NCP4318ALS [ONSEMI]

Advanced Synchronous Rectifier Controller for LLC Resonant Converter;
NCP4318ALS
型号: NCP4318ALS
厂家: ONSEMI    ONSEMI
描述:

Advanced Synchronous Rectifier Controller for LLC Resonant Converter

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中文:  中文翻译
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Advanced Synchronous  
Rectifier Controller for LLC  
Resonant Converter  
NCP4318  
NCP4318 is an advanced synchronous rectification (SR) controller  
for LLC resonant converter with minimum external components. It  
has two gate driver stages for driving the SR MOSFETs which are  
rectifying the outputs of the secondary transformer windings. The two  
gate driver stages have their own Drain and Source sensing inputs and  
operate independently of each other. The advanced adaptive dead time  
control compensates a voltage across parasitic inductance to minimize  
the body diode conduction and maximize the system efficiency. The  
advanced turnoff control algorithm allows stable SR operation over  
entire load range. NCP4318 has two versions of pin assignment –  
NCP4318AXX, NCP4318BXX.  
www.onsemi.com  
SOIC 8, 150 mils  
CASE 751BD  
MARKING DIAGRAM  
Features  
8
Mixed Mode SR Turnoff Control  
Anti Shootthrough Control for Reliable SR Operation  
NCP4318  
UVW  
AWLYYWW  
Separate 200 V Rated Sense Pins for the Drain and Dedicated Source  
1
Sense Pins  
Advanced Adaptive Dead Time Control  
SR Current Inversion Detection  
U
V
W
A
= Pin Layout, A and B  
= Frequency, H: High, L: Low  
= Additional IPT option  
= Assembly Location  
Adaptive Minimum Turnon Time for Noise Immunity  
SR Conduction Time Increase Rate Limitation  
Multilevel Turnoff Threshold Voltage  
WL = Wafer Lot Traceability  
YYWW = Date Code  
Adaptive Gate Voltage Control (10 V, 6 V)  
PIN CONNECTIONS  
Low Operating Current (100 mA) in Green Mode  
Soft Start for 512 Switching Cycle with 0 V/6 V Gate Output Voltage  
Very Fast Turnon and Turnoff Delay Time (30 ns/30 ns)  
Large Gate Sourcing and Sinking Current (1.5 A/4.5 A)  
Wide Operating Supply Voltage Range from 6.5 V to 35 V  
Wide Operating Frequency Range (22 kHz to 500 kHz)  
SOIC8 Package  
NCP4318AXX  
GATE1  
GND  
VS1  
GATE2  
VDD  
VD2  
VD1  
VS2  
These Devices are PbFree and are RoHS Compliant  
NCP4318BXX  
Applications  
High Power Density Adapters  
Large Screen LEDTV and OLEDTV Power Supplies  
High Efficiency Desktop and Server Power Supplies  
Networking and Telecom Power Supplies  
High Power LED Lighting  
GATE1  
GND  
VD1  
GATE2  
VDD  
VD2  
VS1  
VS2  
(Top View)  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information on  
page 3 of this data sheet.  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
March, 2021 Rev. 1  
NCP4318/D  
NCP4318  
M2  
Optional  
Roffset2  
Bridge  
Diode  
Q1  
Q2  
EMI  
Filter  
PFC  
Stage  
VAC  
Cin  
Cr  
Lr  
VO  
Lp  
RO  
CO  
Roffset1  
Optional  
M1  
LLC  
Controller  
Shunt  
Regulator  
Figure 1. Typical Application Schematic of NCP4318  
VD1_HGH  
VD2_HGH  
SR  
Conduction  
SR  
Conduction  
SR_COND1  
SR_COND2  
VTH_HGH  
VTH_HGH  
IOFFSET1  
IOFFSET2  
DLY_EN1  
DLY_EN2  
RUN  
RUN  
SET  
CLR  
SET  
CLR  
Q
Q
Q
Q
D
D
Adaptive  
turnon  
delay  
Adaptive  
turnon  
delay  
VD1  
VS1  
VD2  
VS2  
VTH_ON  
VTH_ON  
Turnon  
Turnon  
VTH_OFF1  
VTH_OFF2  
Turnoff  
Turnoff  
Adaptive  
Tmin_on  
Adaptive  
Tmin_on  
SRC_INV1  
SRC_INV2  
Adaptive  
Adaptive  
VGATE  
VGATE  
Adaptive  
dead time  
control  
Adaptive  
dead time  
control  
IOFFSET1  
VTH_OFF1  
IOFFSET2  
VTH_OFF2  
VD1_HGH  
VD2_HGH  
GATE  
GATE  
CLAMP  
CLAMP  
VG1  
VG2  
GATE1  
GATE2  
VD1  
GREEN  
VD2  
SR Current Inversion detect  
SRC_INV1  
DLY_EN1  
DLY_EN2  
RUN  
SRC_INV2  
VDD_GATE_ON /VDD_GATE_OFF  
SR_COND1,2  
GREEN  
VD1_HGH  
GREEN MODE  
GREEN  
Protections  
SOFT  
START  
SR_COND1  
SR_COND2  
Adaptive  
VGATE  
VTH_OFF1  
HFS  
SS_7V  
VGATE  
Control  
OTP1  
VDD  
GND  
Figure 2. Internal Block Diagram of NCP4318  
www.onsemi.com  
2
NCP4318  
PIN DESCRIPTION  
Pin Number  
NCP4318A  
NCP4318B  
Name  
GATE1  
GND  
Description  
1
2
3
1
2
4
Gate drive output for SR MOSFET1  
Ground  
VS1  
Synchronous rectifier source sense input for SR1  
Synchronous rectifier drain sense input. I  
current source flows out of the  
OFFSET1  
VD1 pin such that an external series resistor can be used to adjust the synchronous  
4
5
6
3
5
6
VD1  
VS2  
VD2  
rectifier turnoff threshold. The I  
current source is turned off when V is  
OFFSET1  
DD  
undervoltage or when switching is disabled in green mode  
Synchronous rectifier source sense input for SR2  
Synchronous rectifier drain sense input. I  
current source flows out of the  
OFFSET2  
VD2 pin such that an external series resistor can be used to adjust the synchronous  
rectifier turnoff threshold. The I current source is turned off when V is  
OFFSET2  
DD  
undervoltage or when switching is disabled in green mode  
7
8
7
8
VDD  
Supply Voltage  
GATE2  
Gate drive output for SR MOSFET2  
ORDERING INFORMATION  
Device (Ordering Code)  
NCP4318ALC  
Device Marking  
NCP4318ALC  
NCP4318BLC  
NCP4318ALS  
NCP4318AHJ  
Package  
Shipping†  
NCP4318BLC  
SOIC 8  
(PbFree)  
2500 / Tape & Reel  
NCP4318ALS  
NCP4318AHJ  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
3
NCP4318  
MAXIMUM RATINGS  
Symbol  
Parameter  
Min  
0.3  
4  
Max  
37  
Unit  
V
V
Power Supply Input Pin Voltage  
Drain Sense Input Pin Voltage  
Gate Drive Output Pin Voltage  
DD  
V
V
200  
17  
V
D1, D2  
V
V
0.3  
V
GATE1,  
GATE2  
V
V
Source Sense Input Pin Voltage  
0.3  
4  
5.5  
5.5  
V
V
S1, S2  
V
Source Sense Dynamic Input Pin Voltage (pulse width = 200 ns)  
S1_DYN,  
V
S2_DYN  
P
Power Dissipation (T = 25°C)  
0.625  
150  
150  
260  
3
W
°C  
°C  
°C  
kV  
D
A
T
Maximum Junction Temperature  
Storage Temperature Range  
40  
60  
J
T
STG  
T
Lead Temperature (Soldering, 10 Seconds)  
L
ESD  
Electrostatic Discharge Capability Human Body Model, ANSI / ESDA / JEDEC  
JS0012012 (except VD1, VD2 pin)  
Human Body Model, VD1GND, VD2GND pin to  
2
2
pin with 330pF capacitance on VD1 and VD2 pin  
Charged Device Model, JESD22C101  
1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. All voltage values are with respect to the GND pin.  
2. The capacitance can be replaced by C  
of MOSFET.  
OSS  
THERMAL CHARACTERISTICS  
Rating  
Symbol  
Value  
22  
Unit  
°C/W  
°C/W  
Thermal Characteristics  
Thermal Characteristics  
R
y
JT  
R
165  
q
JA  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
0
Max  
35  
Unit  
V
DD  
(Note 3)  
VDD Pin Supply Voltage to GND  
V
V
V
,V  
Drain Sense Input Pin Voltage  
Source Sense Input Pin Voltage  
Operating Ambient Temperature  
0.7  
0.3  
40  
180  
5
D1 D2  
V
V
V
S1 S2  
T
J
+125  
°C  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
3. Allowable operating supply voltage V can be limited by the power dissipation of NCP4318 related to switching frequency, load capacitance  
DD  
and ambient temperature.  
www.onsemi.com  
4
 
NCP4318  
ELECTRICAL CHARACTERISTICS  
V
DD  
= 12 V and T = 40°C to 125°C unless otherwise specified  
J
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
4.3  
Unit  
Supply Voltage and Current Section  
V
Turnon threshold  
V
DD  
V
DD  
V
DD  
V
DD  
rising with 4.3 V / 1 ms  
4.0  
3.8  
6.5  
6.0  
V
V
V
V
DD_ON  
V
Turnoff threshold  
< V  
> V  
< V  
3.6  
5.0  
DD_OFF  
DD_GATE_ON  
DD_OFF  
V
SR gate enable threshold voltage  
SR gate disable threshold voltage  
7.1  
DD_GATE_ON  
DD_GATE_OFF  
V
DD_GATE_OFF  
(Note 4)  
I
Operating current  
f
f
= 100 kHz, C  
= 100 kHz, C  
= 1 nF  
8
10  
6
mA  
mA  
mA  
DD_OP1  
SW  
GATE  
I
Operating current  
= 0 nF  
0
DD_OP  
SW  
GATE  
I
Startup current  
V
V
= V - 0.1 V  
DD_ON  
100  
210  
DD_START  
DD  
I
Operating current in green mode1  
= 12 V (no V  
switching)  
100  
255  
mA  
DD_GREEN  
DD  
D1/2  
GREEN1 enable at T = 25°C  
J
h
_
Number of V  
alternative  
V
falling lower than V  
& V  
D1/2  
Cycle  
SS SKIP  
D1/2  
D1/2  
TH_ON  
switching for soft start skip range  
rising higher than V  
& No GATE  
= 0 nF  
GATE  
TH_HGH  
output at f  
= 200 kHz, C  
SW  
Drain Voltage Sensing Section  
V
(Note 4)  
Comparator input offset voltage  
Drain pin leakage current  
Turnon threshold  
1  
0
1
1
mV  
mA  
OSI  
I
V
= 200 V  
DRAIN_LKG  
D1/2  
V
(Note 4)  
R
= 0 W (includes comparator in-  
OFFSET  
100  
mV  
TH_ON  
put offset voltage)  
From V higher than V  
TH_HGH  
t
Minimum off-time  
1400  
2000  
2800  
ns  
OFF_MIN  
D1/2  
in ALC, BLC  
in ALS  
450  
750  
800  
1150  
30  
1150  
1550  
80  
ns  
ns  
ns  
In AHJ  
t
Turnon propagation delay  
Turnon comparator delay  
From V = 0.2 to V  
DLY_EN = 0  
ON_DLY  
= 1 V, when  
= 1 V, when  
D1/2  
GATE  
t
(Note 4) Turnon debounce time for Lver- Turnon comparator delay  
240  
ns  
ON_DLY2  
sion when additional turnon delay  
is enabled in light load condition  
From V  
= 0.2 to V  
D1/2  
GATE  
DLY_EN = 1 in ALC, BLC, ALS, AHJ  
t
Turnoff propagation delay  
Turnoff comparator delay  
30  
80  
ns  
OFF_DLY  
From V  
= 0.6 to V  
= 5.7 V  
D1/2  
GATE  
V
Minimum turnoff threshold voltage  
mV  
R
= 0 W (includes comparator in-  
6  
TH_OFF_MIN  
(Note 4)  
OFFSET  
put offset voltage) in ALC, BLC, ALS  
In AHJ  
14  
4
mV  
mV  
mV  
mV  
mV  
mV  
mV  
mV  
mV  
%
V
One step size of turnoff threshold  
voltage  
R
= 0 W, in ALC, BLC, AHJ  
= 0 W, in ALC, BLC  
TH_OFF_STEP  
(Note 4)  
OFFSET  
in ALS  
8
V
Maximum turnoff threshold volt-  
age  
R
118  
242  
110  
2
TH_OFF_MAX  
(Note 4)  
OFFSET  
in ALS  
In AHJ  
V
Turnoff threshold voltage reset  
value  
R
= 0 W, in ALC, BLC  
TH_OFF_RST  
(Note 4)  
OFFSET  
in ALS  
In AHJ  
10  
6  
60  
K
Ratio of the second step V  
LLD1 is low.  
If LLD1 is high, 2 step V  
2ND_VOFF  
(Note 4)  
TH_OFF  
in one  
based on nominal V  
switching cycle  
nd  
rd  
TH_OFF  
= 3  
TH_OFF  
step V  
TH_OFF  
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5
NCP4318  
ELECTRICAL CHARACTERISTICS (continued)  
= 12 V and T = 40°C to 125°C unless otherwise specified  
V
DD  
J
Symbol  
Drain Voltage Sensing Section  
Effective time ratio based on  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
K
LLD1 = 0 & t  
(n1) = 8 μs & t <  
MIN_ON  
(n1).  
70  
%
2nd_TOFF  
VG1  
2nd_TOFF VG1  
nd  
(Note 4)  
t
(n1) for the 2 step V  
K
*t  
VG1  
TH_OFF  
in one switching cycle  
If t  
> K  
*t  
(n1),  
MIN_ON  
2nd_TOFF VG1  
= t  
MIN_ON  
t
VG1_70  
V
(Note 4) Drain voltage high detect threshold  
voltage  
V
Rising in ALC, BLC, AHJ  
0.85  
1.5  
V
V
TH_HGH  
D1/2  
in ALS  
t
Minimum SR conduction time to  
enable SR when DLY_EN = 0  
TH_OFF1 or 2  
when gate skip is triggered)  
The duration from turnon trigger to  
500  
350  
710  
ns  
GATE_SKIP_L1  
V
rising higher than V ,when  
D1/2  
TH_HGH  
(3 steps V  
decrease  
DLY_EN = 0 in ALC, BLC, ALS  
In AHJ  
550  
510  
ns  
ns  
t
Minimum SR conduction time to  
enable SR when DLY_EN = 1 (3  
The duration from turnon trigger to  
V rising higher than V ,when  
D1/2  
GATE_SKIP_L2  
(Note 4)  
TH_HGH  
steps V  
decrease  
DLY_EN=1 in ALC, BLC, ALS  
TH_OFF1 or 2  
when gate skip is triggered)  
In AHJ  
385  
ns  
Minimum OnTime and Maximum OnTime Section  
K
K
Adaptive minimum on time ratio  
when DLY_EN = 0  
DLY_EN=0 & t  
(n1) = 8 ms  
/ t (n1)  
43  
50  
20  
57  
%
%
TON1  
SR_COND  
K
TON  
= t  
MIN_ON SR_COND  
Adaptive minimum on time ratio  
when DLY_EN = 1  
DLY_EN=1 & t  
(n1) = 8 ms  
/ t (n1)  
TON2  
SR_COND  
K
TON  
= t  
MIN_ON SR_COND  
t
t
Minimum ontime upper limit when  
t
< t  
< t  
< t  
, when  
, when  
4
2
5
6
3
ms  
ms  
%
MIN_ON_U1  
MIN_ON_U2  
MIN_ON_L  
MIN_ON  
MIN_ON_U  
DLY_EN = 0  
DLY_EN = 0  
Minimum ontime upper limit when  
DLY_EN = 1  
t
< t  
MIN_ON  
2.5  
50  
MIN_ON_L  
MIN_ON_U  
DLY_EN = 1  
= K when DLY_EN = 0  
INV1,  
K
Adaptive SR current inversion de-  
tection window ratio when DLY_EN  
= 0  
K
43  
57  
INV1  
INV2  
TON1  
t
= t  
MIN_ON  
INV_WIN  
K
Adaptive SR current inversion de-  
tection window ratio when DLY_EN  
= 1  
K
= K  
when DLY_EN = 1  
20  
16k  
30  
%
TON2  
INV2,  
= t  
MIN_ON  
t
INV_WIN  
h
(Note 4) Normal consecutive switching cy-  
cles to exit SR current inversion  
Without parasitic V  
oscillation  
cycle  
INV_EXT  
D1/2  
state which has t  
ON_DLY2  
t
Maximum SR turnon time  
21  
39  
22  
ms  
SR_MAX_ON  
(Note 4)  
f
(Note 4)  
Minimum switching frequency  
1/(t  
+ t  
)
kHz  
MIN  
SR_MAX_ON_CH1  
SR_MAX_ON_CH2  
Dead Time Regulation Section  
I
Maximum of adaptive offset current  
which have 31 steps and 10μA of  
resolution  
V
= V = 0  
285  
310  
90  
335  
mA  
OFFSET  
D1  
D2  
t
Lower band of dead time regula-  
tion  
From V  
in ALC, BLC, ALS  
falling below V  
GATE_LOW  
ns  
DEAD_LBAND  
(Note 4)  
GATE  
In AHJ  
170  
ns  
ns  
t
Upper band of dead time regula-  
tion  
From V  
when LLD1 = 0  
falling below V  
,
t
DEAD_L  
BAND  
+90  
DEAD_HBAND  
(Note 4)  
GATE  
GATE_LOW  
h
LLD1  
(Note 4)  
First light load detection (LLD1)  
ηV  
h  
LLD1  
7
TH_OFF_CNT  
threshold number of V  
ulator output  
mod-  
TH_OFF  
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6
NCP4318  
ELECTRICAL CHARACTERISTICS (continued)  
= 12 V and T = 40°C to 125°C unless otherwise specified  
V
DD  
J
Symbol  
Dead Time Regulation Section  
(Note 4)  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
h
LLD2  
Second light load detection (LLD2) ηV  
h  
3
TH_OFF_CNT  
LLD2  
threshold number of V  
ulator output  
mod-  
TH_OFF  
Green Mode Section  
t
Nonswitching period of SR gate  
to Enter Green Mode 1 for Lver-  
sion  
When SR_COND1, 2 are both low for  
, the green mode1 is  
45  
60  
75  
ms  
GRN1_ENT  
t
GRN1_ENT_L  
enabled in ALC, BLC, ALS  
in AHJ  
25  
40  
6
55  
ms  
ms  
t
Nonswitching period of SR gate  
to Enter Green Mode 2 for Lver-  
sion  
When SR_COND1, 2 are both low for  
4.5  
7.5  
GRN2_ENT  
t
, the green mode2 is  
GRN2_ENT_L  
enabled in ALC, BLC, ALS  
in AHJ  
2.5  
4
4
5.5  
ms  
h
_
Number of buffer switching cycle to Number of switching with V > V  
TH_HGH  
cycle  
CSW EXT  
D1  
(Note 4)  
recover I  
when IC exits from  
GREEN1 exit only  
DD_OP  
green mode 1.  
Protection Section  
V
(Note 4) Threshold voltage of current inver-  
sion detection  
LLD1 = 0  
0
mV  
ns  
SRC_INV  
LLD1 = 1, Virtual V  
V
TH_OFF  
TH_OF  
F
t
(Note 4)  
Debounce time of SR current  
inversion detection for Lversion  
V
INV  
> 4.5 V & V  
> V for  
SRC_INV  
320  
INV  
GATE1/2  
D1/2  
t
In ALC, BLC  
In ALS  
520  
170  
150  
ns  
ns  
In AHJ  
V
(Note 4)  
Drain threshold voltage for the  
primary shutdown protection  
V
D1/2  
> 4.5 V with 200 ns delay &  
GATE1/2  
mV  
SD_PRI  
V
> V  
when DLY_EN = 0,  
SD_PRI  
V
V
> 4.5 V with 100 ns delay &  
SD_PRI  
ALC, BLC  
GATE1/2  
D1/2  
> V  
when DLY_EN = 1 in  
in ALS  
200  
100  
70  
mV  
mV  
%
In AHJ  
K
(Note 4)  
Detection window time ratio based  
LLD1 = 0 & t  
(n1) = 8 ms & t <  
MIN_ON  
65  
75  
SD_PRI  
VG1  
on t  
(n1) for the primary shut-  
K
*t  
(n1).  
VG1  
2nd_TOFF VG1  
down protection  
If t  
VG1_70  
> K  
MIN_ON  
*t  
(n1),  
MIN_ON  
2nd_TOFF VG1  
t
= t  
V
(Note 4) Drain threshold voltage to trigger  
abnormal VD sensing protection  
V
> V  
& V  
> 4.5V with  
in ALC,  
0.85  
V
ABN_VD  
D1/2  
ABN_VD  
GATE1/2  
SD_PRI  
100 ns delay within K  
BLC, AHJ  
V
= V  
TH_HGH  
ABN_VD  
in ALS  
T > T  
1.5  
V
T
T
(Note 4)  
Over temperature protection1  
Over temperature protection2  
& V = 6.7 V in ALC,  
GATE  
°C  
105  
OTP1  
J
OTP1  
BLC, AHJ  
in ALS  
130  
140  
°C  
°C  
(Note 4)  
T > T  
& No gate output in ALC,  
OTP2  
J
OTP2  
BLC, AHJ  
in ALS  
disable  
80  
T
(Note 4) Over temperature protection reset  
T < T  
, OTP1 and OTP2 are  
°C  
OTP_RST  
J
OTP_RST  
reset  
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7
NCP4318  
ELECTRICAL CHARACTERISTICS (continued)  
= 12 V and T = 40°C to 125°C unless otherwise specified  
V
DD  
J
Symbol  
Gate Driver Section  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
V
Gate clamping voltage  
12 V < V < 33 V, C = 4.7 nF at  
GATE  
J OTP1  
9
5.0  
4
10.5  
6.7  
5
12  
8.2  
6.1  
V
V
GATE_MAX  
DD  
(Note 4)  
T < T  
V
Gate clamping voltage for adaptive  
gate voltage control  
V
DD  
= 12 V, C  
= 4.7 nF  
GATE_MAX_7V  
GATE  
(Note 4)  
t
(Note 4) Adaptive gate control enabling  
switching period  
The time t from V  
(n1) rising edge  
ms  
HFS1_EN  
s
GATE1  
to V  
(n) rising edge at  
GATE1  
OTP1  
T < T  
in ALC, BLC, ALS  
J
In AHJ  
4
ms  
I
(Note 4) Peak sourcing current of gate  
driver  
1.5  
A
SOURCE  
I
(Note 4)  
Peak sinking current of gate driver  
Gate driver sourcing resistance  
4.5  
8
A
SINK  
R
W
DRV_SOURCE  
(Note 4)  
R
Gate driver sinking resistance  
Rise time  
1.5  
50  
30  
W
ns  
ns  
DRV_SINK  
(Note 4)  
t
R
V
V
= 12 V, C = 3.3 nF,  
GATE  
150  
50  
DD  
L
= 1 V 6 V at T = 25°C  
J
t
F
Fall time  
V
V
= 12 V, C = 3.3 nF,  
DD  
GATE  
L
= 6 V 1 V at T = 25°C  
J
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. Not tested but guaranteed by design  
KEY PARAMETERS FOR IPT OPTIONS  
NCP4318ALC  
#4, #6  
NCP4318BLC  
#3, #6  
NCP4318ALS  
#4, #6  
NCP4318AHJ  
#4, #6  
Drain sensing pin  
Frequency  
Lversion  
Low / High  
320 ns  
90 ns  
Lversion  
Low / High  
320 ns  
90 ns  
Lversion  
Always High  
520 ns  
90 ns  
Hversion  
Low/High  
170 ns  
170 ns  
4 ms  
DLY_EN  
t
t
t
f
INV  
DEAD_LBAND  
GRN2_ENT  
HFS_EN  
6 ms  
6 ms  
6 ms  
200 kHz  
2
200 kHz  
2
200 kHz  
2
250 kHz  
1
nV  
TH_OFF_RST  
V
V
0.85 V  
0.85 V  
1.5 V  
0.85 V  
TH_HGH  
2Level  
(10 V, 6 V)  
2Level  
(10 V, 6 V)  
1Level  
(10 V)  
1Level  
(10 V)  
GATE_CTRL  
t
2 ms  
6 mV  
4 mV  
2 ms  
6 mV  
4 mV  
800 ns  
6 mV  
8 mV  
1.15 ms  
14 mV  
4 mV  
OFF_MIN  
V
V
V
V
TH_OFF_MIN  
TH_OFF_STEP  
TH_OFF_MAX  
TH_OFF_RST  
GATE_SKIP_L1  
GATE_SKIP_L2  
GRN1_ENT  
118 mV  
2 mV  
118 mV  
2 mV  
242 mV  
10 mV  
710 ns  
510 ns  
60 ms  
110 mV  
6 mV  
550 ns  
385 ns  
40 ms  
t
t
t
t
710 ns  
510 ns  
60 ms  
710 ns  
510 ns  
60 ms  
6 ms  
6 ms  
6 ms  
4 ms  
GRN2_ENT  
V
150 mV  
105°C  
140°C  
5 ms  
150 mV  
105°C  
140°C  
5 ms  
200 mV  
130°C  
Disable  
5 ms  
100 mV  
105°C  
140°C  
4 ms  
SD_PRI  
OTP1  
T
T
OTP2  
t
HFS1_EN  
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8
 
NCP4318  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 3. IOFFSET1 vs. Temperature  
Figure 5. tMIN_ON_U1_CH1 vs. Temperature  
Figure 7. VTH_ON_CH1 vs. Temperature  
Figure 4. IOFFSET2 vs. Temperature  
Figure 6. tMIN_ON_U1_CH2 vs. Temperature  
Figure 8. VTH_ON_CH2 vs. Temperature  
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9
NCP4318  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 9. VTH_OFF_STEP_CH1 vs. Temperature  
Figure 10. VTH_OFF_STEP_CH2 vs. Temperature  
Figure 12. VDD_OFF vs. Temperature  
Figure 11. VDD_ON vs. Temperature  
Figure 13. VDD_GATE_ON vs. Temperature  
Figure 14. IDD_START vs. Temperature  
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10  
NCP4318  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 15. IDD_OP1 vs. Temperature  
Figure 17. IDD_GREEN vs. Temperature  
Figure 19. tON_DLY_CH1 vs. Temperature  
Figure 16. IDD_OP0 vs. Temperature  
Figure 18. nSS_SKIP vs. Temperature  
Figure 20. tON_DLY_CH2 vs. Temperature  
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11  
NCP4318  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 21. tOFF_DLY_CH1 vs. Temperature  
Figure 23. KTON1_CH1 vs. Temperature  
Figure 25. KINV1_CH1 vs. Temperature  
Figure 22. tOFF_DLY_CH2 vs. Temperature  
Figure 24. KTON1_CH2 vs. Temperature  
Figure 26. KINV1_CH2 vs. Temperature  
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12  
NCP4318  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 27. VGATE_MAX_CH1 vs. Temperature  
Figure 29. VGATE_MAX_7V_CH1 vs. Temperature  
Figure 31. tR_CH1 vs. Temperature  
Figure 28. VGATE_MAX_CH2 vs. Temperature  
Figure 30. VGATE_MAX_7V_CH2 vs. Temperature  
Figure 32. tR_CH2 vs. Temperature  
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13  
NCP4318  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 33. tF_CH1 vs. Temperature  
Figure 35. VTH_HIGH_CH1 vs. Temperature  
Figure 37. tOFF_MIN_CH1 vs. Temperature  
Figure 34. tF_CH2 vs. Temperature  
Figure 36. VTH_HIGH_CH2 vs. Temperature  
Figure 38. tOFF_MIN_CH2 vs. Temperature  
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14  
NCP4318  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 39. tGATE_SKIP_L1_CH1 vs. Temperature  
Figure 40. tGATE_SKIP_L1_CH2 vs. Temperature  
Figure 42. tGRN2_ENT vs. Temperature  
Figure 41. tGRN1_ENT vs. Temperature  
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15  
NCP4318  
APPLICATION INFORMATION  
Basic Operation Principle  
constant operating frequency and turnon time. However, in  
case of the frequency varying system, it may lead to late  
turnoff during frequency increasing so that negative  
current can flow in the secondary side.  
To achieve both advantages, NCP4318 adopts mixed type  
turnoff control method which utilizes a hysteresis band  
dead time control. As shown in Figure 44, the instantaneous  
NCP4318 controls the SR MOSFET based on the  
instantaneous draintosource voltage sensed across  
DRAIN and SOURCE pins. Before SR gate is turned on, SR  
body diode operates as the conventional diode rectifier.  
Once the body diode starts conducting, the draintosource  
voltage drops below the turnon threshold voltage V  
TH_ON  
which triggers the turnon of the SR gate. Then, the  
draintosource voltage is determined by the product of  
drain voltage V is compared with a virtual V  
to  
D1  
TH_OFF1  
turn off SR gate. The virtual V  
is adaptively  
TH_OFF1  
turnon resistance  
instantaneous SR current. When the draintosource  
voltage reaches the turnoff threshold voltage V , as  
R
of SR MOSFET and  
changed to compensate the stray inductance effect and  
regulate t between t and t  
DS_ON  
DEAD  
DEAD_LBAND  
DEAD_HBAND  
regardless of parasitic inductances. Therefore, NCP4318  
can show robust operation with minimum dead time.  
TH_OFF  
SR MOSFET current decreases to near zero, NCP4318 turns  
off the gate. If SR dead time is larger or smaller than the dead  
time regulation target. NCP4318 adaptively changes a  
virtual turnoff threshold voltage to regulate the dead time  
Present information  
=instantaneous Vdrain type  
Present information+Previous cycle information  
=mixed type control  
RUN  
between t  
and t  
and to maximize  
DEAD_LBAND  
DEAD_HBAND  
system efficiency.  
VG1  
SET  
D
Q
Q
Turnon  
SR Turnon Algorithm  
CLR  
VD1  
When V  
is lower than V  
by body diode  
D1  
TH_ON  
VOFFSET1,  
VTH_OFF1  
Control  
Turnoff  
conduction of SR MOSFET, turnon comparator COM1  
outputs high. If an additional delay flag signal DLY_EN1 is  
Virtual VTH_OFF1  
low, VG1 goes high with 30 ns of t  
is charged by 1.5 A of sourcing current I  
and finally GATE1  
ON_DLY  
Previous cycle dead time information  
=Prediction type  
of a gate  
SOURCE  
driver.  
On the other hand, if DLY_EN is turned to high by current  
inversion detection SRC_INV high or GREEN high,  
additional turnon delay is applied by adaptive turnon  
delay block. In this case, SR gate is turned on after a body  
Figure 44. SR Turnoff Algorithm  
Hysteresis Band Dead Time Regulation Control  
The stray inductance of SR MOSFET induces a positive  
voltage offset across draintosource voltage when SR  
current decreases. This makes draintosource voltage of  
diode conduction time longer than t  
is confirmed.  
ON_DLY2  
IOFFSET1  
SR MOSFET higher than the product of R  
and  
DS_ON  
DLY_EN1  
RUN  
instantaneous SR current, which results in premature SR  
turnoff as shown in Figure 45. Since the induced offset  
voltage is changed as the output load current changes, the SR  
dead time needs to tune with the output load variation. To  
compensate it, NCP4318 utilizes the virtual turnoff  
threshold voltage which is determined by 31 steps of internal  
COM1  
VG1  
SET  
CLR  
Q
Q
GATE1  
D
Adaptive  
turnon  
delay  
VD1  
VS1  
VTH_ON  
Turnon  
Turnoff  
VTH_OFF1  
turnoff threshold voltages V  
and modulated  
TH_OFF(n)  
offset voltage V  
as shown in Figure 44. The virtual  
Figure 43. SR Turnon Algorithm  
OFFSET(n)  
turnoff threshold voltage and the offset voltage can be  
expressed as:  
SR Turnoff Algorithm  
Since a SR turnoff method determines SR conduction  
time and stable SR operation, the SR turnoff method is one  
of important feature of the SR controllers. One of the  
conventional method uses present information by an  
instantaneous drain voltage. This method is widely used and  
easy to realize, and can prevent late turnoff. However, it  
frequently shows premature turnoff due to parasitic stray  
inductances of PCB pattern and lead frame of SR MOSFET.  
In another method, SR conduction time is predicted by using  
previous cycle drain voltage information. Since it can  
prevent the premature turnoff, it is good for the system with  
Virtual VTH_OFF1 VTH_OFF1(n) VOFFSET1(n)  
(eq. 1)  
VOFFSET1(n) ROFFSET1 IOFFSET1(n)  
(eq. 2)  
where, R  
is the external drain sensing resistance  
OFFSET  
and I  
has 10 mA of step size. So, V  
is used  
OFFSET1  
OFFSET1  
for fine tuning of Virtual V  
. When V  
has  
TH_OFF1  
OFFSET1  
saturated to maximum or minimum values, V  
changes to its next step for coarse control.  
TH_OFF1  
In Figure 46, if a measured dead time T  
is larger than  
DEAD  
upper band of t  
, V  
is decreased by one  
DEAD_HBAND  
OFFSET  
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16  
NCP4318  
step decrease of I  
next switching cycle. As a result,  
ISR1  
OFFSET  
the dead time is decreased by increase of virtual V  
,
TH_OFF  
and becomes closer to t  
, as shown in Figure 47.  
DEAD_HBAND  
If the dead time is placed between lower band t  
DEAD_LBAND  
VD1  
and upper band t  
is and waits until T  
in Figure 48, V  
is larger than t  
stay as  
or  
DEAD_HBAND  
OFFSET  
Virtual  
VTH_OFF  
DEAD  
DEAD_HBAND  
smaller than t  
regulated between the lower band t  
Therefore, the dead time is  
DEAD_LBAND  
VTH_ON  
and the  
DEAD_LBAND  
VGATE1  
tDEAD_LBAND<TDEAD<tDEAD_HBAND  
upper band  
t
regardless of parasitic  
DEAD_HBAND  
inductances. This hysteresis band dead time control  
provides stable operation in light load condition by  
minimized dead time variation.  
tDEAD_LBAND tDEAD_HBAND  
Figure 48. When tDEAD_LBAND < TDEAD < tDEAD_HBAND  
ISR1  
VD1  
Advanced Adaptive Minimum Turnon Time  
VD1  
When SR gate is turning on, there may be severe  
oscillation in draintosource voltage of SR MOSFET,  
which results in several turnoff mistriggering as shown in  
Figure 49. To provide stable SR gate signal without short  
pulses, it is desirable to have large turnoff blanking time  
(=minimum turnon time) until the drain voltage oscillation  
attenuates. However, too large blanking time results in an  
inversion current problem under light load condition, where  
the SR conduction time is shorter than the minimum turnon  
time.  
VLS1  
VTH_OFF  
V
VGATE1  
VLS1  
ISR1  
Figure 45. Premature SR Turnoff by Stray Inductor  
ISR1  
To solve this issue, NCP4318 has adaptive minimum  
turnon time t  
where the turnoff blanking time  
MIN_ON  
changes in accordance with the SR conduction time  
(n1) measured in previous switching cycle. The  
SR conduction time is measured by the time from SR gate  
VD1  
t
SR_COND  
Virtual  
VTH_OFF1  
rising edge to where the drain sensing voltage V is higher  
VTH_ON  
D1  
than 0.85 V of V  
. So, the adaptive minimum ontime  
VGATE1  
DEAD1>tDEAD_HBAND  
TH_HGH  
t
is defined by 50% of t  
(n1) as shown in  
T
MIN_ON  
SR_COND  
Figure 50. During the t  
, SR turnoff by Virtual  
MIN_ON  
tDEAD_LBAND  
t
V
is prohibited to prevent abnormal turnoff by the  
TH_OFF1  
Figure 46. When TDEAD > tDEAD_HBAND  
drain sensing noise. The minimum value of t  
and the  
MIN_ON  
maximum value of t  
are defined by 200 ns and 5 ms,  
MIN_ON  
respectively. When the additional turnon delay flag  
DLY_EN1 is high in the light load condition, t  
ISR1  
MIN_ON  
becomes 20% of t  
(n1) as shown in Figure 51.  
SR_COND  
VD1  
Virtual  
VTH_OFF1  
VTH_ON  
VGATE1  
TDEAD1tDEAD_HBAND  
tDEAD_LBAND  
t
Figure 47. When TDEAD = tDEAD_HBAND  
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17  
NCP4318  
VD1  
shown in Figure 52, which induces SR turnon mistrigger.  
Turnoff mistrigger is prohibited  
during tMIN_ON  
Finally, the turnon mistrigger makes leading edge  
inversion current in the secondary side.  
The second inversion current is trailing edge inversion  
VTH_HGH  
VTH_OFF  
VTH_ON  
current caused by minimum ontime t  
. If t  
is  
MIN_ON  
MIN_ON  
tMIN_ON=50% of tSR_COND of  
previous cycle  
longer than current transfer width from the primary side,  
trailing edge inversion current can happen as shown in  
Figure 53. If proper algorithm is not provided to prevent this  
inversion current, severe drain voltage spike may happen.  
To prevent the both leading edge and trailing edge  
inversion currents, NCP4318 uses the current inversion  
detection function SRC_INV. When SR gate is turned on and  
current inversion occurs, the drain sensing voltage of SR  
SR conduction time = tSR_COND  
tON_DLY  
tDEAD  
VGATE1  
ISR  
MOSFET becomes positive value. In this condition, if V  
D1  
Figure 49. Minimum Turnon Time and Turnoff  
Mistriggering  
is higher than 0mV with a light load detection flag signal  
LLD=0, or the virtual V with LLD = 1 for t of the  
TH_OFF  
INV  
detection debounce time, SR current inversion detection is  
triggered and turnoff SR gate immediately. Then, turnon  
delay is increased to t  
from next turningon.  
ON_DLY2  
VGATE1  
VGATE2  
SR turnon mistrigger By capacitive current spike  
tSR_COND(n1) tMIN_ON=50% of tSR_COND(n1)  
VD1  
V
ISR  
VDS  
Figure 50. Minimum Turnon Time tMIN_ON when  
DLY_EN = 0  
Capacitive  
current spike  
Leading edge inversion current  
Figure 52. Leading Edge Inversion Current  
VGATE1  
VGATE2  
tMIN_ON  
VGATE1 VGATE2  
tSR_COND(n1) tMIN_ON=20% of tSRCOND(n1)  
V
VDS spike  
ISR  
VDS  
Figure 51. Minimum Turnon Time tMIN_ON when  
Trailing edge inversion current  
DLY_EN = 1  
Figure 53. Trailing Edge Inversion Current  
Current Inversion Detection  
During SR operation, two types of inversion current may  
occur. First, leading edge inversion current is caused by the  
capacitive current spike in light load condition. In heavy  
load condition, the body diode of SR MOSFET starts  
conducting right after the primary side switching transition  
takeing place. However, when the resonance capacitor  
voltage amplitude is not large enough in light load condition,  
the voltage across the magnetizing inductance of the  
transformer is smaller than the reflected output voltage.  
Thus, the secondary side SR body diode conduction is  
delayed until the magnetizing inductor voltage builds up to  
the reflected output voltage. However, the primary side  
switching transition can cause capacitive current spike and  
turn on the body diode of SR MOSFET for a short time as  
Light Load Detection (LLD)  
Since NCP4318 adopts the dead time regulation control  
algorithm, the output load condition can be detected by the  
control variable V  
(n). As shown in Figure 54, when  
TH_OFF  
the output load is increased to the heavy load condition,  
V
(n) is also increased. Vice versa. Therefore,  
level can represent the output load condition.  
TH_OFF  
V
TH_OFF  
When the control variable number ‘n’ is lower than ‘7’,  
NCP4318 detects a light load condition. So, light load  
detection flag signal LLD goes high. If ‘n’ is higher than ‘8’,  
LLD becomes low. This LLD signal is used for SRC_INV  
detection threshold voltage control and adaptive V  
control.  
GATE  
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18  
NCP4318  
Virtual VTH_OFF  
VTH_OFF(4)  
Heavy Load  
VTH_OFF(4)ROFFSET x IOFFSET_STEP0  
VTH_OFF(5)ROFFSET x IOFFSET_STEP31  
VGATE1  
VGATE2  
Virtual VTH_OFF trajectory when load  
VTH_OFF4  
VTH_OFF(3)  
VTH_OFF(3)ROFFSET x IOFFSET_STEP0  
VTH_OFF(4)ROFFSET x IOFFSET_STEP31  
1
2
3
4
GREEN1 exit  
VTH_OFF3 Range  
V
VDS2  
VTH_OFF(2)  
VTH_OFF(2)ROFFSET x IOFFSET_STEP0  
VTH_OFF(3)ROFFSET x IOFFSET_STEP31  
VTH_OFF2 Range  
VTH_OFF(1)  
VTH_OFF(1)ROFFSET x IOFFSET_STEP0  
VTH_OFF(2)ROFFSET x IOFFSET_STEP31  
Figure 56. GREEN1 Exits  
Adaptive VGATE Control  
VTH_OFF1 Range  
VTH_OFF(0)  
VTH_OFF(0)ROFFSET x IOFFSET_STEP0  
VTH_OFF(1)ROFFSET x IOFFSET_STEP31  
In NCP4318, there are three condition to trigger adaptive  
control. First one is the output load condition. In light  
load condition, to save SR gate driving current and  
maximize efficiency, NCP4318 adaptively changes the gate  
VTH_OFF0 Range  
V
GATE  
Virtual VTH_OFF_MIN  
Light Load  
VTH_OFF(0)ROFFSET x IOFFSET_STEP31  
t
Figure 54. Virtual VTH_OFF Trajectory when Iout  
Increases  
clamp voltage V  
. As shown in Figure 57, when LLD  
GATE  
goes high, the gate clamp voltage is reduced from 10 V to  
6 V. It could save 40% of gate driving power consumption.  
Green Mode  
In heavy load condition, V  
comes back to 10 V for  
GATE  
In NCP4318, there are two stages to trigger GREEN  
function. GREEN1 is for low power consumption in light  
load condition and GREEN2 is for preparing GREEN1  
triggering.  
When the LLC system in the primary side operates with  
skip mode under light load condition, NCP4318 can enter  
GREEN1 mode to reduce operating current. In that  
condition, if V has no switching operation for longer than  
, the GREEN1 mode is activated as shown in  
Figure 55. Once NCP4318 is in the GREEN1 mode, all the  
lower turnon resistance R  
of SR MOSFET in  
DS_ON  
Figure 58.  
The second condition is the operating frequency. If the  
LLC operating frequency is higher than 200 kHz of f  
HFS_EN  
in Lversion and 250 kHz in Hversion, NCP4318 reduces  
for lower SR gate driving current.  
V
GATE  
The last condition is junction temperature T of IC. When  
J
D1  
T is higher than 105 °C of T  
, V  
is changed to 6 V  
J
OTP1 GATE  
t
GRN1_ENT  
to reduce T . V  
comes back to 10 V, when T is lower  
J
GATE  
J
than 80 °C of T  
.
OTP_RST  
major functions are disabled to reduce the operating current  
down to 100 mA of I  
exits from the GREEN1 mode, four cycles of V switching  
. After then, when NCP4318  
DD_GREEN  
V
VGATE2  
D1  
are required as shown in Figure 56.  
Before GREEN1 is triggered, if no switching operation of  
Adaptive VGATE control enter @ LLD1=1  
V
D1  
is longer than t , 100 ns of GREEN2 pulse is  
GRN2_ENT  
generated to reset adaptive dead time control variables  
including V and I . In addition, the additional  
VDS1  
VDS2  
TH_OFF  
OFFSET  
delay flag signal DLY_EN and the light load detection signal  
LLD become high. So, GREEN2 prepares new SR operation  
start and allows soft increment of SR gate pulses next  
switching bundle.  
Figure 57. VGATE Control Enters when LLD is High  
VGATE1  
VGATE2  
VGATE1  
VGATE2  
Adaptive VGATE control exit @ LLD1=0  
GREEN1 trigger  
tGRN1_ENT  
V
VDS2  
V
VDS2  
Figure 55. GREEN1 Enters  
Figure 58. VGATE Control Exits when LLD is Low  
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19  
NCP4318  
Soft Start  
even in minimum ontime. Though SRC_INV function can  
turnoff SR gate at that moment, it has longer delay time for  
confirmation. For faster turnoff method, the primary  
shutdown protection is utilized.  
When the LLC gate signal in the primary side is suddenly  
disappears, SR current shows inflection point which induces  
high dV/dt of drain sensing voltage. If the dV/dt is higher  
At the beginning of LLC startup, the operating frequency  
is severely changed and sometimes symmetrical 50% duty  
cycles between highside and lowside power switches on  
the primary side cannot be guaranteed. It makes SR control  
difficult and unstable operation.  
To avoid SR operation under the transition, softstart  
function is utilized. In the first region of softstart, SR gate  
is skipped during 256cycles to check whether LLC system  
is normal or not. After the first region, NCP4318 starts  
than a threshold level V /t , the protection is  
SD_PRI INV  
triggered and SR gate turns off immediately. In addition, it  
turns GREEN1 high making 4 cycles gate skipping to ignore  
turnon mistrigger caused by energy bouncing in the  
secondary side.  
The other protection is the abnormal drain sensing  
protection. In normal condition, when SR gate is turning on,  
generating SR gate pulses with V  
= 6 V and V  
until LLD signal goes low. This allows  
GATE  
TH_OFF  
= V  
TH_OFF_RST  
softincrement of SR gate pulses and gradual reduction of  
the SR dead time at startup.  
V
is higher than 4.5 V and the drain sensing voltage V  
GATE  
D
Protection  
should be lower than 0.85 V of V  
diode conduction. However, in abnormal condition, V can  
be higher than V  
fluctuation. In that condition, NCP4318 triggers abnormal  
drain sensing protection and turns off SR gate and makes  
GREEN1 high.  
due to the body  
TH_HGH  
For higher system reliability, two protections are  
implemented in NCP4318. First one is the primary side  
shutdown protection. In SR controller point of view,  
NCP4318 cannot know directly the primary side abnormal  
gate off by a certain LLC protection or poweroff. In that  
condition, SR gate should be turned off as soon as possible  
D
even if V > 4.5 V due to V  
GATE D  
TH_HGH  
www.onsemi.com  
20  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOIC 8, 150 mils  
CASE 751BD01  
ISSUE O  
DATE 19 DEC 2008  
SYMBOL  
MIN  
NOM  
MAX  
1.35  
A
1.75  
A1  
b
0.10  
0.33  
0.19  
4.80  
5.80  
3.80  
0.25  
0.51  
0.25  
5.00  
6.20  
4.00  
c
E1  
E
D
E
E1  
e
h
L
θ
1.27 BSC  
0.25  
0.40  
0º  
0.50  
1.27  
8º  
PIN # 1  
IDENTIFICATION  
TOP VIEW  
D
h
A1  
θ
A
c
e
b
L
SIDE VIEW  
END VIEW  
Notes:  
(1) All dimensions are in millimeters. Angles in degrees.  
(2) Complies with JEDEC MS-012.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON34272E  
SOIC 8, 150 MILS  
PAGE 1 OF 1  
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