NCP5008DMR2G [ONSEMI]
Backlight LED Boost Driver; 背光LED升压驱动器![NCP5008DMR2G](http://pdffile.icpdf.com/pdf1/p00115/img/icpdf/NCP5008_627425_icpdf.jpg)
型号: | NCP5008DMR2G |
厂家: | ![]() |
描述: | Backlight LED Boost Driver |
文件: | 总17页 (文件大小:160K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NCP5008, NCP5009
Backlight LED Boost Driver
The NCP5008/NCP5009 is a high efficiency boost converter
operating in current loop control mode to drive Light Emitting
Diode. The current mode regulation allows a uniform brightness of
the LEDs.
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Features
• 2.7 to 6.0 V Input Voltage Range
MARKING
DIAGRAM
• Output Voltage from V to 15 V
bat
• 3.0 mA Quiescent Supply Current
• Automatically LEDs Current Matching
• No External Sense Resistor
Micro 10
DM SUFFIX
CASE 846B
5Tx
AYW G
G
• Includes Dimming Function
1
1
• Programmable or Automatic Current Output Mode
• LOCAL or REMOTE Control Facility
• Photo Transistor Sense Feedback Input
• Inductor Based Converter brings High Efficiency
• Low Noise DC/DC Converter
• All Pins are Fully ESD Protected
• Pb−Free Package is Available
5Tx = Device Number
x = 8 or 9
A
Y
W
G
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
Typical Applications
• LED Display Back Light Control
• High Efficiency Step Up Converter
I
1
2
3
4
5
10
9
V
bat
ref
NC
CS
L1
V
bat
8
L2 Iout
GND
VBIAS
CLOCK
7
C1
6
LOCAL
U1
R1
30 k
1
2
10
9
10 mF/6.3 V
NCP5008
I
V
bat
ref
GND
PHOTO
L1
GND
Q1
I
1
2
3
4
5
10
9
V
ref
bat
Photo
CS
L1
L1
8
L2 Iout
GND
V
bat
22 mH
NPN−PHOTO
VBIAS
CLOCK
7
GND
6
LOCAL
Vcc
D5 MBR0520
GND
4
3
5
8
7
6
NCP5009
VBIAS
CS
L2
GND
CLK
LOCAL
ORDERING INFORMATION
NCP5009
D2
†
Device
Package
Shipping
D1
LED
D3
D4
LED
NCP5008DMR2
Micro 10
4000 / Tape & Reel
4000 / Tape & Reel
LED
LED
Micro 10
NCP5008DMR2G
GND
C2
(Pb−Free)
4000 / Tape & Reel
NCP5009DMR2
Micro 10
2.2 mF/16 V
GND
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Figure 1. Typical Battery Powered LED Boost Driver
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
April, 2006 − Rev. 7
NCP5008/D
NCP5008, NCP5009
BACK LIGHT WHITE LED CURRENT DRIVE CONTROLLER
V
bat
V
bat
V
bat
10
BandGap
POR
POR
VBIAS
CLK
4
5
Iout Reference
Isense
L1
9
V
bat
+
A=10
CS
3
GND
V
bat
V
bat
Q2
V
bat
POR
Iout
L2
8
7
Q1
LOCAL
6
CONTROLLER
I
1
2
ref
GND
PHOTO
GND
(See Note)
V
bat
V
bat
+
V
bat
_OK
BANDGAP
REFERENCE
BandGap
−
GND
NOTE: This functionality is NOT implemented on the NCP5008 type.
Figure 2. Block Diagram
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2
NCP5008, NCP5009
PIN FUNCTION DESCRIPTION
Pin
Symbol
Type
Description
1
I
ref
INPUT
This pin provides the output current range adjustment by means of a resistor connected to
ground. The current output tolerance depends upon the accuracy of this resistor. Using a "1%
metal film resistor, or better, yields the best output current accuracy.
2
3
PHOTO
SIGNAL
INPUT
This pin provides an access to the output current control loop for the NCP5009 version. The cur-
rent sunk to ground from this pin is subtracted from the output current mirror. Primary use is the
ambient light automatic adjustment by means of an external photo transistor connected across
this pin and ground. The output current decreases as the ambient light increases. The internal
circuit provides a 1/1 current ratio with the I defined by the resistor connected from pin 1 to
ref
ground. This current shall be limited to 65 mA.
This functionality is NOT implemented on the NCP5008 type.
CS
Negative going Chip Select logic input. This pin is used to select the NCP5008/ NCP5009 and
validate the clock/data when CS = Low. The internal shift register is automatically clear to zero
upon the falling edge, thanks to a 20 ns built−in one shoot. The built−in pull−up resistor disables
the device when the CS pin is left open.
4
5
VBIAS
POWER
INPUT
This pin should be connected to V
.
bat
CLOCK
The clock signal connected to this pin is used to serially shift right the internal preset high logic
level. The clock is valid between the falling edge and until the rising edge of the CS. There is nei-
ther a feedback nor an overflow control. If the clock count exceeds 8 bits, the internal register is
clear, the output current is forced to zero and the device comes back to the shutdown mode.
6
LOCAL
INPUT
This pin is used to select the mode of operation.
•
•
When LOCAL = High or Open, the chip is controlled by two digital lines:CS and CLOCK. The
output current is programmed by the logic control of these pins, allowing a current adjustment
within the range defined by the I resistor.
ref
When LOCAL = Low, the chip is turned ON /OFF by means of the CS line, the CLOCK pins
being deactivated. The output current is constant, as defined by the I resistor value.
ref
In order to minimize the standby current a dynamic pull−up resistor is activated when POR is
High, this pull−up resistor being disconnected when LOCAL = Low.
7
8
GND
L2
POWER
POWER
This pin is the system ground for the NCP5008/NCP5009 and carries both the Power and the
Digital signals. High quality ground must be provided to avoid spikes and/or uncontrolled opera-
tion. Care must be observed to avoid high−density current flow in a limited PCB copper track.
This pin is the power side of the external inductor and must be connected either to the external
Schottky diode (see Figure 22) or directly to one external LED (see Figure 23). It provides the
output current to the load. Since the boost converter operates in a current loop mode, the output
voltage can range up to +15 V but shall not extend this limit. The user must make sure this voltage
will not be exceeded during the normal operation of this part.
An external low cost ceramic capacitor (2.2 mF/16 V, ESR < 100 mW) is recommended to smooth
the current flowing into the diode(s), thus limiting the noise created by the fast transients present
in this circuitry.
Care must be observed to avoid EMI though the PCB copper tracks connected to this pin.
9
L1
POWER
POWER
The return side of the external inductor shall be connected to this pin. Typical application will use a
22 mH, size 1210, to handle the 2.8 to 364 mA max range. On the other hand, when the desired
output current is above 20 mA, the inductor shall have an ESR < 1.0 W. The output current toler-
ance can be improved by using a larger inductor value.
10
V
bat
The external voltage supply is connected to this pin. A high quality reservoir capacitor must be
connected across pin 10 and Ground to achieve the specified output voltage parameters. A
10 mF/6.3 V, low ESR capacitor must be connected as close as possible across pin 10 and
ground pin 7. The X5R ceramic types are recommended.
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3
NCP5008, NCP5009
Table 1. Shift Register Bits Assignment and Functions
SetReg shift register (Note: The register content is latched upon CS positive going).
B7
B6
B5
B4
B3
B2
B1
Bn Value After POR
Iout Peak (mA)
0
0
0
0
0
0
0
I
ref
*k*7.5
I
ref
*k*6.5
I
ref
*k*5.5
I
ref
*k*4.5
I
ref
*k*3.5
I
ref
*k*2.5
I *k*1.5
ref
LOCAL
L
CLOCK
CS
H
L
B1−B7
Output Current
X
X
X
↓
↑
X
X
0
L
I
ref
* k
H or Open
H or Open
H or Open
H
L
No Change
No Change
I
I
I
* k * (Bn + 0.5)
* k * (Bn + 0.5)
* k * (Bn + 0.5)
ref
ref
ref
L
Q
→ Bn
data
The register is clear to 0 during the first 20 ns following the CS falling edge.
Note:
Coefficient Value (internal ratio): k = 746
Maximum output peak current @ B7 = 1 and Iphoto = 0 mA :Iout peak = I * (7 + 0.5) * 746 = I * 5595
ref
ref
V
R1
ref
1.24 V
R1
I
+
+
ref
MAXIMUM RATINGS
Rating
Symbol
V , V
bat BIAS
Value
7.0
Unit
V
Power Supply
Output Power Supply Voltage Compliance
V
L2
16
V
Digital Input Voltage
Digital Input Current
CLK, CS
−0.3 tV tV + 3.0 V
V
mA
bat
1.0
Human Body Model: R = 1500 W, C = 100 pF
Machine Model
ESD
ESD
"2.0
"200
kV
V
Micro 10 Package
Power Dissipation @ T = +85°C
P
200
200
mW
°C/W
A
D
Thermal Resistance, Junction−to−Air
Operating Ambient Temperature Range
Operating Junction Temperature Range
Maximum Junction Temperature
Storage Temperature Range
R
Thja
T
A
−25 to +85
−25 to +125
+150
°C
°C
°C
°C
T
J
T
Jmax
T
stg
−65 to +150
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
RecommendedOperating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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4
NCP5008, NCP5009
POWER SUPPLY SECTION (−25°C to +85°C ambient temperature, unless otherwise noted.)
Rating
Pin
10
10
8
Symbol
Min
2.7
−
Typ
−
Max
6.0
2.7
15.0
400
75
Unit
V
Power Supply
V
bat
Power Supply Threshold Startup Voltage
Output Load Voltage Compliance
Pulsed Current Regulation Range
Continuous DC Current in the Load
V
batThr
2.3
−
V
V
out
−
V
8
I
I
I
0
−
mA
mA
%
out
out
out
8
−
−
Output Pulsed Current Tolerance @ V = 3.6 V, L1 = 22 mH/0.71 W,
8
−
"5.0
−
bat
R
ref
"1%, I
= 20 mA (Note 1)
LED
Output Leakage @ LOCAL = 0, CS = H, Vout = 15 V, V = 6.0 V
8
I
−
−
−
−
−
3.0
−
500
−
nA
mA
mA
bat
out
Standby Current @ Iout = 0 mA, CS = H, CLK = H, V = V
= 3.6 V
= 6.0 V
BIAS
10
10
10
I
bat
BIAS
stdb
stdb
Standby Current @ Iout = 0 mA, CS = H, CLK = H, V = V
I
10
−
bat
Operating Current @ V = V
= 3.6 V, I = 30 mA, CLK = H, CS = L,
I
ope
600
bat
BIAS
ref
LOCAL = Open
mA
Boost Internal Oscillator Clock @ L1 = 22 mH, V = V
= 3.6 V,
−
F
osc
−
300
−
kHz
bat
BIAS
Iout = 20 mA (Vout = 14 V)
1. The tolerance refers to the 20 mA to 70 mA current range.
DIGITAL SECTION (−25°C to +85°C ambient temperature, unless otherwise noted.)
Rating
Pin
Symbol
Min
Typ
Max
Unit
High Level Input Voltage
Low Level Input Voltage
Input Capacitance
(Note 2)
(Note 2)
3, 5
V
V
C
0.7*V
−
−
10
V
bat
V
V
pF
IH
IL
in
bat
−
−
0.3*V
−
bat
High Level Input Voltage
Low Level Input Voltage
Input Capacitance
(Note 2)
(Note 2)
6
V
V
C
−
−
−
0.6*V
0.4*V
10
−
−
−
V
V
pF
IH
IL
in
bat
bat
LOCAL Pullup Resistor
LOCAL Leakage Current
CS Pullup Resistor
6
9
3
3
5
5
−
−
R
20
−
−
−
80
kW
nA
kW
ns
loc
I
100
80
−
Loc
R
20
−
cs
Minimum CS Low Time
Clock Frequency
Tcs
250
−
−
setup
CLK
F
−
5.0
−
MHz
ns
CLOCK tr and tf
tr
, tf
CLK CLK
10
10
−
−
Internal Register Clear
Internal Power on Reset Width
t
30
−
ns
clear
t
100
−
ms
POR
2. Digital inputs undershoot < − 0.30 V, Digital inputs overshoot < 0.30 V.
ANALOG SECTION (−25°C to +85°C ambient temperature, unless otherwise noted.)
Rating
Pin
Symbol
Min
1.20
−
Typ
1.24
5595
1119
1.8
Max
1.28
−
Unit
V
Output Voltage Range Reference @ 2.5 mA < I < 65 mA (Note 3)
1
V
ref
ref
Maximum Output Current Range Ratio
8
8
I
I
−
out
out
Minimum Output Current Range Ratio
−
−
−
Output Current Sense Resistor
10, 9
2
R
s
−
5.0
1.28
−
W
Output Voltage Range Reference @ 2.5 mA < Ipho < 65 mA
Output Current Stabilization tdelay following a DC/DC startup
V
pho
1.20
−
1.24
100
2.2
V
8
I
ms
W
outdly
Internal NMOS Resistor @ V = 3.6 V
8
QR
−
3.0
−
bat
DSON
comp
Internal Comparator Delay Time
−
Td
−
60
ns
3. The overall tolerance depends upon the accuracy of the external resistor. Using a 1%/low PPM metal film resistor is recommended to achieve
"5% output current tolerance.
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5
NCP5008, NCP5009
TYPICAL OPERATING CHARACTERISTICS
Condition: Typical Application: L = 22 mH, Cin = 10 mF, Cout = 2.2 mF, R1 = 30 kW
80
75
70
65
60
55
50
80
75
V
= 4.2 V
= 3.6 V
bat
V
= 4.2 V
= 3.6 V
bat
V
bat
70
65
60
55
50
V
bat
V
= 3.0 V
bat
V
= 3.0 V
25
bat
0
5
10
15
20
(mA)
25
30
35
0
5
10
15
20
(mA)
30
35
I
I
LED
LED
Figure 3. Efficiency vs. Load Current @ 4 LEDS
Figure 4. Efficiency vs. Load Current @ 3 LEDS
(Vload = 4*Vf ⇒ 14.2 V)
(Vload = 3*Vf ⇒ 10.5 V)
100
90
80
70
60
50
85
80
75
70
65
60
V
= 4.2 V
bat
V
=7.5 V
= 40 mA
V
= 3.6 V
= 3.0 V
out
bat
I
led
V
bat
V
= 15 V
= 20 mA
out
I
led
0
5
10
15
20
(mA)
25
30
35
2.5
3.0
3.5
4.0
4.5
(V)
5.0
5.5
6.0
6.5
I
V
LED
bat
Figure 5. Efficiency vs. Load Current @ 2 LEDS
Figure 6. Efficiency vs. Vbat @
(Vload = 2*Vf ⇒ 7.1 V)
Vout = 15 V/Iled = 20mA and
Vout = 7.5 V/Iled = 40 mA
100
95
90
85
80
75
400
Bn
V
= 6.0 V
bat
350
300
250
200
150
100
50
7
6
5.0 V
5
4
4.2 V
3
2
1
3.6 V
3.0 V
50
0
0
20
40
(mA)
60
80
0
10
20
30
40
(mA)
60
70
I
I
ref
LED
Figure 7. Efficiency vs. Load Current @ 4 LEDS
(Vload = 2 strings of 2 LEDs in series = 7.1V)
Figure 8. Inductor peak Current vs.
Iref @ Bn = {1, 2, 3, 4, 5, 6, 7}
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6
NCP5008, NCP5009
TYPICAL OPERATING CHARACTERISTICS
Condition: Typical Application: L = 22 mH, Cin = 10 mF, Cout = 2.2 mF, R1 = 30 kW
50
45
40
35
30
25
20
15
10
5
20
18
V
= 10 V
= 15 V
load
16
14
12
10
8
V
load
6
4
2
0
0
0
0
10
20
30
40
(mA)
50
60
70
50
100
150
200
250
(mA)
peak
300
350 400
I
ref
THEORETICAL I
Figure 9. Load Current (Iled) vs. Iref
@ Vbat = 3.6 V, Vload = 15 V and 10 V
Figure 10. Inductor Peak Current Error vs.
Theoretical Inductor Peak Current
7.0
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
200
180
160
140
120
100
80
Theoretical
Measured
60
40
20
0
0
10
20
(mA)
30
40
2.4 2.8 3.2 3.6 4.0 4.4 4.8 5.2 5.6
6.0
I
V
bat
(V)
photo
Figure 11. Inductor Peak Current vs. Iphoto @ Iref = 34 mA
Figure 12. Stand by Current vs. Vbat @ T = 20°C
80
75
85
80
75
70
65
60
55
50
V
= 4.2 V
= 3.6 V
bat
V
= 4.2 V
bat
70
65
60
55
50
V
bat
V
= 3.6 V
bat
V
= 3.0 V
bat
V
= 3.0 V
30
bat
0
5
10
15
20
25
30
35
0
5
10
15
20
25
35
I
(mA)
I
(mA)
LED
LED
Figure 14. Efficiency vs. Load Current @ 3 LEDS
Figure 13. Efficiency vs. Load Current @ 4 LEDS
(Vload = 3*Vf ⇒ 10.5 V)
(Vload = 4*Vf ⇒ 14.2 V)
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7
NCP5008, NCP5009
TYPICAL OPERATING CHARACTERISTICS
Condition: Typical Application: L = 22 mH, Cin = 10 mF, Cout = 2.2 mF, R1 = 30 kW
90
85
80
75
70
65
60
100
V
= 6.0 V
bat
V
= 4.2 V
= 3.6 V
bat
V
95
90
85
80
75
70
5.0 V
bat
4.2 V
V
bat
= 3.0 V
3.6 V
3.0 V
40
0
5
10
15
20
25
30
35
0
10
20
30
50
60
70
I
(mA)
I
(mA)
LED
LED
Figure 15. Efficiency vs Load Current @ 2 LEDS
Figure 16. Efficiency vs Load Current @ 4 LEDS
(Vload = 2 strings of 2 LEDs in series = 7.1 V)
(Vload = 2*Vf ⇒ 7.1 V)
Operating Description
Output
t
CLKmin
V
bat
ON
90%
50%
10%
tf
tr
OFF
Input
0.30* V
0.70* V
V
bat
bat
bat
Figure 17. Digital Timing Definitions
Figure 18. Typical Schmitt Trigger Characteristic
Input Schmitt Triggers
the current drawn pin 1. The clock signal is irrelevant and
All the Logic Input pins have built−in Schmitt trigger
circuits to prevent the NCP5008/NCP5009 against
uncontrolled operation. The typical dynamic characteristics
of the related pins are depicted in Figure 18.
the output current is derived by equation I = I * k, the
internal constant k being equal to 746.
out ref
ESD Protection
The NCP5008/NCP5009 includes silicon devices to
protect the pins against the ESD spikes voltages. To cope
with the different ESD voltages developed in the
applications, the built−in structures have been designed to
handle $2.0 kV in Human Body Model (HBM) and
$200 V in Machine Model (MM) and on each pin.
The output signal is guaranteed to go High when the
input voltage is above 0.70*V , and will go Low when the
bat
input voltage is below 0.30*V
.
bat
Local Mode
When the system operate in a Local Mode (Pin 6,
/LOCAL=Low), the output current depends solely upon
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8
NCP5008, NCP5009
Remote Control Programming Sequence
tCSsetup
CS
tclear
CLEAR
CLK
Qdata
B1
B2
B3
B4
B5
B6
B7
Last Latched Bit
Output Current Programmed Register
Internal Latch Data and Reset
I
out ref
Ioutdly
Iout
Figure 19. Programming Sequence
Upon CS transition from High to Low, the internal
sequence will take place:
− Qdata is internally set to high level.
− Upon positive going transition of the next CLK signal,
the Qdata is shifted to the next Bn stage.
− Clear the Qdata flip−flop upon the positive going of
the SetReg[B1] transient.
will be adjusted accordingly. If the number of CLK pulses
is higher than 7, the Qdata is lost and the SetReg register
bits B[1−7] are in the Low state, yielding a zero output
current.
The internal shift register can be clear by sending more
than 7 pulses to the CLK pin when the pin CS is low. If the
internal shift register is clear upon the CS transition from
Low to High, the device will be placed or maintained in the
shut down mode.
The sequence keeps going until CS = High.
When the CS line returns to a High state, the
programming output current flip−flop is set according to
the previous state of the shift register and SetReg B[1−7] is
cleared afterward.
When the register content is higher than zero, the DC/DC
is activated and a 100 ms delay (typical) is necessary to
stabilize the output current to the programmed value.
Depending upon the CS width, for a given CLK period,
the last SetReg bit will be latched and the output current
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NCP5008, NCP5009
Set Up Output Current Range
V
bat
1
1
V
bat
I
ref
+
−
BandGap
V
bat
GND
I
ref
1
1:746
V
bat
R
30 k
ref
Iphoto
1
Iout Reference
= (I −Iphoto)*746*(Bn+0.5)
ref
GND
1
I = (I −Iphoto)*(Bn+0.5)
ref
V
bat
1
1
1
1:Bn
2:1
+
−
BandGap
GND
GND GND
GND
GND
GND
Photo
Q1
NPN−PHOTO
GND
Figure 20. Functional Diagram
The current sunk to ground on PHOTO pin is subtracted
Where k = 746, Bn represents the bit of the internal shift
from the current sunk to ground on I pin. The result is
register, range from 1 to 7, and Ivalley = (I − Iphoto)
ref
ref
multiplied by the programmed value (Bn) and then
multiplied by the constant factor ratio (k = 746) in the
current mirror.
The constant factor k is a ratio between the current on
Iout sense and the Iout reference internally fixed.
* 0.5 * k.
We can write also Ipeak = (I − Iphoto) * (Bn + 0.5) * k.
Please find below the formula to quickly calculate R1
resistor (resistor on I pin):
ref
ref
1.24
R1
I
+
ref
The output current reference is:
Ipeak = Ivalley + (I − Iphoto) * Bn * k.
ref
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10
NCP5008, NCP5009
DC/DC Converter Operation
is monitored by the internal sense resistor Rsense to Set and
Reset the flip−flop U3 and U6 according to the comparators
U2 and U4 output state.
The DC/DC converter operates with a boost structure
depicted in Figure 21, the load being supplied by the pulsed
current coming from the external inductor L1. The current
V
bat
V
bat
V
bat
+
Rsense
1R8
U1
−
L1
V
bat
GND
L1
22 mH
+
U2
−
I
I
peak_ref
U3
U6
L2
V
D5
MBR0520
bat
GND
+
valley_ref
D4
LED
U4
U5
Q1
U7
−
D3
LED
GND
GND
C2
2.2 mF/16 V
POR
D2
LED
D1
LED
GND
GND
Figure 21. Basic DC/DC Boost Structure
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11
NCP5008, NCP5009
Output Load Drive
maximum rating will not exist across pin 8 and
ground. Depending upon a specific application
In order to make profit of the built−in Boost capabilities,
one shall operate the NCP5008/NCP5009 in the continuous
output current mode. Such a mode is achieved by using and
external reservoir capacitor (preferably a low ESR ceramic
type) across the LED as depicted in Figures 22, 23, 24, 25,
and 26.
(V voltage, PCB layout…), using an external
bat
voltage clamp could be necessary.
2. The peak current flowing into the LED diodes
shall be within the maximum ratings specified for
these devices.
Using an extra photo sensor is not mandatory and the
The Schottky diode D5, associated with capacitor C2,
provides a rectification and filtering function.
When a pulse−operating mode is acceptable:
related pin 2 can be either left open or connected to V
,
bat
but must not be grounded on the NCP5009 version only.
At this point, the designer must carefully analyze two
parameters:
• The LEDs brightness can be controlled in LOCAL
mode with a PWM on CS pin as depicted in Figure 24.
• Or the Schottky can be removed and replaced by at
least one LED diode as depicted in Figure 23.
1. The output voltage must be limited to 15 V
maximum. It’s the designer responsibility to
make sure that spike voltages beyond the
TYPICAL APPLICATION CIRCUIT
V
bat
C1
U1
R1
1
10 mF/6.3 V
10
9
I
ref
V
bat
GND
30 k
2
PHOTO
L1
GND
Q1
Vcc
L1
22 mH
V
bat
NPN−PHOTO
GND
D5
MBR0520
4
3
5
8
7
6
VBIAS
CS
L2
GND
CLK
LOCAL
GND
NCP5009
D1
D2
LED
D3
LED
D4
GND
LED
LED
C2
2.2 mF/16 V
GND
Figure 22. Basic DC Current Mode Operation in REMOTE Control
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NCP5008, NCP5009
V
bat
C1
U1
R1
10 mF/6.3 V
1
2
10
I
ref
V
bat
GND
30 k
9
PHOTO
L1
GND
Q1
Vcc
L1
22 mH
V
bat
NPN−PHOTO
GND
4
3
5
8
7
6
VBIAS
CS
L2
GND
CLK
LOCAL
GND
D3
NCP5009
D4
GND
LED
C2
LED
1.0 mF/16 V
GND
Figure 23. Typical Semi−Pulsed Mode of Operation in REMOTE Mode
V
bat
C1
U1
R1
10 mF/6.3 V
1
2
10
9
I
ref
V
bat
GND
30 k
PHOTO
L1
GND
Q1
L1
22 mH
V
bat
NPN−PHOTO
GND
D5
MBR0520
4
3
5
8
7
6
VBIAS
CS
L2
PWM
GND
CLK
LOCAL
NCP5009
GND
D4
D1
D2
LED
D3
LED
LED
LED
C2
2.2 mF/16 V
GND
Figure 24. PWM Current Control Mode Operation in LOCAL Mode
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NCP5008, NCP5009
V
bat
C1
U1
R1
10 mF/6.3 V
1
2
10
9
I
ref
V
bat
DAC
GND
30 k
PHOTO
L1
L1
22 mH
Q1
NPN−PHOTO
V
bat
GND
OFF ON
D5
MBR0520
4
3
5
8
7
6
VBIAS
CS
L2
GND
CLK
LOCAL
NCP5009
GND
D4
D1
D2
LED
D3
LED
LED
LED
C2
2.2 mF/16 V
GND
Figure 25. DAC Current Control Mode Operation in LOCAL Mode
V
bat
C1
U1
R1
10 mF/6.3 V
1
2
10
9
I
ref
V
bat
GND
30 k
PHOTO
L1
GND
L1
22 mH
Q1
NPN−PHOTO
V
bat
GND
OFF ON
D5
MBR0520
4
3
5
8
7
6
VBIAS
CS
L2
GND
CLK
LOCAL
NCP5009
GND
D4
D1
D2
D3
LED
LED
LED
LED
C2
2.2 mF/16 V
GND
Figure 26. Basic DC Current Mode Operation in LOCAL Mode
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14
NCP5008, NCP5009
TYPICAL LEDS LOAD MAPPING
75 mA
Load+
D1
LED
D3
LED
D5
LED
D7
LED
D9
LED
6.7 V
D2
LED
D4
LED
D6
LED
D8
LED
D10
LED
Example 1
GND
50 mA
Load+
D1
LED
D4
LED
D7
LED
60 mA
Load+
D2
LED
D5
LED
D8
LED
D1
LED
D3
LED
D5
LED
10.4 V
6.7 V
D3
LED
D6
LED
D9
LED
D2
LED
D4
LED
D6
LED
Example 2
Example 3
GND
GND
Figure 27. Three different examples of load can be driven by the NCP5009 or NCP5008
Condition: Vbat = 3.6 V, L = 22 mH
MANUFACTURER REFERENCE
Design Ref
Value/Reference or Size
Manufacturer
ON Semiconductor
MURATA
Reference Number
MBR0520
D5
L1
MBR0520/SOD−123
22 mH/1210
LQH3C220K34
C1
10 mF/ 6.3 V/0805
2.2 mF/16 V/1206
SFH320/PLCC2
White LED
MURATA
GRM40 X5R 106K 6.3
GRM42−6 X7R 225K 16
SFH320
C2
MURATA
Q1
Osram
D1 to D4
Osram
LW5413−VBW−1
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15
NCP5008, NCP5009
LAYOUT EXAMPLE
Figure 28. Typical Printed Circuit Layout
(the Top Silk Screen and the Top Layer)
The Figure 28 represents the typical printed circuit
layout based on the basic application Figure 1. This
application has been routed on a single copper layer to save
cost. A dual side PCB has better noise protection and can
be the right choice for an industrial system. In order to
avoid voltage spikes, care must be observed to group the
capacitors, the inductor, the Schottky diode and the
integrated circuit in the same area. On the other hand, using
large copper tracks to reduce the resistor connectivity is
strongly recommended.
Obviously, the connectors GND, CLK, CS, V and
bat
Load are for engineering purpose only and not for final
application.
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NCP5008, NCP5009
PACKAGE DIMENSIONS
Micro10
CASE 846B−03
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
−A−
4. DIMENSION “B” DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846B−01 OBSOLETE. NEW STANDARD
846B−02
−B−
K
G
MILLIMETERS
INCHES
PIN 1 ID
D 8 PL
DIM MIN
MAX
3.10
3.10
1.10
0.30
MIN
MAX
0.122
0.122
0.043
0.012
M
S
S
A
0.08 (0.003)
T B
A
B
C
D
G
H
J
2.90
2.90
0.95
0.20
0.114
0.114
0.037
0.008
0.50 BSC
0.020 BSC
C
0.038 (0.0015)
0.05
0.10
4.75
0.40
0.15
0.21
5.05
0.70
0.002
0.004
0.187
0.016
0.006
0.008
0.199
0.028
−T−
SEATING
PLANE
L
H
K
L
J
SOLDERING FOOTPRINT*
1.04
0.041
0.32
0.0126
10X
10X
3.20
4.24
5.28
0.126
0.167 0.208
0.50
mm
inches
ǒ
Ǔ
8X 0.0196
SCALE 8:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
MountingTechniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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NCP5008/D
相关型号:
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