NCV4274ADT33RKG [ONSEMI]
400 mA 2% and 4%Voltage Regulator Family; 400毫安2 ％和4 ％，电压稳压器系列
| 型号： | NCV4274ADT33RKG |
| 厂家： | 
ONSEMI |
| 描述： | 400 mA 2% and 4%Voltage Regulator Family |
| 文件： | 总16页 (文件大小：156K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCV4274, NCV4274A
400 mA 2% and 4%Voltage
Regulator Family
Description
The NCV4274 and NCV4274A is a precision micro−power voltage
regulator with an output current capability of 400 mA available in the
DPAK and D2PAK packages.
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The output voltage is accurate within ±2.0% or ±4.0% depending on
the version with a maximum dropout voltage of 0.5 V with an input up
to 40 V. Low quiescent current is a feature drawing only 150 mA with a
1 mA load. This part is ideal for automotive and all battery operated
microprocessor equipment.
The regulator is protected against reverse battery, short circuit, and
thermal overload conditions. The device can withstand load dump
transients making it suitable for use in automotive environments.
MARKING DIAGRAMS
4
74X−xxG
1
Input
ALYWW
2, 4 Ground
3 Output
x
DPAK
DT SUFFIX
CASE 369C
2
1
3
Features
• 2.5, 3.3 V, 5.0 V, ±2.0% and ±4.0% Output Options
• Low 150 mA Quiescent Current at 1 mA load current
• 400 mA Output Current Capability
• Fault Protection
• +60 V Peak Transient Voltage with Respect to GND
• −40 V Reverse Voltage
4
NC
V4274X−xx
AWLYWWG
1
2, 4 Ground
Output
Input
3
D2PAK
DS SUFFIX
CASE 936
• Short Circuit
• Thermal Overload
2
1
3
• Very Low Dropout Voltage
• Electrical Parameters Guaranteed Over Entire Temperature Range
• NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
• These are Pb−Free Devices
AYW
74X−xxG
SOT−223
ST SUFFIX
CASE 318E
1
X
= A or blank
xx
A
= Voltage Ratings
= Assembly Location
L, WL = Wafer Lot
Y
= Year
WW, W = Work Week
= Pb−Free Package
G
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 13 of this data sheet.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
December, 2006 − Rev. 7
NCV4274/D
NCV4274, NCV4274A
I
Q
Current Limit and
Saturation Sense
Bandgap
Refernece
−
+
Thermal
Shutdown
GND
Figure 1. Block Diagram
Pin Definitions and Functions
Pin No.
Symbol
Function
1
2,4
3
I
Input; Bypass directly at the IC a ceramic capacitor to GND.
Ground
GND
Q
Output; Bypass with a capacitor to GND.
1. DPAK 3LD package code 6025
2. D2PAK 3LD package code 6083
ABSOLUTE MAXIMUM RATINGS
Pin Symbol, Parameter
Symbol
Condition
Min
Max
Unit
V
I, Input−to−Regulator
Voltage
Current
V
−42
45
I
I
Internally
Limited
Internally
Limited
I
I, Input peak Transient Voltage to Regulator with Respect
V
60
V
V
I
to GND
Q, Regulated Output
Voltage
Current
V
−1.0
40
Q
I
Internally
Limited
Internally
Limited
Q
GND, Ground Current
I
−
100
mA
GND
Junction Temperature
Storage Temperature
T
Stg
−
−50
150
150
°C
°C
J
T
ESD Capability, Human Body Model
ESD Capability, Machine Model
ESD
4
200
1
kV
V
HB
ESD
MM
ESD Capability, Charged Device Model
ESD
kV
CDM
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. This device series incorporates ESD protection and is tested by the following methods:
ESD HBM tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD MM tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD CDM tested per EIA/JES D22/C101, Field Induced Charge Model
4. Latchup Current Maximum Rating: ≤ 150 mA per JEDEC standard: JESD78.
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2
NCV4274, NCV4274A
OPERATING RANGE
Parameter
Symbol
Condition
Min
5.5
Max
40
Unit
V
Input Voltage (5.0 V Version)
Input Voltage (3.3 V, and 2.5 V Version)
Junction Temperature
V
V
I
I
4.5
40
V
T
−40
150
°C
J
THERMAL RESISTANCE
Parameter
Symbol
Condition
Min
Max
Unit
Junction−to−Ambient
DPAK
R
thja
−
70
(Note 6)
°C/W
Junction−to−Ambient
D2PAK
R
thja
−
60
(Note 6)
°C/W
Junction−to−Case
Junction−to−Case
Junction−to−Tab
DPAK
D2PAK
R
R
−
−
−
4
3
°C/W
°C/W
°C/W
thjc
thjc
SOT−223
Y−JLX,
Y
14.5
(Note 7)
LX
Junction−to−Ambient
SOT−223
R , q
q
JA JA
−
169.7
(Note 7)
°C/W
2
5. Soldered in, 1 cm copper area at Pin 4, FR4
6. Soldered in, minimal footprint, FR4
2
7. 1 oz copper, 5 mm copper area, FR4
LEAD SOLDERING TEMPERATURE AND MSL
Parameter
Symbol
Condition
Min
Max
Unit
Lead Temperature Soldering, (Note 8)
Reflow (SMD styles only),
T
sld
°C
Pb
Pb−Free
60s − 150s Above 183s
30s Max at Peak
60s − 150s Above 217s
40s Max at Peak
−
−
240 pk
265 pk
Moisture Sensitivity Level
MSL
1
−
8. Per IPC/JEDEC J−STD−020C
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3
NCV4274, NCV4274A
ELECTRICAL CHARACTERISTICS NCV4274A and NCV4274 5.0 V
−40°C < T < 150°C; V = 13.5 V unless otherwise noted.
J
I
Min Typ
Max Min Typ
Max
NCV4274A
NCV4274
Parameter
Symbol
Test Conditions
Unit
REGULATOR
Output Voltage (5.0 V Version)
Output Voltage (5.0 V Version)
Output Voltage (3.3 V Version)
Output Voltage (3.3 V Version)
Output Voltage (2.5 V Version)
Output Voltage (2.5 V Version)
V
V
V
V
V
V
5 mA < I < 400 mA
4.9
4.9
5.0
5.0
5.1
5.1
4.8
4.8
5.0
5.0
5.2
5.2
3.43
3.43
2.6
2.6
−
V
V
Q
Q
Q
Q
Q
Q
Q
6V < V < 28 V
I
5 mA < I < 200 mA
Q
6 V < V < 40 V
I
5 mA < I < 400 mA
3.23 3.3
3.23 3.3
2.45 2.5
2.45 2.5
400 600
3.37 3.17 3.3
3.37 3.17 3.3
V
Q
4.5 V < V < 28 V
I
5 mA < I < 200 mA
V
Q
4.5 V < V < 40 V
I
5 mA < I < 400 mA
2.55
2.55
−
2.4
2.4
2.5
2.5
V
Q
4.5 V < V < 28 V
I
5 mA < I < 200 mA
V
Q
4.5 V < V < 40 V
I
Current Limit
I
−
400 600
mA
Q
Quiescent Current
I
I = 1 mA
q
q
V
V
V
= 5.0 V
= 3.3 V
= 2.5 V
−
−
−
190
145
140
250
250
250
−
−
−
190
145
140
250
250
250
mA
mA
mA
Q
Q
Q
I = 250 mA
q
V
V
V
= 5.0 V
= 3.3 V
= 2.5 V
−
−
−
10
13
12
15
20
15
−
−
−
10
13
12
15
20
15
mA
mA
mA
Q
Q
Q
I = 400 mA
q
V
V
V
= 5.0 V
= 3.3 V
= 2.5 V
−
−
−
20
30
28
35
45
35
−
−
−
20
30
28
35
45
35
mA
mA
mA
Q
Q
Q
Dropout Voltage
V
I = 250 mA,
Q
DR
V
= V − V
DR
I Q
5.0 V Version
3.3 V Version
2.5 V Version
V = 5.0 V
−
−
−
250
−
−
500
1.23
2.05
−
−
−
250
−
−
500
1.33
2.1
mV
V
V
I
V = 4.5 V
I
V = 4.5 V
I
Load Regulation
Line Regulation
DV
DV
I
= 5 mA to 400 mA
Q
−
−
7
20
25
−
−
7
30
25
mV
mV
Q
Q
DV = 12 V to 32 V
I
10
10
I
= 5 mA
Q
Power Supply Ripple Rejection
P
ƒr = 100 Hz,
V = 0.5 V
−
60
−
−
60
−
dB
SRR
r
PP
Temperature output voltage drift
dV /dT
Q
−
0.5
−
−
0.5
−
mV/K
Thermal Shutdown Temperature*
T
I
= 5 mA
150
−
210
150
−
210
°C
SD
Q
*Guaranteed by design, not tested in production
4.5 − 40 V
5.0 V
V
I
I
Q
I
V
Q
I
I
Q
1
3
1
3
NCV4274
NCV4274A
NCV4274
NCV4274A
C
C
C
C
C
Q
10 mF
11
1.0 mF
12
Q
I
Input
R
load
Output
100 nF
10 mF
or
22 mF
100 nF
V
Q
V
I
2,4
2,4
GND
GND
I
GND
Figure 2. Measuring Circuit
Figure 3. Application Circuit
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4
NCV4274, NCV4274A
TYPICAL CHARACTERISTIC CURVES
1000
100
10
V = 13.5 V
I
Maximum ESR
= 1 mF − 100 mF
C
OUT
Stable Region
1.0
Minimum ESR
= 1 mF
C
OUT
0.1
0
5
20 60 100 140 180 220
300 340 380 420
260
LOAD CURRENT (mA)
Figure 4. ESR Characterization
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5
NCV4274, NCV4274A
TYPICAL CHARACTERISTIC CURVES − 5.0 V Version
5.2
5.1
5.0
4.9
4.8
6
V = 13.5 V
R = 1 kW
L
R = 20 W
T = 25°C
J
I
L
5
4
3
2
1
0
−40
0
40
80
120
160
0
2
4
6
8
10
T (°C)
J
V (V)
I
Figure 5. Output Voltage vs. Junction Temperature
Figure 6. Output Voltage vs. Input Voltage
800
60
50
40
30
20
10
0
T = 25°C
T = 25°C
V = 13.5 V
I
J
J
V
= 0 V
Q
600
400
200
0
0
100
200
300
(mA)
400
500
600
0
10
20
30
40
50
I
V (V)
I
Q
Figure 7. Output Current vs. Input Voltage
Figure 8. Current Consumption vs. Output
Current (High Load)
1.6
1.4
1.2
1
600
500
400
300
200
100
T = 25°C
V = 13.5 V
I
J
T = 125°C
J
0.8
0.6
0.4
0.2
0
T = 25°C
J
0
0
100
200
300
400
0
10
20
30
40
50
60
I
(mA)
I
(mA)
Q
Q
Figure 9. Current Consumption vs. Output
Current (Low Load)
Figure 10. Drop Voltage vs. Output Current
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6
NCV4274, NCV4274A
TYPICAL CHARACTERISTIC CURVES − 5.0 V Version
40
30
20
10
0
6
R = 6.8 kW
4
2
L
R = 20 W
T = 25°C
J
L
T = 25°C
J
0
−2
−4
−6
−8
−10
−12
−14
−16
0
10
20
30
40
50
−50
−25
0
25
50
V (V)
I
V (V)
I
Figure 11. Current Consumption vs. Input Voltage
Figure 12. Input Current vs. Input Voltage
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7
NCV4274, NCV4274A
TYPICAL CHARACTERISTIC CURVES − 3.3 V Version
3.5
6
V = 6 V
R = 1 kW
L
R = 20 W
T = 25°C
J
I
L
5
3.4
3.3
3.2
3.1
4
3
2
1
0
3.0
2.9
0
1
2
3
4
5
6
−40
0
40
80
120
160
T (°C)
J
V (V)
I
Figure 13. Output Voltage vs. Junction
Temperature
Figure 14. Output Voltage vs. Input Voltage
800
60
50
40
30
20
T = 25°C
T = 25°C
J
J
V = 13.5 V
I
V
= 0 V
Q
600
400
200
0
10
0
0
10
20
30
40
50
0
100
200
300
400
500
600
I
(mA)
V (V)
I
Q
Figure 15. Output Current vs. Input Voltage
Figure 16. Current Consumption vs. Output
Current (High Load)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
1.26
1.24
1.22
1.20
1.18
T = 25°C
V = 13.5 V
I
J
T = 125°C
J
T = 25°C
J
V
= V
− V
I(min) Q
DR
1.16
1.14
0.2
0
0
100
200
(mA)
300
400
0
10
20
30
40
50
60
I
I
(mA)
Q
Q
Figure 17. Current Consumption vs. Output
Current (Low Load)
Figure 18. Voltage Drop vs. Output Current
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8
NCV4274, NCV4274A
TYPICAL CHARACTERISTIC CURVES − 3.3 V Version
7
6
5
4
3
2
4
2
0
R = 20 W
T = 25°C
J
L
−2
−4
−6
−8
−10
−12
−14
−16
R = 3.3 kW
L
1
0
T = 25°C
J
0
10
20
30
40
50
−50
−25
0
25
50
V (V)
I
V (V)
I
Figure 19. Current Consumption vs. Input Voltage
Figure 20. Input Current vs. Input Voltage
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9
NCV4274, NCV4274A
TYPICAL CHARACTERISTIC CURVES − 2.5 V Version
2.7
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
V = 6 V
R = 1 kW
L
I
2.6
2.5
2.4
2.3
2.2
2.1
0.5
0
0
1
2
3
4
5
6
−40
0
40
80
120
160
T (°C)
J
V (V)
I
Figure 21. Output Voltage vs. Junction
Temperature
Figure 22. Output Voltage vs. Input Voltage
800
60
50
40
30
20
T = 25°C
J
T = 25°C
J
V
= 0 V
Q
V = 13.5 V
I
600
400
200
0
10
0
0
10
20
30
40
50
0
100
200
300
400
500
600
I
(mA)
V (V)
I
Q
Figure 23. Output Current vs. Input Voltage
Figure 24. Current Consumption vs. Output
Current (High Load)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
2.05
2.04
2.03
2.02
2.01
2.00
1.99
1.98
1.97
T = 25°C
V = 13.5 V
I
J
T = 125°C
J
T = 25°C
J
V
= V
− V
DR
I(min) Q
0.2
0
1.96
1.95
0
100
200
300
400
0
10
20
30
40
50
60
I
(mA)
I
(mA)
Q
Q
Figure 25. Current Consumption vs. Output
Current (Low Load)
Figure 26. Voltage Drop vs. Output Current
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10
NCV4274, NCV4274A
TYPICAL CHARACTERISTIC CURVES − 2.5 V Version
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
2
R = 20 W
T = 25°C
J
L
0
−2
−4
−6
−8
−10
R = 3.3 kW
T = 25°C
J
L
−12
−14
0.5
0
0
10
20
30
40
50
−50
−25
0
25
50
V (V)
I
V (V)
I
Figure 27. Current Consumption vs. Input Voltage
Figure 28. Input Current vs. Input Voltage
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11
NCV4274, NCV4274A
APPLICATION DESCRIPTION
Output Regulator
Once the value of P
is known, the maximum
D(max)
The output is controlled by a precision trimmed reference
and error amplifier. The PNP output has saturation control
for regulation while the input voltage is low, preventing over
saturation. Current limit and voltage monitors complement
the regulator design to give safe operating signals to the
processor and control circuits.
permissible value of R
can be calculated:
qJA
ǒ
Ǔ
150 C * TA
(eq. 2)
PqJA
+
PD
The value of R
can then be compared with those in the
qJA
package section of the data sheet. Those packages with
R
’s less than the calculated value in Equation 2 will keep
qJA
Stability Considerations
The input capacitor C in Figure 2 is necessary for
compensating input line reactance. Possible oscillations
caused by input inductance and input capacitance can be
damped by using a resistor of approximately 1 W in series
the die temperature below 150°C. In some cases, none of the
packages will be sufficient to dissipate the heat generated by
the IC, and an external heat sink will be required. The current
flow and voltages are shown in the Measurement Circuit
Diagram.
I1
with C
I2.
The output or compensation capacitor helps determine
three main characteristics of a linear regulator: startup delay,
load transient response and loop stability.
The capacitor value and type should be based on cost,
availability, size and temperature constraints. The
aluminum electrolytic capacitor is the least expensive
solution, but, if the circuit operates at low temperatures
(−25°C to −40°C), both the value and ESR of the capacitor
will vary considerably. The capacitor manufacturer’s data
sheet usually provides this information.
Heat Sinks
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of R
:
qJA
R
qJA + RqJC ) RqCS ) RqSA
(eq. 3)
Where:
The value for the output capacitor C shown in Figure 2
Q
R
qJC
R
qCS
R
qSA
R
qJC
= the junction−to−case thermal resistance,
should work for most applications; however, it is not
necessarily the optimized solution. Stability is guaranteed at
= the case−to−heat sink thermal resistance, and
= the heat sink−to−ambient thermal resistance.
appears in the package section of the data sheet.
values C w 2.2 mF and an ESR v 2.5 W within the
Q
operating temperature range. Actual limits are shown in a
graph in the Typical Performance Characteristics section.
Like R , it too is a function of package type. R
and
qJA
qCS
R
are functions of the package type, heat sink and the
qSA
Calculating Power Dissipation in a Single Output
Linear Regulator
The maximum power dissipation for a single output
regulator (Figure 3) is:
interface between them. These values appear in data sheets
of heat sink manufacturers. Thermal, mounting, and
heat sinking are discussed in the ON Semiconductor
application note AN1040/D, available on the
ON Semiconductor Website.
P
D(max) + [VI(max) * VQ(min)]IQ(max) ) VI(max)Iq
(eq. 1)
Where:
V
V
I
is the maximum input voltage,
is the minimum output voltage,
is the maximum output current for the application,
I(max)
Q(min)
Q(max)
and
I is the quiescent current the regulator consumes at I
.
Q(max)
q
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NCV4274, NCV4274A
ORDERING INFORMATION4
Device
†
Output Voltage Accuracy
Output Voltage
Package
Shipping
NCV4274DS50G
4%
4%
4%
4%
2%
2%
2%
2%
4%
4%
2%
2%
4%
2%
5.0 V
D2PAK
50 Units / Rail
800 / Tape & Reel
75 Units / Rail
(Pb−Free)
NCV4274DS50R4G
NCV4274DT50G
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
3.3 V
3.3 V
3.3 V
3.3 V
2.5 V
2.5 V
D2PAK
(Pb−Free)
DPAK
(Pb−Free)
NCV4274DT50RKG
NCV4274ADS50G
NCV4274ADS50R4G
NCV4274ADT50G
NCV4274ADT50RKG
NCV4274ST33T3G
NCV4274DT33RKG
NCV4274AST33T3G
NCV4274ADT33RKG
NCV4274ST25T3G
NCV4274AST25T3G
DPAK
(Pb−Free)
2500 / Tape & Reel
50 Units / Rail
D2PAK
(Pb−Free)
D2PAK
(Pb−Free)
800 / Tape & Reel
75 Units / Rail
DPAK
(Pb−Free)
DPAK
(Pb−Free)
2500 / Tape & Reel
4000 / Tape & Reel
2500 / Tape & Reel
4000 / Tape & Reel
2500 / Tape & Reel
4000 / Tape & Reel
4000 / Tape & Reel
SOT−223
(Pb−Free)
DPAK
(Pb−Free)
SOT−223
(Pb−Free)
DPAK
(Pb−Free)
SOT−223
(Pb−Free)
SOT−223
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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13
NCV4274, NCV4274A
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
SEATING
PLANE
−T−
2. CONTROLLING DIMENSION: INCH.
C
B
R
INCHES
DIM MIN MAX
MILLIMETERS
E
V
MIN
5.97
6.35
2.19
0.69
0.46
0.94
MAX
6.22
6.73
2.38
0.88
0.58
1.14
A
B
C
D
E
F
G
H
J
0.235 0.245
0.250 0.265
0.086 0.094
0.027 0.035
0.018 0.023
0.037 0.045
0.180 BSC
0.034 0.040
0.018 0.023
0.102 0.114
0.090 BSC
4
2
Z
A
K
S
1
3
4.58 BSC
U
0.87
0.46
2.60
1.01
0.58
2.89
K
L
2.29 BSC
F
J
R
S
U
V
Z
0.180 0.215
0.025 0.040
4.57
0.63
0.51
0.89
3.93
5.45
1.01
−−−
1.27
−−−
L
H
0.020
0.035 0.050
0.155 −−−
−−−
D 2 PL
M
G
0.13 (0.005)
T
SOLDERING FOOTPRINT*
6.20
0.244
3.0
0.118
2.58
0.101
5.80
0.228
1.6
0.063
6.172
0.243
mm
inches
ǒ
Ǔ
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
14
NCV4274, NCV4274A
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
D
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
b1
MILLIMETERS
INCHES
NOM
0.064
0.002
0.030
0.121
0.012
0.256
0.138
0.091
0.037
0.069
0.276
−
4
2
DIM
A
A1
b
b1
c
D
E
e
e1
L1
MIN
1.50
0.02
0.60
2.90
0.24
6.30
3.30
2.20
0.85
1.50
6.70
0°
NOM
1.63
0.06
0.75
3.06
0.29
6.50
3.50
2.30
0.94
1.75
7.00
−
MAX
1.75
0.10
0.89
3.20
0.35
6.70
3.70
2.40
1.05
2.00
7.30
10°
MIN
0.060
0.001
0.024
0.115
0.009
0.249
0.130
0.087
0.033
0.060
0.264
0°
MAX
0.068
0.004
0.035
0.126
0.014
0.263
0.145
0.094
0.041
0.078
0.287
10°
H
E
E
1
3
b
e1
e
H
E
C
q
q
A
0.08 (0003)
A1
L1
SOLDERING FOOTPRINT
3.8
0.15
2.0
0.079
6.3
0.248
2.3
0.091
2.3
0.091
2.0
0.079
mm
inches
1.5
0.059
ǒ
Ǔ
SCALE 6:1
http://onsemi.com
15
NCV4274, NCV4274A
PACKAGE DIMENSIONS
D2PAK
CASE 936−03
ISSUE B
NOTES:
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
5. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
6. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
7. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
TERMINAL 4
−T−
OPTIONAL
CHAMFER
K
E
A
U
S
V
B
H
F
INCHES
DIM MIN MAX
0.403 9.804 10.236
MILLIMETERS
1
2
3
MIN MAX
M
L
A
B
C
D
E
F
0.386
0.356
0.170
0.026
0.045
0.368 9.042
0.180 4.318
0.036 0.660
0.055 1.143
9.347
4.572
0.914
1.397
J
D
P
N
G
0.010 (0.254)M
T
0.051 REF
0.100 BSC
0.539 0.579 13.691 14.707
0.125 MAX
0.050 REF
1.295 REF
R
G
H
J
2.540 BSC
3.175 MAX
1.270 REF
K
L
0.000
0.088
0.018
0.058
0.010 0.000
0.254
2.591
0.660
1.981
M
N
P
R
S
U
V
0.102 2.235
0.026 0.457
0.078 1.473
C
5_REF
5_REF
SOLDERING FOOTPRINT*
0.116 REF
0.200 MIN
0.250 MIN
2.946 REF
5.080 MIN
6.350 MIN
8.38
0.33
1.016
0.04
10.66
0.42
5.08
0.20
3.05
0.12
17.02
0.67
mm
inches
ǒ
Ǔ
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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