcorders
V
V
OUT
IN
IN
OUT
NCP167
GND
C
1 mF
Ceramic
EN
IN
C
OUT
1 mF
Ceramic
ON
(Top View)
OFF
ORDERING INFORMATION
See detailed ordering and shipping information on page 10 of
this data sheet.
Figure 1. Typical Application Schematics
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
September, 2019 − Rev. 3
NCP167/D
NCP167
IN
ENABLE
LOGIC
THERMAL
EN
SHUTDOWN
BANDGAP
MOSFET
REFERENCE
INTEGRATED
DRIVER WITH
CURRENT LIMIT
SOFT−START
OUT
* ACTIVE DISCHARGE
Version A only
EN
GND
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
CSP4
Pin No.
XDFN4
Pin
Name
Description
A1
A2
B1
B2
−
4
IN
Input voltage supply pin
1
3
OUT
EN
Regulated output voltage. The output should be bypassed with small 1 mF ceramic capacitor.
Chip enable: Applying V < 0.4 V disables the regulator, Pulling V > 1.2 V enables the LDO.
EN
EN
2
GND
EPAD
Common ground connection
EPAD
Expose pad should be tied to ground plane for better power dissipation
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
V
Input Voltage (Note 1)
V
IN
−0.3 V to 6
Output Voltage
V
OUT
−0.3 to V + 0.3, max. 6 V
V
IN
Chip Enable Input
V
−0.3 to V + 0.3, max. 6 V
V
CE
SC
IN
Output Short Circuit Duration
Maximum Junction Temperature
Storage Temperature
t
unlimited
150
s
T
°C
°C
V
J
T
STG
−55 to 150
2000
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Model (Note 2)
ESD
HBM
ESD
200
V
MM
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Characteristics, WLCSP4 (Note 3)
108
Thermal Resistance, Junction−to−Air
R
°C/W
q
JA
Thermal Characteristics, XDFN4 (Note 3)
198
Thermal Resistance, Junction−to−Air
3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7
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2
NCP167
ELECTRICAL CHARACTERISTICS −40°C ≤ T ≤ 125°C; V = V
+ 1 V; I
= 1 mA, C = C
= 1 mF, unless otherwise
J
IN
OUT(NOM)
OUT
IN
OUT
noted. V = 1.2 V. Typical values are at T = +25°C (Note 4).
EN
J
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
Operating Input Voltage
V
IN
1.9
5.5
V
Output Voltage Accuracy (Note 5)
V
IN
= V
+ 1 V to 5.5 V
≤ 700 mA
OUT(NOM)
V
OUT
−2
+2
%
0 mA ≤ I
OUT
Line Regulation
Load Regulation
V
+ 1 V ≤ V ≤ 5.5 V
Line
Reg
0.02
0.001
0.002
315
%/V
OUT(NOM)
IN
I
I
= 1 mA to
WLCSP4
XDFN4
OUT
Load
%/mA
mV
700 mA
Reg
Dropout Voltage (Note 6)
= 700 mA
V
V
= 1.8 V
= 3.3 V
450
290
OUT
OUT(NOM)
OUT(NOM)
V
DO
190
Output Current Limit
Short Circuit Current
Quiescent Current
V
V
= 90% V
I
800
1.2
1000
1050
9.7
OUT
OUT(NOM)
CL
mA
V
OUT
= 0 V
I
SC
I
= 0 mA
I
18
1
mA
mA
OUT
Q
Shutdown Current
≤ 0.4 V, V = 4.8 V
I
0.01
EN
IN
DIS
EN Pin Threshold Voltage
EN Input Voltage “H”
EN Input Voltage “L”
V
ENH
V
V
ENL
0.4
0.5
EN Pull Down Current
V
EN
= 4.8 V
I
0.2
mA
ms
EN
Turn−On Time
C
= 1 mF, From assertion of V to
OUT EN
120
V
= 95% V
OUT
OUT(NOM)
Power Supply Rejection Ratio
V
= 3.3 V,
f = 100 Hz
83
85
80
63
OUT(NOM)
OUT
I
= 20 mA
f = 1 kHz
f = 10 kHz
f = 100 kHz
PSRR
dB
Output Voltage Noise
f = 10 Hz to 100 kHz
I
= 20 mA
V
8.5
160
140
280
mV
RMS
OUT
N
Thermal Shutdown Threshold
Temperature rising
Temperature falling
T
SDH
°C
°C
W
T
SDL
Active output discharge resistance
V
EN
< 0.4 V, Version A only
R
DIS
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at T = 25°C.
A
Low duty cycle pulse techniques are used during the testing to maintain the junction temperature as close to ambient as possible.
5. Respect SOA.
6. Dropout voltage is characterized when V
falls 100 mV below V
.
OUT
OUT(NOM)
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3
NCP167
TYPICAL CHARACTERISTICS
2.90
2.89
16
14
12
10
8
2.88
2.87
2.86
T = 25°C
J
T = 125°C
J
T = −40°C
J
I
= 10 mA
OUT
2.85
2.84
2.83
6
V
= 3.85 V
= 2.85 V
= 1 mF
IN
V
C
C
= 2.85 V
= 1 mF
= 1 mF
4
OUT
V
OUT
2.82
2.81
2.80
IN
OUT
C
C
IN
2
0
= 1 mF
OUT
−40 −20
0
20
40
60
80
100 120
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
, INPUT VOLTAGE (V)
T , JUNCTION TEMPERATURE (°C)
J
V
IN
Figure 3. Output Voltage vs. Temperature −
OUT = 2.85 V
Figure 4. Quiescent Current vs. Input Voltage
V
1800
1600
1400
1200
1000
800
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
V
C
C
= 1.8 V
= 1 mF
= 1 mF
OUT
T = 125°C
J
V
V
C
C
= 3.85 V
IN
IN
= 2.85 V
OUT
OUT
= 1 mF
T = 25°C
J
IN
= 1 mF
OUT
T = 125°C
J
T = −40°C
J
T = 25°C
J
600
400
T = −40°C
200
0
J
0.05
0
0.001 0.01
0.1
1
10
100
1000
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7 0.8
I , OUTPUT CURRENT (mA)
OUT
I , OUTPUT CURRENT (A)
OUT
Figure 5. Ground Current vs. Output Current
Figure 6. Dropout Voltage vs. Output Current −
OUT = 1.8 V
V
0.30
0.27
0.24
0.21
0.18
0.15
0.12
0.09
0.06
0.30
0.27
0.24
0.21
0.18
0.15
0.12
0.09
0.06
T = 125°C
T = 125°C
J
J
V
C
C
= 3.3 V
= 1 mF
= 1 mF
V
C
C
= 2.85 V
= 1 mF
= 1 mF
OUT
OUT
IN
IN
OUT
OUT
T = 25°C
J
T = 25°C
J
T = −40°C
J
T = −40°C
J
0.03
0
0.03
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7 0.8
I , OUTPUT CURRENT (A)
OUT
I , OUTPUT CURRENT (A)
OUT
Figure 7. Dropout Voltage vs. Output Current −
OUT = 2.85 V
Figure 8. Dropout Voltage vs. Output Current −
V
VOUT = 3.3 V
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4
NCP167
TYPICAL CHARACTERISTICS
1050
1000
950
900
850
800
750
700
1050
1000
950
900
850
800
750
V
V
C
C
= 3.85 V
V
V
C
C
= 3.85 V
700
650
IN
IN
= 2.85 V
= 2.85 V
OUT
OUT
650
= 1 mF
= 1 mF
IN
IN
= 1 mF
600
550
= 1 mF
600
550
OUT
OUT
−40 −20
0
20
40
60
80
100 120
−40 −20
0
20
40
60
80
100 120
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 9. Current Limit vs. Temperature
Figure 10. Short Circuit Current vs.
Temperature
1000
900
800
700
600
500
400
300
200
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
T = 125°C
J
C
C
= 1 mF
T = −40°C
IN
J
= 1 mF
OUT
T = 25°C
J
V
IN
= 5.5 V
V
IN
= 3.85 V
C
C
= 1 mF
= 1 mF
IN
OUT
100
0
0.05
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
, INPUT VOLTAGE (V)
−40 −20
0
20
40
60
80
100 120
V
IN
T , JUNCTION TEMPERATURE (°C)
J
Figure 11. Short Circuit Current vs. Input
Voltage
Figure 12. Disable Current vs. Temperature
400
360
320
280
240
200
160
120
80
800
750
700
650
600
550
500
450
400
V
V
I
C
C
= 5.5 V
IN
= 2.85 V
OUT
= 10 mA
OUT
OFF −> ON
ON −> OFF
= 1 mF
IN
= 1 mF
OUT
V
= 5.5 V
EN
V
V
I
C
C
= 5.5 V
IN
= 2.85 V
OUT
= 1 mA
OUT
= 1 mF
IN
350
300
40
0
−40 −20
= 1 mF
OUT
0
20
40
60
80
100 120
−40 −20
0
20
40
60
80
100 120
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 13. Current to Enable Pin vs.
Temperature
Figure 14. Enable Voltage Threshold vs.
Temperature
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5
NCP167
TYPICAL CHARACTERISTICS
100
90
100
90
1 mA
1 mA
80
70
60
50
40
30
20
80
70
60
50
20 mA
20 mA
40
30
20
V
V
C
C
= 3.6 V
V
V
C
C
= 3.8 V
IN
IN
= 3.3 V
= 1 mF
= 3.3 V
= 1 mF
OUT
OUT
IN
IN
100 mA
100 mA
1M
= 1 mF
= 1 mF
OUT
OUT
MLCC, X7R, 0805
MLCC, X7R, 0805
10
0
10
0
100 1K
10K
100K
1M
10M
100
1K
10K
100K
10M
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 15. Power Supply Rejection Ratio vs.
Figure 16. Power Supply Rejection Ratio vs.
Current, VDROP = 0.5 V, COUT = 1 mF
Current, VDROP = 0.3 V, COUT = 1 mF
100
90
80
70
60
50
40
30
20
100
90
4.3 V
4.3 V
80
70
60
50
40
30
20
3.6 V
3.6 V
3.8 V
3.8 V
V
OUT
= 3.3 V
V
I
C
C
= 3.3 V
= 100 mA
OUT
I
= 20 mA
OUT
OUT
C
C
= 1 mF
IN
= 1 mF
IN
= 1 mF
OUT
= 1 mF
MLCC, X7R, 0805
OUT
MLCC, X7R, 0805
10
0
10
0
100 1K
10K
100K
1M
10M
100
1K
10K
100K
1M
10M
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 17. Power Supply Rejection Ratio vs.
Figure 18. Power Supply Rejection Ratio vs.
Input Voltage, IOUT = 100 mA, COUT = 1 mF
Input Voltage, IOUT = 20 mA, COUT = 1 mF
100K
10K
100K
10K
1K
V
V
= 3.6 V
IN
V
V
= 3.8 V
IN
= 3.3 V
OUT
= 3.3 V
OUT
I
= 20 mA
= 1 mF
OUT
I
= 250 mA
= 1 mF
OUT
C
C
IN
C
C
IN
= 1 mF
OUT
= 1 mF
OUT
MLCC, X7R, 0805
MLCC, X7R, 0805
1K
100
10
100
10
10
100
1K
10K
100K
1M
10
100
1K
10K
100K
1M
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 19. Output Voltage Noise Spectral Density
Figure 20. Output Voltage Noise Spectral Density
for VOUT = 3.3 V, IOUT = 20 mA, COUT = 1 mF
for VOUT = 3.3 V, IOUT = 250 mA, COUT = 1 mF
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6
NCP167
APPLICATIONS INFORMATION
General
maximum value of ESR should be less than 1.7 W. Larger
The NCP167 is an ultra−low noise 700 mA low dropout
output capacitors and lower ESR could improve the load
transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
regulator designed to meet the requirements of RF
applications and high performance analog circuits. The
NCP167 device provides very high PSRR and excellent
dynamic response. In connection with low quiescent current
this device is well suitable for battery powered application
such as cell phones, tablets and other. The NCP167 is fully
protected in case of current overload, output short circuit and
overheating.
Enable Operation
The NCP167 uses the EN pin to enable/disable its device
and to deactivate/activate the active discharge function. If
the EN pin voltage is <0.4 V the device is guaranteed to be
disabled. The pass transistor is turned−off so that there is
virtually no current flow between the IN and OUT. The
active discharge transistor is active so that the output voltage
Input Capacitor Selection (CIN)
Input capacitor connected as close as possible is necessary
for ensure device stability. The X7R or X5R capacitor
should be used for reliable performance over temperature
range. The value of the input capacitor should be 1 mF or
greater to ensure the best dynamic performance. This
capacitor will provide a low impedance path for unwanted
AC signals or noise modulated onto constant input voltage.
There is no requirement for the ESR of the input capacitor
but it is recommended to use ceramic capacitors for their low
ESR and ESL. A good input capacitor will limit the
influence of input trace inductance and source resistance
during sudden load current changes.
V
OUT
is pulled to GND through a 280 W resistor. In the
disable state the device consumes as low as typ. 10 nA from
the V . If the EN pin voltage >1.2 V the device is
IN
guaranteed to be enabled. The NCP167 regulates the output
voltage and the active discharge transistor is turned−off. The
EN pin has internal pull−down current source with typ. value
of 200 nA which assures that the device is turned−off when
the EN pin is not connected. In the case where the EN
function isn’t required the EN should be tied directly to IN.
Output Decoupling (COUT
)
Output Current Limit
The NCP167 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
recommended capacitor value is 1 mF and X7R or X5R
dielectric due to its low capacitance variations over the
specified temperature range. The NCP167 is designed to
remain stable with minimum effective capacitance of 0.7 mF
to account for changes with temperature, DC bias and
package size. Especially for small package size capacitors
such as 0201 the effective capacitance drops rapidly with the
applied DC bias. Please refer Figure 21.
Output Current is internally limited within the IC to a
typical 1000 mA. The NCP167 will source this amount of
current measured with a voltage drops on the 90% of the
nominal V
. If the Output Voltage is directly shorted to
= 0 V), the short circuit protection will limit
OUT
ground (V
OUT
the output current to 1050 mA (typ.). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (T = 160°C typical), Thermal Shutdown event
SD
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (T
= 140°C typical).
SDU
Once the IC temperature falls below the 140°C the LDO is
enabled again. The thermal shutdown feature provides the
protection from a catastrophic device failure due to
accidental overheating. This protection is not intended to be
used as a substitute for proper heat sinking.
Reverse Current
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that V
> V .
OUT
IN
Figure 21. Capacity vs DC Bias Voltage
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the C
but the
OUT
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NCP167
Power Supply Rejection Ratio
The NCP167 features very high Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
100 kHz – 10 MHz can be tuned by the selection of C
capacitor and proper PCB layout.
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. The maximum power dissipation the
OUT
NCP167 can handle is given by:
Turn−On Time
The turn−on time is defined as the time period from EN
assertion to the point in which V
o
ƪ
ƫ
125 C * TA
PD(MAX)
+
(eq. 1)
qJA
will reach 98% of its
OUT
nominal value. This time is dependent on various
The power dissipated by the NCP167 for given application
conditions can be calculated from the following equations:
application conditions such as V
, C
, T .
OUT(NOM) OUT A
ǒV
Ǔ
(eq. 2)
Power Dissipation
As power dissipated in the NCP167 increases, it might
become necessary to provide some thermal relief. The
P
D [ VIN @ IGND ) IOUT IN * VOUT
160
150
140
130
120
110
1.6
P
P
, T = 25°C, 2 oz Cu
D(MAX)
A
1.4
1.2
1.0
0.8
0.6
0.4
, T = 25°C, 1 oz Cu
D(MAX)
A
q
, 1 oz Cu
JA
JA
100
90
q
, 2 oz Cu
500
0.2
0
80
0
100
200
300
400
600
700
2
PCB COPPER AREA (mm )
Figure 22. qJA and PD (MAX) vs. Copper Area (CSP4)
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8
NCP167
220
210
200
190
180
170
1.0
0.9
P
, T = 25°C, 2 oz Cu
A
D(MAX)
0.8
0.7
0.6
0.5
P
, T = 25°C, 1 oz Cu
A
D(MAX)
q
, 2 oz Cu
, 1 oz Cu
JA
JA
q
160
150
0.4
0.3
0
100
200
300
400
500
600
700
2
PCB COPPER AREA (mm )
Figure 23. qJA and PD (MAX) vs. Copper Area (XDFN4)
PCB Layout Recommendations
To obtain good transient performance and good regulation
pins will also improve the device thermal resistance. The
actual power dissipation can be calculated from the equation
above (Equation 2). Expose pad can be tied to the GND pin
for improvement power dissipation and lower device
temperature.
characteristics place C and C
capacitors close to the
IN
OUT
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 or 0201 capacitors with
appropriate capacity. Larger copper area connected to the
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NCP167
ORDERING INFORMATION (XDFN4)
Device
Nominal Output Voltage
Description
Marking
CH
Package
Shipping
NCP167AMX180TBG
NCP167AMX280TBG
NCP167AMX285TBG
NCP167AMX300TBG
NCP167AMX330TBG
NCP167AMX350TBG
1.8 V
2.8 V
2.85 V
3.0 V
3.3 V
3.5 V
CP
CK
700 mA, Active
Discharge
CQ
XDFN4
(Pb−Free)
3000 / Tape
& Reel
CR
CL
700 mA, Non-Active
Discharge
NCP167BMX330TBG
3.3 V
AR
ORDERING INFORMATION (WLCSP4)
Nominal
Output
Voltage
†
Device
Description
Marking*
Rotation
Package
Shipping
NCP167AFCT180T2G
NCP167AFCT285T2G
NCP167AFCT295T2G
NCP167AFCT330T2G
NCP167AFCT350T2G
NCP167AFCTC350T2G
1.8 V
H
K
P
R
L
0°
0°
0°
0°
0°
0°
2.85 V
2.95 V
3.3 V
700 mA, Active Discharge
WLCSP4
(Pb-Free)
5000 / Tape
& Reel
3.5 V
3.5 V
700 mA, Active Discharge,
Backside Coating
L
NCP167BFCT330T2G
3.3 V
700 mA, Non−Active
R
180°
Discharge
*Marking letter with overbar.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP4, 0.64x0.64
CASE 567JZ
ISSUE A
SCALE 4:1
DATE 03 AUG 2016
NOTES:
A
E
B
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
PIN A1
REFERENCE
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM
A
A1
A2
b
D
E
MIN
−−−
0.04
NOM
−−−
0.06
0.23 REF
0.210
0.640
MAX
0.33
0.08
TOP VIEW
0.195
0.610
0.610
0.225
0.670
0.670
A2
0.640
0.05
C
e
0.35 BSC
A
0.05
C
RECOMMENDED
A1
SEATING
PLANE
SOLDERING FOOTPRINT*
NOTE 3
C
SIDE VIEW
PACKAGE
A1
OUTLINE
e
4X
b
4X0.20
e
0.35
PITCH
0.03
C A B
B
0.35
PITCH
DIMENSIONS: MILLIMETERS
A
1
2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON85781F
WLCSP4, 0.64X0.64
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN4 1.0x1.0, 0.65P
CASE 711AJ
ISSUE A
1
DATE 13 NOV 2015
SCALE 4:1
4X L2
NOTES:
A
B
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
REFERENCE
E
4X b2
2X
0.05
C
MILLIMETERS
DETAIL A
DIM MIN
0.33
A1 0.00
MAX
0.43
0.05
0.05
C
2X
A
TOP VIEW
A3
b
b2 0.02
0.10 REF
0.15
0.25
0.12
(A3)
0.05
0.05
C
D
1.00 BSC
D2 0.43
0.53
A
E
e
L
1.00 BSC
0.65 BSC
0.20
C
0.30
0.17
SEATING
PLANE
NOTE 4
A1
L2 0.07
C
SIDE VIEW
GENERIC
MARKING DIAGRAM*
e
e/2
DETAIL A
4X L
D2
1
4
2
XX M
1
D2
XX = Specific Device Code
455
3
M
= Date Code
4X b
*This information is generic. Please refer
to device data sheet for actual part
marking.
M
0.05
C A B
NOTE 3
BOTTOM VIEW
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
MOUNTING FOOTPRINT*
2X
0.52
0.65
PITCH
PACKAGE
OUTLINE
4X
0.39
4X
0.11
1.20
4X
0.24
4X
0.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON67179E
XDFN4, 1.0X1.0, 0.65P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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