NCP4318ALS [ONSEMI]
Advanced Synchronous Rectifier Controller for LLC Resonant Converter;型号: | NCP4318ALS |
厂家: | ONSEMI |
描述: | Advanced Synchronous Rectifier Controller for LLC Resonant Converter |
文件: | 总22页 (文件大小:1074K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Advanced Synchronous
Rectifier Controller for LLC
Resonant Converter
NCP4318
NCP4318 is an advanced synchronous rectification (SR) controller
for LLC resonant converter with minimum external components. It
has two gate driver stages for driving the SR MOSFETs which are
rectifying the outputs of the secondary transformer windings. The two
gate driver stages have their own Drain and Source sensing inputs and
operate independently of each other. The advanced adaptive dead time
control compensates a voltage across parasitic inductance to minimize
the body diode conduction and maximize the system efficiency. The
advanced turn−off control algorithm allows stable SR operation over
entire load range. NCP4318 has two versions of pin assignment –
NCP4318AXX, NCP4318BXX.
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SOIC 8, 150 mils
CASE 751BD
MARKING DIAGRAM
Features
8
• Mixed Mode SR Turn−off Control
• Anti Shoot−through Control for Reliable SR Operation
NCP4318
UVW
AWLYYWW
• Separate 200 V Rated Sense Pins for the Drain and Dedicated Source
1
Sense Pins
• Advanced Adaptive Dead Time Control
• SR Current Inversion Detection
U
V
W
A
= Pin Layout, A and B
= Frequency, H: High, L: Low
= Additional IPT option
= Assembly Location
• Adaptive Minimum Turn−on Time for Noise Immunity
• SR Conduction Time Increase Rate Limitation
• Multi−level Turn−off Threshold Voltage
WL = Wafer Lot Traceability
YYWW = Date Code
• Adaptive Gate Voltage Control (10 V, 6 V)
PIN CONNECTIONS
• Low Operating Current (100 mA) in Green Mode
• Soft Start for 512 Switching Cycle with 0 V/6 V Gate Output Voltage
• Very Fast Turn−on and Turn−off Delay Time (30 ns/30 ns)
• Large Gate Sourcing and Sinking Current (1.5 A/4.5 A)
• Wide Operating Supply Voltage Range from 6.5 V to 35 V
• Wide Operating Frequency Range (22 kHz to 500 kHz)
• SOIC−8 Package
NCP4318AXX
GATE1
GND
VS1
GATE2
VDD
VD2
VD1
VS2
• These Devices are Pb−Free and are RoHS Compliant
NCP4318BXX
Applications
• High Power Density Adapters
• Large Screen LED−TV and OLED−TV Power Supplies
• High Efficiency Desktop and Server Power Supplies
• Networking and Telecom Power Supplies
• High Power LED Lighting
GATE1
GND
VD1
GATE2
VDD
VD2
VS1
VS2
(Top View)
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 3 of this data sheet.
© Semiconductor Components Industries, LLC, 2020
1
Publication Order Number:
March, 2021 − Rev. 1
NCP4318/D
NCP4318
M2
Optional
Roffset2
Bridge
Diode
Q1
Q2
EMI
Filter
PFC
Stage
VAC
Cin
Cr
Lr
VO
Lp
RO
CO
Roffset1
Optional
M1
LLC
Controller
Shunt
Regulator
Figure 1. Typical Application Schematic of NCP4318
VD1_HGH
VD2_HGH
SR
Conduction
SR
Conduction
SR_COND1
SR_COND2
VTH_HGH
VTH_HGH
IOFFSET1
IOFFSET2
DLY_EN1
DLY_EN2
RUN
RUN
SET
CLR
SET
CLR
Q
Q
Q
Q
D
D
Adaptive
turn−on
delay
Adaptive
turn−on
delay
VD1
VS1
VD2
VS2
VTH_ON
VTH_ON
Turn−on
Turn−on
VTH_OFF1
VTH_OFF2
Turn−off
Turn−off
Adaptive
Tmin_on
Adaptive
Tmin_on
SRC_INV1
SRC_INV2
Adaptive
Adaptive
VGATE
VGATE
Adaptive
dead time
control
Adaptive
dead time
control
IOFFSET1
VTH_OFF1
IOFFSET2
VTH_OFF2
VD1_HGH
VD2_HGH
GATE
GATE
CLAMP
CLAMP
VG1
VG2
GATE1
GATE2
VD1
GREEN
VD2
SR Current Inversion detect
SRC_INV1
DLY_EN1
DLY_EN2
RUN
SRC_INV2
VDD_GATE_ON /VDD_GATE_OFF
SR_COND1,2
GREEN
VD1_HGH
GREEN MODE
GREEN
Protections
SOFT
START
SR_COND1
SR_COND2
Adaptive
VGATE
VTH_OFF1
HFS
SS_7V
VGATE
Control
OTP1
VDD
GND
Figure 2. Internal Block Diagram of NCP4318
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2
NCP4318
PIN DESCRIPTION
Pin Number
NCP4318A
NCP4318B
Name
GATE1
GND
Description
1
2
3
1
2
4
Gate drive output for SR MOSFET1
Ground
VS1
Synchronous rectifier source sense input for SR1
Synchronous rectifier drain sense input. I
current source flows out of the
OFFSET1
VD1 pin such that an external series resistor can be used to adjust the synchronous
4
5
6
3
5
6
VD1
VS2
VD2
rectifier turn−off threshold. The I
current source is turned off when V is
OFFSET1
DD
under−voltage or when switching is disabled in green mode
Synchronous rectifier source sense input for SR2
Synchronous rectifier drain sense input. I
current source flows out of the
OFFSET2
VD2 pin such that an external series resistor can be used to adjust the synchronous
rectifier turn−off threshold. The I current source is turned off when V is
OFFSET2
DD
under−voltage or when switching is disabled in green mode
7
8
7
8
VDD
Supply Voltage
GATE2
Gate drive output for SR MOSFET2
ORDERING INFORMATION
Device (Ordering Code)
NCP4318ALC
Device Marking
NCP4318ALC
NCP4318BLC
NCP4318ALS
NCP4318AHJ
Package
Shipping†
NCP4318BLC
SOIC 8
(Pb−Free)
2500 / Tape & Reel
NCP4318ALS
NCP4318AHJ
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
NCP4318
MAXIMUM RATINGS
Symbol
Parameter
Min
−0.3
−4
Max
37
Unit
V
V
Power Supply Input Pin Voltage
Drain Sense Input Pin Voltage
Gate Drive Output Pin Voltage
DD
V
V
200
17
V
D1, D2
V
V
−0.3
V
GATE1,
GATE2
V
V
Source Sense Input Pin Voltage
−0.3
−4
5.5
5.5
V
V
S1, S2
V
Source Sense Dynamic Input Pin Voltage (pulse width = 200 ns)
S1_DYN,
V
S2_DYN
P
Power Dissipation (T = 25°C)
0.625
150
150
260
3
W
°C
°C
°C
kV
D
A
T
Maximum Junction Temperature
Storage Temperature Range
−40
−60
J
T
STG
T
Lead Temperature (Soldering, 10 Seconds)
L
ESD
Electrostatic Discharge Capability Human Body Model, ANSI / ESDA / JEDEC
JS−001−2012 (except VD1, VD2 pin)
Human Body Model, VD1−GND, VD2−GND pin to
2
2
pin with 330pF capacitance on VD1 and VD2 pin
Charged Device Model, JESD22−C101
1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. All voltage values are with respect to the GND pin.
2. The capacitance can be replaced by C
of MOSFET.
OSS
THERMAL CHARACTERISTICS
Rating
Symbol
Value
22
Unit
°C/W
°C/W
Thermal Characteristics
Thermal Characteristics
R
y
JT
R
165
q
JA
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
0
Max
35
Unit
V
DD
(Note 3)
VDD Pin Supply Voltage to GND
V
V
V
,V
Drain Sense Input Pin Voltage
Source Sense Input Pin Voltage
Operating Ambient Temperature
−0.7
−0.3
−40
180
5
D1 D2
V
V
V
S1 S2
T
J
+125
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
3. Allowable operating supply voltage V can be limited by the power dissipation of NCP4318 related to switching frequency, load capacitance
DD
and ambient temperature.
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4
NCP4318
ELECTRICAL CHARACTERISTICS
V
DD
= 12 V and T = −40°C to 125°C unless otherwise specified
J
Symbol
Parameter
Conditions
Min
Typ
Max
4.3
Unit
Supply Voltage and Current Section
V
Turn−on threshold
V
DD
V
DD
V
DD
V
DD
rising with 4.3 V / 1 ms
4.0
3.8
6.5
6.0
V
V
V
V
DD_ON
V
Turn−off threshold
< V
> V
< V
3.6
5.0
DD_OFF
DD_GATE_ON
DD_OFF
V
SR gate enable threshold voltage
SR gate disable threshold voltage
7.1
DD_GATE_ON
DD_GATE_OFF
V
DD_GATE_OFF
(Note 4)
I
Operating current
f
f
= 100 kHz, C
= 100 kHz, C
= 1 nF
8
10
6
mA
mA
mA
DD_OP1
SW
GATE
I
Operating current
= 0 nF
0
DD_OP
SW
GATE
I
Start−up current
V
V
= V - 0.1 V
DD_ON
100
210
DD_START
DD
I
Operating current in green mode1
= 12 V (no V
switching)
100
255
mA
DD_GREEN
DD
D1/2
GREEN1 enable at T = 25°C
J
h
_
Number of V
alternative
V
falling lower than V
& V
D1/2
Cycle
SS SKIP
D1/2
D1/2
TH_ON
switching for soft start skip range
rising higher than V
& No GATE
= 0 nF
GATE
TH_HGH
output at f
= 200 kHz, C
SW
Drain Voltage Sensing Section
V
(Note 4)
Comparator input offset voltage
Drain pin leakage current
Turn−on threshold
−1
0
1
1
mV
mA
OSI
I
V
= 200 V
DRAIN_LKG
D1/2
V
(Note 4)
R
= 0 W (includes comparator in-
OFFSET
−100
mV
TH_ON
put offset voltage)
From V higher than V
TH_HGH
t
Minimum off-time
1400
2000
2800
ns
OFF_MIN
D1/2
in ALC, BLC
in ALS
450
750
800
1150
30
1150
1550
80
ns
ns
ns
In AHJ
t
Turn−on propagation delay
Turn−on comparator delay
From V = −0.2 to V
DLY_EN = 0
ON_DLY
= 1 V, when
= 1 V, when
D1/2
GATE
t
(Note 4) Turn−on de−bounce time for L−ver- Turn−on comparator delay
240
ns
ON_DLY2
sion when additional turn−on delay
is enabled in light load condition
From V
= −0.2 to V
D1/2
GATE
DLY_EN = 1 in ALC, BLC, ALS, AHJ
t
Turn−off propagation delay
Turn−off comparator delay
30
80
ns
OFF_DLY
From V
= 0.6 to V
= 5.7 V
D1/2
GATE
V
Minimum turn−off threshold voltage
mV
R
= 0 W (includes comparator in-
−6
TH_OFF_MIN
(Note 4)
OFFSET
put offset voltage) in ALC, BLC, ALS
In AHJ
−14
4
mV
mV
mV
mV
mV
mV
mV
mV
mV
%
V
One step size of turn−off threshold
voltage
R
= 0 W, in ALC, BLC, AHJ
= 0 W, in ALC, BLC
TH_OFF_STEP
(Note 4)
OFFSET
in ALS
8
V
Maximum turn−off threshold volt-
age
R
118
242
110
2
TH_OFF_MAX
(Note 4)
OFFSET
in ALS
In AHJ
V
Turn−off threshold voltage reset
value
R
= 0 W, in ALC, BLC
TH_OFF_RST
(Note 4)
OFFSET
in ALS
In AHJ
10
−6
60
K
Ratio of the second step V
LLD1 is low.
If LLD1 is high, 2 step V
2ND_VOFF
(Note 4)
TH_OFF
in one
based on nominal V
switching cycle
nd
rd
TH_OFF
= 3
TH_OFF
step V
TH_OFF
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5
NCP4318
ELECTRICAL CHARACTERISTICS (continued)
= 12 V and T = −40°C to 125°C unless otherwise specified
V
DD
J
Symbol
Drain Voltage Sensing Section
Effective time ratio based on
Parameter
Conditions
Min
Typ
Max
Unit
K
LLD1 = 0 & t
(n−1) = 8 μs & t <
MIN_ON
(n−1).
70
%
2nd_TOFF
VG1
2nd_TOFF VG1
nd
(Note 4)
t
(n−1) for the 2 step V
K
*t
VG1
TH_OFF
in one switching cycle
If t
> K
*t
(n−1),
MIN_ON
2nd_TOFF VG1
= t
MIN_ON
t
VG1_70
V
(Note 4) Drain voltage high detect threshold
voltage
V
Rising in ALC, BLC, AHJ
0.85
1.5
V
V
TH_HGH
D1/2
in ALS
t
Minimum SR conduction time to
enable SR when DLY_EN = 0
TH_OFF1 or 2
when gate skip is triggered)
The duration from turn−on trigger to
500
350
710
ns
GATE_SKIP_L1
V
rising higher than V ,when
D1/2
TH_HGH
(3 steps V
decrease
DLY_EN = 0 in ALC, BLC, ALS
In AHJ
550
510
ns
ns
t
Minimum SR conduction time to
enable SR when DLY_EN = 1 (3
The duration from turn−on trigger to
V rising higher than V ,when
D1/2
GATE_SKIP_L2
(Note 4)
TH_HGH
steps V
decrease
DLY_EN=1 in ALC, BLC, ALS
TH_OFF1 or 2
when gate skip is triggered)
In AHJ
385
ns
Minimum On−Time and Maximum On−Time Section
K
K
Adaptive minimum on time ratio
when DLY_EN = 0
DLY_EN=0 & t
(n−1) = 8 ms
/ t (n−1)
43
50
20
57
%
%
TON1
SR_COND
K
TON
= t
MIN_ON SR_COND
Adaptive minimum on time ratio
when DLY_EN = 1
DLY_EN=1 & t
(n−1) = 8 ms
/ t (n−1)
TON2
SR_COND
K
TON
= t
MIN_ON SR_COND
t
t
Minimum on−time upper limit when
t
< t
< t
< t
, when
, when
4
2
5
6
3
ms
ms
%
MIN_ON_U1
MIN_ON_U2
MIN_ON_L
MIN_ON
MIN_ON_U
DLY_EN = 0
DLY_EN = 0
Minimum on−time upper limit when
DLY_EN = 1
t
< t
MIN_ON
2.5
50
MIN_ON_L
MIN_ON_U
DLY_EN = 1
= K when DLY_EN = 0
INV1,
K
Adaptive SR current inversion de-
tection window ratio when DLY_EN
= 0
K
43
57
INV1
INV2
TON1
t
= t
MIN_ON
INV_WIN
K
Adaptive SR current inversion de-
tection window ratio when DLY_EN
= 1
K
= K
when DLY_EN = 1
20
16k
30
%
TON2
INV2,
= t
MIN_ON
t
INV_WIN
h
(Note 4) Normal consecutive switching cy-
cles to exit SR current inversion
Without parasitic V
oscillation
cycle
INV_EXT
D1/2
state which has t
ON_DLY2
t
Maximum SR turn−on time
21
39
22
ms
SR_MAX_ON
(Note 4)
f
(Note 4)
Minimum switching frequency
1/(t
+ t
)
kHz
MIN
SR_MAX_ON_CH1
SR_MAX_ON_CH2
Dead Time Regulation Section
I
Maximum of adaptive offset current
which have 31 steps and 10μA of
resolution
V
= V = 0
285
310
90
335
mA
OFFSET
D1
D2
t
Lower band of dead time regula-
tion
From V
in ALC, BLC, ALS
falling below V
GATE_LOW
ns
DEAD_LBAND
(Note 4)
GATE
In AHJ
170
ns
ns
t
Upper band of dead time regula-
tion
From V
when LLD1 = 0
falling below V
,
t
DEAD_L
BAND
+90
DEAD_HBAND
(Note 4)
GATE
GATE_LOW
h
LLD1
(Note 4)
First light load detection (LLD1)
ηV
≤ h
LLD1
7
TH_OFF_CNT
threshold number of V
ulator output
mod-
TH_OFF
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6
NCP4318
ELECTRICAL CHARACTERISTICS (continued)
= 12 V and T = −40°C to 125°C unless otherwise specified
V
DD
J
Symbol
Dead Time Regulation Section
(Note 4)
Parameter
Conditions
Min
Typ
Max
Unit
h
LLD2
Second light load detection (LLD2) ηV
≤ h
3
TH_OFF_CNT
LLD2
threshold number of V
ulator output
mod-
TH_OFF
Green Mode Section
t
Non−switching period of SR gate
to Enter Green Mode 1 for L−ver-
sion
When SR_COND1, 2 are both low for
, the green mode1 is
45
60
75
ms
GRN1_ENT
t
GRN1_ENT_L
enabled in ALC, BLC, ALS
in AHJ
25
40
6
55
ms
ms
t
Non−switching period of SR gate
to Enter Green Mode 2 for L−ver-
sion
When SR_COND1, 2 are both low for
4.5
7.5
GRN2_ENT
t
, the green mode2 is
GRN2_ENT_L
enabled in ALC, BLC, ALS
in AHJ
2.5
4
4
5.5
ms
h
_
Number of buffer switching cycle to Number of switching with V > V
TH_HGH
cycle
CSW EXT
D1
(Note 4)
recover I
when IC exits from
GREEN1 exit only
DD_OP
green mode 1.
Protection Section
V
(Note 4) Threshold voltage of current inver-
sion detection
LLD1 = 0
0
mV
ns
SRC_INV
LLD1 = 1, Virtual V
V
TH_OFF
TH_OF
F
t
(Note 4)
Debounce time of SR current
inversion detection for L−version
V
INV
> 4.5 V & V
> V for
SRC_INV
320
INV
GATE1/2
D1/2
t
In ALC, BLC
In ALS
520
170
150
ns
ns
In AHJ
V
(Note 4)
Drain threshold voltage for the
primary shutdown protection
V
D1/2
> 4.5 V with 200 ns delay &
GATE1/2
mV
SD_PRI
V
> V
when DLY_EN = 0,
SD_PRI
V
V
> 4.5 V with 100 ns delay &
SD_PRI
ALC, BLC
GATE1/2
D1/2
> V
when DLY_EN = 1 in
in ALS
200
100
70
mV
mV
%
In AHJ
K
(Note 4)
Detection window time ratio based
LLD1 = 0 & t
(n−1) = 8 ms & t <
MIN_ON
65
75
SD_PRI
VG1
on t
(n−1) for the primary shut-
K
*t
(n−1).
VG1
2nd_TOFF VG1
down protection
If t
VG1_70
> K
MIN_ON
*t
(n−1),
MIN_ON
2nd_TOFF VG1
t
= t
V
(Note 4) Drain threshold voltage to trigger
abnormal VD sensing protection
V
> V
& V
> 4.5V with
in ALC,
0.85
V
ABN_VD
D1/2
ABN_VD
GATE1/2
SD_PRI
100 ns delay within K
BLC, AHJ
V
= V
TH_HGH
ABN_VD
in ALS
T > T
1.5
V
T
T
(Note 4)
Over temperature protection1
Over temperature protection2
& V = 6.7 V in ALC,
GATE
°C
105
OTP1
J
OTP1
BLC, AHJ
in ALS
130
140
°C
°C
(Note 4)
T > T
& No gate output in ALC,
OTP2
J
OTP2
BLC, AHJ
in ALS
disable
80
T
(Note 4) Over temperature protection reset
T < T
, OTP1 and OTP2 are
°C
OTP_RST
J
OTP_RST
reset
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NCP4318
ELECTRICAL CHARACTERISTICS (continued)
= 12 V and T = −40°C to 125°C unless otherwise specified
V
DD
J
Symbol
Gate Driver Section
Parameter
Conditions
Min
Typ
Max
Unit
V
Gate clamping voltage
12 V < V < 33 V, C = 4.7 nF at
GATE
J OTP1
9
5.0
4
10.5
6.7
5
12
8.2
6.1
V
V
GATE_MAX
DD
(Note 4)
T < T
V
Gate clamping voltage for adaptive
gate voltage control
V
DD
= 12 V, C
= 4.7 nF
GATE_MAX_7V
GATE
(Note 4)
t
(Note 4) Adaptive gate control enabling
switching period
The time t from V
(n−1) rising edge
ms
HFS1_EN
s
GATE1
to V
(n) rising edge at
GATE1
OTP1
T < T
in ALC, BLC, ALS
J
In AHJ
4
ms
I
(Note 4) Peak sourcing current of gate
driver
1.5
A
SOURCE
I
(Note 4)
Peak sinking current of gate driver
Gate driver sourcing resistance
4.5
8
A
SINK
R
W
DRV_SOURCE
(Note 4)
R
Gate driver sinking resistance
Rise time
1.5
50
30
W
ns
ns
DRV_SINK
(Note 4)
t
R
V
V
= 12 V, C = 3.3 nF,
GATE
150
50
DD
L
= 1 V ꢀ 6 V at T = 25°C
J
t
F
Fall time
V
V
= 12 V, C = 3.3 nF,
DD
GATE
L
= 6 V ꢀ 1 V at T = 25°C
J
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Not tested but guaranteed by design
KEY PARAMETERS FOR IPT OPTIONS
NCP4318ALC
#4, #6
NCP4318BLC
#3, #6
NCP4318ALS
#4, #6
NCP4318AHJ
#4, #6
Drain sensing pin
Frequency
L−version
Low / High
320 ns
90 ns
L−version
Low / High
320 ns
90 ns
L−version
Always High
520 ns
90 ns
H−version
Low/High
170 ns
170 ns
4 ms
DLY_EN
t
t
t
f
INV
DEAD_LBAND
GRN2_ENT
HFS_EN
6 ms
6 ms
6 ms
200 kHz
2
200 kHz
2
200 kHz
2
250 kHz
1
nV
TH_OFF_RST
V
V
0.85 V
0.85 V
1.5 V
0.85 V
TH_HGH
2−Level
(10 V, 6 V)
2−Level
(10 V, 6 V)
1−Level
(10 V)
1−Level
(10 V)
GATE_CTRL
t
2 ms
−6 mV
4 mV
2 ms
−6 mV
4 mV
800 ns
−6 mV
8 mV
1.15 ms
−14 mV
4 mV
OFF_MIN
V
V
V
V
TH_OFF_MIN
TH_OFF_STEP
TH_OFF_MAX
TH_OFF_RST
GATE_SKIP_L1
GATE_SKIP_L2
GRN1_ENT
118 mV
2 mV
118 mV
2 mV
242 mV
10 mV
710 ns
510 ns
60 ms
110 mV
−6 mV
550 ns
385 ns
40 ms
t
t
t
t
710 ns
510 ns
60 ms
710 ns
510 ns
60 ms
6 ms
6 ms
6 ms
4 ms
GRN2_ENT
V
150 mV
105°C
140°C
5 ms
150 mV
105°C
140°C
5 ms
200 mV
130°C
Disable
5 ms
100 mV
105°C
140°C
4 ms
SD_PRI
OTP1
T
T
OTP2
t
HFS1_EN
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8
NCP4318
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 3. IOFFSET1 vs. Temperature
Figure 5. tMIN_ON_U1_CH1 vs. Temperature
Figure 7. VTH_ON_CH1 vs. Temperature
Figure 4. IOFFSET2 vs. Temperature
Figure 6. tMIN_ON_U1_CH2 vs. Temperature
Figure 8. VTH_ON_CH2 vs. Temperature
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9
NCP4318
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 9. VTH_OFF_STEP_CH1 vs. Temperature
Figure 10. VTH_OFF_STEP_CH2 vs. Temperature
Figure 12. VDD_OFF vs. Temperature
Figure 11. VDD_ON vs. Temperature
Figure 13. VDD_GATE_ON vs. Temperature
Figure 14. IDD_START vs. Temperature
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10
NCP4318
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 15. IDD_OP1 vs. Temperature
Figure 17. IDD_GREEN vs. Temperature
Figure 19. tON_DLY_CH1 vs. Temperature
Figure 16. IDD_OP0 vs. Temperature
Figure 18. nSS_SKIP vs. Temperature
Figure 20. tON_DLY_CH2 vs. Temperature
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11
NCP4318
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 21. tOFF_DLY_CH1 vs. Temperature
Figure 23. KTON1_CH1 vs. Temperature
Figure 25. KINV1_CH1 vs. Temperature
Figure 22. tOFF_DLY_CH2 vs. Temperature
Figure 24. KTON1_CH2 vs. Temperature
Figure 26. KINV1_CH2 vs. Temperature
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12
NCP4318
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 27. VGATE_MAX_CH1 vs. Temperature
Figure 29. VGATE_MAX_7V_CH1 vs. Temperature
Figure 31. tR_CH1 vs. Temperature
Figure 28. VGATE_MAX_CH2 vs. Temperature
Figure 30. VGATE_MAX_7V_CH2 vs. Temperature
Figure 32. tR_CH2 vs. Temperature
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13
NCP4318
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 33. tF_CH1 vs. Temperature
Figure 35. VTH_HIGH_CH1 vs. Temperature
Figure 37. tOFF_MIN_CH1 vs. Temperature
Figure 34. tF_CH2 vs. Temperature
Figure 36. VTH_HIGH_CH2 vs. Temperature
Figure 38. tOFF_MIN_CH2 vs. Temperature
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14
NCP4318
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 39. tGATE_SKIP_L1_CH1 vs. Temperature
Figure 40. tGATE_SKIP_L1_CH2 vs. Temperature
Figure 42. tGRN2_ENT vs. Temperature
Figure 41. tGRN1_ENT vs. Temperature
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15
NCP4318
APPLICATION INFORMATION
Basic Operation Principle
constant operating frequency and turn−on time. However, in
case of the frequency varying system, it may lead to late
turn−off during frequency increasing so that negative
current can flow in the secondary side.
To achieve both advantages, NCP4318 adopts mixed type
turn−off control method which utilizes a hysteresis band
dead time control. As shown in Figure 44, the instantaneous
NCP4318 controls the SR MOSFET based on the
instantaneous drain−to−source voltage sensed across
DRAIN and SOURCE pins. Before SR gate is turned on, SR
body diode operates as the conventional diode rectifier.
Once the body diode starts conducting, the drain−to−source
voltage drops below the turn−on threshold voltage V
TH_ON
which triggers the turn−on of the SR gate. Then, the
drain−to−source voltage is determined by the product of
drain voltage V is compared with a virtual V
to
D1
TH_OFF1
turn off SR gate. The virtual V
is adaptively
TH_OFF1
turn−on resistance
instantaneous SR current. When the drain−to−source
voltage reaches the turn−off threshold voltage V , as
R
of SR MOSFET and
changed to compensate the stray inductance effect and
regulate t between t and t
DS_ON
DEAD
DEAD_LBAND
DEAD_HBAND
regardless of parasitic inductances. Therefore, NCP4318
can show robust operation with minimum dead time.
TH_OFF
SR MOSFET current decreases to near zero, NCP4318 turns
off the gate. If SR dead time is larger or smaller than the dead
time regulation target. NCP4318 adaptively changes a
virtual turn−off threshold voltage to regulate the dead time
Present information
=instantaneous Vdrain type
Present information+Previous cycle information
=mixed type control
RUN
between t
and t
and to maximize
DEAD_LBAND
DEAD_HBAND
system efficiency.
VG1
SET
D
Q
Q
Turn−on
SR Turn−on Algorithm
CLR
VD1
When V
is lower than V
by body diode
D1
TH_ON
VOFFSET1,
VTH_OFF1
Control
Turn−off
conduction of SR MOSFET, turn−on comparator COM1
outputs high. If an additional delay flag signal DLY_EN1 is
Virtual VTH_OFF1
low, VG1 goes high with 30 ns of t
is charged by 1.5 A of sourcing current I
and finally GATE1
ON_DLY
Previous cycle dead time information
=Prediction type
of a gate
SOURCE
driver.
On the other hand, if DLY_EN is turned to high by current
inversion detection SRC_INV high or GREEN high,
additional turn−on delay is applied by adaptive turn−on
delay block. In this case, SR gate is turned on after a body
Figure 44. SR Turn−off Algorithm
Hysteresis Band Dead Time Regulation Control
The stray inductance of SR MOSFET induces a positive
voltage offset across drain−to−source voltage when SR
current decreases. This makes drain−to−source voltage of
diode conduction time longer than t
is confirmed.
ON_DLY2
IOFFSET1
SR MOSFET higher than the product of R
and
DS_ON
DLY_EN1
RUN
instantaneous SR current, which results in premature SR
turn−off as shown in Figure 45. Since the induced offset
voltage is changed as the output load current changes, the SR
dead time needs to tune with the output load variation. To
compensate it, NCP4318 utilizes the virtual turn−off
threshold voltage which is determined by 31 steps of internal
COM1
VG1
SET
CLR
Q
Q
GATE1
D
Adaptive
turn−on
delay
VD1
VS1
VTH_ON
Turn−on
Turn−off
VTH_OFF1
turn−off threshold voltages V
and modulated
TH_OFF(n)
offset voltage V
as shown in Figure 44. The virtual
Figure 43. SR Turn−on Algorithm
OFFSET(n)
turn−off threshold voltage and the offset voltage can be
expressed as:
SR Turn−off Algorithm
Since a SR turn−off method determines SR conduction
time and stable SR operation, the SR turn−off method is one
of important feature of the SR controllers. One of the
conventional method uses present information by an
instantaneous drain voltage. This method is widely used and
easy to realize, and can prevent late turn−off. However, it
frequently shows premature turn−off due to parasitic stray
inductances of PCB pattern and lead frame of SR MOSFET.
In another method, SR conduction time is predicted by using
previous cycle drain voltage information. Since it can
prevent the premature turn−off, it is good for the system with
Virtual VTH_OFF1 ꢁ VTH_OFF1(n) ꢂ VOFFSET1(n)
(eq. 1)
VOFFSET1(n) ꢁ ROFFSET1 ꢃ IOFFSET1(n)
(eq. 2)
where, R
is the external drain sensing resistance
OFFSET
and I
has 10 mA of step size. So, V
is used
OFFSET1
OFFSET1
for fine tuning of Virtual V
. When V
has
TH_OFF1
OFFSET1
saturated to maximum or minimum values, V
changes to its next step for coarse control.
TH_OFF1
In Figure 46, if a measured dead time T
is larger than
DEAD
upper band of t
, V
is decreased by one
DEAD_HBAND
OFFSET
www.onsemi.com
16
NCP4318
step decrease of I
next switching cycle. As a result,
ISR1
OFFSET
the dead time is decreased by increase of virtual V
,
TH_OFF
and becomes closer to t
, as shown in Figure 47.
DEAD_HBAND
If the dead time is placed between lower band t
DEAD_LBAND
VD1
and upper band t
is and waits until T
in Figure 48, V
is larger than t
stay as
or
DEAD_HBAND
OFFSET
Virtual
VTH_OFF
DEAD
DEAD_HBAND
smaller than t
regulated between the lower band t
Therefore, the dead time is
DEAD_LBAND
VTH_ON
and the
DEAD_LBAND
VGATE1
tDEAD_LBAND<TDEAD<tDEAD_HBAND
upper band
t
regardless of parasitic
DEAD_HBAND
inductances. This hysteresis band dead time control
provides stable operation in light load condition by
minimized dead time variation.
tDEAD_LBAND tDEAD_HBAND
Figure 48. When tDEAD_LBAND < TDEAD < tDEAD_HBAND
ISR1
VD1
Advanced Adaptive Minimum Turn−on Time
VD1
When SR gate is turning on, there may be severe
oscillation in drain−to−source voltage of SR MOSFET,
which results in several turn−off mis−triggering as shown in
Figure 49. To provide stable SR gate signal without short
pulses, it is desirable to have large turn−off blanking time
(=minimum turn−on time) until the drain voltage oscillation
attenuates. However, too large blanking time results in an
inversion current problem under light load condition, where
the SR conduction time is shorter than the minimum turn−on
time.
VLS1
VTH_OFF
V
VGATE1
VLS1
ISR1
Figure 45. Premature SR Turn−off by Stray Inductor
ISR1
To solve this issue, NCP4318 has adaptive minimum
turn−on time t
where the turn−off blanking time
MIN_ON
changes in accordance with the SR conduction time
(n−1) measured in previous switching cycle. The
SR conduction time is measured by the time from SR gate
VD1
t
SR_COND
Virtual
VTH_OFF1
rising edge to where the drain sensing voltage V is higher
VTH_ON
D1
than 0.85 V of V
. So, the adaptive minimum on−time
VGATE1
DEAD1>tDEAD_HBAND
TH_HGH
t
is defined by 50% of t
(n−1) as shown in
T
MIN_ON
SR_COND
Figure 50. During the t
, SR turn−off by Virtual
MIN_ON
tDEAD_LBAND
t
V
is prohibited to prevent abnormal turn−off by the
TH_OFF1
Figure 46. When TDEAD > tDEAD_HBAND
drain sensing noise. The minimum value of t
and the
MIN_ON
maximum value of t
are defined by 200 ns and 5 ms,
MIN_ON
respectively. When the additional turn−on delay flag
DLY_EN1 is high in the light load condition, t
ISR1
MIN_ON
becomes 20% of t
(n−1) as shown in Figure 51.
SR_COND
VD1
Virtual
VTH_OFF1
VTH_ON
VGATE1
TDEAD1≈tDEAD_HBAND
tDEAD_LBAND
t
Figure 47. When TDEAD = tDEAD_HBAND
www.onsemi.com
17
NCP4318
VD1
shown in Figure 52, which induces SR turn−on mis−trigger.
Turn−off mis−trigger is prohibited
during tMIN_ON
Finally, the turn−on mis−trigger makes leading edge
inversion current in the secondary side.
The second inversion current is trailing edge inversion
VTH_HGH
VTH_OFF
VTH_ON
current caused by minimum on−time t
. If t
is
MIN_ON
MIN_ON
tMIN_ON=50% of tSR_COND of
previous cycle
longer than current transfer width from the primary side,
trailing edge inversion current can happen as shown in
Figure 53. If proper algorithm is not provided to prevent this
inversion current, severe drain voltage spike may happen.
To prevent the both leading edge and trailing edge
inversion currents, NCP4318 uses the current inversion
detection function SRC_INV. When SR gate is turned on and
current inversion occurs, the drain sensing voltage of SR
SR conduction time = tSR_COND
tON_DLY
tDEAD
VGATE1
ISR
MOSFET becomes positive value. In this condition, if V
D1
Figure 49. Minimum Turn−on Time and Turn−off
Mis−triggering
is higher than 0mV with a light load detection flag signal
LLD=0, or the virtual V with LLD = 1 for t of the
TH_OFF
INV
detection debounce time, SR current inversion detection is
triggered and turn−off SR gate immediately. Then, turn−on
delay is increased to t
from next turning−on.
ON_DLY2
VGATE1
VGATE2
SR turn−on mis−trigger By capacitive current spike
tSR_COND(n−1) tMIN_ON=50% of tSR_COND(n−1)
VD1
V
ISR
VDS
Figure 50. Minimum Turn−on Time tMIN_ON when
DLY_EN = 0
Capacitive
current spike
Leading edge inversion current
Figure 52. Leading Edge Inversion Current
VGATE1
VGATE2
tMIN_ON
VGATE1 VGATE2
tSR_COND(n−1) tMIN_ON=20% of tSRCOND(n−1)
V
VDS spike
ISR
VDS
Figure 51. Minimum Turn−on Time tMIN_ON when
Trailing edge inversion current
DLY_EN = 1
Figure 53. Trailing Edge Inversion Current
Current Inversion Detection
During SR operation, two types of inversion current may
occur. First, leading edge inversion current is caused by the
capacitive current spike in light load condition. In heavy
load condition, the body diode of SR MOSFET starts
conducting right after the primary side switching transition
takeing place. However, when the resonance capacitor
voltage amplitude is not large enough in light load condition,
the voltage across the magnetizing inductance of the
transformer is smaller than the reflected output voltage.
Thus, the secondary side SR body diode conduction is
delayed until the magnetizing inductor voltage builds up to
the reflected output voltage. However, the primary side
switching transition can cause capacitive current spike and
turn on the body diode of SR MOSFET for a short time as
Light Load Detection (LLD)
Since NCP4318 adopts the dead time regulation control
algorithm, the output load condition can be detected by the
control variable V
(n). As shown in Figure 54, when
TH_OFF
the output load is increased to the heavy load condition,
V
(n) is also increased. Vice versa. Therefore,
level can represent the output load condition.
TH_OFF
V
TH_OFF
When the control variable number ‘n’ is lower than ‘7’,
NCP4318 detects a light load condition. So, light load
detection flag signal LLD goes high. If ‘n’ is higher than ‘8’,
LLD becomes low. This LLD signal is used for SRC_INV
detection threshold voltage control and adaptive V
control.
GATE
www.onsemi.com
18
NCP4318
Virtual VTH_OFF
VTH_OFF(4)
Heavy Load
VTH_OFF(4)−ROFFSET x IOFFSET_STEP0
VTH_OFF(5)−ROFFSET x IOFFSET_STEP31
VGATE1
VGATE2
↑
Virtual VTH_OFF trajectory when load
VTH_OFF4
VTH_OFF(3)
VTH_OFF(3)−ROFFSET x IOFFSET_STEP0
VTH_OFF(4)−ROFFSET x IOFFSET_STEP31
1
2
3
4
GREEN1 exit
VTH_OFF3 Range
V
VDS2
VTH_OFF(2)
VTH_OFF(2)−ROFFSET x IOFFSET_STEP0
VTH_OFF(3)−ROFFSET x IOFFSET_STEP31
VTH_OFF2 Range
VTH_OFF(1)
VTH_OFF(1)−ROFFSET x IOFFSET_STEP0
VTH_OFF(2)−ROFFSET x IOFFSET_STEP31
Figure 56. GREEN1 Exits
Adaptive VGATE Control
VTH_OFF1 Range
VTH_OFF(0)
VTH_OFF(0)−ROFFSET x IOFFSET_STEP0
VTH_OFF(1)−ROFFSET x IOFFSET_STEP31
In NCP4318, there are three condition to trigger adaptive
control. First one is the output load condition. In light
load condition, to save SR gate driving current and
maximize efficiency, NCP4318 adaptively changes the gate
VTH_OFF0 Range
V
GATE
Virtual VTH_OFF_MIN
Light Load
VTH_OFF(0)−ROFFSET x IOFFSET_STEP31
t
Figure 54. Virtual VTH_OFF Trajectory when Iout
Increases
clamp voltage V
. As shown in Figure 57, when LLD
GATE
goes high, the gate clamp voltage is reduced from 10 V to
6 V. It could save 40% of gate driving power consumption.
Green Mode
In heavy load condition, V
comes back to 10 V for
GATE
In NCP4318, there are two stages to trigger GREEN
function. GREEN1 is for low power consumption in light
load condition and GREEN2 is for preparing GREEN1
triggering.
When the LLC system in the primary side operates with
skip mode under light load condition, NCP4318 can enter
GREEN1 mode to reduce operating current. In that
condition, if V has no switching operation for longer than
, the GREEN1 mode is activated as shown in
Figure 55. Once NCP4318 is in the GREEN1 mode, all the
lower turn−on resistance R
of SR MOSFET in
DS_ON
Figure 58.
The second condition is the operating frequency. If the
LLC operating frequency is higher than 200 kHz of f
HFS_EN
in L−version and 250 kHz in H−version, NCP4318 reduces
for lower SR gate driving current.
V
GATE
The last condition is junction temperature T of IC. When
J
D1
T is higher than 105 °C of T
, V
is changed to 6 V
J
OTP1 GATE
t
GRN1_ENT
to reduce T . V
comes back to 10 V, when T is lower
J
GATE
J
than 80 °C of T
.
OTP_RST
major functions are disabled to reduce the operating current
down to 100 mA of I
exits from the GREEN1 mode, four cycles of V switching
. After then, when NCP4318
DD_GREEN
V
VGATE2
D1
are required as shown in Figure 56.
Before GREEN1 is triggered, if no switching operation of
Adaptive VGATE control enter @ LLD1=1
V
D1
is longer than t , 100 ns of GREEN2 pulse is
GRN2_ENT
generated to reset adaptive dead time control variables
including V and I . In addition, the additional
VDS1
VDS2
TH_OFF
OFFSET
delay flag signal DLY_EN and the light load detection signal
LLD become high. So, GREEN2 prepares new SR operation
start and allows soft increment of SR gate pulses next
switching bundle.
Figure 57. VGATE Control Enters when LLD is High
VGATE1
VGATE2
VGATE1
VGATE2
Adaptive VGATE control exit @ LLD1=0
GREEN1 trigger
tGRN1_ENT
V
VDS2
V
VDS2
Figure 55. GREEN1 Enters
Figure 58. VGATE Control Exits when LLD is Low
www.onsemi.com
19
NCP4318
Soft Start
even in minimum on−time. Though SRC_INV function can
turn−off SR gate at that moment, it has longer delay time for
confirmation. For faster turn−off method, the primary
shutdown protection is utilized.
When the LLC gate signal in the primary side is suddenly
disappears, SR current shows inflection point which induces
high dV/dt of drain sensing voltage. If the dV/dt is higher
At the beginning of LLC startup, the operating frequency
is severely changed and sometimes symmetrical 50% duty
cycles between high−side and low−side power switches on
the primary side cannot be guaranteed. It makes SR control
difficult and unstable operation.
To avoid SR operation under the transition, soft−start
function is utilized. In the first region of soft−start, SR gate
is skipped during 256cycles to check whether LLC system
is normal or not. After the first region, NCP4318 starts
than a threshold level V /t , the protection is
SD_PRI INV
triggered and SR gate turns off immediately. In addition, it
turns GREEN1 high making 4 cycles gate skipping to ignore
turn−on mis−trigger caused by energy bouncing in the
secondary side.
The other protection is the abnormal drain sensing
protection. In normal condition, when SR gate is turning on,
generating SR gate pulses with V
= 6 V and V
until LLD signal goes low. This allows
GATE
TH_OFF
= V
TH_OFF_RST
soft−increment of SR gate pulses and gradual reduction of
the SR dead time at startup.
V
is higher than 4.5 V and the drain sensing voltage V
GATE
D
Protection
should be lower than 0.85 V of V
diode conduction. However, in abnormal condition, V can
be higher than V
fluctuation. In that condition, NCP4318 triggers abnormal
drain sensing protection and turns off SR gate and makes
GREEN1 high.
due to the body
TH_HGH
For higher system reliability, two protections are
implemented in NCP4318. First one is the primary side
shutdown protection. In SR controller point of view,
NCP4318 cannot know directly the primary side abnormal
gate off by a certain LLC protection or power−off. In that
condition, SR gate should be turned off as soon as possible
D
even if V > 4.5 V due to V
GATE D
TH_HGH
www.onsemi.com
20
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC 8, 150 mils
CASE 751BD−01
ISSUE O
DATE 19 DEC 2008
SYMBOL
MIN
NOM
MAX
1.35
A
1.75
A1
b
0.10
0.33
0.19
4.80
5.80
3.80
0.25
0.51
0.25
5.00
6.20
4.00
c
E1
E
D
E
E1
e
h
L
θ
1.27 BSC
0.25
0.40
0º
0.50
1.27
8º
PIN # 1
IDENTIFICATION
TOP VIEW
D
h
A1
θ
A
c
e
b
L
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MS-012.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34272E
SOIC 8, 150 MILS
PAGE 1 OF 1
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