NCS20071 [ONSEMI]
Rail-to-Rail Output, BW Operational Amplifier;
| 型号： | NCS20071 |
| 厂家： | 
ONSEMI |
| 描述： | Rail-to-Rail Output, BW Operational Amplifier |
| 文件： | 总24页 (文件大小：967K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCS20071, NCS20072,
NCS20074
Rail-to-Rail Output, 3 MHz
BW Operational Amplifier
The NCS2007 series operational amplifiers provide rail−to−rail
output operation, 3 MHz bandwidth, and are available in single, dual,
and quad configurations. Rail−to−rail operation enables the user to
make optimal use of the entire supply voltage range while taking
advantage of 3 MHz bandwidth. The NCS2007 can operate on supply
voltages as low as 2.7 V over the temperature range of −40°C to
125°C. At a 2.7 V supply, the high bandwidth provides a slew rate of
2.8 V/ms while only consuming 405 mA of quiescent current per
channel. The wide supply range allows the NCS2007 to run on supply
voltages as high as 36 V, making it ideal for a broad range of
applications. Since this is a CMOS device, high input impedance and
low bias currents make it ideal for interfacing to a wide variety of
signal sensors. The NCS2007 devices are available in a variety of
compact packages.
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5
1
SOT−553
TSOP−5
CASE 463B
CASE 483
8
1
Micro8]
SOIC−8
CASE 751
Features
CASE 846AH
• Rail−To−Rail Output
• Wide Supply Range: 2.7 V to 36 V
8
• Wide Bandwidth: 3 MHz typical at V = 2.7 V
S
1
• High Slew Rate: 2.8 V/ms typical at V = 2.7 V
S
• Low Supply Current: 405 mA per channel at V = 2.7 V
S
TSSOP−8
CASE 948S
UDFN8
CASE 517AC
• Low Input Bias Current: 5 pA typical
• Wide Temperature Range: −40°C to 125°C
• Available in a variety of packages
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
14
14
1
1
TSSOP−14
CASE 948G
SOIC−14 NB
CASE 751A
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 2 of this data sheet.
• Current Sensing
• Signal Conditioning
• Automotive
ORDERING INFORMATION
See detailed ordering and shipping information on page 4 of
this data sheet.
End Products
• Notebook Computers
• Portable Instruments
• Power Supplies
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
July, 2014 − Rev. 1
NCS20071/D
NCS20071, NCS20072, NCS20074
Single Channel Configuration
NCS20071, NCV20071
5
ADYAYWG
XXMG
G
G
1
SOT−553
TSOP−5
CASE 463B
CASE 483
Dual Channel Configuration
NCS20072, NCV20072
8
1
XXX
YWW
A G
1
XXXXXX
AYWW
XXX
YMD
XX MG
G
G
G
Micro8]
SOIC−8
CASE 751
TSSOP−8
CASE 948S
UDFN8
CASE 517AC
CASE 846AH
Quad Channel Configuration
NCS20074, NCV20074
14
14
XXXX
XXXX
ALYW
XXXXX
AWLYWW
1
1
TSSOP−14
CASE 948G
SOIC−14 NB
CASE 751A
X
A, R
Y
= Specific Device Code
= Assembly Location
= Year
WW, W = Work Week
G or G = Pb−Free Package
Figure 1. Marking Diagrams
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2
NCS20071, NCS20072, NCS20074
Single Channel Configuration
NCS20071, NCV20071
IN+
OUT
VSS
1
2
3
5
4
VDD
IN−
1
2
3
5
4
VDD
OUT
+
VSS
−
IN+
IN−
SOT23−5
(TSOP−5)
SOT553−5
Quadruple Channel Configuration
NCS20074, NCV20074
Dual Channel Configuration
NCS20072, NCV20072
OUT 1
IN− 1
IN+ 1
VDD
1
2
3
4
5
6
7
14
13
12
11
10
9
OUT 4
IN− 4
IN+ 4
VSS
OUT 1
1
8
−
+
−
+
VDD
−
2
3
4
7
6
5
OUT 2
IN− 1
IN+ 1
VSS
+
IN− 2
IN+ 2
−
IN+ 3
IN− 3
OUT 3
IN+ 2
IN− 2
+
−
+
−
+
OUT 2
8
Figure 2. Pin Connections
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3
NCS20071, NCS20072, NCS20074
ORDERING INFORMATION
Device
†
Configuration
Automotive
Marking
Package
Shipping
NCS20071SN2T1G*
*
SOT23−5
(TSOP−5)
(Pb−Free)
3000 / Tape and Reel
No
NCS20071*
*
*
SOT553−5
(Pb−Free)
4000 / Tape and Reel
3000 / Tape and Reel
Single
NCV20071SN2T1G*
SOT23−5
(TSOP−5)
(Pb−Free)
Yes
NCV20071*
*
SOT553−5
(Pb−Free)
4000 / Tape and Reel
4000 / Tape and Reel
2500 / Tape and Reel
3000 / Tape and Reel
3000 / Tape and Reel
4000 / Tape and Reel
2500 / Tape and Reel
3000 / Tape and Reel
3000 / Tape and Reel
2500 / Tape and Reel
2500 / Tape and Reel
2500 / Tape and Reel
2500 / Tape and Reel
NCS20072DMR2G*
NCS20072DR2G*
NCS20072DTBR2G*
NCS20072*
*
Micro8 (MSOP8)
(Pb−Free)
*
SOIC−8
(Pb−Free)
No
*
TSSOP−8
(Pb−Free)
*
UDFN8
(Pb−Free)
Dual
NCV20072DMR2G*
NCV20072DR2G*
NCV20072DTBR2G*
NCV20072*
*
Micro8 (MSOP8)
(Pb−Free)
*
SOIC−8
(Pb−Free)
Yes
*
TSSOP−8
(Pb−Free)
*
UDFN8
(Pb−Free)
NCS20074DR2G
NCS20074DTBR2G
NCV20074DR2G
NCV20074DTBR2G
NCS20074
SOIC−14
(Pb−Free)
No
NCS2
0074
TSSOP−14
(Pb−Free)
Quad
NCS20074
SOIC−14
(Pb−Free)
Yes
NCS2
0074
TSSOP−14
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*Contact local sales office for more information
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4
NCS20071, NCS20072, NCS20074
ABSOLUTE MAXIMUM RATINGS (Note 1)
Rating
Symbol
Limit
Unit
V
Supply Voltage (V – V ) (Note 2)
V
S
40
DD
SS
Input Voltage
V
I
V
SS
− 0.2 to V + 0.2
V
DD
Differential Input Voltage
Maximum Input Current
V
V
V
ID
s
I
10
100
mA
mA
mW
°C
°C
°C
V
I
Maximum Output Current
I
O
Continuous Total Power Dissipation (Note 2)
Maximum Junction Temperature
P
200
D
T
150
J
Storage Temperature Range
T
STG
−65 to 150
260
Mounting Temperature (Infrared or Convection – 20 sec)
T
mount
ESD Capability (Note 3)
Human Body Model
Machine Model
ESD
ESD
2000
150
HBM
MM
Charged Device Model
ESD
1000 (C6)
CDM
Latch−Up Current (Note 3)
I
LU
100
mA
Moisture Sensitivity Level (Note 3)
MSL
Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. Continuous short circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junction
temperature of 150°C. Output currents in excess of the maximum output current rating over the long term may adversely affect reliability.
Shorting output to either VDD or VSS will adversely affect reliability.
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per ANSI/ANSI/ESDA/JEDEC JS-001−2010 (AEC−Q100−002)
ESD Machine Model tested per JESD22−A115 (AEC−Q100−003)
ESD Charged Device Model tested per ANSI/ESD S5.3.1−2009 (AEC−Q100−011)
4. Latch−up Current tested per JEDEC standard: JESD78 (AEC−Q100−004)
5. Moisture Sensitivity Level tested per IPC/JEDEC standard: J−STD−020A
THERMAL INFORMATION
Parameter
Symbol
Package
SOT23−5/ TSOP5
SOT553−5
Micro8/MSOP8
SOIC−8
Value
235
250
238
190
140
350
156
190
Unit
Junction−to−Ambient
q
°C/W
JA
TSSOP−8
UDFN−8
SOIC−14
TSSOP−14
OPERATING RANGES
Parameter
Symbol
Min
Max
36
Unit
V
Operating Supply Voltage
Differential Input Voltage
V
S
2.7
V
ID
V
S
V
Input Common Mode Range
Ambient Temperature
V
V
V − 1.35
DD
V
ICM
SS
T
−40
125
°C
A
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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5
NCS20071, NCS20072, NCS20074
ELECTRICAL CHARACTERISTICS AT VS = 2.7 V
T = 25°C; R ≥ 10 kW; V
= V
= mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
A
L
CM
OUT
Boldface limits apply over the specified temperature range, T = −40°C to 125°C. (Notes 6, 7)
A
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
INPUT CHARACTERISTICS
1.3
3
mV
mV
mV/°C
pA
Input Offset Voltage
Offset Voltage Drift
V
OS
+4
DV /DT
T = 25°C to 125°C
2
5
OS
A
200
1500
75
Input Bias Current
Input Offset Current
I
IB
Note 7
pA
2
pA
I
Note 7
DC
OS
175
pA
Channel Separation
XTLK
115
50
dB
Differential Input Resistance
Common Mode Input Resistance
Differential Input Capacitance
Common Mode Input Capacitance
R
R
C
GW
GW
pF
ID
IN
ID
5
1.5
3.5
110
C
pF
CM
90
Common Mode Rejection Ratio
CMRR
V
CM
= 0 V to V − 1.35 V
dB
DD
69
OUTPUT CHARACTERISTICS
96
118
Open Loop Voltage Gain
Output Current Capability
Output Voltage High
A
dB
mA
V
VOL
86
Op amp sinking current
70
50
I
O
Op amp sourcing current
0.006
0.15
0.22
0.15
0.22
V
Voltage output swing from positive rail
OH
0.005
Output Voltage Low
V
Voltage output swing from negative rail
V
OL
AC CHARACTERISTICS
Unity Gain Bandwidth
Slew Rate at Unity Gain
Phase Margin
UGBW
SR
C = 25 pF
3
MHz
V/ms
°
L
C = 20 pF
L
2.8
50
ö
m
C = 25 pF
L
Gain Margin
A
m
C = 25 pF
L
14
dB
Settling time to 0.1%
Settling time to 0.01%
0.6
1.2
V
= 1 Vpp,
O
Settling Time
t
S
ms
Gain = 1, C = 20 pF
L
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise
THD+N
V
= 0.5 Vpp, f = 1 kHz, Av = 1
0.05
30
%
IN
f = 1 kHz
f = 10 kHz
f = 1 kHz
Input Referred Voltage Noise
Input Referred Current Noise
e
n
nV/√Hz
fA/√Hz
20
i
n
0.25
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
6. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
7. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
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6
NCS20071, NCS20072, NCS20074
ELECTRICAL CHARACTERISTICS AT VS = 2.7 V
T = 25°C; R ≥ 10 kW; V
= V
= mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
A
L
CM
OUT
Boldface limits apply over the specified temperature range, T = −40°C to 125°C. (Notes 6, 7)
A
Parameter
Symbol
Conditions
Min
Typ
135
405
Max
Unit
SUPPLY CHARACTERISTICS
114
Power Supply Rejection Ratio
PSRR
No Load
dB
100
525
Power Supply Quiescent Current
I
Per channel, no load
mA
DD
625
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
6. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
7. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
ELECTRICAL CHARACTERISTICS AT VS = 5 V
T = 25°C; R ≥ 10 kW; V
= V
= mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
A
L
CM
OUT
Boldface limits apply over the specified temperature range, T = −40°C to 125°C. (Notes 8, 9)
A
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
INPUT CHARACTERISTICS
1.3
3
mV
mV
mV/°C
pA
Input Offset Voltage
Offset Voltage Drift
V
OS
+4
DV /DT
T = 25°C to 125 °C
2
5
OS
A
200
1500
75
Input Bias Current
Input Offset Current
I
IB
Note 9
pA
2
pA
I
Note 9
DC
OS
175
pA
Channel Separation
XTLK
115
50
dB
Differential Input Resistance
Common Mode Input Resistance
Differential Input Capacitance
Common Mode Input Capacitance
R
R
C
GW
GW
pF
ID
IN
ID
5
1.5
3.5
125
C
pF
CM
105
80
Common Mode Rejection Ratio
CMRR
V
= 0 V to V − 1.35 V
dB
CM
DD
OUTPUT CHARACTERISTICS
96
120
Open Loop Voltage Gain
Output Current Capability
Output Voltage High
A
dB
mA
V
VOL
86
Op amp sinking current
50
60
I
O
Op amp sourcing current
0.013
0.20
0.25
0.10
0.15
V
Voltage output swing from positive rail
OH
0.01
Output Voltage Low
V
Voltage output swing from negative rail
V
OL
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
8. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
9. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
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7
NCS20071, NCS20072, NCS20074
ELECTRICAL CHARACTERISTICS AT VS = 5 V
T = 25°C; R ≥ 10 kW; V
= V
= mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
A
L
CM
OUT
Boldface limits apply over the specified temperature range, T = −40°C to 125°C. (Notes 8, 9)
A
Parameter
AC CHARACTERISTICS
Unity Gain Bandwidth
Slew Rate at Unity Gain
Phase Margin
Symbol
Conditions
Min
Typ
Max
Unit
UGBW
SR
C = 25 pF
L
3.2
2.7
50
MHz
V/ms
°
C = 20 pF
L
ö
m
C = 25 pF
L
Gain Margin
A
m
C = 25 pF
L
14
dB
Settling time to 0.1%
Settling time to 0.01%
1.2
5.6
V
= 3 Vpp,
O
Settling Time
t
S
ms
Gain = 1, C = 20 pF
L
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise
THD+N
V
IN
= 2.5 Vpp, f = 1 kHz, Av = 1
0.009
30
%
f = 1 kHz
f = 10 kHz
f = 1 kHz
Input Referred Voltage Noise
e
n
nV/√Hz
fA/√Hz
20
Input Referred Current Noise
i
n
0.25
SUPPLY CHARACTERISTICS
114
135
410
Power Supply Rejection Ratio
PSRR
No Load
dB
100
530
Power Supply Quiescent Current
I
Per channel, no load
mA
DD
630
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
8. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
9. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
ELECTRICAL CHARACTERISTICS AT VS = 10 V
T = 25°C; R ≥ 10 kW; V
= V
= mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
A
L
CM
OUT
Boldface limits apply over the specified temperature range, T = −40°C to 125°C. (Notes 10, 11)
A
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
INPUT CHARACTERISTICS
1.3
3
mV
mV
mV/°C
pA
Input Offset Voltage
Offset Voltage Drift
V
OS
+4
DV /DT
T = 25°C to 125°C
2
5
OS
A
200
1500
75
Input Bias Current
Input Offset Current
I
IB
Note 11
pA
2
pA
I
Note 11
DC
OS
175
pA
Channel Separation
XTLK
115
50
5
dB
Differential Input Resistance
Common Mode Input Resistance
Differential Input Capacitance
Common Mode Input Capacitance
R
R
C
GW
GW
pF
ID
IN
ID
1.5
3.5
C
pF
CM
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
10.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
11. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
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8
NCS20071, NCS20072, NCS20074
ELECTRICAL CHARACTERISTICS AT VS = 10 V
T = 25°C; R ≥ 10 kW; V
= V
= mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
A
L
CM
OUT
Boldface limits apply over the specified temperature range, T = −40°C to 125°C. (Notes 10, 11)
A
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
INPUT CHARACTERISTICS
110
130
Common Mode Rejection Ratio
CMRR
V
CM
= 0 V to V − 1.35 V
dB
DD
87
OUTPUT CHARACTERISTICS
98
120
Open Loop Voltage Gain
Output Current Capability
Output Voltage High
A
dB
mA
V
VOL
88
Op amp sinking current
50
65
I
O
Op amp sourcing current
0.023
0.08
0.10
0.3
V
Voltage output swing from positive rail
OH
0.022
Output Voltage Low
V
OL
Voltage output swing from negative rail
V
0.35
AC CHARACTERISTICS
Unity Gain Bandwidth
Slew Rate at Unity Gain
Phase Margin
UGBW
SR
C = 25 pF
3.2
2.2
50
MHz
V/ms
°
L
C = 20 pF
L
ö
m
C = 25 pF
L
Gain Margin
A
m
C = 25 pF
L
14
dB
Settling time to 0.1%
Settling time to 0.01%
3.4
6.8
V
= 8.5 Vpp,
O
Settling Time
t
S
ms
Gain = 1, C = 20 pF
L
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise
THD+N
V
IN
= 7.5 Vpp, f = 1 kHz, Av = 1
0.004
30
%
f = 1 kHz
f = 10 kHz
f = 1 kHz
Input Referred Voltage Noise
e
n
nV/√Hz
fA/√Hz
20
Input Referred Current Noise
i
n
0.25
SUPPLY CHARACTERISTICS
114
135
416
Power Supply Rejection Ratio
PSRR
No Load
dB
100
540
Power Supply Quiescent Current
I
Per channel, no load
mA
DD
640
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
10.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
11. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
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9
NCS20071, NCS20072, NCS20074
ELECTRICAL CHARACTERISTICS AT VS = 36 V
T = 25°C; R ≥ 10 kW; V
= V
= mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
A
L
CM
OUT
Boldface limits apply over the specified temperature range, T = −40°C to 125°C. (Notes 12, 13)
A
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
INPUT CHARACTERISTICS
1.3
3
mV
mV
mV/°C
pA
Input Offset Voltage
Offset Voltage Drift
V
OS
+4
DV /DT
T = 25°C to 125°C
2
5
OS
A
200
1500
75
Input Bias Current
Input Offset Current
I
IB
Note 13
pA
2
pA
I
Note 13
DC
OS
175
pA
Channel Separation
XTLK
115
50
dB
Differential Input Resistance
Common Mode Input Resistance
Differential Input Capacitance
Common Mode Input Capacitance
R
R
C
GW
GW
pF
ID
IN
ID
5
1.5
3.5
145
C
pF
CM
120
Common Mode Rejection Ratio
CMRR
V
CM
= 0 V to V − 1.35 V
dB
DD
95
OUTPUT CHARACTERISTICS
98
120
Open Loop Voltage Gain
Output Current Capability
Output Voltage High
A
dB
mA
V
VOL
88
Op amp sinking current
50
65
I
O
Op amp sourcing current
0.074
0.10
0.12
0.3
V
Voltage output swing from positive rail
OH
0.065
Output Voltage Low
V
OL
Voltage output swing from negative rail
V
0.35
AC CHARACTERISTICS
Unity Gain Bandwidth
Slew Rate at Unity Gain
Phase Margin
UGBW
SR
C = 25 pF
3.2
2.4
50
MHz
V/ms
°
L
C = 20 pF
L
ö
m
C = 25 pF
L
Gain Margin
A
m
C = 25 pF
L
14
dB
Settling time to 0.1%
Settling time to 0.01%
3.2
6.8
V
= 10 Vpp,
O
Settling Time
t
S
ms
Gain = 1, C = 20 pF
L
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise
THD+N
V
IN
= 28.5 Vpp, f = 1 kHz, Av = 1
0.001
30
%
f = 1 kHz
f = 10 kHz
f = 1 kHz
Input Referred Voltage Noise
Input Referred Current Noise
e
n
nV/√Hz
fA/√Hz
20
i
n
0.25
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
12.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
13.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
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10
NCS20071, NCS20072, NCS20074
ELECTRICAL CHARACTERISTICS AT VS = 36 V
T = 25°C; R ≥ 10 kW; V
= V
= mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
A
L
CM
OUT
Boldface limits apply over the specified temperature range, T = −40°C to 125°C. (Notes 12, 13)
A
Parameter
Symbol
Conditions
Min
Typ
135
465
Max
Unit
SUPPLY CHARACTERISTICS
114
Power Supply Rejection Ratio
PSRR
No Load
dB
100
600
Power Supply Quiescent Current
I
Per channel, no load
mA
DD
700
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
12.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
13.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
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11
NCS20071, NCS20072, NCS20074
0.7
0.6
0.5
0.4
0.3
0.2
0.7
0.6
0.5
0.4
V
= 36 V
S
T = 125°C
T = 85°C
T = 25°C
V
S
= 2.7 V
T = −40°C
V
= 5 V
S
V
S
= 10 V
0.3
0.2
0
6
12
18
24
30
36
−40 −20
0
20
40
60
80
100 120
SUPPLY VOLTAGE (V)
TEMPERATURE (°C)
Figure 3. Quiescent Current Per Channel vs.
Supply Voltage
Figure 4. Quiescent Current vs. Temperature
0
−0.2
−0.4
−0.6
−0.8
−1
5
4
V
=
18 V
V
= mid−supply
S
CM
10 units
3
2
1
T = −40°C
0
−1
−2
−3
−4
−5
T = 85°C
T = 25°C
T = 125°C
−1.2
0
6
12
18
24
30
36
−18 −14 −10 −6
−2
2
6
10
14 18
SUPPLY VOLTAGE (V)
COMMON MODE VOLTAGE (V)
Figure 5. Offset Voltage vs. Supply Voltage
Figure 6. Input Offset Voltage vs. Common
Mode Voltage
5
2.5
125
100
75
180
135
90
V
S
V
S
V
S
V
S
= 2.7 V, Gain
= 36 V, Gain
= 2.7 V, Phase
= 36 V, Phase
V
=
18 V
S
Normal
operation
10 units
0
GAIN
−2.5
−5
50
45
25
0
R = 10 kW
C = 15 pF
L
−7.5
−10
−12.5
−15
0
L
−45
−90
−135
−180
−25
−50
−75
PHASE
15.5
16
16.5
17
17.5
18
18.5
10
100
1k
10k
100k
1M
10M
COMMON MODE VOLTAGE (V)
FREQUENCY (Hz)
Figure 7. Input Offset Voltage vs. Common
Mode Voltage
Figure 8. Gain and Phase vs. Frequency
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12
NCS20071, NCS20072, NCS20074
60
50
40
30
20
10
0
1E+1
V
= 36 V
= 1 kHz
A = 1
V
S
V
= 5 V
S
F
IN
R = 10 kW
L
1E+0
1E−1
1E−2
1E−3
1E−4
T = 25°C
A
0
100
200
300
400
500
0
6
12
18
24
30
36
CAPACITIVE LOAD (pF)
OUTPUT VOLTAGE (Vpp)
Figure 9. Phase Margin vs. Capacitive Load
Figure 10. THD+N vs. Output Voltage
275
250
225
200
175
150
125
100
75
1E+1
1E+0
1E−1
1E−2
1E−3
1E−4
V
V
V
V
= 2.7 V
= 5 V
= 10 V
= 36 V
S
S
S
S
A = 1
V
V
= 2.7 V
S
V
= 5 V
S
V
= 10 V
= 36 V
S
V
S
50
25
0
10
10
100
1k
10k
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 11. THD+N vs. Frequency
Figure 12. Input Voltage Noise vs. Frequency
140
120
100
80
5
V
S
V
S
V
S
V
S
= 2.7 V, V
= 5 V, V
V
S
V
S
V
S
V
S
= 2.7 V
= 5 V
= 10 V
= 36 V
DD
SS
4
3
= 10 V, V
DD
SS
= 36 V V
2
60
1
40
0
20
0
−1
10
100
1k
10k
100k
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 13. Input Current Noise vs. Frequency
Figure 14. PSRR vs. Frequency
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13
NCS20071, NCS20072, NCS20074
120
100
80
60
40
20
0
1.4
V
S
V
S
V
S
V
S
= 2.7 V
= 5 V
= 10 V
= 36 V
T = −40°C
T = 25°C
T = 85°C
T = 125°C
1.2
1
0.8
0.6
0.4
0.2
0
R = 10 kW
T = 25°C
A
L
V
S
= 36 V
10
100
1k
10k
100k
1M
0
2
4
6
8
10
12 14
16 18 20
FREQUENCY (Hz)
OUTPUT CURRENT (mA)
Figure 15. CMRR vs. Frequency
Figure 16. High Level Output vs. Output
Current
1
0.8
0.6
0.4
0.2
0
18.1
18.05
18
Input
Output
T = −40°C
T = 25°C
T = 85°C
T = 125°C
V
= 36 V
S
A = +1
R = 10 kW
L
V
17.95
17.9
V
S
= 36 V
0
2
4
6
8
10
12 14
16 18 20
−20
0
20
40
60
OUTPUT CURRENT (mA)
TIME (ms)
Figure 17. Low Level Output vs. Output
Current
Figure 18. Non−inverting Small Signal
Transient Response
18.075
18.05
18.025
18
25
Input
Output
20
15
10
V
= 36 V
S
17.975
17.95
17.925
A = +1
R = 10 kW
L
V
V
S
= 36 V
A = +1
R = 10 kW
L
V
Input
Output
−20
0
20
40
60
−20
0
20
40
60
TIME (ms)
TIME (ms)
Figure 19. Inverting Small Signal Transient
Response
Figure 20. Non−inverting Large Signal
Transient Response
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14
NCS20071, NCS20072, NCS20074
24
22
20
18
16
14
12
10
1200
V
S
= 36 V
1000
800
600
400
200
0
I +
V
= 36 V
IB
S
I −
A = −1
R = 10 kW
L
IB
V
I
OS
Input
Output
−200
−20
0
20
40
60
−25
0
25
50
75
100
125
TIME (ms)
TEMPERATURE (°C)
Figure 21. Inverting Large Signal Transient
Response
Figure 22. Input Bias and Offset Current vs.
Temperature
50
40
0.1 Hz to 10 Hz noise
V
S
= 36 V
V
S
=
18 V, V = V /2
CM S
I +
IB
R = 10 kW, C = 100 pF
30
L
L
I −
IB
A = −1, V = 0 V
V
IN
I
OS
20
10
0
−10
−20
−30
−40
−50
0
6
12
18
24
30
36
0
1
2
3
4
5
6
7
8
9
10
COMMON MODE VOLTAGE (V)
TIME (s)
Figure 23. Input Bias Current vs. Common
Mode Voltage
Figure 24. 0.1 Hz to 10 Hz Noise
0
500
V
S
V
S
V
S
V
S
= 2.7 V
= 5 V
= 10 V
= 36 V
R = 10 kW
C = 25 pF
L
L
450
400
350
300
250
200
150
100
50
−20
−40
−60
−80
−100
−120
−140
−160
V
S
V
S
V
S
V
S
= 2.7 V
= 5 V
= 10 V
= 36 V
0
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 25. Channel Separation vs. Frequency
Figure 26. Open Loop Output Impedance
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15
NCS20071, NCS20072, NCS20074
1000
500
10
V
= 36 V
S
V
= 36 V
S
8
6
10 V step
A = −1
5 Units
= mid−supply
V
V
CM
0
4
2
12−bit Setting
−500
−1000
−1500
−2000
−2500
0
1/2LSB = 0.024%
−2
−4
−6
−8
−10
−50
−25
0
25
50
75
100
125
0
5
10
15
20 25 30 35 40
45 50
TEMPERATURE (°C)
TIME (ms)
Figure 27. Offset Voltage vs. Temperature
Figure 28. Large Signal Settling Time
5
4
3
2
1
0
SR+
SR−
V
S
= 36 V
−40 −20
0
20
40
60
80
100 120
TEMPERATURE (°C)
Figure 29. Slew Rate vs. Temperature
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16
NCS20071, NCS20072, NCS20074
PACKAGE DIMENSIONS
SOT−553, 5 LEAD
CASE 463B
ISSUE C
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
A
−X−
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
L
5
4
3
MILLIMETERS
INCHES
NOM
0.022
0.009
0.005
0.063
0.047
0.020 BSC
0.008
0.063
E
−Y−
DIM
A
b
c
D
E
MIN
0.50
0.17
0.08
1.55
1.15
NOM
0.55
0.22
0.13
1.60
MAX
MIN
MAX
0.024
0.011
0.007
0.065
0.049
H
E
0.60
0.27
0.18
1.65
1.25
0.020
0.007
0.003
0.061
0.045
1
2
b 5 PL
c
1.20
e
M
e
L
0.50 BSC
0.20
1.60
0.08 (0.003)
X Y
0.10
1.55
0.30
1.65
0.004
0.061
0.012
0.065
H
E
RECOMMENDED
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.0
0.0394
1.35
0.0531
0.5
0.5
0.0197 0.0197
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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17
NCS20071, NCS20072, NCS20074
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
NOTE 5
5X
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
0.20 C A B
2X
0.10
T
M
5
4
3
2X
0.20
T
B
S
1
2
K
B
A
DETAIL Z
G
A
MILLIMETERS
TOP VIEW
DIM
A
B
MIN
3.00 BSC
1.50 BSC
MAX
DETAIL Z
C
D
0.90
0.25
1.10
0.50
J
G
H
J
K
M
S
0.95 BSC
C
0.01
0.10
0.20
0
0.10
0.26
0.60
0.05
H
SEATING
PLANE
END VIEW
C
10
_
_
SIDE VIEW
2.50
3.00
SOLDERING FOOTPRINT*
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.7
0.028
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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18
NCS20071, NCS20072, NCS20074
PACKAGE DIMENSIONS
Micro8 / MSOP8 (150 mil)
CASE 846AH
ISSUE A
SOLDERING FOOTPRINT*
4.30
(Unit: mm)
1.0
0.35
0.65
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
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19
NCS20071, NCS20072, NCS20074
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
−X−
A
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
S
M
M
B
0.25 (0.010)
Y
1
K
−Y−
MILLIMETERS
DIM MIN MAX
INCHES
G
MIN
MAX
0.197
0.157
0.069
0.020
A
B
C
D
G
H
J
K
M
N
S
4.80
3.80
1.35
0.33
5.00 0.189
4.00 0.150
1.75 0.053
0.51 0.013
C
N X 45
_
SEATING
PLANE
1.27 BSC
0.050 BSC
−Z−
0.10
0.19
0.40
0
0.25 0.004
0.25 0.007
1.27 0.016
0.010
0.010
0.050
8
0.020
0.244
0.10 (0.004)
M
J
H
D
8
0
_
_
_
_
0.25
5.80
0.50 0.010
6.20 0.228
M
S
S
X
0.25 (0.010)
Z
Y
SOLDERING FOOTPRINT*
1.52
0.060
7.0
4.0
0.275
0.155
0.6
0.024
1.270
0.050
mm
inches
ǒ
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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20
NCS20071, NCS20072, NCS20074
PACKAGE DIMENSIONS
TSSOP−8
CASE 948S
ISSUE C
8x K REF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
V
0.10 (0.004)
T U
S
0.20 (0.008) T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
8
5
4
2X L/2
B
−U−
J
J1
L
1
PIN 1
IDENT
K1
K
S
0.20 (0.008) T U
A
SECTION N−N
−V−
MILLIMETERS
INCHES
MIN
DIM MIN
MAX
3.10
4.50
1.10
0.15
0.70
MAX
0.122
0.177
0.043
0.006
0.028
A
B
2.90
4.30
---
0.114
0.169
---
−W−
C
C
0.076 (0.003)
D
0.05
0.50
0.002
0.020
F
DETAIL E
SEATING
D
−T−
G
G
J
0.65 BSC
0.026 BSC
PLANE
0.09
0.09
0.19
0.19
0.20
0.16
0.30
0.25
0.004
0.004
0.007
0.007
0.008
0.006
0.012
0.010
J1
K
0.25 (0.010)
N
K1
L
6.40 BSC
0.252 BSC
0
M
M
0
8
8
_
_
_
_
N
F
DETAIL E
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21
NCS20071, NCS20072, NCS20074
PACKAGE DIMENSIONS
UDFN8, 1.6x1.6, 0.4P
CASE 517AC
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
A
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
B
2X
0.10
C
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. EXPOSED PADS CONNECTED TO DIE FLAG.
USED AS TEST CONTACTS.
PIN ONE
REFERENCE
E
MILLIMETERS
2X
(A3)
DIM MIN
0.45
A1 0.00
NOM MAX
0.10
C
A
0.50
0.03
0.55
0.05
TOP VIEW
A3
0.127 REF
b
D
0.15
0.20
1.60 BSC
0.80
1.60 BSC
0.50
0.25
A
(A3)
D2 0.70
E
E2 0.40
0.90
0.60
0.10
0.08
C
C
e
K
L
0.40 BSC
−−−
0.30
SEATING
PLANE
0.20
0.20
−−−
0.40
8X
SIDE VIEW
D2
C
A1
e
SOLDERING FOOTPRINT*
0.490
0.0193
0.924
0.0364
8X L
4
1
E2
0.902
0.0355
0.200
0.0079
8
5
8X K
8X b
0.10 C A B
BOTTOM VIEW
0.400
0.0157
PITCH
NOTE 3
C
0.05
0.502
0.0197
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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22
NCS20071, NCS20072, NCS20074
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE B
NOTES:
14X K REF
1. DIMENSIONING AND TOLERANCING PER
M
S
S
V
ANSI Y14.5M, 1982.
0.10 (0.004)
T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
S
0.15 (0.006) T U
N
0.25 (0.010)
14
8
2X L/2
M
B
−U−
L
N
PIN 1
IDENT.
F
7
1
DETAIL E
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
K
0.15 (0.006) T U
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
−V−
A
B
C
D
F
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
J J1
1.20
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N−N
G
H
J
J1
K
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
−W−
C
K1 0.19
L
M
6.40 BSC
0.252 BSC
0.10 (0.004)
0
8
0
8
_
_
_
_
SEATING
−T−
H
G
DETAIL E
D
PLANE
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
23
NCS20071, NCS20072, NCS20074
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE K
NOTES:
D
A
B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
14
8
7
A3
E
H
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
L
DETAIL A
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
13X b
M
M
B
0.25
A
A1
A3
b
D
E
1.35
0.10
0.19
0.35
8.55
3.80
1.75 0.054 0.068
0.25 0.004 0.010
0.25 0.008 0.010
0.49 0.014 0.019
8.75 0.337 0.344
4.00 0.150 0.157
M
S
S
B
0.25
C A
DETAIL A
h
A
X 45
_
e
H
h
L
1.27 BSC
0.050 BSC
6.20 0.228 0.244
0.50 0.010 0.019
1.25 0.016 0.049
5.80
0.25
0.40
0
M
A1
e
M
7
0
7
_
_
_
_
SEATING
PLANE
C
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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