NCV33202DMR2G [ONSEMI]
Low Voltage, Rail-to-Rail Operational Amplifiers;
| 型号： | NCV33202DMR2G |
| 厂家： | 
ONSEMI |
| 描述： | Low Voltage, Rail-to-Rail Operational Amplifiers 放大器 光电二极管 |
| 文件： | 总17页 (文件大小：258K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC33201, MC33202,
MC33204, NCV33201,
NCV33202, NCV33204
Low Voltage, Rail-to-Rail
Operational Amplifiers
www.onsemi.com
The MC33201/2/4 family of operational amplifiers provide
rail−to−rail operation on both the input and output. The inputs can be
driven as high as 200 mV beyond the supply rails without phase
reversal on the outputs, and the output can swing within 50 mV of each
rail. This rail−to−rail operation enables the user to make full use of the
supply voltage range available. It is designed to work at very low
supply voltages ( 0.9 V) yet can operate with a supply of up to +12 V
and ground. Output current boosting techniques provide a high output
current capability while keeping the drain current of the amplifier to a
minimum. Also, the combination of low noise and distortion with a
high slew rate and drive capability make this an ideal amplifier for
audio applications.
PDIP−8
P, VP SUFFIX
CASE 626
8
1
SOIC−8
D, VD SUFFIX
CASE 751
8
1
Micro8]
DM SUFFIX
CASE 846A
Features
8
• Low Voltage, Single Supply Operation
(+1.8 V and Ground to +12 V and Ground)
• Input Voltage Range Includes both Supply Rails
1
• Output Voltage Swings within 50 mV of both Rails
PDIP−14
P, VP SUFFIX
CASE 646
• No Phase Reversal on the Output for Over−driven Input Signals
• High Output Current (I = 80 mA, Typ)
SC
14
• Low Supply Current (I = 0.9 mA, Typ)
D
1
• 600 W Output Drive Capability
• Extended Operating Temperature Ranges
(−40° to +105°C and −55° to +125°C)
• Typical Gain Bandwidth Product = 2.2 MHz
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
SOIC−14
D, VD SUFFIX
CASE 751A
14
1
TSSOP−14
DTB SUFFIX
CASE 948G
14
• These Devices are Pb−Free and are RoHS Compliant
1
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 11 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
July, 2018 − Rev. 18
MC33201/D
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
PIN CONNECTIONS
MC33201
MC33204
All Case Styles
All Case Styles
Output 1
Inputs 1
1
2
3
4
5
6
7
14 Output 4
1
2
3
4
8
7
6
5
NC
V
NC
13
Inputs 4
12
1
2
4
3
CC
Inputs
Output
NC
V
CC
11
10
9
V
EE
V
EE
Inputs 2
Output 2
Inputs 3
Output 3
(Top View)
8
MC33202
All Case Styles
(Top View)
Output 1
1
2
3
4
8
7
6
5
V
CC
Output 2
1
Inputs 1
Inputs 2
2
V
EE
(Top View)
V
CC
V
CC
V
EE
V
CC
V
inꢀ-
V
out
V
CC
V
inꢀ+
V
EE
This device contains 70 active transistors (each amplifier).
Figure 1. Circuit Schematic
(Each Amplifier)
www.onsemi.com
2
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
MAXIMUM RATINGS
Rating
Symbol
Value
+13
Unit
V
Supply Voltage (V to V
)
V
S
CC
EE
Input Differential Voltage Range
V
IDR
Note 1
V
Common Mode Input Voltage Range (Note 2)
V
CM
V
CC
+ 0.5 V to
V
V
EE
− 0.5 V
Output Short Circuit Duration
Maximum Junction Temperature
Storage Temperature
t
Note 3
+150
sec
°C
s
T
J
T
stg
− 65 to +150
°C
Maximum Power Dissipation
P
D
Note 3
mW
DC ELECTRICAL CHARACTERISTICS (T = 25°C)
A
Characteristic
V
CC
= 2.0 V
V
CC
= 3.3 V
V = 5.0 V
CC
Unit
Input Offset Voltage
mV
V
IO (max)
MC33201, NCV33201V
MC33202, NCV33202, V
MC33204, NCV33204, V
8.0
10
12
8.0
10
12
6.0
8.0
10
Output Voltage Swing
V
OH
V
OL
(R = 10 kW)
(R = 10 kW)
L
1.9
0.10
3.15
0.15
4.85
0.15
V
V
L
min
max
Power Supply Current
per Amplifier (I )
mA
1.125
1.125
1.125
D
Specifications at V = 3.3 V are guaranteed by the 2.0 V and 5.0 V tests. V = GND.
CC
EE
DC ELECTRICAL CHARACTERISTICS (V = + 5.0 V, V = Ground, T = 25°C, unless otherwise noted.)
CC
EE
A
Characteristic
Figure
Symbol
⎮V
Min
Typ
Max
Unit
Input Offset Voltage (V
0 V to 0.5 V, V
1.0 V to 5.0 V)
3
⎮
IO
mV
CM
CM
MC33201/NCV33201V:
MC33201:
T = + 25°C
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
6.0
9.0
13
8.0
11
14
10
13
17
A
T = − 40° to +105°C
A
MC33201V/NCV33201V: T = − 55° to +125°C
A
MC33202/NCV33202, V:
MC33202/NCV33202:
T = + 25°C
T = − 40° to +105°C
A
A
MC33202V/NCV33202V: T = − 55° to +125°C (Note 4)
A
MC33204/NCV33204V:
MC33204:
T = + 25°C
A
T = − 40° to +105°C
A
MC33204V/NCV33204V: T = − 55° to +125°C (Note 4)
A
Input Offset Voltage Temperature Coefficient (R = 50 W)
4
DV /DT
mV/°C
S
IO
T = − 40° to +105°C
−
−
2.0
2.0
−
−
A
T = − 55° to +125°C
A
Input Bias Current (V
= 0 V to 0.5 V, V
= 1.0 V to 5.0 V)
5, 6
⎮I ⎮
IB
nA
CM
CM
T = + 25°C
−
−
−
80
100
−
200
250
500
A
T = − 40° to +105°C
A
T = − 55° to +125°C
A
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The differential input voltage of each amplifier is limited by two internal parallel back−to−back diodes. For additional differential input voltage
range, use current limiting resistors in series with the input pins.
2. The input common mode voltage range is limited by internal diodes connected from the inputs to both supply rails. Therefore, the voltage
on either input must not exceed either supply rail by more than 500 mV.
3. Power dissipation must be considered to ensure maximum junction temperature (T ) is not exceeded. (See Figure 2)
J
4. All NCV devices are qualified for Automotive use.
www.onsemi.com
3
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
DC ELECTRICAL CHARACTERISTICS (cont.) (V = + 5.0 V, V = Ground, T = 25°C, unless otherwise noted.)
CC
EE
A
Characteristic
Figure
Symbol
⎮I
Min
Typ
Max
Unit
Input Offset Current (V
= 0 V to 0.5 V, V
= 1.0 V to 5.0 V)
−
⎮
IO
nA
CM
CM
T = + 25°C
−
−
−
5.0
10
−
50
100
200
A
T = − 40° to +105°C
A
T = − 55° to +125°C
A
Common Mode Input Voltage Range
−
V
ICR
V
EE
−
V
CC
V
Large Signal Voltage Gain (V = + 5.0 V, V = − 5.0 V)
7
A
VOL
kV/V
CC
EE
R = 10 kW
R = 600 W
L
50
25
300
250
−
−
L
Output Voltage Swing (V
=
0.2 V)
8, 9, 10
V
ID
R = 10 kW
V
V
4.85
−
4.75
−
4.95
0.05
4.85
0.15
−
0.15
−
L
OH
R = 10 kW
OL
L
V
OH
R = 600 W
L
V
0.25
R = 600 W
L
OL
Common Mode Rejection (V = 0 V to 5.0 V)
11
12
CMR
60
90
−
dB
in
Power Supply Rejection Ratio
PSRR
mV/V
V
/V = 5.0 V/GND to 3.0 V/GND
500
50
25
80
−
−
CC EE
Output Short Circuit Current (Source and Sink)
Power Supply Current per Amplifier (V = 0 V)
13, 14
15
I
mA
mA
SC
I
O
D
T = − 40° to +105°C
T = − 55° to +125°C
A
−
−
0.9
0.9
1.125
1.125
A
AC ELECTRICAL CHARACTERISTICS (V = + 5.0 V, V = Ground, T = 25°C, unless otherwise noted.)
CC
EE
A
Characteristic
Figure
Symbol
Min
Typ
Max
Unit
Slew Rate
(V
16, 26
SR
V/ms
=
2.5 V, V = − 2.0 V to + 2.0 V, R = 2.0 kW, A = +1.0)
0.5
−
1.0
2.2
12
65
90
28
−
−
−
−
−
−
S
O
L
V
Gain Bandwidth Product (f = 100 kHz)
Gain Margin (R = 600 W, C = 0 pF)
17
GBW
MHz
dB
20, 21, 22
20, 21, 22
23
A
−
L
L
M
M
Phase Margin (R = 600 W, C = 0 pF)
O
−
Deg
dB
L
L
Channel Separation (f = 1.0 Hz to 20 kHz, A = 100)
CS
BW
−
V
Power Bandwidth (V = 4.0 V , R = 600 W, THD ≤ 1 %)
−
kHz
%
O
pp
L
P
Total Harmonic Distortion (R = 600 W, V = 1.0 V , A = 1.0)
24
THD
L
O
pp
V
f = 1.0 kHz
f = 10 kHz
−
−
0.002
0.008
−
−
Open Loop Output Impedance
(V = 0 V, f = 2.0 MHz, A = 10)
⎮Z ⎮
W
O
−
−
−
100
200
8.0
−
−
−
O
V
Differential Input Resistance (V
= 0 V)
R
in
C
in
e
n
kW
CM
Differential Input Capacitance (V
= 0 V)
pF
CM
Equivalent Input Noise Voltage (R = 100 W)
25
25
S
nV/
Hz
f = 10 Hz
f = 1.0 kHz
−
−
25
20
−
−
Equivalent Input Noise Current
f = 10 Hz
i
n
pA/
Hz
−
−
0.8
0.2
−
−
f = 1.0 kHz
www.onsemi.com
4
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
2500
2000
1500
1000
500
40
360 amplifiers tested from
3 (MC33204) wafer lots
ꢁV = +ꢀ5.0 V
ꢁV = Gnd
EE
ꢁT = 25°C
A
ꢁDIP Package
8 and 14 Pin DIP Pkg
35
30
25
20
CC
TSSOP-14 Pkg
SO-14 Pkg
15
10
5.0
0
SOIC-8
Pkg
0
-ꢀ55 -ꢀ40 -ꢀ25
0
25
50
85
125
-10 -ꢀ8.0 -ꢀ6.0 -ꢀ4.0 -ꢀ2.0
0
2.0 4.0 6.0 8.0
10
T , AMBIENT TEMPERATURE (°C)
A
V , INPUT OFFSET VOLTAGE (mV)
IO
Figure 2. Maximum Power Dissipation
versus Temperature
Figure 3. Input Offset Voltage Distribution
50
40
30
20
200
160
120
80
V
V
= +ꢀ5.0 V
= Gnd
360 amplifiers tested from
3 (MC33204) wafer lots
ꢁV = +ꢀ5.0 V
ꢁV = Gnd
EE
ꢁT = 25°C
A
ꢁDIP Package
CC
EE
CC
V
CM
= 0 V to 0.5 V
V
CM
> 1.0 V
10
0
40
0
-ꢀ55
-ꢀ40 -ꢀ25
0
25
70
85
125
-ꢀ50 -ꢀ40 -ꢀ30 -ꢀ20 -10
0
10
20
30
40
50
m
, INPUT OFFSET VOLTAGE TEMPERATURE COEFFICIENT ( V/ C)
°
TC
V
IO
T , AMBIENT TEMPERATURE (°C)
A
Figure 4. Input Offset Voltage
Temperature Coefficient Distribution
Figure 5. Input Bias Current
versus Temperature
150
100
300
260
50
0
220
180
140
100
-ꢀ50
-100
-150
-ꢀ200
-ꢀ250
V
V
= +ꢀ5.0 V
= Gnd
CC
V
V
= 12 V
= Gnd
CC
EE
EE
R = 600 W
L
DV = 0.5 V to 4.5 V
T = 25°C
A
O
0
2.0
V
4.0
6.0
8.0
10
12
-ꢀ55 -ꢀ40 -ꢀ25
0
25
70
85
105 125
, INPUT COMMON MODE VOLTAGE (V)
T , AMBIENT TEMPERATURE (°C)
CM
A
Figure 6. Input Bias Current
versus Common Mode Voltage
Figure 7. Open Loop Voltage Gain versus
Temperature
www.onsemi.com
5
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
V
V
12
10
CC
R = 600 W
L
T = 25°C
A
T = -ꢀ55°C
A
T = 125°C
A
- 0.2 V
- 0.4 V
+ 0.4 V
+ 0.2 V
CC
T = 25°C
A
8.0
6.0
4.0
2.0
0
V
V
V
CC
EE
V
CC
V
EE
= +ꢀ5.0 V
= -ꢀ5.0 V
T = 25°C
A
EE
T = 125°C
A
T = -ꢀ55°C
A
V
EE
20
1.0
ꢀ2.0
ꢀ3.0
ꢀ4.0
ꢀ5.0
ꢀ6.0
0
5.0
10
I , LOAD CURRENT (mA)
15
V
CC
,⎮V ⎮ SUPPLY VOLTAGE (V)
EE
L
Figure 8. Output Voltage Swing
versus Supply Voltage
Figure 9. Output Saturation Voltage
versus Load Current
12
9.0
6.0
100
80
60
40
V
V
= +ꢀ6.0 V
= -ꢀ6.0 V
CC
EE
V
V
= +ꢀ6.0 V
= -ꢀ6.0 V
CC
R = 600 W
L
A = +1.0
T = 25°C
A
3.0
0
EE
20
0
V
T = -ꢀ55° to +125°C
A
10
1.0 k
10 k
100 k
1.0 M
100
1.0 k
10 k
100 k
1.0 M
f, FREQUENCY (Hz)
f, FREQUENCY (Hz)
Figure 10. Output Voltage
versus Frequency
Figure 11. Common Mode Rejection
versus Frequency
120
100
80
60
40
20
0
Source
100
80
60
40
20
0
PSR+
PSR-
Sink
V
CC
V
EE
= +ꢀ6.0 V
= -ꢀ6.0 V
V
V
= +ꢀ6.0 V
= -ꢀ6.0 V
CC
EE
T = 25°C
A
T = -ꢀ55° to +125°C
A
10
0
1.0
2.0
3.0
4.0
5.0
6.0
100
1.0 k
10 k
100 k
1.0 M
f, FREQUENCY (Hz)
⎮V ⎮, OUTPUT VOLTAGE (V)
out
Figure 12. Power Supply Rejection
versus Frequency
Figure 13. Output Short Circuit Current
versus Output Voltage
www.onsemi.com
6
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
2.0
1.6
150
125
V
CC
V
EE
= +ꢀ5.0 V
= Gnd
T = 125°C
100
75
50
25
0
A
Source
Sink
1.2
T = 25°C
A
0.8
T = -ꢀ55°C
A
0.4
0
-ꢀ55 -ꢀ40 -ꢀ25
0
25
70 85
105 125
ꢀ0
1.0
ꢀ2.0
ꢀ3.0
ꢀ4.0
ꢀ5.0
ꢀ6.0
T , AMBIENT TEMPERATURE (°C)
A
V
CC
, ⎮V ⎮, SUPPLY VOLTAGE (V)
EE
Figure 14. Output Short Circuit Current
versus Temperature
Figure 15. Supply Current per Amplifier
versus Supply Voltage with No Load
2.0
4.0
V
V
V
= +ꢀ2.5 V
= -ꢀ2.5 V
V
V
= +ꢀ2.5 V
= -ꢀ2.5 V
CC
EE
O
CC
EE
=
ꢀ2.0 V
f = 100 kHz
3.0
2.0
1.0
0
1.5
1.0
0.5
0
+Slew Rate
-Slew Rate
-ꢀ55 -ꢀ40 -ꢀ25
0
25
70 85
105 125
-ꢀ55 -ꢀ40 -ꢀ25
0
25
70 85
105 125
T , AMBIENT TEMPERATURE (°C)
A
T , AMBIENT TEMPERATURE (°C)
A
Figure 16. Slew Rate
versus Temperature
Figure 17. Gain Bandwidth Product
versus Temperature
70
50
40
80
70
50
40
80
V
=
ꢀ6.0 V
C = 0 pF
L
S
T = 25°C
A
R = 600 W
T = 25°C
A
R = 600 W
L
L
30
10
120
160
200
240
30
10
120
160
1A
1A
2A
2A
2B
1B
1A - Phase, C = 0 pF
L
1B - Gain, C = 0 pF
1A - Phase, V
1B - Gain, V
=
=
ꢀ6.0 V
ꢀ6.0 V
ꢀ1.0 V
ꢀ1.0 V
S
2B
1B
L
2A - Phase, C = 300 pF
=
-10
S
2A - Phase, V
2B - Gain, V
-10
200
240
L
2B - Gain, C = 300 pF
S
L
=
S
-ꢀ30
-ꢀ30
10 k
100 k
1.0 M
10 M
10 k
100 k
f, FREQUENCY (Hz)
1.0 M
10 M
f, FREQUENCY (Hz)
Figure 18. Voltage Gain and Phase
versus Frequency
Figure 19. Voltage Gain and Phase
versus Frequency
www.onsemi.com
7
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
70
60
50
40
30
20
10
0
70
60
50
40
30
20
10
0
75
60
75
60
Phase Margin
Phase Margin
V
V
= +ꢀ6.0 V
= -ꢀ6.0 V
T = 25°C
CC
45
30
45
30
15
V
V
= +ꢀ6.0 V
= -ꢀ6.0 V
CC
EE
EE
A
R = 600 W
L
C = 100 pF
L
15
0
Gain Margin
Gain Margin
0
100 k
-ꢀ55 -ꢀ40 -ꢀ25
0
25
70 85
105 125
10
100
1.0 k
10 k
T , AMBIENT TEMPERATURE (°C)
A
R , DIFFERENTIAL SOURCE RESISTANCE (W)
T
Figure 20. Gain and Phase Margin
versus Temperature
Figure 21. Gain and Phase Margin
versus Differential Source Resistance
80
70
60
50
40
30
20
10
0
16
14
12
10
8.0
6.0
4.0
2.0
0
150
V
V
= +ꢀ6.0 V
= -ꢀ6.0 V
CC
EE
A = 100
V
Phase Margin
Gain Margin
R = 600 W
L
A = 100
120
90
60
30
0
V
T = 25°C
A
A = 10
V
V
V
V
= +ꢀ6.0 V
= -ꢀ6.0 V
= 8.0 V
CC
EE
O
pp
T = 25°C
A
10
100
C , CAPACITIVE LOAD (pF)
1.0 k
100
1.0 k
f, FREQUENCY (Hz)
10 k
L
Figure 22. Gain and Phase Margin
versus Capacitive Load
Figure 23. Channel Separation
versus Frequency
10
50
40
5.0
4.0
V
= -ꢀ5.0 V
R = 600 W
V
= +ꢀ5.0 V
EE
V
V
= +ꢀ6.0 V
= -ꢀ6.0 V
CC
CC
EE
T = 25°C
L
A
V
O
= 2.0 V
pp
T = 25°C
A
1.0
A = 1000
V
30
20
10
3.0
2.0
1.0
0
A = 100
V
0.1
0.01
Noise Voltage
Noise Current
A = 10
V
A = 1.0
V
0
10
0.001
10
100
1.0 k
f, FREQUENCY (Hz)
10 k
100 k
100
1.0 k
f, FREQUENCY (Hz)
10 k
100 k
Figure 24. Total Harmonic Distortion
versus Frequency
Figure 25. Equivalent Input Noise Voltage
and Current versus Frequency
www.onsemi.com
8
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
DETAILED OPERATING DESCRIPTION
General Information
Circuit Information
The MC33201/2/4 family of operational amplifiers are
unique in their ability to swing rail−to−rail on both the input
and the output with a completely bipolar design. This offers
low noise, high output current capability and a wide
common mode input voltage range even with low supply
voltages. Operation is guaranteed over an extended
temperature range and at supply voltages of 2.0 V, 3.3 V and
5.0 V and ground.
Rail−to−rail performance is achieved at the input of the
amplifiers by using parallel NPN−PNP differential input
stages. When the inputs are within 800 mV of the negative
rail, the PNP stage is on. When the inputs are more than 800
mV greater than V , the NPN stage is on. This switching of
EE
input pairs will cause a reversal of input bias currents (see
Figure 6). Also, slight differences in offset voltage may be
noted between the NPN and PNP pairs. Cross−coupling
techniques have been used to keep this change to a minimum.
In addition to its rail−to−rail performance, the output stage
is current boosted to provide 80 mA of output current,
enabling the op amp to drive 600 W loads. Because of this
high output current capability, care should be taken not to
exceed the 150°C maximum junction temperature.
Since the common mode input voltage range extends from
V
CC
to V , it can be operated with either single or split
EE
voltage supplies. The MC33201/2/4 are guaranteed not to
latch or phase reverse over the entire common mode range,
however, the inputs should not be allowed to exceed
maximum ratings.
V
V
= +ꢀ6.0 V
= -ꢀ6.0 V
V
V
= +ꢀ6.0 V
= -ꢀ6.0 V
CC
CC
EE
EE
R = 600 W
L
C = 100 pF
R = 600 W
L
C = 100 pF
L
L
T = 25°C
A
T = 25°C
A
t, TIME (5.0 ms/DIV)
t, TIME (10 ms/DIV)
Figure 26. Noninverting Amplifier Slew Rate
Figure 27. Small Signal Transient Response
V
V
= +ꢀ6.0 V
= -ꢀ6.0 V
CC
EE
R = 600 W
L
C = 100 pF
L
A = 1.0
V
T = 25°C
A
t, TIME (10 ms/DIV)
Figure 28. Large Signal Transient Response
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self−align when subjected to a
solder reflow process.
www.onsemi.com
9
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
ORDERING INFORMATION
Operational
Amplifier Function
Device
Operating
Temperature Range
Package
†
Shipping
MC33201DG
SOIC−8
(Pb−Free)
98 Units / Rail
2500 / Tape & Reel
98 Units / Rail
T = −40° to +105°C
A
MC33201DR2G
MC33201VDG
Single
MC33201VDR2G
NCV33201VDR2G
MC33202DG
2500 / Tape & Reel
2500 / Tape & Reel
98 Units / Rail
T = −55° to 125°C
A
SOIC−8
(Pb−Free)
MC33202DR2G
MC33202DMR2G
NCV33202DMR2G*
MC33202VDG
2500 / Tape & Reel
T = −40 ° to +105°C
A
Micro−8
(Pb−Free)
4000 / Tape & Reel
98 Units / Rail
Dual
SOIC−8
(Pb−Free)
MC33202VDR2G
NCV33202VDR2G*
MC33204DG
T = −55° to 125°C
A
2500 / Tape & Reel
SO−14
55 Units / Rail
2500 Units / Tape & Reel
96 Units / Rail
(Pb−Free)
MC33204DR2G
MC33204DTBG
MC33204DTBR2G
MC33204VDG
T = −40 ° to +105°C
A
TSSOP−14
(Pb−Free)
2500 Units / Tape & Reel
55 Units / Rail
Quad
SO−14
(Pb−Free)
MC33204VDR2G
NCV33204DR2G*
NCV33204DTBR2G*
2500 Units / Tape & Reel
2500 Units / Tape & Reel
T = −55° to 125°C
A
TSSOP−14
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
www.onsemi.com
10
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
MARKING DIAGRAMS
PDIP−8
P SUFFIX
CASE 626
PDIP−8
VP SUFFIX
CASE 626
Micro−8
DM SUFFIX
CASE 846A
SOIC−8
D SUFFIX
CASE 751
SOIC−8
VD SUFFIX
CASE 751
SO−14
D SUFFIX
CASE 751A
8
1
8
1
8
1
8
8
14
**
*
3320x
ALYW
G
320xV
ALYW
G
MC3320xP
AWL
YYWWG
MC33202VP
AWL
3202
AYWG
G
MC33204DG
AWLYWW
YYWWG
1
1
1
SO−14
VD SUFFIX
CASE 751A
PDIP−14
P SUFFIX
CASE 646
PDIP−14
VP SUFFIX
CASE 646
TSSOP−14
DTB SUFFIX
CASE 948G
14
1
14
1
14
14
14
*
MC33204P
AWLYYWWG
MC33204VP
AWLYYWWG
MC33204VDG
AWLYWW
*
MC33
204
MC33
204V
ALYWG
ALYWG
1
G
G
1
1
x
= 1 or 2
A
= Assembly Location
WL, L = Wafer Lot
YY, Y
= Year
WW, W = Work Week
G
= Pb−Free Package
= Pb−Free Package
G
(Note: Microdot may be in either location)
*This marking diagram applies to NCV3320xV
**This marking diagram applies to NCV33202DMR2G
www.onsemi.com
11
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
PACKAGE DIMENSIONS
PDIP−8
P, VP SUFFIX
CASE 626−05
ISSUE N
NOTES:
D
A
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
E
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
H
8
5
4
E1
1
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
NOTE 8
c
b2
B
END VIEW
WITH LEADS CONSTRAINED
NOTE 5
TOP VIEW
INCHES
DIM MIN MAX
−−−−
A1 0.015
MILLIMETERS
A2
A
MIN
−−−
0.38
2.92
0.35
MAX
5.33
−−−
4.95
0.56
e/2
A
0.210
−−−−
NOTE 3
A2 0.115 0.195
L
b
b2
C
0.014 0.022
0.060 TYP
0.008 0.014
0.355 0.400
1.52 TYP
0.20
9.02
0.13
7.62
6.10
0.36
10.16
−−−
8.26
7.11
D
SEATING
PLANE
D1 0.005
0.300 0.325
E1 0.240 0.280
−−−−
A1
D1
E
C
M
e
eB
L
0.100 BSC
−−−− 0.430
0.115 0.150
−−−− 10°
2.54 BSC
−−−
2.92
−−−
10.92
3.81
10°
e
eB
8X
b
END VIEW
M
NOTE 6
M
M
M
B
0.010
C A
SIDE VIEW
www.onsemi.com
12
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
NOTES:
1. DIMENSIONING AND TOLERANCING PER
−X−
ANSI Y14.5M, 1982.
A
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
S
M
M
B
0.25 (0.010)
Y
1
K
−Y−
MILLIMETERS
DIM MIN MAX
INCHES
G
MIN
MAX
0.197
0.157
0.069
0.020
A
B
C
D
G
H
J
K
M
N
S
4.80
3.80
1.35
0.33
5.00 0.189
4.00 0.150
1.75 0.053
0.51 0.013
C
N X 45
_
SEATING
PLANE
1.27 BSC
0.050 BSC
−Z−
0.10
0.19
0.40
0
0.25 0.004
0.25 0.007
1.27 0.016
0.010
0.010
0.050
8
0.020
0.244
0.10 (0.004)
M
J
H
D
8
0
_
_
_
_
0.25
5.80
0.50 0.010
6.20 0.228
M
S
S
X
0.25 (0.010)
Z
Y
SOLDERING FOOTPRINT*
1.52
0.060
7.0
4.0
0.275
0.155
0.6
0.024
1.270
0.050
mm
inches
ǒ
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
13
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
PACKAGE DIMENSIONS
Micro8
DM SUFFIX
CASE 846A−02
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
D
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
H
E
E
MILLIMETERS
INCHES
NOM
−−
0.003
0.013
0.007
0.118
DIM
A
A1
b
c
D
MIN
−−
0.05
0.25
0.13
2.90
2.90
NOM
−−
MAX
MIN
−−
0.002
0.010
0.005
0.114
0.114
MAX
0.043
0.006
0.016
0.009
0.122
0.122
PIN 1 ID
1.10
0.15
0.40
0.23
3.10
3.10
e
0.08
b 8 PL
0.33
M
S
S
0.08 (0.003)
T
B
A
0.18
3.00
E
3.00
0.118
e
L
0.65 BSC
0.55
4.90
0.026 BSC
0.021
0.193
0.40
4.75
0.70
5.05
0.016
0.187
0.028
0.199
SEATING
PLANE
H
E
−T−
A
0.038 (0.0015)
L
A1
c
SOLDERING FOOTPRINT*
1.04
0.38
8X
8X 0.041
0.015
3.20
0.126
4.24
0.167 0.208
5.28
0.65
6X0.0256
SCALE 8:1
mm
inches
ǒ
Ǔ
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
14
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
PACKAGE DIMENSIONS
PDIP−14
CASE 646−06
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
D
2. CONTROLLING DIMENSION: INCHES.
A
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
14
8
E
H
E1
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
1
7
c
b2
NOTE 8
B
END VIEW
TOP VIEW
WITH LEADS CONSTRAINED
NOTE 5
A2
A
INCHES
DIM MIN MAX
−−−−
A1 0.015
MILLIMETERS
MIN
−−−
0.38
2.92
0.35
MAX
5.33
−−−
4.95
0.56
NOTE 3
A
0.210
−−−−
L
A2 0.115 0.195
b
b2
C
0.014 0.022
0.060 TYP
0.008 0.014
SEATING
PLANE
1.52 TYP
A1
D1
0.20
0.36
C
M
D
0.735 0.775 18.67 19.69
D1 0.005
0.300 0.325
E1 0.240 0.280
−−−−
0.13
7.62
6.10
−−−
8.26
7.11
E
eB
e
END VIEW
NOTE 6
14X
b
e
eB
L
0.100 BSC
−−−− 0.430
0.115 0.150
−−−− 10°
2.54 BSC
−−−
2.92
−−−
10.92
3.81
10°
M
M
M
B
0.010
C A
SIDE VIEW
M
www.onsemi.com
15
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE K
NOTES:
D
A
B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
14
8
7
A3
E
H
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
L
DETAIL A
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
13X b
M
M
B
0.25
A
A1
A3
b
D
E
1.35
0.10
0.19
0.35
8.55
3.80
1.75 0.054 0.068
0.25 0.004 0.010
0.25 0.008 0.010
0.49 0.014 0.019
8.75 0.337 0.344
4.00 0.150 0.157
M
S
S
B
0.25
C
A
DETAIL A
h
A
X 45
_
e
H
h
L
1.27 BSC
0.050 BSC
6.20 0.228 0.244
0.50 0.010 0.019
1.25 0.016 0.049
5.80
0.25
0.40
0
M
A1
e
M
7
0
7
_
_
_
_
SEATING
PLANE
C
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
16
MC33201, MC33202, MC33204, NCV33201, NCV33202, NCV33204
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE B
NOTES:
14X K REF
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
M
S
S
V
0.10 (0.004)
T
U
S
0.15 (0.006) T
U
N
0.25 (0.010)
14
8
2X L/2
M
B
L
N
−U−
PIN 1
IDENT.
F
7
1
DETAIL E
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
K
0.15 (0.006) T
U
A
−V−
K1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
A
B
C
D
F
G
H
J
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
J J1
1.20
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N−N
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
−W−
C
J1
K
0.10 (0.004)
K1 0.19
L
M
6.40 BSC
0.252 BSC
SEATING
−T−
H
G
DETAIL E
D
0
8
0
8
_
_
_
_
PLANE
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
01.34X6
14X
1.26
DIMENSIONS: MILLIMETERS
Micro8 is a trademark of International Rectifier.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
◊
MC33201/D
相关型号：
©2020 ICPDF网 联系我们和版权申明