NCP4625DSN12T1G [ONSEMI]
300 mA, 10 V, Low Dropout Regulator; 300毫安， 10 V ，低压差稳压器
| 型号： | NCP4625DSN12T1G |
| 厂家： | 
ONSEMI |
| 描述： | 300 mA, 10 V, Low Dropout Regulator |
| 文件： | 总17页 (文件大小：535K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCP4625
300 mA, 10 V, Low Dropout
Regulator
The NCP4625 is a CMOS Linear voltage regulator with 300 mA
output current capability. The device is capable of operating with input
voltages up to 10 V, with high output voltage accuracy and low
temperature−drift coefficient. The NCP4625 is easy to use, with
output current fold−back protection and a thermal shutdown circuit
included. A Chip Enable function is included to save power by
lowering supply current.
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MARKING
DIAGRAMS
Features
XXX MG
• Operating Input Voltage Range: 2.6 V to 10 V
• Output Voltage Range: 1.2 to 6.0 V (available in 0.1 V steps)
• Low Supply Current: 23 mA
G
SC−70
CASE 419A
1
• Very Low Dropout:
1
♦ 200 mV (I
♦ 770 mV (I
= 100 mA, V = 3.0 V)
IN
OUT
= 300 mA, V = 2.8 V)
XXX
XMM
OUT
IN
• High PSRR: 70 dB at 1 kHz
SOT−89 5
CASE 528AB
• Line Regulation 0.02%/V Typ
• Current Fold Back Protection
• Thermal Shutdown Protection
• Stable with Ceramic Capacitors
• Available in SC−70, SOT89 and SOT−23 Package
• These are Pb−Free Devices
XXXMM
SOT−23−5
CASE 1212
1
Typical Applications
XX, XXX= Specific Device Code
M, MM = Date Code
• Battery products powered by Two Lithium Ion cells
• Networking and Communication Equipment
• Cameras, DVRs, STB and Camcorders
• Toys, industrial applications
A
Y
W
G
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(*Note: Microdot may be in either location)
NCP4625x
VIN
VOUT
VIN
VOUT
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 14 of this data sheet.
C1
C2
CE
1m
1m
GND
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
February, 2012 − Rev. 2
NCP4625/D
NCP4625
VIN
VOUT
VIN
VOUT
Vref
Vref
Current Limit
Thermal Shutdown
Current Limit
Thermal Shutdown
CE
CE
GND
GND
NCP4625Hxxxx
NCP4625Dxxxx
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
SOT89
Pin No.
SC−70
Pin No.
SOT23
Pin Name
VIN
Description
5
2
3
1
4
5
3
1
4
2
1
2
3
5
4
Input pin
GND
CE
Ground
Chip enable pin (Active “H”)
Output pin
VOUT
NC
No connection
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
VIN
Value
12.0
Unit
Input Voltage (Note 1)
V
V
Output Voltage
VOUT
VCE
−0.3 to VIN + 0.3
12.0
Chip Enable Input
V
Output Current
I
330
mA
mW
OUT
Power Dissipation SOT89
Power Dissipation SC−70
Power Dissipation SOT23
Junction Temperature
P
D
900
380
420
TJ
TSTG
ESD
−40 to 150
−55 to 125
2000
°C
°C
V
Storage Temperature
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Model (Note 2)
HBM
ESD
200
V
MM
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
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2
NCP4625
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Characteristics, SOT89
R
111
°C/W
q
JA
Thermal Resistance, Junction−to−Air
Thermal Characteristics, SOT23
Thermal Resistance, Junction−to−Air
R
238
263
°C/W
°C/W
q
JA
Thermal Characteristics, SC−70
Thermal Resistance, Junction−to−Air
R
q
JA
ELECTRICAL CHARACTERISTICS −40°C ≤ T ≤ 85°C; V = V
+ 1 V; I
= 1 mA, C = C
= 0.47 mF, unless
A
IN
OUT(NOM)
OUT
IN
OUT
otherwise noted. Typical values are at T = +25°C.
A
Parameter
Test Conditions
Symbol
Min
2.6
Typ
Max
10
Unit
V
Operating Input Voltage
V
IN
Output Voltage
T = +25°C
V
V
V
V
> 1.5 V
≤ 1.5 V
> 1.5 V
≤ 1.5 V
V
OUT
x0.99
−15
x1.01
15
V
A
OUT
OUT
OUT
OUT
mV
V
−40°C ≤ T ≤ 85°C
x0.974
−40
x1.023
35
A
mV
ppm/°C
Output Voltage Temp.
Coefficient
−40°C ≤ T ≤ 85°C
80
A
Line Regulation
V
+ 0.5 V or 2.6 V (whichever is higher)
Line
Line
0.02
0.2
%/V
OUT(NOM)
Reg
≤ V ≤ 10 V
IN
Load Regulation
Dropout Voltage
IOUT = 0.1 mA to 300 mA
10
70
mV
V
Reg
I
= 300 mA
1.2 V ≤ V
1.3 V ≤ V
1.5 V ≤ V
1.8 V ≤ V
2.3 V ≤ V
3.0 V ≤ V
4.0 V ≤ V
< 1.3 V
< 1.5 V
< 1.8 V
< 2.3 V
< 3.0 V
< 4.0 V
< 6.0 V
V
DO
1.40
1.35
1.20
0.98
0.77
0.60
0.50
1.80
1.75
1.55
1.30
1.08
0.85
0.75
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
Output Current
IOUT
300
1.7
mA
mA
mA
mA
V
Short Current Limit
Quiescent Current
Standby Current
V
= 0 V
I
40
23
OUT
SC
IQ
40
V
IN
= 10 V, V = 0 V, T = 25°C
ISTB
VCEH
VCEL
0.1
1.0
CE
A
CE Pin Threshold Voltage
CE Input Voltage “H”
CE Input Voltage “L”
0.8
CE Pull Down Current
ICEPD
PSRR
0.3
70
mA
Power Supply Rejection Ratio
V
IN
= V
IN
+ 1 V or 3.0 V whichever is higher,
pk−pk OUT
dB
OUT
ΔV = 0.2 V
, I
= 30 mA, f = 1 kHz
Output Noise Voltage
f = 10 Hz to 100 kHz
V
N
85
mV
rms
Low Output N−channel Tr. On
Resistance
V
IN
= 7 V, V = 0 V, V
= 1.2 V, V = 2.6 V,
R
LOW
250
W
CE
OUT
IN
I
= 30 mA
OUT
Thermal Shutdown Temperature
Thermal Shutdown Release
T
165
110
°C
°C
TSD
T
TSR
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3
NCP4625
TYPICAL CHARACTERISTICS
3.0
2.5
2.0
1.5
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
3.6 V
4.0 V
3.3 V
5.0 V
V
IN
= 3.0 V
V
= 2.6 V
IN
3.0 V
4.0 V
1.0
0.5
0.0
0
0
0
100
200
300
(mA)
400
500
600
600
300
0
0
0
100
200
300
(mA)
400
500
600
I
I
OUT
OUT
Figure 3. Output Voltage vs. Output Current
Figure 4. Output Voltage vs. Output Current
1.2 V Version (TJ = 255C)
2.8 V Version (TJ = 255C)
6.0
5.0
4.0
3.0
2.0
1.0
0.0
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
8.0 V
105°C
V
IN
= 5.3 V
T = −40°C and T = 25°C
J
J
5.6 V
6.0 V
7.0 V
100
200
300
(mA)
400
500
50
100
150
(mA)
200
250
300
I
I
OUT
OUT
Figure 5. Output Voltage vs. Output Current
Figure 6. Dropout Voltage vs. Output Current
1.2 V Version
5.0 V Version (TJ = 255C)
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
0.50
0.40
0.30
0.20
0.10
0.00
T = 25°C
J
T = 25°C
J
105°C
105°C
−40°C
−40°C
50
100
150
(mA)
200
250
50
100
150
200
250
300
I
I
(mA)
OUT
OUT
Figure 7. Dropout Voltage vs. Output Current
2.8 V Version
Figure 8. Dropout Voltage vs. Output Current
5.0 V Version
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4
NCP4625
TYPICAL CHARACTERISTICS
1.30
1.28
1.26
1.24
1.22
1.20
1.18
1.16
1.14
1.12
1.10
2.90
V
= 2.6 V
V
= 3.8 V
IN
IN
2.88
2.86
2.84
2.82
2.80
2.78
2.76
2.74
2.72
2.70
−40
−20
0
20
40
60
80
−40
−20
0
20
40
60
80
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 9. Output Voltage vs. Temperature,
1.2 V Version
Figure 10. Output Voltage vs. Temperature,
2.8 V Version
5.10
5.08
5.06
5.04
5.02
5.00
4.98
4.96
4.94
4.92
4.90
40
35
30
25
20
15
10
5
V
= 6.0 V
IN
V
= 5 V
1.2 V
OUT
2.8 V
0
−40
−20
0
20
40
60
80
0
1
2
3
4
5
6
T , JUNCTION TEMPERATURE (°C)
J
V , OUTPUT VOLTAGE (V)
IN
Figure 11. Output Voltage vs. Temperature,
5.0 V Version
Figure 12. Supply Current vs. Input Voltage
30
25
20
15
10
5
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1 mA
20 mA
5.0 V
2.8 V
50 mA
V
OUT
= 1.2 V
100 mA
I
= 200 mA
OUT
0
−40
−20
0
20
40
60
80
0
2
4
6
8
10
T , JUNCTION TEMPERATURE (°C)
J
V
IN
, INPUT VOLTAGE (V)
Figure 13. Supply Current vs. Temperature,
1.2 V Version
Figure 14. Output Voltage vs. Input Voltage,
1.2 V Version
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5
NCP4625
TYPICAL CHARACTERISTICS
3.0
2.5
2.0
1.5
1.0
0.5
0.0
6.0
5.0
4.0
3.0
1 mA
20 mA
50 mA
20 mA
50 mA
100 mA
I
= 200 mA
OUT
2.0
100 mA
= 200 mA
1 mA
1.0
I
OUT
0.0
0
2
4
6
8
10
0
2
4
6
8
10
V
IN
, INPUT VOLTAGE (V)
V , INPUT VOLTAGE (V)
IN
Figure 15. Output Voltage vs. Input Voltage,
2.8 V Version
Figure 16. Output Voltage vs. Input Voltage,
5.0 V Version
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
I
= 100 mA
30 mA
OUT
I
= 100 mA
30 mA
OUT
1 mA
1 mA
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 17. PSRR, 1.2 V Version, VIN = 2.6 V
Figure 18. PSRR, 1.2 V Version, VIN = 3.0 V
100
100
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
I
= 100 mA
30 mA
OUT
I
= 100 mA
30 mA
OUT
1 mA
1 mA
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 19. PSRR, 2.8 V Version, VIN = 3.8 V
Figure 20. PSRR, 2.8 V Version, VIN = 4.8 V
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NCP4625
TYPICAL CHARACTERISTICS
100
90
80
70
60
50
40
30
20
10
0
100
90
80
30 mA
70
30 mA
60
50
40
30
20
10
0
1 mA
1 mA
I
= 100 mA
OUT
I
= 100 mA
OUT
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 21. PSRR, 5.0 V Version, VIN = 6.0 V
Figure 22. PSRR, 5.0 V Version, VIN = 7.0 V
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 23. Output Voltage Noise, 1.2 V Version,
Figure 24. Output Voltage Noise, 2.8 V Version,
IN = 3.8 V
V
IN = 2.6 V
V
12
10
8.0
6.0
4.0
2.0
0.0
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
Figure 25. Output Voltage Noise, 5.0 V Version,
IN = 6.0 V
V
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NCP4625
TYPICAL CHARACTERISTICS
5
4
3
2
1
0
1.220
1.215
1.210
1.205
1.200
1.195
1.190
0
10 20 30 40 50 60 70 80 90 100
t (ms)
Figure 26. Line Transients, 1.2 V Version,
tR = tF = 5 ms, IOUT = 30 mA
6
5
4
3
2
1
2.820
2.815
2.810
2.805
2.800
2.795
2.790
0
10 20 30 40 50 60 70 80 90 100
t (ms)
Figure 27. Line Transients, 2.8 V Version,
tR = tF = 5 ms, IOUT = 30 mA
8
7
6
5
4
3
5.010
5.005
5.000
4.995
4.990
4.985
4.980
0
10 20 30 40 50 60 70 80 90 100
t (ms)
Figure 28. Line Transients, 5.0 V Version,
tR = tF = 5 ms, IOUT = 30 mA
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8
NCP4625
TYPICAL CHARACTERISTICS
200
150
100
50
0
1.24
1.22
1.20
1.18
1.16
1.14
0
20 40 60 80 100 120 140 160 180 200
t (ms)
Figure 29. Load Transients, 1.2 V Version,
OUT = 50 – 100 mA, tR = tF = 0.5 ms, VIN = 2.6 V
I
200
150
100
50
0
2.83
2.81
2.79
2.77
2.75
2.73
0
20 40 60 80 100 120 140 160 180 200
t (ms)
Figure 30. Load Transients, 2.8 V Version,
IOUT = 50 – 100 mA, tR = tF = 0.5 ms, VIN = 3.8 V
200
150
100
50
0
5.05
5.03
5.01
4.99
4.97
4.95
0
20 40 60 80 100 120 140 160 180 200
t (ms)
Figure 31. Load Transients, 5.0 V Version,
OUT = 50 – 100 mA, tR = tF = 0.5 ms, VIN = 6.0 V
I
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9
NCP4625
TYPICAL CHARACTERISTICS
200
150
100
50
0
1.40
1.30
1.20
1.10
1.00
0.99
0
50 100 150 200 250 300 350 400 450 500
t (ms)
Figure 32. Load Transients, 1.2 V Version,
I
I
I
OUT = 1 – 150 mA, tR = tF = 0.5 ms, VIN = 2.6 V
200
150
100
50
0
2.90
2.80
2.70
2.60
2.50
2.40
0
50 100 150 200 250 300 350 400 450 500
t (ms)
Figure 33. Load Transients, 2.8 V Version,
OUT = 1 – 150 mA, tR = tF = 0.5 ms, VIN = 3.8 V
200
150
100
50
0
5.20
5.10
5.00
4.90
4.80
4.70
0
50 100 150 200 250 300 350 400 450 500
t (ms)
Figure 34. Load Transients, 5.0 V Version,
OUT = 1 – 150 mA, tR = tF = 0.5 ms, VIN = 6.0 V
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NCP4625
TYPICAL CHARACTERISTICS
4
3
2
1
0
Chip Enable
2.0
1.5
I
= 30 mA
OUT
1.0
I
= 300 mA
OUT
I
= 1 mA
0.5
OUT
0.0
−0.5
0
20 40 60 80 100 120 140 160 180 200
t (ms)
Figure 35. Start−up, 1.2 V Version, VIN = 2.6 V
5
Chip Enable
4
3
2
1
0
4
3
I
= 30 mA
OUT
2
I
= 300 mA
OUT
I
= 1 mA
OUT
1
0
−1
0
20 40 60 80 100 120 140 160 180 200
t (ms)
Figure 36. Start−up, 2.8 V Version, VIN = 3.8 V
10
8
6
4
2
0
Chip Enable
8
6
4
I
= 30 mA
OUT
I
= 300 mA
OUT
2
I
= 1 mA
OUT
0
−2
0
20 40 60 80 100 120 140 160 180 200
t (ms)
Figure 37. Start−up, 5.0 V Version, VIN = 6.0 V
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NCP4625
TYPICAL CHARACTERISTICS
4
3
2
1
0
Chip Enable
2.0
1.5
I
= 1 mA
OUT
1.0
I
= 30 mA
OUT
0.5
0.0
I
= 300 mA
OUT
−0.5
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
t (ms)
Figure 38. Shutdown, 1.2 V Version D,
V
IN = 2.6 V
5
4
3
2
1
Chip Enable
= 1 mA
4
3
I
OUT
2
I
= 30 mA
OUT
1
0
I
= 300 mA
OUT
−1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
t (ms)
Figure 39. Shutdown, 2.8 V Version D,
V
IN = 3.8 V
10
8
6
4
2
Chip Enable
= 1 mA
8
6
0
I
OUT
4
I
= 30 mA
OUT
2
0
I
= 300 mA
OUT
−2
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
t (ms)
Figure 40. Shutdown, 5.0 V Version D,
V
IN = 6.0 V
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NCP4625
APPLICATION INFORMATION
Enable Operation
A typical application circuit for NCP4625 series is shown
in Figure 41.
The enable pin CE may be used for turning the regulator
on and off. The IC is switched on when a high level voltage
is applied to the CE pin. The enable pin has an internal pull
down current source. If the enable function is not needed
connect CE pin to VIN.
NCP4625x
VIN
VOUT
VIN
VOUT
C1
C2
CE
1m
1m
GND
Output Discharger
The D version includes a transistor between V
and
OUT
GND that is used for faster discharging of the output
capacitor. This function is activated when the IC goes into
disable mode.
Figure 41. Typical Application Schematic
Thermal
As a power across the IC increase, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and also the ambient
temperature affect the rate of temperature increase for the
part. When the device has good thermal conductivity
through the PCB the junction temperature will be relatively
low in high power dissipation applications.
Input Decoupling Capacitor (C1)
A 1 mF ceramic input decoupling capacitor should be
connected as close as possible to the input and ground pin of
the NCP4625. Higher values and lower ESR improves line
transient response.
Output Decoupling Capacitor (C2)
A 1 mF ceramic output decoupling capacitor is enough to
achieve stable operation of the IC. If a tantalum capacitor is
used, and its ESR is high, loop oscillation may result. The
capacitors should be connected as close as possible to the
output and ground pins. Larger values and lower ESR
improves dynamic parameters.
PCB Layout
Make the VIN and GND line as large as practical. If their
impedance is high, noise pickup or unstable operation may
result. Connect capacitors C1 and C2 as close as possible to
the IC, and make wiring as short as possible.
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NCP4625
ORDERING INFORMATION
Nominal Output
†
Voltage
Device
Description
Marking
Package
Shipping
NCP4625DSN12T1G
1.2 V
Auto discharge
FBA
FBH
FBU
FBX
GBA
GBT
FAA
FAH
FAU
FAX
GAA
GAT
SOT−23
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
(Pb−Free)
NCP4625DSN18T1G
NCP4625DSN28T1G
NCP4625DSN30T1G
NCP4625DSN33T1G
NCP4625DSN50T1G
NCP4625HSN12T1G
NCP4625HSN18T1G
NCP4625HSN28T1G
NCP4625HSN30T1G
NCP4625HSN33T1G
NCP4625HSN50T1G
1.8 V
2.8 V
3.0 V
3.3 V
5.0 V
1.2 V
1.8 V
2.8 V
3.0 V
3.3 V
5.0 V
Auto discharge
Auto discharge
Auto discharge
Auto discharge
Auto discharge
Standard
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
Standard
SOT−23
(Pb−Free)
Standard
SOT−23
(Pb−Free)
Standard
SOT−23
(Pb−Free)
Standard
SOT−23
(Pb−Free)
Standard
SOT−23
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
14
NCP4625
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE K
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
G
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5
4
3
−B−
S
INCHES
DIM MIN MAX
MILLIMETERS
MIN
1.80
1.15
0.80
0.10
MAX
2.20
1.35
1.10
0.30
1
2
A
B
C
D
G
H
J
0.071
0.045
0.031
0.004
0.087
0.053
0.043
0.012
0.026 BSC
0.65 BSC
M
M
B
D 5 PL
0.2 (0.008)
---
0.004
0.004
0.004
0.010
0.012
---
0.10
0.10
0.10
0.25
0.30
K
N
S
N
0.008 REF
0.20 REF
0.079
0.087
2.00
2.20
J
C
K
H
http://onsemi.com
15
NCP4625
PACKAGE DIMENSIONS
SOT−89, 5 LEAD
CASE 528AB−01
ISSUE O
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS INCLUDES LEAD FINISH.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
5. DIMENSIONS L, L2, L3, L4, L5, AND H ARE MEAS-
URED AT DATUM PLANE C.
E
H
MILLIMETERS
DIM MIN
MAX
1.60
0.52
0.57
0.50
4.60
1.80
2.60
1.60
4.45
1.50
1.20
1.35
1.05
0.60
A
b
1.40
0.32
0.37
0.30
4.40
1.40
2.40
1.40
4.25
1.10
0.80
0.95
0.65
0.20
1
b1
c
D
TOP VIEW
SIDE VIEW
D2
E
e
c
A
H
L
L2
L3
L4
L5
0.10
C
C
e
b1
e
RECOMMENDED
MOUNTING FOOTPRINT*
b
L2
4X
0.57
L
1
2
3
4
1.75
1.50
0.45
L5
2.79
5
4.65
L3
D2
BOTTOM VIEW
L4
1.65
1.30
1
2X
0.62
2X
1.50
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
16
NCP4625
PACKAGE DIMENSIONS
SOT−23 5−LEAD
CASE 1212−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DATUM C IS THE SEATING PLANE.
A
A2
B
A
D
S
A1
0.05
MILLIMETERS
5
1
4
DIM MIN
MAX
1.45
0.10
1.30
0.50
0.25
3.10
3.10
1.80
E
L
A
A1
A2
b
---
0.00
1.00
0.30
0.10
2.70
2.50
1.50
2
3
E1
5X b
L1
C
c
M
S
S
A
D
0.10
C B
e
C
E
E1
e
0.95 BSC
L
0.20
0.45
---
0.75
RECOMMENDED
SOLDERING FOOTPRINT*
L1
5X
0.85
3.30
5X
0.56
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
NCP4625/D
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