NCP582LXV30T2G [ONSEMI]
Ultra-Fast, Low Noise 150 mA CMOS LDO; 超高速，低噪声150毫安CMOS LDO
| 型号： | NCP582LXV30T2G |
| 厂家： | 
ONSEMI |
| 描述： | Ultra-Fast, Low Noise 150 mA CMOS LDO |
| 文件： | 总12页 (文件大小：165K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCP582
Ultra-Fast, Low Noise
150 mA CMOS LDO
Regulator with Enable
The NCP582 series of low dropout regulators are designed for
portable battery powered applications which require precise output
voltage accuracy, low quiescent current, and high ripple rejection.
These devices feature an enable function and are offered in active
low and active high with auto discharge.
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MARKING
DIAGRAMS
The following ceramic capacitors are the recommended values to
be used with these devices; for V < 2.5 V, C = C = 1.0 mF,
out
in
out
V
out
w 2.5 V, C = C = 0.47 mF.
in out
SC−82AB
SQ SUFFIX
CASE 419C
4
Features
1
• Ultra−Low Dropout Voltage of 220 mV at 150 mA
1
• Low Output Noise of 30 mVrms without Noise Reduction Cap
• Excellent Line Regulation of 0.02%/V
• Excellent Load Regulation of 22 mV
• High Output Voltage Accuracy of "2%
• Low Iq Current of 75 mA
SOT−563
XV SUFFIX
CASE 463A
XXX
XTT
6
1
1
• Very Low Shutdown Current
• Excellent Power Supply Rejection Ratio of 70 dB at f = 1.0 kHz
• Wide Output Voltage Range of 1.5 V to 3.3 V
• Fast Dynamic Performance
X
T
= Device Code
= Traceability Information
• Fold Back Protection Circuit
• Low Temperature Drift Coefficient on the Output Voltage of
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
"100 ppm/°C
• Input Voltage up to 6.5 V
• These are Pb−Free Devices
Typical Applications
• Portable Equipment
• Hand−Held Instrumentation
• Camcorders and Cameras
V
in
V
in
V
out
V
out
-
+
-
+
V
ref
V
ref
Current Limit
Current Limit
CE
CE
GND
GND
Figure 1. Simplified Block Diagram
for Active Low
Figure 2. Simplified Block Diagram
for Active High with Auto Discharge
©
Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
May, 2009 − Rev. 10
NCP582/D
NCP582
PIN FUNCTION DESCRIPTION
SOT−563 Pin
SC−82AB Pin
Symbol
Vin
Description
1
2
3
4
2
3
Power supply inout voltage.
Power supply ground.
GND
Regulated output voltage.
V
out
4
5
6
−
−
1
NC
GND
No connect.
Power supply ground.
Chip enable pin.
CE or CE
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
V
Input Voltage
V
in
6.5
Input Voltage (CE or CE Pin)
Output Voltage
V
−0.3 to V +0.3
V
CE
in
V
−0.3 to V +0.3
V
out
out
in
Output Current
I
200
mA
mW
Power Dissipation
SC−82AB
P
D
150
500
SOT−563
ESD Capability, Human Body Model, C = 100 pF, R = 1.5 kW
ESD Capability, Machine Model, C = 200 pF, R = 0 W
Operating Ambient Temperature Range
Maximum Junction Temperature
ESD
2000
200
V
HBM
ESD
V
MM
T
A
−40 to +85
125
°C
°C
°C
T
J(max)
Storage Temperature Range
T
stg
−55 to +150
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
RecommendedOperating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (V = V + 1.0 V, T = 25°C, unless otherwise noted.)
in
out
A
Characteristic
Symbol
Min
2.0
Typ
−
Max
Unit
V
Input Voltage
Output Voltage (I = 1.0 mA to 30 mA)
V
in
6.0
V
out
V
out
X 0.980
−
−
V
out
X 1.020
0.10
V
out
Line Regulation (I = 30 mA),
(V > 1.7 V; V + 0.5 V v V v 6.0 V)
out
Reg
0.02
%/V
out
out
out
in
line
(V = 1.5 V; 2.2 V v V v 6.0 V)
in
Load Regulation (I = 1.0 mA to 150 mA)
Reg
−
22
40
mV
V
out
load
Dropout Voltage (I = 150 mA)
V
DO
−
−
−
−
0.38
0.32
0.28
0.22
0.70
0.55
0.50
0.35
out
V
= 1.5 V
= 1.8 V
= 2.5 V
out
V
out
V
out
2.8 V v V v 3.3 V
out
Quiescent Current (I = 0 mA)
Iq
−
150
−
75
−
95
−
mA
mA
mA
out
Output Current
I
I
out
SD
Shutdown Current (V = Gnd for Active High with Auto Discharge)
0.1
1.0
CE
(V = V for Active Low)
CE
in
Output Short Circuit Current (V = 0)
I
−
40
−
mA
dB
out
lim
Ripple Rejection (I = 30 mA)
(V > 1.7 V; V – V = 1.0 V)
RR
out
out
in
in
out
out
(V = 1.5 V; V – V = 1.2 V)
out
f = 1.0 kHz
−
−
70
60
−
−
f = 10 kHz
Enable Input Threshold Voltage
High
Low
1.5
0
−
−
V
V
Vth
enh
in
0.3
Vth
enl
Output Noise Voltage (Bandwidth = 10 Hz to 100 kHz)
V
−
−
−
30
"100
60
−
−
−
mVrms
ppm/°C
W
n
Output Voltage Temperature Coefficient (I = 30 mA, −40°C v T v 85°C)
DV /DT
out
out
A
N−Channel On Resistance for Auto Discharge
R
Low
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2
NCP582
TYPICAL CHARACTERISTICS
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
3.0
2.5
2.0
1.5
V
= 4.8 V
in
1.8 V
3.1 V
V
= 3.5 V
in
2.5 V
3.5 V
1.0
0.5
0
3.8 V
2.0 V
V
= 1.5 V
out
V
out
= 2.8 V
300
300
OUTPUT CURRENT I (mA)
0
100
200
400
6.0
6.0
0
100
200
400
OUTPUT CURRENT I (mA)
out
out
Figure 3. Output Voltage vs. Output Current
Figure 4. Output Voltage vs. Output Current
2.9
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
I
= 1.0 mA
I
= 1.0 mA
= 30 mA
out
out
I
I
= 30 mA
= 50 mA
out
out
I
= 50 mA
I
out
out
V
= 1.5 V
out
V
out
= 2.8 V
4.0
2.0
3.0
4.0
INPUT VOLTAGE V (V)
5.0
6.0
1.0
2.0
3.0
5.0
INPUT VOLTAGE V (V)
in
in
Figure 5. Output Voltage vs. Input Voltage
Figure 6. Output Voltage vs. Input Voltage
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
V
= 1.5 V
5.0
V
out
= 2.8 V
5.0
out
4.0
INPUT VOLTAGE V (V)
4.0
INPUT VOLTAGE V (V)
0
1.0
2.0
3.0
0
1.0
2.0
3.0
6.0
in
in
Figure 7. Quiescent Current vs. Input Voltage
Figure 8. Quiescent Current vs. Input Voltage
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3
NCP582
TYPICAL CHARACTERISTICS
2.86
1.53
1.52
1.51
1.50
1.49
1.48
1.47
1.46
2.84
2.82
2.80
2.78
2.76
2.74
V
out
= 1.5 V
V
out
= 2.8 V
60
−40
−15
10
35
85
60
−40
−15
10
35
85
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 10. Output Voltage vs. Temperature
Figure 9. Output Voltage vs. Temperature
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
V
out
= 1.5 V
V
out
= 2.8 V
−40
−15
10
35
60
85
−40
−15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 12. Quiescent Current vs. Temperature
Figure 11. Quiescent Current vs. Temperature
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.6
0.5
0.4
0.3
0.2
0.1
0.0
85°C
85°C
25°C
25°C
−40°C
−40°C
V
out
= 1.5 V
V
out
= 1.8 V
0
25
50
75
100
125
150
0
25
50
75
100
125
150
OUTPUT CURRENT I (mA)
OUTPUT CURRENT I (mA)
out
out
Figure 13. Dropout Voltage vs. Output Current
Figure 14. Dropout Voltage vs. Output Current
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4
NCP582
TYPICAL CHARACTERISTICS
90
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
I
= 1 mA
out
80
70
60
50
40
30
20
10
0
I
= 30 mA
out
85°C
I
= 50 mA
out
25°C
−40°C
V
C
= 2.5 Vdc + 0.5 Vp−p
= Ceramic 1.0 mF
in
V
out
= 1.5 V
V
out
= 2.8 V
out
10
0.1
1
100
0
25
50
75
100
125
150
OUTPUT CURRENT I (mA)
out
FREQUENCY, f (kHz)
Figure 15. Dropout Voltage vs. Output Current
Figure 16. Ripple Rejection vs. Frequency
90
80
70
90
I
= 1 mA
out
I
= 1 mA
out
80
70
60
50
40
30
20
10
0
I
= 30 mA
out
I
= 50 mA
out
60 I = 30 mA
out
I
= 50 mA
out
50
40
30
20
V
C
= 2.5 Vdc + 0.5 Vp−p
= Ceramic 2.2 mF
V = 3.8 Vdc + 0.5 Vp−p
in
in
V
out
= 1.5 V
10
0
V
out
= 2.8 V
C
= Ceramic 0.47 mF
out
out
10
10
0.1
1
100
0.1
1
100
FREQUENCY, f (kHz)
FREQUENCY, f (kHz)
Figure 17. Ripple Rejection vs. Frequency
Figure 18. Ripple Rejection vs. Frequency
90
I
= 1 mA
out
80
70
60
50
40
30
20
10
0
I
= 30 mA
out
I
= 50 mA
out
V
C
= 3.8 Vdc + 0.5 Vp−p
in
V
out
= 2.8 V
= Ceramic 1.0 mF
out
10
0.1
1
100
FREQUENCY, f (kHz)
Figure 19. Ripple Rejection vs. Frequency
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5
NCP582
TYPICAL CHARACTERISTICS
Vout = 1.5 V
1.55
1.54
1.53
1.52
1.51
1.50
1.49
4
3
2
1
0
Input Voltage
Output Voltage
0
10
20
30
40
50
60
70
80
90
100
TIME, t (ms)
Vout = 2.8 V
2.85
2.84
2.83
2.82
2.81
2.80
2.79
6
5
4
3
2
1
0
Input Voltage
Output Voltage
0
10
20
30
40
50
60
70
80
90
100
TIME, t (ms)
Figure 20. Input Transient Response
(Iout = 30 mA, Cin = 0, tr = tf = 5.0 ms, Cout = 0.47 mF)
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6
NCP582
TYPICAL CHARACTERISTICS
(Vin = 2.5 V, Cout = 1.0 mF, Vout = 1.5 V)
1.75
1.70
1.65
1.60
1.55
1.50
1.45
150
100
50
Output Current
0
Output Voltage
0
2
4
6
8
10
12
14
16
18
20
TIME, t (ms)
(Vin = 2.5 V, Cout = 2.2 mF, Vout = 1.5 V)
1.75
1.70
1.65
1.60
1.55
1.50
1.45
150
100
50
Output Current
Output Voltage
0
0
2
4
6
8
10
12
14
16
18
20
TIME, t (ms)
Figure 21. Load Transient Response
(tr = tf = 0.5 ms, Cin = 1.0 mF)
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7
NCP582
TYPICAL CHARACTERISTICS
(Vin = 3.8 V, Cout = 0.47 mF, Vout = 2.8 V)
3.05
3.00
2.95
2.90
2.85
2.80
2.75
150
100
50
Output Current
0
Output Voltage
0
0
0
2
2
2
4
4
4
6
8
10
12
14
16
18
20
20
20
TIME, t (ms)
(Vin = 3.8 V, Cout = 1.0 mF, Vout = 2.8 V)
3.05
3.00
2.95
2.90
2.85
2.80
2.75
150
100
50
Output Current
Output Voltage
0
6
8
10
12
14
16
18
TIME, t (ms)
(Vin = 3.8 V, Cout = 2.2 mF, Vout = 2.8 V)
3.05
3.00
2.95
2.90
2.85
2.80
2.75
150
100
50
Output Current
Output Voltage
0
6
8
10
12
14
16
18
TIME, t (ms)
Figure 22. Load Transient Response
(tr = tf = 0.5 ms, Cin = 1.0 mF)
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8
NCP582
4
3
2
1
0
6
5
4
3
2
4
3
2
1
0
6
5
4
3
2
1
0
V
in
V
in
I
= 0 mA
out
I
= 0 mA
out
I
= 30 mA
out
I
= 30 mA
out
1
0
I
= 150 mA
out
I
= 150 mA
out
−2
25
−5
0
5
10
TIME, t (ms)
15
20
−50
0
50 100 150 200 250 300 350 400 450
TIME, t (ms)
Figure 23. Turn−On/Off Speed with CE Pin (D Version)
(Vout = 1.5 V, Vin = 2.5 V, Cin = 1.0 mF, Cout = 1.0 mF)
4
3
8
7
6
5
4
3
2
1
0
4
3
8
7
6
5
4
3
2
1
0
V
in
V
2
2
in
1
1
I
= 0 mA
0
0
out
−1
−1
I
= 30 mA
I
= 0 mA
out
out
I
= 30 mA
out
I
= 150 mA
out
I
= 150 mA
out
−5
0
5
10
TIME, t (ms)
15
20
25
−20
0
20 40 60 80 100 120 140 160 180
TIME, t (ms)
Figure 24. Turn−On/Off Speed with CE Pin (D Version)
(Vout = 2.8 V, Vin = 3.8 V, Cin = 0.47 mF, Cout = 0.47 mF)
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9
NCP582
APPLICATION INFORMATION
Input Decoupling
A 1.0 mF ceramic capacitor is the recommended value to
be connected between V and GND. For PCB layout
considerations, the traces of V and GND should be
performance, select a capacitor with low Equivalent Series
Resistance (ESR). For PCB layout considerations, place
the output capacitor close to the output pin and keep the
leads as short as possible.
in
in
sufficiently wide in order to minimize noise and prevent
unstable operation.
Noise Decoupling
The NCP582 series are low noise regulators and reach a
noise level of only 30 mVrms between 10 Hz and 100 kHz.
Output Decoupling
It is best to use a 1.0 mF capacitor value when V
out
t2.5 V and a 0.47 mF when V w 2.5 V. For better
out
ORDERING INFORMATION
Nominal
Output
Voltage
Device
Output Type / Features
Active High w/Auto Discharge
Active High w/Auto Discharge
Active High w/Auto Discharge
Active High w/Auto Discharge
Active High w/Auto Discharge
Active High w/Auto Discharge
Active Low
Marking
SF
Package
Shipping†
NCP582DSQ15T1G
NCP582DSQ18T1G
NCP582DSQ25T1G
NCP582DSQ28T1G
NCP582DSQ30T1G
NCP582DSQ33T1G
NCP582LSQ15T1G
NCP582LSQ18T1G
NCP582LSQ25T1G
NCP582LSQ28T1G
NCP582LSQ30T1G
NCP582LSQ33T1G
NCP582DXV15T2G
NCP582DXV18T2G
NCP582DXV25T2G
NCP582DXV28T2G
NCP582DXV29T2G
NCP582DXV30T2G
NCP582DXV33T2G
NCP582LXV15T2G
NCP582LXV18T2G
NCP582LXV25T2G
NCP582LXV28T2G
NCP582LXV29T2G
NCP582LXV30T2G
NCP582LXV33T2G
1.5
1.8
2.5
2.8
3.0
3.3
1.5
1.8
2.5
2.8
3.0
3.3
1.5
1.8
2.5
2.8
2.9
3.0
3.3
1.5
1.8
2.5
2.8
2.9
3.0
3.3
SC−82AB (Pb−Free)
SC−82AB (Pb−Free)
SC−82AB (Pb−Free)
SC−82AB (Pb−Free)
SC−82AB (Pb−Free)
SC−82AB (Pb−Free)
SC−82AB (Pb−Free)
SC−82AB (Pb−Free)
SC−82AB (Pb−Free)
SC−82AB (Pb−Free)
SC−82AB (Pb−Free)
SC−82AB (Pb−Free)
SOT−563 (Pb−Free)
SOT−563 (Pb−Free)
SOT−563 (Pb−Free)
SOT−563 (Pb−Free)
SOT−563 (Pb−Free)
SOT−563 (Pb−Free)
SOT−563 (Pb−Free)
SOT−563 (Pb−Free)
SOT−563 (Pb−Free)
SOT−563 (Pb−Free)
SOT−563 (Pb−Free)
SOT−563 (Pb−Free)
SOT−563 (Pb−Free)
SOT−563 (Pb−Free)
3000 Tape & Reel
3000 Tape & Reel
3000 Tape & Reel
3000 Tape & Reel
3000 Tape & Reel
3000 Tape & Reel
3000 Tape & Reel
3000 Tape & Reel
3000 Tape & Reel
3000 Tape & Reel
3000 Tape & Reel
3000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
SJ
TF
TJ
UA
UD
JF
Active Low
JJ
Active Low
KF
Active Low
KJ
Active Low
LA
Active Low
LD
Active High w/Auto Discharge
Active High w/Auto Discharge
Active High w/Auto Discharge
Active High w/Auto Discharge
Active High w/Auto Discharge
Active High w/Auto Discharge
Active High w/Auto Discharge
Active Low
F15D
F18D
F25D
F28D
F29D
F30D
F33D
F15A
F18A
F25A
F28A
F29A
F30A
F33A
Active Low
Active Low
Active Low
Active Low
Active Low
Active Low
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Other voltages are available. Consult your ON Semiconductor representative.
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10
NCP582
PACKAGE DIMENSIONS
SOT−563
XV SUFFIX
CASE 463A−01
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
D
−X−
A
L
6
5
2
4
3
MILLIMETERS
DIM MIN NOM MAX
INCHES
NOM MAX
E
−Y−
MIN
H
E
A
b
C
D
E
e
0.50
0.17
0.08
1.50
1.10
0.55
0.22
0.12
1.60
1.20
0.5 BSC
0.20
0.60 0.020 0.021 0.023
0.27 0.007 0.009 0.011
0.18 0.003 0.005 0.007
1.70 0.059 0.062 0.066
1.30 0.043 0.047 0.051
0.02 BSC
1
b 56 PL
C
e
M
0.08 (0.003)
X Y
L
0.10
1.50
0.30 0.004 0.008 0.012
1.70 0.059 0.062 0.066
H
E
1.60
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.0
0.0394
1.35
0.0531
0.5
0.5
0.0197 0.0197
mm
ǒinches
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
MountingTechniques Reference Manual, SOLDERRM/D.
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11
NCP582
PACKAGE DIMENSIONS
SC−82AB
SQ SUFFIX
CASE 419C−02
ISSUE E
A
G
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
C
2. CONTROLLING DIMENSION: MILLIMETER.
3. 419C−01 OBSOLETE. NEW STANDARD IS
419C−02.
D 3 PL
N
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
4
3
K
B
F
S
MILLIMETERS
INCHES
MIN
1
2
DIM
A
B
C
D
F
G
H
J
MIN
1.8
1.15
0.8
MAX
2.2
1.35
1.1
MAX
0.087
0.053
0.043
0.016
0.020
0.059
0.004
0.010
−−−
0.071
0.045
0.031
0.008
0.012
0.043
0.000
0.004
0.004
H
J
0.2
0.3
0.4
0.5
L
0.05 (0.002)
1.1
0.0
1.5
0.1
0.10
0.1
0.26
−−−
K
L
N
S
0.05 BSC
0.2 REF
1.8
0.002 BSC
0.008 REF
0.07 0.09
2.4
SOLDERING FOOTPRINT*
1.30
0.0512
0.65
0.026
1.90
0.075
0.95
0.037
0.90
0.035
mm
0.70
0.028
ǒinches
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
MountingTechniques Reference Manual, SOLDERRM/D.
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NCP582/D
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