NCV21671DM050R2G_技术文档

DATA SHEET

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Current-Shunt Monitors,

Zero-Drift, 40 V Common

Mode, Bidirectional,

Shutdown

MARKING

DIAGRAMS

xxxx

AYW

NCS21671, NCV21671

The NCS21671 and NCV21671 are a series of voltage output

current sense amplifiers offered in gains of 25, 50, 100, and 200 V/V.

These parts can measure voltage across shunts at common mode

voltages from −0.1 V to 40 V, independent of supply voltage. The low

offset of the zero−drift architecture enables current sensing with

voltage drops across sense resistors as low as 10 mV full−scale. An

optional enable function is available to reduce current drain through

the input pins and power supply pins to negligible levels when

disabled or if Vs is less than 1.5 V. Two optional pins are included to

simplify input filtering. These devices can operate from a single

+1.8 V to +5.5 V power supply, drawing a maximum of 80 mA of

supply current. These parts are available in Micro10 and SC70−6

packages.

Micro10

CASE 846B−03

XXXX = Device Code

A

Y

W

G

= Assembly Location

= Year

= Work Week

= Pb−Free Package

6

XXXMG

G

1

SC−88/SC70−6

/SOT−363

CASE 419B−02

XXX = Specific Device Code

M

= Date Code*

Features

G

= Pb−Free Package

• Wide Common Mode Input Range: −0.1 V to 40 V

• Supply Voltage Range: 1.8 V to 5.5 V

• Low Offset Voltage: ±25 mV max

• Rail−to−Rail Output Capability

(Note: Microdot may be in

either location)

PIN CONNECTIONS

• Low Current Consumption: 80 mA max

• Enable Pin to Turn Off Input and Power Supply Currents

See pin connections on page 2 of this datasheet.

• Optional Input Filtering Through C

and C Pins

IN−

IN+

• NCV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q100

Qualified and PPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 14 of this data sheet.

Typical Applications

• Power Bus Monitoring

• Battery Current Monitor

• Lighting Ballast

1

Publication Order Number:

May, 2023 − Rev. 0

NCS21671/D

NCS21671, NCV21671

1.8 V to 5.5 V

Supply

Reference

Voltage

R

fb

NCS21671

Enable − HI

EN

Shutdown − LOW

R

in

filt

I

LOAD

IN+

+

R

SHUNT

OUT

VOUT

−

IN−

R

in

filt

R

fb

C

FILT

V

OUT

= (I

x R ) * GAIN + V

SHUNT REF

LOAD

Figure 1. Example Application Schematic of High−Side Current Sensing

PIN FUNCTION DESCRIPTION

10

1

NC

OUT

GND

REF

EN

C

2

3

4

5

9

8

IN+

IN−

1

2

3

6

5

OUT

REF

IN−

GND

7

6

IN+

4

V

S

V

S

C

IN−

Micro−10

SC70−6

Figure 2. Pin Function Description

PIN DESCRIPTION

Pin Name

Type

Description

This pin must be left not connected to external circuitry.

NC

No connect

C

Input

Supply

Input

Available on Micro10 packages only. An optional capacitor can be added between C

to create a low−pass input filter.

and C

IN+ IN−

IN+

This pin is connected to the positive side of the sense resistor or current shunt. This pin becomes

high impedance when the part is in shutdown mode (EN = 0).

IN−

This pin is connected to the negative side of the sense resistor or current shunt. This pin becomes

high impedance when the part is in shutdown mode (EN = 0).

C

Available on Micro10 packages only. An optional capacitor can be added between C

to create a low−pass input filter.

and C

IN+ IN−

IN−

V

This is the positive supply pin that provides power to the internal circuitry. An external bypass

capacitor of 0.1 μF is recommended to be placed as close as possible to this pin.

S

EN

Available on Micro10 packages only. There is no pull−up enable the part when this pin is open

circuit. The enable pin can be connected to V or driven with a logic level to enable the part. If this

S

pin is driven low the part enters a low power mode to conserve current consumption.

REF

Input

This pin sets the reference voltage of the internal difference amplifier circuit, allowing for

unidiretional or bidirectional current sensing. For unidirectional current sensing, connect this pin to

GND. For bidirectional current sensing, connect this pin between the GND and V range.

S

GND

OUT

Supply

Output

This is the negative supply rail of the circuit.

The output pin provides a low impedance voltage output. This pin becomes high impedance when

the part is in shutdown mode (EN = 0).

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2

NCS21671, NCV21671

MAXIMUM RATINGS

Parameter

Symbol

Rating

−0.3 to 6

44

Unit

V

Supply Voltage (Note 1)

V

S

IN+, IN−, CIN+, CIN−

Differential (V ) − (V ) (Note 2)

V V

IN+, IN−

V

IN+

IN−

Common−Mode (Note 2)

−0.3 to +44

REF Input

V

GND−0.3 to (V ) +0.3

V

REF

s

EN Input

V

GND−0.3 to (V ) +0.3

s

EN

Output (Note 2)

V

OUT

GND−0.3 to (V ) +0.3

V

s

Input Current into Any Pin (Note 2)

Operating Temperature

I

10

−40 to +150

−65 to +150

+150

mA

°C

V

IN

T

A

Storage Temperature

T

STG

Junction Temperature

T

J(max)

ESD Capability, Human Body Model (Note 3)

Charged Device Model (Note 3)

Latch−up Current (Note 4)

HBM

CDM

2000

1000

V

100

mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for safe

operating parameters.

2. Input voltage at any pin may exceed the voltage shown if current at that pin is limited to 10 mA.

3. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per JEDEC standard JS−001−2017

ESD Charged Device Model tested per JEDEC standard JS−002−2014

4. Latch−up Current tested per JEDEC standard JESD78E

THERMAL CHARACTERISTICS

Parameter

Symbol

Micro10 / MSOP10

SC88 / SC70−6 / SOT−363

Unit

°C/W

Junction−to−ambient thermal resistance (Notes 5, 6)

Junction−to−case thermal resistance (Notes 5, 6)

Junction−to−top thermal characterization (Notes 5, 6)

Junction−to−board thermal characterization (Notes 5, 6)

q

180

71

188

128

21

JA

q

JC(top)

Y

1.6

98

JT

91

JB

5. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for safe

operating parameters.

2

6. Values based on copper area of 645 mm (or 1 in ) of 1 oz copper thickness and FR4 PCB substrate. (reference JESD51).

RECOMMENDED OPERATING RANGES

Parameter

Symbol

Conditions

NCS prefix

Min

−40

−0.1

1.8

Max

125

40

Unit

Operating Temperature

T

A

°C

NCV prefix

Common Mode Input Voltage

Supply Voltage

V

CM

Full temperature range

V

S

5.5

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended

Operating Ranges limits may affect device reliability.

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3

NCS21671, NCV21671

ELECTRICAL CHARACTERISTICS

At T = +25°C, V

= (V ) − (V ); V = 1.8 V to 5.5 V, V

= 12 V, and V = V /2, unless otherwise noted. Boldface limits

REF S

A

SENSE

IN+

IN−

S

IN+

apply over the specified temperature range, T = −40 °C to 125 °C.

A

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

INPUT

Common Mode Rejection

Ratio, RTI (Note 7)

CMRR

V

= −0.1 V to 40 V,

SENSE

G = 25

G = 50

G = 100

G = 200

G = 25

G = 50

G = 100

G = 200

G = 25

G = 50

G = 100

G = 200

109

−

127

134

± 9

−

dB

IN+

= 0 mV

T = −40 °C to 125 °C

A

−

Input Offset Voltage,

RTI (Note 7)

V

OS

V

= 0 mV

19

12

10

60

40

25

± ±0.

mV

SENSE

−

± 4

−

± 3

−

± 2

V

= −0.1 V to 40 V

−

± 1

IN+

SENSE

= 0 mV

−

± 1

−

± 1

−

± 1

Input Offset Voltage Drift vs.

Temperature, RTI (Note 7)

DV / dT

V

= 0 mV

−

± 0.1

mV/°C

mV/V

OS

SENSE

Power Supply Rejection Ratio

PSRR

V = 1.8 V to 5.5 V,

S

−

± 1.0

± ±1

V

= 0mV

= 0 mV

= 0mV

SENSE

Input Bias Current

I

−

29

35

mA

IB

Input Bias Current in Shutdown

(Note 10)

I

−

140

nA

IBSD

Input Bias Current in Shutdown

(Note 10)

T = −40 °C to 125 °C

A

−

500

nA

IBSD

Input Offset Current

I

V

= 0 mV

−

1.4

−

± 0.3

−

mA

IO

SENSE

Enable Input Threshold Voltage

V

Enabled

Disabled

V

th(EN)

−

0.3

−

Enable Input Leakage Current

I

V

EN

V

EN

= V

S

−

3

nA

EN

= GND

−

−3

65

20

−

Enable Time (Note 8)

Shutdown Time (Note 8)

OUTPUT

t

R = 10 kΩ to GND

−

μs

ON

L

t

R = 10 kΩ to GND

−

OFF

L

Gain

G

G = 25

G = 50

G = 100

G = 200

−

25

−

V/V

50

100

−

200

−

Gain Error

E

G

V

= −5 mV to + 5 mV, G = 25

−

%

± 0.4

± 0.3

± 0.5

−

SENSE

T = −40°C to 125°C

A

G = 50

−

G = 100

G = 200

−

Nonlinearity Error

± 0.01

%

Reference Voltage Rejection

Ratio (Note 10)

RVRR

V

REF

= 100 mV to

G = 25

G = 50

G = 100

G = 200

−

1

27

mV/V

(V – 100 mV)

S

15

T = −40°C to 125°C

A

V

S

= 5.5 V

10

Maximum Capacitive Load

C

No sustained oscillation

−

nF

L

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4

NCS21671, NCV21671

ELECTRICAL CHARACTERISTICS

At T = +25°C, V

= (V ) − (V ); V = 1.8 V to 5.5 V, V

= 12 V, and V = V /2, unless otherwise noted. Boldface limits

REF S

A

SENSE

IN+

IN−

S

IN+

apply over the specified temperature range, T = −40 °C to 125 °C.

A

Parameter

VOLTAGE OUTPUT

Swing to VS Supply Rail

Symbol

Conditions

Min

Typ

Max

Unit

V

OH

R = 10 kW to GND

−

V

−20

V −35

S

mV

L

A

S

T = −40°C to +125°C

Swing to GND

V

OL

R = 10 kW to GND

1

2.5

L

T = −40°C to +125°C

A

FREQUENCY RESPONSE

Bandwidth (f

)

BW

C = 10pF

G = 25

G = 50

G = 100

G = 200

−

40

35

20

0.3

30

−

kHz

−3dB

L

Slew Rate

SR

V = 5.5 V

S

V/μs

μs

Settling Time

T

e

From current step to within 1% of final

value

S

NOISE

Voltage Noise Density,

RTI (Note 7)

G = 25

G = 50

G = 100

G = 200

−

56

46

−

nV/√Hz

n

POWER SUPPLY

Quiescent Current

IQ

V

= 0 mV

−

45

0.2

40

80

0.5

−

μA

μs

SENSE

Quiescent Current in Shutdown

Power−on Time (Note 9)

I

t

QSD

PON

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be

indicated by the Electrical Characteristics if operated under different conditions.

7. Referred to input.

8. Shutdown Time (t

) and Enable Time (t ) are defined as the time between the 50% point of the signal applied to the EN pin and the point at which the output

OFF

ON

voltage reaches within 10% of its final value. V

= (0.75 * V − V

) / Gain.

SENSE

S

REF

9. Time between V is application and Vout reaching 10% of final value.

S

10. Guaranteed by characterization and/or design.

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5

NCS21671, NCV21671

TYPICAL CHARACTERISTICS (At T = +25°C, V

= (V ) – (V ).; V = V = 1.8 V, V

= V /2, V

=12 V, and all

A

SENSE

IN+

IN−

S

EN

REF

S

CM

gains unless otherwise noted.)

Figure 4.

Input Offset (μV)

Figure 3a. Input Offset Voltage Distribution,

G25

Figure 3b. Input Offset Voltage Distribution,

G50

Input Offset (μV)

Figure 3d. Input Offset Voltage Distribution,

G200

Figure 3c. Input Offset Voltage Distribution,

G100

VOS vs. Temperature

50

40

30

20

10

0

−10

−20

−30

−40

−50

Figure 3.

−50 −25

0

25

50

75

100

125

150

Temperature (°C)

CMRR (μV/V)

Figure 5a. Common Mode Rejection Ratio

Distribution, G25

Figure 5. Input Offset vs. Temperature, G100

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6

NCS21671, NCV21671

TYPICAL CHARACTERISTICS (At T = +25°C, V

= (V ) – (V ); V = V = 1.8 V, V

= V /2, V

=12 V, and all

A

SENSE

IN+

IN−

S

EN

REF

S

CM

gains unless otherwise noted.) (continued)

CMRR (μV/V)

Figure 5b. Common Mode Rejection Ratio

Distribution, G50

Figure 5c. Common Mode Rejection Ratio

Distribution, G100

CMRR vs. Temperature

2

1.5

1

0.5

0

−0.5

−1

−1.5

−2

−50

−25

0

25

50

75

100

125

150

Temperture (°C)

CMRR (μV/V)

Figure 5d. Common Mode Rejection Ratio

Distribution, G200

Figure 6. Common Mode Rejection Ratio vs

Temperature, G100

Gain Error (%)

Figure 7.

Figure 7b. Gain Error Distribution, G50

Figure 7a. Gain Error Distribution, G25

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7

NCS21671, NCV21671

TYPICAL CHARACTERISTICS (At T = +25°C, V

= (V ) – (V ).; V = V = 1.8 V, V

= V /2, V

=12 V, and all

A

SENSE

IN+

IN−

S

EN

REF

S

CM

gains unless otherwise noted.) (continued)

Gain Error (%)

Figure 7c. Gain Error Distribution, G100

Figure 7d. Gain Error Distribution, G200

Giant Error vs. Temperature

VOS vs. VCM

50

40

0.6

0.5

Vs = 1.8 V

Vs = 5 V

−40

0

25

30

85

125

20

0.4

0.3

0.2

10

0

−10

−20

−30

−40

−50

0.1

0

−5

0

5

10

15

20

25

30

35

40

−50

−25

0

25

50

75

100

125

150

Common Mode Voltage (V)

Temperature (°C)

Figure 9. Zero VIN Output vs Common Mode

Voltage, G100

Figure 8. Gain Error vs Temperature, G100

CMRR vs. Frequency

PSRR vs. Frequency

140

120

100

80

Vs = 1.8 V

Vs = 5 V

120

100

80

Vs = 1.8 V

Vs = 5 V

60

40

20

0

−20

10

100

1k

10k

100k

1M

10M

10

100

1k

10k

100k

1M

10M

Frequency (Hz)

Figure 10. Common Mode Rejection Ratio vs

Frequency, G100

Figure 11. Power Supply Rejection Ratio vs

Frequency, G100

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8

NCS21671, NCV21671

TYPICAL CHARACTERISTICS (At T = +25°C, V

= (V ) – (V ).; V = V = 1.8 V, V

= V /2, V =12 V, and all

CM

A

SENSE

IN+

IN−

S

EN

REF

S

gains unless otherwise noted.) (continued)

Bandwidth vs. Frequency

Output Impedance

50

40

10k

1k

30

20

100

10

0

10

1

−10

−20

−30

−40

−50

G200

G100

G50

G25

G50

G100

G200

0.1

G25

0.01

10

100

1k

10k

100k

1M

10M

10

100

1k

10k

100k

1M

Frequency (Hz)

Figure 12. Gain vs Frequency

Figure 13. Output Impedance vs Frequency

2.5

1.5

80

60

Source −40C

Source 25C

Source 125C

Sink −40C

Sink 25C

0.5

40

20

0

Sink 125C

−0.5

−40

25C

125C

−1.5

−20

−2.5

0

5

10

15

20

25

30

35

40

45

50

0

5

10

15

20

25

30

35

Common Mode Voltage (V)

Output Current (mA)

Figure 14. Output Voltage Swing vs Current

Figure 15. Input Bias Current vs Common

Mode Voltage (Enabled)

10

8

0.6

−40°C

0°C

25°C

85°C

100°C

125°C

VS = 1.8 V

VS = 5 V

0.5

0.4

0.3

0.2

0.1

6

4

2

0

−2

−4

−0.1

−0.2

−10

0

10

20

30

40

50

0

30

10

20

40

Common Mode Voltage (V)

Temperature (°C)

Figure 17. Quiescent Current vs Common

Mode Voltage (Enabled)

Figure 16. Input Bias Current vs Common Mode

Voltage (VS open circuit)

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9

NCS21671, NCV21671

TYPICAL CHARACTERISTICS (At T = +25°C, V

= (V ) – (V ).; V = V = 1.8 V, V

= V /2, V

=12 V, and all

A

SENSE

IN+

IN−

S

EN

REF

S

CM

gains unless otherwise noted.) (continued)

Inout Voltage Noise Density

10k

10

8

VS = 1.8 V

VS = 5 V

6

1k

100

10

4

2

0

−2

−4

−10

0

10

20

30

40

50

10

100

1k

10k

100k

1M

Frequency (Hz)

Common Mode Voltage (V)

Figure 18. Quiescent Current vs Common Mode

Voltage (Disabled)

Figure 19. Voltage Noise Density

(Referred−to−Input)

300

250

200

150

100

50

0.01

2.7

Input (V)

Output (V)

2.6

2.5

2.4

2.3

0.005

0

−0.005

−0.01

−50

−100

−150

0

2

4

6

8

10

0

20

40

60

80

100

Time (s)

Time (ms)

Figure 20. 0.1−Hz to 10−Hz Voltage Noise

(Referred−To−Input)

Figure 21. Step Response, G25 (10mV Input)

0.01

0.005

0

5

50

40

30

20

10

0

2.64

2.6

Input (V)

Output (V)

4.6

4.2

3.8

3.4

3.2

2

2.56

2.52

2.2

1.8

1.4

1

−0.005

−0.01

2.48

VCM

VOUT

2.44

0

20

40

60

80

100

0

10

20

30

40

50

60

Time (ms)

Figure 23.

Figure 23a. Common Mode Voltage Step

Figure 22. Step Response, G200 (10mV Input)

Rising, G100 (10ms)

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NCS21671, NCV21671

TYPICAL CHARACTERISTICS (At T = +25°C, V

= (V ) – (V ).; V = V = 1.8 V, V

otherwise noted.) (continued)

= V /2, V

=12 V, and all gains unless

A

SENSE

IN+

IN−

S

EN

REF

S

CM

50

40

30

20

10

0

2.58

2.54

VCM

VOUT

40

2.56

2.54

2.52

2.5

2.532

30

2.524

20

10

0

2.516

2.508

2.5

VCM

VOUT

2.48

0

20

40

60

80

100

120

140

160

0

100

200

300

400

500

600

Time (ms)

Figure 23b. Common Mode Voltage Step

Figure 23c. Common Mode Voltage Step

Rising, G100 (100ms)

Falling, G100 (10ms)

50

40

30

20

10

0

2.58

2.56

2.54

2.52

2.5

120

100

80

60

40

20

0

VCM

VOUT

1 kHz

10 kHz

100 kHz

2.48

0

5

10

15

20

25

30

35

40

0

20

40

60

80 100 120 140 160 180 200

VCM (V)

Time (ms)

Figure 24.

Figure 24a. Common Mode Rejection Ratio

vs Common mode Voltage, G25

Figure 23d. Common Mode Voltage Step

Falling, G100 (100ms)

140

120

100

80

140

120

100

80

60

40

1 kHz

10 kHz

100 kHz

1 kHz

10 kHz

100 kHz

20

0

5

10

15

20

25

30

35

40

0

5

10

15

20

25

30

35

40

VCM (V)

Figure 24b. Common Mode Rejection Ratio

vs Common mode Voltage, G50

Figure 24c. Common Mode Rejection Ratio

vs Common mode Voltage, G100

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NCS21671, NCV21671

TYPICAL CHARACTERISTICS (At T = +25°C, V

= (V ) – (V ).; V = V = 1.8 V, V

= V /2, V =12 V, and all gains unless otherwise noted.)

CM

A

SENSE

IN+

IN−

S

EN

REF

S

(continued)

6

5

4

3

2

1

0

5

140

120

Vin (V)

Vout (V)

4.5

4

3.5

3

100

80

2.5

2

60

1.5

1

40

20

0

0,5

0

1 kHz

10 kHz

100 kHz

− 0.5

−1

0

50

100

150

200

0

5

10

15

20

25

30

35

40

Time (ms)

VCM (V)

Figure 25.

Figure 24d. Common Mode Rejection Ratio

vs Common mode Voltage, G200

Figure 25a. Positive Differential Input

Overload, G100

6

5

4

3

2

1

6

5

4

3

2

1

0

5

4.5

4

3

Vin (V)

Vout (V)

VS

VOUT

3.5

3

2

2.5

2

1

1.5

1

0.5

0

− 0.5

− 1

0

−50

−1

0

50

100

0

100

200

Time (ms)

Figure 25b. Negative Differential Input

Overload, G100

Figure 26a. VS Power Startup

Figure 26.

6

5

4

3

2

1

0

6

5

4

3

2

1

0

6

5

4

3

2

1

6

5

4

3

2

1

0

Series 1

Series 2

VS

VOUT

0

50

100

150

0

5

10

15

20

Time (ms)

Figure 27.

Figure 26b. VS Power Shutdown

Figure 27a. Enable Startup

www.onsemi.com

12

NCS21671, NCV21671

6

5

4

3

2

1

0

6

Series 1

Series 2

5

4

3

2

1

0

2

4

6

8

10

Time (ms)

Figure 27b. Enable Shutdown

APPLICATION INFORMATION

Current Sensing Techniques

pin is connected to the mid−supply voltage for bidirectional

The NCS21671 and NCV21671 are current sense

amplifiers featuring a wide common mode voltage range

that spans from −0.1 V to 40 V independent of the supply

voltage. These amplifiers can be configured for low−side

and high−side current sensing.

At first glance, low−side sensing appears to have the

advantage of being straightforward, inexpensive, and the

ability to be implemented with a simple op amp circuit.

However, the NCS21671 provides the full differential input

necessary to get accurate shunt connections while also

providing a built−in gain network with precision difficult to

obtain with external resistors.

While at times the application requires low−side sensing,

only high−side sensing can detect a short from the positive

supply line to ground. Furthermore, high−side sensing

avoids adding resistance to the ground path of the load being

measured.

monitoring.

Enable Pin

The enable pin can be used to shut down the part and

reduce current consumption. When the part is shut down,

quiescent current drops to less than 1 mA and the inputs

become high impedance. The output also becomes high

impedance in the shutdown mode.

Input Filtering

Some applications may require filtering at the input of the

current sense amplifier. Input filtering is simplified with the

CIN+ and CIN− pins. Simply add an external capacitor

across the pins to set the cutoff frequency, f .

c

1

f_c+

(eq. 1)

2p(2R_Filt)C_Filt

Table 1. Internal Resistance Values

Bidirectional Operation

The NCS21671 can be configured to monitor

unidirectional or bidirectional current flow.

Gain (V/V)

R

(kW)

R

(kW)

R (MW)

fb

filt

in

25

50

20

1

In unidirectional current sensing, the measured load

current always flows in the same direction. Common

applications for unidirectional operation include power

supplies and load current monitoring. The NCS21671 can be

set up for unidirectional monitoring by connecting the REF

pin to ground. In this configuration, the IN+ pin should be

connected to the high side of the sense resistor, while the IN−

pin should be connected to the low side of the sense resistor.

Bidirectional current sensing measures current flow in

both directions. A common application for bidirectional

current sensing is battery monitoring. While the battery is

charging, current flows in one direction; while the battery is

being used, current flows in the other direction. For

bidirectional current flow, the REF pin can be connected to a

voltage between GND and the Vs supply. Typically, the REF

10

5

10

5

100

200

2.5

The internal filter resistance has a tolerance of 25%.

If the filtering capacitor is not used, Cin+ and Cin− pins

should be left floating.

As shunt resistors decrease in value, shunt inductance can

significantly affect frequency response. At values below

1 mW, the shunt inductance causes a zero in the transfer

function that often results in corner frequencies in the low

100’s of kHz. This inductance increases the amplitude of

high frequency spike transient events on the current sensing

www.onsemi.com

13

NCS21671, NCV21671

line that can overload the front end of any shunt current

sensing IC.

For the most accurate measurements, use four terminal

current sense resistors. It provides two terminals for the

current path in the application circuit, and a second pair for

the voltage detection path of the sense amplifier. This

technique is also known as Kelvin Sensing. This ensures that

the voltage measured by the sense amplifier is the actual

voltage across the resistor and does not include the small

resistance of a combined connection. When using

non−Kelvin shunts, follow manufacturer recommendations

on how to lay out the sensing traces closely.

This problem must be solved by filtering at the input of the

amplifier. Note that all current sensing ICs are vulnerable to

this problem, regardless of manufacturer claims. Filtering is

required at the input of the device to resolve this problem,

even if the spike frequencies are above the rated bandwidth

of the device.

Ideally, select the capacitor to exactly match the time

constant of the shunt resistor and its inductance;

alternatively, select the capacitor to provide a pole below

that point. Make the input filter time constant equal to or

larger than the shunt and its inductance time constant:

Gain Options

The gain is set by integrated, precision, ratio−matched

resistors. The NCS21671 is available in gain options of

25 V/V, 50 V/V, 100 V/V, and 200 V/V. Adding external

resistors to adjust the gain can contribute to the overall

system error and is not recommended.

L_SHUNT

R_SHUNT

v R_FILTC_FILT

(eq. 2)

Selecting the Shunt Resistor

.

P_D≈ V_in(I_GND@I_out) ) I_out(V_in* V_out

)

The desired accuracy of the current measurement

determines the precision, shunt size, and the resistor value.

The larger the resistor value, the more accurate the

measurement possible, but a large resistor value also results

in greater current loss.

(eq. 3)

P_D(MAX)) (V_out@ I_out

)

V_in(MAX)

≈

(eq. 4)

I

_out) I_GND

ORDERING INFORMATION

†

Device

Channels

Package

Gain

OPN

Marking

Shipping

INDUSTRIAL AND CONSUMER

Filter

Pins

Package

GAIN

25

Enable

Part Number

Marking

AAC(M)

\A/(YW)

R(YW)

G025

Shipping

SC70−6

No

NCS21671SQ025T2G

NCS21671SQ050T2G

NCS21671SQ100T2G

NCS21671SQ200T2G

NCS21671DM025R2G

NCS21671DM050R2G

NCS21671DM100R2G

NCS21671DM200R2G

Tape and Reel

3000 / Reel

50

100

200

25

Micro10

Yes

Tape and Reel

4000 / Reel

50

G050

100

200

G100

G200

AUTOMOTIVE GRADE1 QUALIFIED

Filter

Pins

Package

GAIN

25

Enable

Part Number

Marking

AAC(M)

\A/(YW)

R(YW)

G025

Shipping

SC70−6

No

NCV21671SQ025T2G

NCV21671SQ050T2G

NCV21671SQ100T2G

NCV21671SQ200T2G

NCV21671DM025R2G

NCV21671DM050R2G

NCV21671DM100R2G

NCV21671DM200R2G

Tape and Reel

3000 / Reel

50

100

200

25

Micro10

Yes

Tape and Reel

4000 / Reel

50

G050

100

200

G100

G200

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP

Capable.

www.onsemi.com

14

NCS21671, NCV21671

PACKAGE DIMENSIONS

SC−88/SC70−6/SOT−363

CASE 419B−02

ISSUE Y

2X

aaa H D

NOTES:

D

H

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

A

3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,

PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-

SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.

4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF

THE PLASTIC BODY AND DATUM H.

5. DATUMS A AND B ARE DETERMINED AT DATUM H.

6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE

LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.

7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.

ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN

EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-

TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OF THE FOOT.

D

GAGE

PLANE

6

1

5

2

4

3

L

L2

E1

E

DETAIL A

aaa C

2X

2X 3 TIPS

bbb H D

e

MILLIMETERS

DIM MIN NOM MAX

−−−

INCHES

MIN

−−−

NOM MAX

−−− 0.043

−−− 0.004

6X b

B

TOP VIEW

A

−−−

1.10

A1 0.00

A2 0.70

0.10 0.000

M

ddd

C A-B D

0.90

0.20

0.15

2.00

2.10

1.25

0.65 BSC

0.36

1.00 0.027 0.035 0.039

0.25 0.006 0.008 0.010

0.22 0.003 0.006 0.009

2.20 0.070 0.078 0.086

2.20 0.078 0.082 0.086

1.35 0.045 0.049 0.053

0.026 BSC

b

C

D

E

0.15

0.08

1.80

2.00

A2

DETAIL A

A

E1 1.15

e

L

0.26

0.46 0.010 0.014 0.018

0.006 BSC

L2

0.15 BSC

0.15

aaa

bbb

ccc

ddd

0.006

0.012

0.004

0.30

0.10

6X

ccc C

A1

SEATING

PLANE

c

C

SIDE VIEW

END VIEW

RECOMMENDED

SOLDERING FOOTPRINT*

6X

0.30

6X

0.66

2.50

0.65

PITCH

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy

and soldering details, please download the

onsemi Soldering and Mounting

Techniques Reference Manual, SOLDERRM/D.

STYLES ON PAGE 2

www.onsemi.com

15

NCS21671, NCV21671

SC−88/SC70−6/SOT−363

CASE 419B−02

ISSUE Y

STYLE 1:

PIN 1. EMITTER 2

2. BASE 2

STYLE 2:

CANCELLED

STYLE 3:

CANCELLED

STYLE 4:

STYLE 5:

STYLE 6:

PIN 1. ANODE 2

2. N/C

PIN 1. CATHODE

2. CATHODE

3. COLLECTOR

4. EMITTER

5. BASE

PIN 1. ANODE

2. ANODE

3. COLLECTOR 1

4. EMITTER 1

5. BASE 1

3. COLLECTOR

3. CATHODE 1

4. ANODE 1

5. N/C

4. EMITTER

5. BASE

6. COLLECTOR 2

6. ANODE

6. CATHODE

6. CATHODE 2

STYLE 7:

STYLE 8:

CANCELLED

STYLE 9:

STYLE 10:

STYLE 11:

STYLE 12:

PIN 1. SOURCE 2

2. DRAIN 2

3. GATE 1

PIN 1. EMITTER 2

2. EMITTER 1

3. COLLECTOR 1

4. BASE 1

PIN 1. SOURCE 2

2. SOURCE 1

3. GATE 1

PIN 1. CATHODE 2

2. CATHODE 2

3. ANODE 1

PIN 1. ANODE 2

2. ANODE 2

3. CATHODE 1

4. ANODE 1

5. ANODE 1

6. CATHODE 2

4. SOURCE 1

5. DRAIN 1

6. GATE 2

4. DRAIN 1

5. DRAIN 2

6. GATE 2

4. CATHODE 1

5. CATHODE 1

6. ANODE 2

5. BASE 2

6. COLLECTOR 2

STYLE 13:

PIN 1. ANODE

2. N/C

STYLE 14:

PIN 1. VREF

2. GND

STYLE 15:

STYLE 16:

STYLE 17:

STYLE 18:

PIN 1. VIN1

2. VCC

PIN 1. ANODE 1

2. ANODE 2

PIN 1. BASE 1

2. EMITTER 2

3. COLLECTOR 2

4. BASE 2

PIN 1. BASE 1

2. EMITTER 1

3. COLLECTOR 2

4. BASE 2

3. COLLECTOR

4. EMITTER

5. BASE

3. GND

3. ANODE 3

3. VOUT2

4. VIN2

5. GND

6. VOUT1

4. IOUT

5. VEN

6. VCC

4. CATHODE 3

5. CATHODE 2

6. CATHODE 1

5. EMITTER 1

6. COLLECTOR 1

5. EMITTER 2

6. COLLECTOR 1

6. CATHODE

STYLE 19:

PIN 1. I OUT

2. GND

STYLE 20:

STYLE 21:

PIN 1. ANODE 1

2. N/C

STYLE 22:

PIN 1. D1 (i)

2. GND

STYLE 23:

PIN 1. Vn

2. CH1

3. Vp

STYLE 24:

PIN 1. CATHODE

2. ANODE

PIN 1. COLLECTOR

2. COLLECTOR

3. BASE

3. GND

3. ANODE 2

4. CATHODE 2

5. N/C

3. D2 (i)

3. CATHODE

4. CATHODE

5. CATHODE

6. CATHODE

4. V CC

4. EMITTER

5. COLLECTOR

6. COLLECTOR

4. D2 (c)

5. VBUS

6. D1 (c)

4. N/C

5. V EN

5. CH2

6. N/C

6. V REF

6. CATHODE 1

STYLE 30:

STYLE 25:

STYLE 26:

PIN 1. SOURCE 1

2. GATE 1

STYLE 27:

PIN 1. BASE 2

2. BASE 1

STYLE 28:

PIN 1. DRAIN

2. DRAIN

3. GATE

STYLE 29:

PIN 1. ANODE

2. ANODE

PIN 1. SOURCE 1

2. DRAIN 2

3. DRAIN 2

4. SOURCE 2

5. GATE 1

PIN 1. BASE 1

2. CATHODE

3. COLLECTOR 2

4. BASE 2

3. DRAIN 2

4. SOURCE 2

5. GATE 2

3. COLLECTOR 1

4. EMITTER 1

5. EMITTER 2

6. COLLECTOR 2

3. COLLECTOR

4. EMITTER

5. BASE/ANODE

6. CATHODE

4. SOURCE

5. DRAIN

6. DRAIN

5. EMITTER

6. COLLECTOR 1

6. DRAIN 1

Note: Please refer to datasheet for

style callout. If style type is not called

out in the datasheet refer to the device

datasheet pinout or pin assignment.

www.onsemi.com

16

NCS21671, NCV21671

Micro10

CASE 846B−03

ISSUE D

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION “A” DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE

BURRS SHALL NOT EXCEED 0.15 (0.006)

PER SIDE.

−A−

4. DIMENSION “B” DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION

SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. 846B−01 OBSOLETE. NEW STANDARD

846B−02

−B−

K

G

MILLIMETERS

INCHES

PIN 1 ID

D 8 PL

DIM MIN

MAX

3.10

MIN

MAX

0.122

0.043

0.012

M

S

A

0.08 (0.003)

T B

A

B

C

D

G

H

J

2.90

0.95

0.20

0.114

1.10 0.037

0.30 0.008

0.50 BSC

0.020 BSC

0.05

0.10

4.75

0.40

0.15 0.002

0.21 0.004

5.05 0.187

0.70 0.016

0.006

0.008

0.199

0.028

K

L

C

0.038 (0.0015)

−T−

SEATING

PLANE

L

H

J

SOLDERING FOOTPRINT

1.04

0.041

0.32

0.0126

10X

3.20

4.24

5.28

0.126

0.167 0.208

0.50

mm

inches

ǒ

Ǔ

^8X0.0196

SCALE 8:1

Micro10

onsemi,

, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates

and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.

A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any

products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the

information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use

of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products

and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information

provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may

vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license

under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems

or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should

Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

Email Requests to: orderlit@onsemi.com

TECHNICAL SUPPORT

North American Technical Support:

Voice Mail: 1 800−282−9855 Toll Free USA/Canada

Phone: 011 421 33 790 2910

Europe, Middle East and Africa Technical Support:

Phone: 00421 33 790 2910

For additional information, please contact your local Sales Representative

onsemi Website: www.onsemi.com

◊

www.onsemi.com

17

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

SC−88/SC70−6/SOT−363

CASE 419B−02

ISSUE Y

1

DATE 11 DEC 2012

SCALE 2:1

2X

aaa H

D

NOTES:

D

H

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

A

3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,

PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-

SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.

4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF

THE PLASTIC BODY AND DATUM H.

5. DATUMS A AND B ARE DETERMINED AT DATUM H.

6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE

LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.

7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.

ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN

EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-

TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OF THE FOOT.

D

GAGE

PLANE

6

1

5

2

4

3

L

L2

E1

E

DETAIL A

aaa

C

2X

2X 3 TIPS

bbb H

D

e

MILLIMETERS

DIM MIN NOM MAX

−−−

INCHES

MIN

−−−

NOM MAX

−−− 0.043

−−− 0.004

6X b

B

TOP VIEW

A

−−−

1.10

A1 0.00

A2 0.70

0.10 0.000

M

ddd

C A-B D

0.90

0.20

0.15

2.00

2.10

1.25

0.65 BSC

0.36

1.00 0.027 0.035 0.039

0.25 0.006 0.008 0.010

0.22 0.003 0.006 0.009

2.20 0.070 0.078 0.086

2.20 0.078 0.082 0.086

1.35 0.045 0.049 0.053

0.026 BSC

b

C

D

E

0.15

0.08

1.80

2.00

A2

DETAIL A

A

E1 1.15

e

L

0.26

0.46 0.010 0.014 0.018

0.006 BSC

L2

0.15 BSC

0.15

aaa

bbb

ccc

ddd

0.006

0.012

0.004

0.30

0.10

6X

ccc C

A1

SEATING

PLANE

c

C

SIDE VIEW

END VIEW

GENERIC

MARKING DIAGRAM*

RECOMMENDED

SOLDERING FOOTPRINT*

6

6X

0.30

XXXMG

6X

0.66

G

1

2.50

XXX = Specific Device Code

M

= Date Code*

G

= Pb−Free Package

0.65

(Note: Microdot may be in either location)

PITCH

*Date Code orientation and/or position may

vary depending upon manufacturing location.

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “G”, may

or may not be present. Some products may

not follow the Generic Marking.

STYLES ON PAGE 2

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DOCUMENT NUMBER:

DESCRIPTION:

98ASB42985B

SC−88/SC70−6/SOT−363

PAGE 1 OF 2

onsemi and

are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves

the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular

purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation

special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.

www.onsemi.com

SC−88/SC70−6/SOT−363

CASE 419B−02

ISSUE Y

DATE 11 DEC 2012

STYLE 1:

PIN 1. EMITTER 2

2. BASE 2

STYLE 2:

CANCELLED

STYLE 3:

CANCELLED

STYLE 4:

STYLE 5:

STYLE 6:

PIN 1. ANODE 2

2. N/C

PIN 1. CATHODE

2. CATHODE

3. COLLECTOR

4. EMITTER

5. BASE

PIN 1. ANODE

2. ANODE

3. COLLECTOR 1

4. EMITTER 1

5. BASE 1

3. COLLECTOR

3. CATHODE 1

4. ANODE 1

5. N/C

4. EMITTER

5. BASE

6. COLLECTOR 2

6. ANODE

6. CATHODE

6. CATHODE 2

STYLE 7:

STYLE 8:

CANCELLED

STYLE 9:

STYLE 10:

STYLE 11:

STYLE 12:

PIN 1. SOURCE 2

2. DRAIN 2

3. GATE 1

PIN 1. EMITTER 2

2. EMITTER 1

3. COLLECTOR 1

4. BASE 1

PIN 1. SOURCE 2

2. SOURCE 1

3. GATE 1

PIN 1. CATHODE 2

2. CATHODE 2

3. ANODE 1

PIN 1. ANODE 2

2. ANODE 2

3. CATHODE 1

4. ANODE 1

5. ANODE 1

6. CATHODE 2

4. SOURCE 1

5. DRAIN 1

6. GATE 2

4. DRAIN 1

5. DRAIN 2

6. GATE 2

4. CATHODE 1

5. CATHODE 1

6. ANODE 2

5. BASE 2

6. COLLECTOR 2

STYLE 13:

PIN 1. ANODE

2. N/C

STYLE 14:

PIN 1. VREF

2. GND

STYLE 15:

STYLE 16:

STYLE 17:

STYLE 18:

PIN 1. VIN1

2. VCC

PIN 1. ANODE 1

2. ANODE 2

PIN 1. BASE 1

2. EMITTER 2

3. COLLECTOR 2

4. BASE 2

PIN 1. BASE 1

2. EMITTER 1

3. COLLECTOR 2

4. BASE 2

3. COLLECTOR

4. EMITTER

5. BASE

3. GND

3. ANODE 3

3. VOUT2

4. VIN2

5. GND

6. VOUT1

4. IOUT

5. VEN

6. VCC

4. CATHODE 3

5. CATHODE 2

6. CATHODE 1

5. EMITTER 1

6. COLLECTOR 1

5. EMITTER 2

6. COLLECTOR 1

6. CATHODE

STYLE 19:

PIN 1. I OUT

2. GND

STYLE 20:

STYLE 21:

PIN 1. ANODE 1

2. N/C

STYLE 22:

PIN 1. D1 (i)

2. GND

STYLE 23:

PIN 1. Vn

2. CH1

3. Vp

STYLE 24:

PIN 1. CATHODE

2. ANODE

PIN 1. COLLECTOR

2. COLLECTOR

3. BASE

3. GND

3. ANODE 2

4. CATHODE 2

5. N/C

3. D2 (i)

3. CATHODE

4. CATHODE

5. CATHODE

6. CATHODE

4. V CC

4. EMITTER

5. COLLECTOR

6. COLLECTOR

4. D2 (c)

5. VBUS

6. D1 (c)

4. N/C

5. V EN

5. CH2

6. N/C

6. V REF

6. CATHODE 1

STYLE 30:

STYLE 25:

STYLE 26:

PIN 1. SOURCE 1

2. GATE 1

STYLE 27:

PIN 1. BASE 2

2. BASE 1

STYLE 28:

PIN 1. DRAIN

2. DRAIN

3. GATE

STYLE 29:

PIN 1. ANODE

2. ANODE

PIN 1. SOURCE 1

2. DRAIN 2

3. DRAIN 2

4. SOURCE 2

5. GATE 1

PIN 1. BASE 1

2. CATHODE

3. COLLECTOR 2

4. BASE 2

3. DRAIN 2

4. SOURCE 2

5. GATE 2

3. COLLECTOR 1

4. EMITTER 1

5. EMITTER 2

6. COLLECTOR 2

3. COLLECTOR

4. EMITTER

5. BASE/ANODE

6. CATHODE

4. SOURCE

5. DRAIN

6. DRAIN

5. EMITTER

6. COLLECTOR 1

6. DRAIN 1

Note: Please refer to datasheet for

style callout. If style type is not called

out in the datasheet refer to the device

datasheet pinout or pin assignment.

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DOCUMENT NUMBER:

DESCRIPTION:

98ASB42985B

SC−88/SC70−6/SOT−363

PAGE 2 OF 2

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are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves

the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular

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MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

Micro10

CASE 846B−03

ISSUE D

DATE 07 DEC 2004

SCALE 2:1

NOTES:

−A−

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION “A” DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE

BURRS SHALL NOT EXCEED 0.15 (0.006)

PER SIDE.

4. DIMENSION “B” DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION

SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. 846B−01 OBSOLETE. NEW STANDARD

846B−02

−B−

K

G

PIN 1 ID

D 8 PL

M

S

A

0.08 (0.003)

T B

MILLIMETERS

INCHES

DIM MIN

MAX

3.10

1.10

0.30

MIN

MAX

0.122

0.043

0.012

C

0.038 (0.0015)

A

B

C

D

G

H

J

2.90

0.95

0.20

0.114

0.037

0.008

−T−

SEATING

PLANE

L

H

J

0.50 BSC

0.020 BSC

0.05

0.10

4.75

0.40

0.15

0.21

5.05

0.70

0.002

0.004

0.187

0.016

0.006

0.008

0.199

0.028

SOLDERING FOOTPRINT

K

L

1.04

0.041

0.32

0.0126

10X

GENERIC

MARKING DIAGRAM*

xxxx

AYW

3.20

0.126

4.24

0.167 0.208

5.28

xxxx

= Device Code

= Assembly Location

= Year

= Work Week

= Pb−Free Package

A

Y

W

G

0.50

mm

inches

ǒ

Ǔ

^8X0.0196

SCALE 8:1

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “G”, may

or may not be present. Some products may

not follow the Generic Marking.

Micro10

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DOCUMENT NUMBER:

DESCRIPTION:

98AON03799D

Micro10

PAGE 1 OF 1