NCP459FCT2G [ONSEMI]

4 A Single Load Switch for Low Voltage Rail;
NCP459FCT2G
型号: NCP459FCT2G
厂家: ONSEMI    ONSEMI
描述:

4 A Single Load Switch for Low Voltage Rail

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NCP458R, NCP459  
4 A Single Load Switch for  
Low Voltage Rail  
The NCP458R and NCP459 are power load switch with very low  
Ron NMOSFET controlled by external logic pin, allowing  
optimization of battery life, and portable device autonomy.  
Indeed, thanks to a best in class current consumption optimization  
with NMOS structure, leakage currents are drastically decreased.  
Offering optimized leakages isolation on the ICs connected on the  
battery.  
http://onsemi.com  
MARKING  
DIAGRAM  
Output discharge path is proposed, in the NCP459 version , to  
eliminate residual voltages on the external components connected on  
output pin.  
Reverse voltage protection, from OUT to IN is offered in the  
NCP458R version.  
XXXX  
AYWWG  
WLCSP8  
CASE 567HD  
A
Y
WW  
G
= Assembly Location  
= Year  
= Work Week  
= Pb−Free Package  
Proposed in wide input voltage range from 0.75 V to 5.5 V, and a  
2
very small CSP8 1 x 2 mm .  
PINOUT  
1
2
Features  
0.75 V − 5.5 V Operating Range  
11 mW N−MOSFET  
Vbias Rail Input  
EN  
IN  
GATE  
A
B
C
D
DC Current up to 4 A  
Output Auto−Discharge Option  
Reverse Blocking Option  
Active High EN Pin  
OUT  
OUT  
GND  
2
CSP8, 1 x 2 mm , Pitch 0.5 mm  
IN  
Typical Applications  
Notebooks  
Tablets  
Wireless  
Mobile Phones  
Digital Cameras  
VBIAS  
(Top View)  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 12 of  
this data sheet.  
Vcc  
V+  
LS  
NCP458−459  
DCDC Converter  
LoDrO  
B1  
C1  
A2  
D1  
B2  
Platform IC’n  
IN  
IN  
OUT  
OUT  
SMPS  
C2  
A1  
D2  
Gate EN  
Vbias GND  
ENx  
EN  
0
Figure 1. Typical Application Schematic  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
June, 2014 − Rev. 1  
NCP458R/D  
NCP458R, NCP459  
LS  
NCP458−459  
DCDC Converter  
B1  
C1  
A2  
D1  
B2  
C2  
A1  
D2  
Platform IC’n  
IN  
IN  
OUT  
OUT  
EN  
or  
LDO  
Gate  
Vbias GND  
ENx  
EN  
0
Figure 2. Application Schematic with Vbias Connected to IN and No Gate Delay  
PIN FUNCTION DESCRIPTION  
Pin Name  
EN  
Pin Number  
A1  
Type  
Description  
Enable input, logic high turns on power switch .  
Load−switch input pin.  
INPUT  
IN  
B1, C1  
D1  
POWER  
POWER  
INPUT  
VBIAS  
GATE  
OUT  
External supply voltage input.  
A2  
OUT pin slew rate control (t ).  
rise  
B2, C2  
D2  
POWER  
POWER  
Load−switch output pin.  
Ground connection.  
GND  
http://onsemi.com  
2
NCP458R, NCP459  
BLOCK DIAGRAMS  
IN: B1, C1  
OUT : B2, C2  
GATE : A2  
Gate driver  
Control  
logic  
EN: A1  
&
Charge  
Pump  
GND: D2  
VBIAS : D1  
Figure 3. NCP458R Block Diagram  
IN: B1, C1  
GATE : A2  
OUT : B2, C2  
Gate driver  
Control  
logic  
&
Charge  
Pump  
GND : D2  
EN : A1  
VBIAS : D1  
Figure 4. NCP459 Block Diagram  
http://onsemi.com  
3
NCP458R, NCP459  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
IN, OUT, EN, VBIAS, GATE Pins: (Note 1)  
V
V
V
V
−0.3 to +6.5  
V
EN, IN , OUT,  
V
BIAS, GATE  
From IN to OUT Pins: Input/Output (Note 1) NCP459  
From IN to OUT Pins: Input/Output (Note 1) NCP458R  
Human Body Model (HBM) ESD Rating are (Note 2)  
Machine Model (MM) ESD Rating are (Note 2)  
V
V
0 to + 6.5  
6.5  
V
V
V
V
IN , OUT  
V
V
IN , OUT  
ESD HBM  
ESD MM  
2000  
200  
Latch−up protection (Note 3)  
− Pins IN, OUT, EN, VBIAS and GATE  
LU  
100  
mA  
°C  
Maximum Junction Temperature  
Storage Temperature Range  
Moisture Sensitivity (Note 4)  
T
J
−40 to + 125  
−40 to + 150  
Level 1  
T
STG  
°C  
MSL  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. According to JEDEC standard JESD22−A108.  
2. This device series contains ESD protection and passes the following tests:  
Human Body Model (HBM) 2.0 kV per JEDEC standard:  
JESD22−A114 for all pins.  
Machine Model (MM) 250 V per JEDEC standard: JESD22−A115 for all pins.  
3. Latch up Current Maximum Rating: 100 mA per JEDEC standard: JESD78 class II.  
4. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.  
OPERATING CONDITIONS  
Symbol  
Parameter  
Operational Power Supply  
Enable Voltage  
Conditions  
Min  
0.75  
0
Typ  
Max  
5.5  
Unit  
V
V
IN  
V
EN  
5.5  
V
V
BIAS  
Bias voltage (V  
best of V V )  
IN, OUT  
1.2  
5.5  
V
BIAS  
T
Ambient Temperature Range  
Decoupling input capacitor  
Decoupling output capacitor  
− 40  
100  
100  
25  
+ 85  
°C  
nF  
nF  
°C/W  
A
A
C
IN  
C
OUT  
R
Thermal Resistance Junction to Air  
DC current  
CSP8 (Note 5)  
90  
4
q
JA  
4.5  
5
AC current 1 ms @ 217 Hz  
AC current 100 ms spike  
A
A
I
OUT  
15  
P
D
Power Dissipation Rating (Note 6)  
0.315  
W
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
5. The R  
is dependent of the PCB heat dissipation and thermal via.  
q
JA  
6. The maximum power dissipation ( ) is given by the following formula:  
PD  
TJMAX * TA  
PD  
+
RqJA  
http://onsemi.com  
4
 
NCP458R, NCP459  
ELECTRICAL CHARACTERISTICS Min & Max Limits apply for T between −40°C to +85°C for V between 0.75 V and 5.5 V,  
A
IN  
and V  
between 1.2 V and 5.5 V (Unless otherwise noted). Typical values are referenced to T = + 25°C, V = 3.3 V and  
BIAS  
A IN  
V
BIAS  
= 5 V (Unless otherwise noted).  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
POWER SWITCH  
T = 25°C  
11  
11  
20  
24  
20  
24  
20  
24  
20  
24  
20  
24  
24  
30  
30  
35  
300  
A
V
IN  
V
IN  
V
IN  
V
IN  
V
IN  
= V  
= V  
= V  
= V  
= V  
= 5.5 V  
= 3.3 V  
= 1.8 V  
= 1.5 V  
= 1.2 V  
BIAS  
BIAS  
BIAS  
BIAS  
BIAS  
T = 125°C  
J
T = 25°C  
A
T = 125°C  
J
T = 25°C  
A
12  
13  
13  
14  
17  
230  
T = 125°C  
J
Static drain−source  
on−state resistance  
for each rail  
T = 25°C  
A
mW  
R
DS(on)  
T = 125°C  
J
T = 25°C  
A
T = 125°C  
J
T = 25°C  
A
V
IN  
= 1.0 V  
= 1.2 V  
V
BIAS  
T = 125°C  
J
T = 25°C  
A
V
IN  
= 0.8 V  
= 1.2 V  
V
BIAS  
T = 125°C  
J
R
Output discharge  
path  
EN = low, NCP459  
W
DIS  
TIMINGS  
No cap on GATE pin  
Gate capacitor = 1 nF  
Gate capacitor = 10 nF  
Without Cgate  
0.26  
1.5  
15  
Output rise time  
From 10% to 90% of  
T
ms  
R
V
OUT  
V
LOAD  
LOAD  
= 5 V  
= 1 mF,  
= 25 W  
IN  
10  
ms  
ms  
Enable time From En  
to 10% of V  
C
R
T
en  
V
ih  
OUT  
With 1 nF on Gate  
60  
Fall Time. From 90%  
to 10% of V  
T
50  
ms  
ms  
F
OUT  
Tdis  
Disable time  
From EN to 90% Vout  
No cap on GATE pin  
Gate capacitor = 1 nF  
Gate capacitor = 10 nF  
Without Cgate, NCP459  
Without Cgate, NCP458R  
With 1 nF on Gate  
75  
0.25  
1
0.5  
Output rise time  
From 10% to 90% of  
T
R
ms  
V
OUT  
10  
20  
50  
ms  
ms  
ms  
V
= 3.3 V  
= 1 mF,  
= 25 W  
IN  
Enable time  
C
LOAD  
LOAD  
From En V to 10%  
90  
150  
T
en  
ih  
R
of V  
OUT  
114  
Output fall time  
From 90% to 10% of  
T
F
60  
120  
ms  
V
OUT  
No cap on GATE pin  
Gate capacitor = 1 nF  
Gate capacitor = 10 nF  
Without Cgate  
0.12  
0.6  
5.5  
15  
Output rise time From  
10% to 90% of V  
T
T
ms  
R
OUT  
V
= 1.8 V  
= 1 mF,  
= 25 W  
IN  
C
LOAD  
LOAD  
ms  
ms  
Enable time From En  
to 10% of V  
R
en  
V
ih  
OUT  
With 1 nF on Gate  
85  
Output fall time From  
90% to 10% of V  
T
F
35  
ms  
OUT  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
7. Parameters are guaranteed for C  
and R  
connected to the OUT pin with respect to the ground  
LOAD  
LOAD  
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5
NCP458R, NCP459  
ELECTRICAL CHARACTERISTICS Min & Max Limits apply for T between −40°C to +85°C for V between 0.75 V and 5.5 V,  
A
IN  
and V  
between 1.2 V and 5.5 V (Unless otherwise noted). Typical values are referenced to T = + 25°C, V = 3.3 V and  
BIAS  
A IN  
V
BIAS  
= 5 V (Unless otherwise noted).  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
TIMINGS  
No cap on GATE pin  
0.01  
1
Output rise time  
From 10% to 90% of  
V
LOAD  
LOAD  
= 1 V  
= 1 mF,  
= 25 W  
IN  
C
R
Gate capacitor = 1 nF  
Gate capacitor = 10 nF  
Without Cgate  
T
R
ms  
V
OUT  
13  
10  
0.4  
20  
ms  
ms  
ms  
Enable time From En  
V
IN  
= 1 V  
= 1 mF,  
= 25 W  
T
en  
V
ih  
to 10% of V  
OUT  
C
R
With 1 nF on Gate  
LOAD  
LOAD  
T
Output fall time  
F
Logic  
High−level input  
voltage  
V
0.9  
3
V
IH  
Low−level input  
voltage  
V
0.4  
V
IL  
R
Pull down resistor  
7
MW  
EN  
REVERSE CURRENT BLOCKING  
V
Reverse threshold  
V
OUT  
− V  
IN  
45  
60  
mV  
mV  
rev_thr  
Reverse threshold  
hysteresis  
V
rev_hyst  
Reverse comparator  
response time  
T
rev  
V
OUT  
− Vin > V  
rev_thr  
2.5  
ms  
QUIESCENT CURRENT− NCP458R  
V
Quiescent  
BIAS  
I
V
= 3.3 V, EN = high  
EN = high  
1.5  
6
mA  
mA  
mA  
VBIAS  
BIAS  
current  
I
IN Quiescent current  
0.01  
0.01  
0.3  
0.3  
INQ  
EN = low, IN standby current, V = 3.3 V, without  
IN  
I
Standby current IN  
STBIN  
discharge path.  
Standby current  
I
V
= 3.3 V EN = low  
0.4  
1.5  
0.5  
mA  
mA  
STDVbias  
BIAS  
V
BIAS  
Output leakage  
current  
I
IN connected to GND, V  
= 5 V  
0.01  
out_leak  
OUT  
QUIESCENT CURRENT − NCP459  
V
Quiescent  
BIAS  
I
V
= 3.3 V, EN = high  
EN = high  
1.3  
5
mA  
mA  
mA  
VBIAS  
BIAS  
current  
I
IN Quiescent current  
0.01  
0.01  
0.3  
0.3  
INQ  
EN = low, IN standby current, V = 3.3 V, with  
IN  
I
Standby current IN  
STBIN  
discharge path. NCP459.  
Standby current  
I
V
BIAS  
= 3.3 V EN = low  
0.4  
1.5  
mA  
STDVbias  
V
BIAS  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
7. Parameters are guaranteed for C  
and R  
connected to the OUT pin with respect to the ground  
LOAD  
LOAD  
http://onsemi.com  
6
NCP458R, NCP459  
TIMINGS  
V
IN  
EN  
V
OUT  
T
T
T
EN  
R
T
F
DIS  
T
T
OFF  
ON  
Figure 5. Enable, Rise and Fall Time  
http://onsemi.com  
7
NCP458R, NCP459  
TYPICAL CHARACTERISTICS  
25  
20  
15  
10  
5
6.0  
5.8  
5.6  
5.4  
−40°C  
125°C  
25°C  
5.0  
85°C  
25°C  
4.8  
4.6  
4.4  
4.2  
4.0  
85°C  
−40°C  
125°C  
0
0.8 1.3 1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3  
(V)  
0.5  
1.5  
2.5  
3.5  
(V)  
4.5  
5.5  
V
IN  
V
EN  
Figure 6. RDS(on) (mW) vs VIN (V), Over  
Figure 7. Pull Down Resistor (MW) vs VEN (V),  
Temperature Range  
Over Temperature Range  
350  
300  
250  
200  
150  
100  
50  
0.60  
0.50  
0.40  
0.30  
0.20  
0.10  
0
−40°C  
25°C  
85°C  
−40°C  
25°C  
85°C  
125°C  
125°C  
0
0.75 1.25 1.75 2.25 2.75 3.25 3.75 4.25 4.75 5.25  
1
2
3
V
4
5
(V)  
V
IN  
(V)  
BIAS  
Figure 8. Discharge Resistor (W) vs VIN (V),  
Figure 9. NCP458R Standby Current (mA) vs  
BIAS (V), Over Temperature Range  
Over Temperature Range  
V
0.50  
0.45  
0.40  
0.35  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
−40°C  
25°C  
85°C  
−40°C  
25°C  
85°C  
125°C  
125°C  
0.75 1.25 1.75 2.25 2.75 3.25 3.75 4.25 4.75 5.25  
(V)  
1
2
3
V
4
5
(V)  
V
BIAS  
BIAS  
Figure 10. NCP459 Standby Current (mA) vs  
BIAS (V), Over Temperature Range  
Figure 11. NCP458R Quiescent Current (mA) vs  
BIAS (V), Over Temperature Range  
V
V
http://onsemi.com  
8
NCP458R, NCP459  
TYPICAL CHARACTERISTICS  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
10k  
1k  
−40°C  
25°C  
85°C  
125°C  
100  
10  
1
−40°C  
25°C  
85°C  
125°C  
0.75 1.25 1.75 2.25 2.75 3.25 3.75 4.25 4.75 5.25  
(V)  
0.8 1.3 1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3  
(V)  
V
BIAS  
V
IN  
Figure 12. NCP459 Quiescent Current (mA) vs  
BIAS (V), Over Temperature Range  
Figure 13. Enable Time (ms) vs VIN (V) , Over  
V
Temperature Range (without Cgate)  
10  
1.0  
0.1  
10k  
1k  
−40°C  
25°C  
85°C  
125°C  
100  
10  
1
−40°C  
25°C  
85°C  
125°C  
0.8 1.3 1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3  
(V)  
0.8 1.3 1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3  
V
IN  
V
IN  
(V)  
Figure 14. Rise Time (ms) vs VIN (V), Over  
Temperature Range (without Cgate)  
Figure 15. Disable Time (ms) vs VIN (V), Over  
Temperature Range  
VBIAS and VIN Tied Together  
1k  
100  
10  
1
0.8 1.3 1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3  
V
IN  
(V)  
Figure 16. Fall Time (ms) vs VIN (V), Over  
Temperature Range  
V
BIAS and VIN Tied Together  
Rload 25 W  
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9
NCP458R, NCP459  
FUNCTIONAL DESCRIPTION  
Overview  
If Vbias rail is not available or used, Vbias pin and Vin pin  
can be connected together as close as possible the DUT. A  
minimum of 1.2 V is necessary to control the IC.  
The NCP458R and NCP459 are high side N channel  
MOSFET power distribution switch designed to isolate ICs  
connected on the battery or DCDC supplies in order to save  
energy. The part can be used with a wide range of supply  
from 0.75 V to 5.5 V.  
Output rise time − Gate control  
The NMOS is control with internal charge pump and  
driver. A minimum gate slew rate is internally set to avoid  
huge inrush current when EN is set from low to high. The  
default gate slew rate depends on Vin level. The higher Vin  
level, the longer rise time.  
Enable Input  
Enable pin is an active high. The path is opened when EN  
pin is tied low (disable), forcing NMOS switch off.  
The IN/OUT path is activated with a minimum of V  
min, Vin min and EN forced to high level.  
In addition, an external capacitor can be connected  
between Gate pin and GND in order to slow down the gate  
rising. See electrical table for more details.  
BIAS  
Auto Discharge (Optional − NCP459)  
NMOS FET is placed between the output pin and GND,  
in order to discharge the application capacitor connected on  
OUT pin.  
The auto−discharge is activated when EN pin is set to low  
level (disable state).  
Cin and Cout Capacitors  
100 nF external capacitors must be connected as close as  
possible the DUT for noise immunity and better stability. In  
case of input hot plug (input voltage connected with fast  
slew rate − few ms − it’s strongly recommended to avoid big  
capacitor connected on the input. That allows to avoid input  
over voltage transients.  
The discharge path ( Pull down NMOS) stays activated as  
long as EN pin is set at low level.  
In order to limit the current across the internal discharge  
Reverse Blocking Control (Optional NCP458R)  
A reverse blocking control circuitry is embedded to  
eliminate leakages from OUT to IN in case of Vout > Vin.  
A comparator measures the dropout voltage on the switch  
between OUT and IN and turn off the NMOS if this voltage  
exceeds specified reverse voltage.  
Nmosfet, the typical value is set at R  
value.  
DIS  
Vbias Rail  
The core of the IC is supplied thanks to Vbias supply rail  
(common +5 V, 3.3 V, 1.8 V, 1.2 V). Indeed, no current  
consumption is used on IN pin, allowing to improve power  
saving of the rail that must be isolated by the power switch.  
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10  
NCP458R, NCP459  
APPLICATION INFORMATION  
Demoboard  
Power Dissipation  
Main contributor in term of junction temperature is the  
power dissipation of the power MOSFET. Assuming this,  
the power dissipation and the junction temperature in  
normal mode can be calculated with the following  
equations:  
The NCP458R and NCP459 integrate a 4 A rated NMOS  
FET, and the PCB rules must be respected to properly  
evacuate the heat out of the silicon.  
The package is a CSP and due to the low thermal  
resistance of the silicon, all the balls can be used to improved  
power dissipation. Indeed, even if the power crosses the IN  
/ OUT pins only, all the balls around this power area should  
be connected to the larger PCB area.  
In the below PCB example (application demonstration  
board), all the PCB areas connected to 6 balls are enlarged.  
In addition vias are connected to bottom side with exactly  
same form factor of the other PCB side.  
(eq. 1)  
ǒ
Ǔ2  
PD + RDS(on)   IOUT  
P
D
= Power dissipation (W)  
R
I
= Power MOSFET on resistance (W)  
= Output current (A)  
DS(on)  
OUT  
TJ + PD   RqJA ) TA  
(eq. 2)  
Additional improvements can be done also by using more  
copper thickness and the thinner epoxy as possible.  
T
= Junction temperature (°C  
= Package thermal resistance (°C/W)  
= Ambient temperature (°C)  
J
R
T
qJA  
A
Figure 18. Demonstration Board  
(bottom view)  
Figure 17. Demonstration Board (top view)  
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11  
NCP458R, NCP459  
IN  
OUT  
IN_2  
OUT_2  
U1  
B1  
C1  
A2  
D1  
B2  
IN  
OUT  
C2  
GND  
GND  
IN  
OUT  
A1  
Gate  
Vbias GND  
EN  
D1  
DIODE ZENER1  
D2  
C2  
1μF  
D2  
DIODE ZENER1  
C1  
1μF  
C3  
1nF  
NCP458−9  
VBIAS  
J9  
1
2
Bat  
100 k  
R1  
1μF  
C4  
EN  
R2  
100 k  
Figure 19. Demonstration Board Schematic  
BILL OF MATERIAL TABLE  
Quantity  
Reference schem  
Part description  
Socket, 4mm, metal, PK5  
HEADER200  
Part number  
B010  
Manufacturer  
HIRSCHMANN  
FC  
2
4
1
3
1
1
2
2
1
IN, OUT  
IN_2, OUT_2, VBIAS, EN  
2.54 mm, 77313-101-06LF  
2.54 mm, 77313-101-06LF  
GRM155R70J105KA12#  
GRM188R60J102ME47#  
ESD9x  
J9 (Bat)  
C1, C2, C4  
C3  
HEADER200-2  
1uF  
FC  
Murata  
1nF, Not mounted  
TVS  
Murata  
D1, D2  
GND2,GND  
R2, R3  
ON Semiconductor  
Harvin  
GND JUMPER  
Resistor 100k 0603  
Load switch  
D3082F05  
MC 0.063 0603 1% 100K  
NCP458 - 459  
MULTICOMP  
ON Semiconductor  
U1  
ORDERING INFORMATION  
Device  
Options  
Marking  
Package  
Shipping  
NCP458RFCT2G  
Reverse Voltage Protection  
458RdYWW  
458RCdYWW  
459dYWW  
WLCSP 1 x 2 mm  
(Pb−Free)  
3000 Tape / Reel  
3000 Tape / Reel  
3000 Tape / Reel  
NCP458RFCCT2G  
NCP459FCT2G  
Reverse Voltage Protection,  
Die Coating  
WLCSP 1 x 2 mm  
(Pb−Free)  
Discharge Path  
WLCSP 1 x 2 mm  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
12  
NCP458R, NCP459  
PACKAGE DIMENSIONS  
WLCSP8, 2.0x1.0  
CASE 567HD  
ISSUE O  
NOTES:  
D
A
B
E
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. COPLANARITY APPLIES TO THE SPHERICAL  
CROWNS OF THE SOLDER BALLS.  
PIN A1  
REFERENCE  
MILLIMETERS  
2X  
0.25  
C
DIM  
A
A1  
A2  
b
D
E
e
MIN  
−−−  
0.21  
0.36 REF  
0.29  
2.00 BSC  
1.00 BSC  
0.50 BSC  
MAX  
0.66  
0.27  
2X  
0.25  
C
TOP VIEW  
SIDE VIEW  
0.34  
A
A2  
A1  
0.10  
C
RECOMMENDED  
SOLDERING FOOTPRINT*  
0.05  
C
SEATING  
PLANE  
NOTE 3  
C
PACKAGE  
OUTLINE  
0.50  
PITCH  
e/2  
e/2  
e
8X  
b
e
8X  
0.25  
0.05  
0.03  
C
C
A B  
A1  
0.50  
PITCH  
1
2
DIMENSIONS: MILLIMETERS  
A
B
C
D
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
BOTTOM VIEW  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,  
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC  
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any  
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without  
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications  
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC  
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for  
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where  
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and  
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,  
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture  
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81−3−5817−1050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
NCP458R/D  

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