NCS37014MNTWG [ONSEMI]

Self Test GFCI controller compliant with UL943;
NCS37014MNTWG
型号: NCS37014MNTWG
厂家: ONSEMI    ONSEMI
描述:

Self Test GFCI controller compliant with UL943

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中文:  中文翻译
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DATA SHEET  
www.onsemi.com  
Self Test Ground Fault  
Circuit Interrupter (GFCI)  
QFN16  
CASE 485FQ  
NCS37014  
The NCS37014 is a UL943 compliant signal processor for GFCI  
applications with self test. The device integrates a flexible power  
supply (including a 12 V shunt and two 3.3 V internal series  
regulators), differential fault, and groundedneutral detection circuits.  
Self test is monitored at start up and then every 17 minutes.  
PIN ASSIGNMENT  
Features  
CTG  
GFT  
CTB  
CTS  
LED  
MLD  
SUP  
RES  
Meets UL943 Selftest GFCI Requirements  
4.0 – 12 Volt Operation (120480 V AC mains with the appropriate  
series impedance)  
o
o
40 C to 95 C  
Typical 575 mA Quiescent Current @ 11 V  
16 Pin QFN  
(Top View)  
Self Syncing Internal Oscillator adjusts to AC Mains Frequency to  
Guarantee Full Resolution on 60 Hz Distribution Systems  
Optimized Solenoid Deployment (coil is not energized near the AC  
mains zero crossings).  
MARKING DIAGRAM  
Power Supply Monitor that Verifies Full Diode Bridge Operation  
Tiered Trip Times that Increase Immunity to Noise  
37014  
ALYWG  
G
Undervoltage Detection that Allows for Increased Operation at  
Lower AC Input Voltages  
37014 = Specific Device Code  
A
L
Y
W
G
= Assembly Location  
= Wafer Lot  
= Year  
= Work Week  
= PbFree Package  
Typical Applications  
GFCI Receptacles  
Load Panel GFCI Breakers  
Inline GFCI Circuits (power cords)  
(Note: Device NCS37014MNTWG includes  
PbFree micro dot below assembly information text;  
Device NCS37014MNATWG includes PbFree  
micro dot to the right of assembly information text)  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 7 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
July, 2022 Rev. 4  
NCS37014/D  
NCS37014  
SUP  
12V Shunt  
Regulator  
3.3V Analog  
Regulator  
3.3V Digital  
Regulator  
1.65V  
CTB  
IDF  
VDA  
RES  
Bandgap  
Reference  
1.2V  
3.3V Analog Regulator  
Voltage Divider  
2 MHz  
Oscillator  
POR  
+
+0.2V  
+
NCS37014  
SCR  
GFT  
PTT  
+ /  
0.2V  
Digital  
Filter  
data[7:0]  
SAR  
done  
ADC  
Saturation  
Clamp/  
Detection  
adc_start  
clk  
TE  
CTO  
CTG  
+
CONTROL LOGIC  
GROUND FAULT  
LED  
DYNAMIC OSC TRIM  
gnComp  
chop  
saturated  
CTS  
MLD  
OFFSET CORRECTION  
GNE  
GND  
3.3V Shunt  
Regulator  
UVD  
Figure 1. Simplified Block Diagram  
Table 1. QFN PIN DESCRIPTION  
Pin #  
1
Name  
CTG  
GFT  
CTB  
CTS  
CTO  
IDF  
Pad Description  
Ground Neutral current transformer stimulus  
2
Differential self test output signal  
Differential current transformer bias voltage  
Differential current input  
3
4
5
Differential current to voltage output  
Differential low pass filter/ADC input  
Analog 3.3 V regulator output/ ADC reference voltage  
Electronics ground  
6
7
VDA  
GND  
RES  
SUP  
MLD  
LED  
PTT  
SCR  
TE  
8
9
Reference current bias input  
Power supply input  
10  
11  
12  
13  
14  
15  
16  
Mains level/under voltage detector  
End of life LED drive  
Push to test input  
SCR gate drive signal  
Test enable  
GNE  
Groundneutral enable input  
www.onsemi.com  
2
NCS37014  
Table 2. ABSOLUTE MAXIMUM RATINGS  
Rating  
Symbol  
Value  
13.5  
Unit  
V
Supply Voltage Range  
Supply Current  
Vs  
Is  
10  
mA  
V
Input Voltage Range (Note 3)  
Output Voltage Range  
V
in  
0.3 to 3.6  
V
out  
0.3 to 3.6 V or (V + 0.3),  
V
in  
whichever is lower  
Maximum Junction Temperature  
T
140  
65 to 150  
2
°C  
°C  
kV  
V
J(max)  
Storage Temperature Range  
TSTG  
ESD Capability, Human Body Model (Note 4)  
ESD Capability, Charge Device Model (Note 4)  
Lead Temperature Soldering  
ESD  
HBM  
CDM  
ESD  
500  
T
260  
°C  
SLD  
Reflow (SMD Styles Only), PbFree Versions (Note 5)  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Functional operation above the Recommended Operating Conditions is not implied. Extended  
2. Exposure to stresses above the Recommended Operating Conditions may affect device reliability.  
3. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.  
4. This device series incorporates ESD protection and is tested by the following methods:  
ESD Human Body Model tested per JS0012012  
ESD Charge Device Model tested per JESD22C101F  
Latchup Current Maximum Rating: v100 mA per JEDEC standard: JESD78D  
5. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D  
Table 3. THERMAL CHARACTERISTICS  
Rating  
Symbol  
Value  
Unit  
Thermal Characteristics, QFN16, 3x3.3 mm (Note 6)  
R
64  
°C/W  
θJA  
Thermal Resistance, JunctiontoAir (Note 7)  
6. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.  
2
2
7. Values based on copper area of 645 mm (or 1 in ) of 1 oz copper thickness and FR4 PCB substrate.  
www.onsemi.com  
3
 
NCS37014  
Table 4. OPERATING RANGES (Unless otherwise noted, I  
= 3 mA, MLD input = 60 Hz, Refer to Figure 2)  
SUP  
Parameter  
Operating Temperature  
Conditions  
Min  
Typ  
Max  
95  
Units  
C
Ambient  
40  
Shunt Regulator Voltage  
Shunt Regulator Current  
Quiescent Current  
SUP to GND, I  
= 1 mA  
12  
13  
V
SUP  
SUP  
I
10  
mA  
mA  
I , SUP = 10.5 V  
SUP  
575  
203  
750  
215  
RMS Trip Threshold Voltage  
SCR Trigger Current  
IDF to CTB, R8 = 32 kW, R  
= 500 W  
191  
4
mV  
mA  
V
CTO  
I
, SCR = 1 V, I  
< 6 mA  
SCR  
SHUNT  
SCR Trigger Output Voltage  
LED Output Voltage  
SCR to GND, SUP < 4 V  
LED to GND, SUP < 4 V  
CTB to GND, VDA = 3.3 V  
CTSCTB  
3
3.6  
3.6  
3
V
CTB Bias Voltage  
1.65  
V
CTSCTB Absolute Offset Voltage  
Fault Response Time  
250  
250  
125  
95  
75  
60  
50  
40  
35  
25  
20  
mV  
6 mA I  
< 10 mA  
< 15 mA  
ms  
DIFF  
Fault Response Time  
10 mA I  
ms  
DIFF  
Fault Response Time  
15 mA I  
< 17.5 mA  
ms  
DIFF  
Fault Response Time  
17.5 mA I  
< 20 mA  
ms  
DIFF  
Fault Response Time  
20 mA I  
< 22.5 mA  
ms  
DIFF  
Fault Response Time  
22.5 mA I  
< 26.5 mA  
ms  
DIFF  
Fault Response Time  
26.5 mA I  
< 29 mA  
ms  
DIFF  
Fault Response Time  
29 mA I  
< 33 mA  
ms  
DIFF  
Fault Response Time  
I
33 mA  
ms  
DIFF  
CTG Comparator Threshold  
CTG Timer  
CTG to GND, VDA = 3.3 V  
CTG > Threshold  
1.95  
45  
V
ms  
CTG GN Trip Frequency  
GN Response Time  
CTG to GND  
2
7
kHz  
ms  
Continuous GN Fault  
350  
2.2  
95  
Internal Oscillator Frequency  
Under Voltage Detect  
F
= 60 Hz +/0.1  
1.8  
80  
2
MHz  
Vrms  
mA  
AC  
V
AC  
to GND, R7 = 1 MW, +/1%  
87  
MLD Max Clamp Current  
MLD Pull Down Current  
First ST Timer  
I
Max Sink Current  
MLD = 1 V  
400  
MLD  
500  
2
nA  
VDA > 3 V  
1.7  
15  
2.3  
20  
seconds  
minutes  
minutes  
Periodic ST Timer, Pass  
Periodic ST Timer, Fail  
Consecutive ST Failure Timer  
LED Blink Frequency  
Steady State, ST Pass  
ST Fail  
17  
1
0.8  
1.2  
ST Fail Counter, Enable SCR  
First ST Failure  
7
1.8  
6
2
2.2  
14  
Hz  
mA  
ST Cycle GF Pass Window  
MLD Pin Check Wait Time to Enable LED  
MLD Pin Continuity Pass  
LED Blink Frequency  
I
Ground Fault  
DIFF  
No MLD signal  
Input Frequency  
No MLD signal  
No MLD signal  
500  
ms  
25  
Hz  
1.5  
2
6
2.5  
Hz  
MLD Pin Check Wait Time to Enable SCR  
minutes  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
8. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.  
www.onsemi.com  
4
NCS37014  
APPLICATIONS INFORMATION  
R7  
LINE  
S1  
Q1  
R6  
DB  
R5  
C3  
TEST  
C4  
R12  
C6  
Rctg  
CTG  
GFT  
CTB  
CTS  
LED  
MLD  
SUP  
RES  
C5  
CT2  
CT1  
C7  
F1  
Ferrite  
Bead  
C1  
R4  
D4  
F2  
Ferrite  
Bead  
R1  
C9  
R8  
Q2  
D1  
R10  
C2  
Rcto  
R2  
R3  
R11  
C8  
D2  
RESET  
LOAD  
Figure 2. GFCI Receptacle Application Diagram  
www.onsemi.com  
5
NCS37014  
Table 5. RECOMMENDED EXTERNAL COMPONENTS  
Component Type  
SCR  
Instance  
Q1  
Value  
Note  
ONMCR08  
NPN  
Q2  
MMBT6517LT1D  
Diode Bridge  
Diode  
DB  
D1, D2  
D3  
1N4007  
Diode  
1N4007, auxiliary supply  
LED for self test failure  
Differential current filter capacitor  
LED  
D4  
Capacitor  
Capacitor  
Capacitor  
Capacitor  
Capacitor  
Capacitor  
Capacitor  
Capacitor  
Capacitor  
Resistor  
C1  
33 nF  
56 nF  
10 nF  
1 mF  
C2  
Antialiasing filter (1 kHz corner frequency)  
SCR gate filter capacitor  
C3  
C4  
SUP pin holding capacitor  
C5  
22220 pF  
4.747 nF  
1 nF  
Ground Neutral CT resonance capacitor  
Ground Neutral CT AC coupler  
C6  
C7  
CTB bias filter  
C8  
1 mF  
Analog 3.3 V regulator filter  
C9  
1 nF  
High frequency filter  
R1  
243 W  
15 kW  
10 kW  
6.8 kW  
0.474.7 kW  
72 kW  
1 MW  
32 kW  
72 kW  
1020 kW  
120 kW  
10 kW  
0.471.5 kW  
0 – 200 W  
800  
Precision resistor (1%), Differential burden/CT low pass filter  
Controls the self test current in the Q2  
Sets the current in the base of Q2  
Limits current to the LED D3  
Resistor  
R2  
Resistor  
R3  
Resistor  
R4  
Resistor  
R5  
Sets allowable gate current in Q1  
Power supply current limit  
Resistor  
R6  
Resistor  
R7  
MLD current limit/under voltage attenuator  
Precision resistor (1%), Sets the differential trip level at 5 mA  
Power supply current limit  
Resistor  
R8  
RMS  
Resistor  
R9  
Resistor  
R10  
R11  
R12  
Rcto  
Rctg  
CT1  
CT2  
Differential filter resistor  
Resistor  
Precision resistor (1%), Current reference bias resistor  
Test button pullup resistor  
Resistor  
Resistor  
Precision resistor (1%), Sets the differential trip level at 5 mA  
Sets the GN sensitivity  
RMS  
Resistor  
Current Transformer  
Current Transformer  
Differential current transformer  
250  
GN current transformer  
Functional Description (refer to application circuit)  
The NCS37014 provides for a single IC controller  
solution for ground fault, grounded neutral and selftest  
protection per UL standard UL943.  
The key internal blocks include: 12 V shunt regulator,  
precision bandgap reference, two 3.3 V linear regulators  
(one for the digital and one for the analog circuit) sense  
(vda) and digital (vdd) internal circuitry via two 3.3 V linear  
regulators.  
At POR detection (vda>2.475) the logic is reset and the  
bias circuitry is enabled, the LED pin will blink once for  
250 ms. The MLD pin is continually checked for an input  
signal greater than 25 Hz. If the MLD signal is greater than  
25 Hz, this test passes. If it fails, the LED blinking logic will  
be enabled. A six minute timer will start and if no MLD  
signal is detected, the SCR will be enabled. If a MLD signal  
occurs before the six minute timer and is longer than one  
minute, the timer will be reset.  
amplifier with V cancellation, 1.65 V reference for the  
OS  
CT, 2 MHz oscillator dynamically trimmed to the AC line  
frequency, 8 bit SAR ADC, comparators, digital filters and  
digital control logic.  
The internal shunt regulator clamps the SUP pin voltage  
at 12 volts. This provides the bias voltage for the analog  
The first self test (ST) cycle will occur at two seconds and  
thereafter every 17 minutes. During the ST cycle the GFT  
www.onsemi.com  
6
NCS37014  
pin will be enabled and the CT current (set at 8 mA, R2 ) will  
and vda. When the pin is clamped at vda, the current is  
compared to a threshold so if the VAC voltage is below  
87VRMS, the ST GF threshold will be reduced by 50%. This  
function provides for an AC under voltage detection which  
allows for the ST cycle to pass with a lower GF threshold.  
The AC UVD threshold can be user programmable by  
changing R7.  
be verified for two half cycles. If a ST cycle fails due to a low  
GF detection or a GF signal greater than 30 mA, the LED  
blinking logic will be enabled. Another ST cycle will occur  
in one minute. If seven consecutive ST cycles fail the SCR  
will be enabled. If a ST cycle passes before the 7 consecutive  
cycle counter, the ST logic will be reset and a ST cycle will  
occur in 17 minutes.  
Grounded Neutral detection is accomplished by the  
addition of a GN coil to generate a “dormant oscillator”  
circuit. When a GN condition occurs, both the sense coil and  
GN coils are mutually coupled and the GN amplifier will  
oscillate. This oscillation can be observed at the CTG pin.  
When the oscillation at the CTG pin is above 1.95 volts for  
greater than 45 us, and if this condition (oscillation) lasts for  
longer than 64 ms, the internal NCS37014 logic will disable  
the GN amplifier to stop the CTG oscillation for  
approximately 90 ms. The amplifier will be enabled again  
and if the oscillation on the CTG pin returns, the GN fault  
will be detected and the SCR will be enabled  
(NCS37014MNATWG device GN fault requires the GN  
amplifier enabling and disability to go through two cycles).  
This total sequence cycle takes a maximum of 175 ms (350  
ms for NCS37014MNATWG). During power up, an  
additional maximum of 80 ms is required. The maximum  
time required during power up is 350 ms. The sensitivity of  
the GN detection can be changed by capacitor C6 and  
resistor Rctg. The frequency of this CTG oscillation needs  
to be in the 2 kHz to 7 kHz.  
The internal oscillator is trimmed to 2 MHz when the AC  
frequency is 60 Hz. If the AC frequency is lower, the GF trip  
threshold response time will be slower and the GN  
sensitivity will be lower.  
When the IC logic enables the SCR gate driver circuit, the  
SCR pin will go high at approximately 26 degree phase  
angle (for AC Mains at 60 Hz) for the duration of the MLD  
half cycle and disable at the zero cross. The LED blinking  
logic will be enabled.  
The CT is biased at 1.65 volts. The sense amplifier  
monitors the ground fault current. This current is converted  
to a voltage level at the CTO pin which is the input to the  
ADC (IDF pin). The resistor R8 sets the GF threshold per the  
following equation:  
ǒ
Ǔ
0.203   CT1   RCT1 ) R1 ) 2pfACLCT1  
Idiff  
+
(eq. 1)  
ǒ
Ǔ
R8   RCT1 ) 2pfACLCT1  
CT = Turns ratio of differential CT  
1
R
CT1  
= DC winding resistance of differential CT  
f
= AC mains frequency  
AC  
L
= Inductance of differential CT  
CT1  
The ground fault detection circuit has different levels of  
time delay before the SCR is enabled:  
6 mA to 10 mA  
10 mA to 15 mA  
15 mA to 17.5 mA  
17.5 mA to 20 mA  
20 mA to 22.5 mA  
22.5 mA to 26.5 mA  
26.5 mA to 29 mA  
29 mA to 33 mA  
>33 mA  
125 ms  
95 ms  
75 ms  
60 ms  
50 ms  
40 ms  
35 ms  
25 ms  
20 ms  
If a very high GF occurs and a greater than 200 mV signal  
occurs across the CT for greater than 1.4 ms, the SCR will  
be enabled immediately.  
Note that the above equation is for an ideal CT. In practice,  
the GF threshold can be +/30% different and should be  
empirically set.  
When the PTT pin is enabled for greater than 64 ms and  
if the GNE PIN is high (16 ms when GNE PIN is low), a ST  
cycle will be enabled. If the ST cycle passes, the SCR will  
be enabled. If the ST cycle fails, the LED will be enabled and  
blink. A PTT ST passing cycle will generate a POR reset.  
The PTT pin has a 50 kW pull down resistor. This pin is a  
CMOS input with hysteresis. To enable the PTT function,  
the input voltage should go above 2.4 volts.  
The RES pin is biased at 1.2 volts and should have an  
external precision 120 kW resistor connected to the GND  
pin. This resistor sets up an internal precision current source.  
The TE pin is used for internal production testing only. A  
50 kW pull down resistor is connected to this pin. This pin  
should be open or connected to the GND pin (preferred).  
The GNE pin has an internal 50 kW pull up resistor  
connected to the internal 3.3 V supply. If this pin is pulled  
low, the GN function will be disabled.  
Contact ON Semiconductor for selftest requirement  
details and noise filtering recommendations.  
The MLD pin monitors the phase and zero cross for the  
AC supply. The MLD circuit clamps the pin voltage to gnd  
ORDERING INFORMATION  
Device  
Package  
Shipping †  
NCS37014MNTWG  
QFN16  
(PbFree)  
3000 / Tape & Reel  
NCS37014MNATWG  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
NOTE: NCS37014MNATWG is the improved version of NCS37014MNTWG with better frequency noise immunity.  
www.onsemi.com  
7
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
QFN16 3x3, 0.5P  
CASE 485FQ  
ISSUE B  
DATE 12 JUL 2022  
GENERIC  
MARKING DIAGRAM*  
XXXXX = Specific Device Code  
A
L
= Assembly Location  
= Wafer Lot  
*This information is generic. Please refer to  
XXXXX  
XXXXX  
ALYWG  
G
Y
W
G
= Year  
= Work Week  
= PbFree Package  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”,  
may or may not be present. Some products  
may not follow the Generic Marking.  
(Note: Microdot may be in either location)  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON84763G  
QFN16 3x3, 0.5P  
PAGE 1 OF 1  
onsemi and  
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves  
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular  
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© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
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TECHNICAL PUBLICATIONS:  
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