NCV7547MWTXG_技术文档

NCV7547

FLEXMOSt 7x Half-bridge

MOSFET Pre-driver

The NCV7547 programmable seven channel half−bridge MOSFET

pre−driver is one of a family of FLEXMOS automotive grade products

for driving logic−level NMOS FETs. The product is controllable by a

combination of serial SPI and CMOS−compatible parallel inputs. An

internal power−on reset provides controlled power up. A reset input

allows external re−initialization and a failsafe input allows the device

to be safely disabled in the event of system upset.

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Each channel independently monitors its external MOSFETs’

drain−source voltages for fault conditions. Overload detection

thresholds are SPI−selectable and the product allows different

detection thresholds for each channel.

The FLEXMOS family of products offers application scalability

through choice of external MOSFETs.

1

48

QFNW48

7x7, 0.5P

CASE 484AJ

Features

MARKING DIAGRAM

• Supports Functional Safety Compliance

• 7 Half−bridge Pre−drivers for External Logic−level NMOS FETs

♦ One Channel with Separated High−side & Low−side Pre−drivers

Configurable as a Half−bridge or as Independent Pre−drivers

1

ON

NCV7547

• Integrated Charge Pump for:

AWLYYWW

G

♦ High−side Gate Drive

♦ Switched Reverse Battery Protection

• 5 V CMOS Compatible I/O:

♦ 16−bit SPI Interface for Control and Diagnosis

♦ Reset and Failsafe Inputs

NCV7547 = Specific Device Code

A

= Assembly Location

= Wafer Lot

WL

YY

WW

G

= Year

= Work Week

= Pb−Free Package

♦ 4 PWM Control Inputs

• Programmable:

♦ Slew Rate Control

♦ Overload Protection Thresholds

ORDERING INFORMATION

• Low Quiescent Current

†

Device

NCV7547MWTXG

Package

Shipping

• Wettable Flanks Pb−free Packaging

QFN−48

(Pb−Free)

2500 / Tape &

Reel

• NCV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q100

Qualified and PPAP Capable

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Benefits

• Scalable to Load by Choice of External MOSFET

1

Publication Order Number:

February, 2019 − Rev. 1

NCV7547/D

NCV7547

VCC VS

CP CPSW

CSB

SCLK

SI

C1A

C1B

C2A

C2B

POWER

SUPPLY

CHARGE

PUMP

SPI

SO

RSTB

FSM

SFL

PWM1

PWM2

PWM3

PWM4

NCV7547

N/C

CP SFL

PDH

GH1

HB1

GL1

HB1

PDL

SFL CP

PDH

PGND

CP SFL

GH7

SH7

DL7

GL7

LOGIC

CORE

PDH

GH2

HB2

GL2

HB7

HB2

PDL

PGND

CP SFL

SFL CP

PDH

GH3

HB3

GL3

GH6

HB6

GL6

HB3

HB6

PDL

PGND

CP SFL

SFL CP

WATCH

DOG

PDH

GH4

HB4

GL4

GH5

HB5

GL5

HB4

HB5

FAILSAFE

PDL

PGND

AGND DGND PGND

Figure 1. Block Diagram

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2

NCV7547

REVERSE

PROTECT

SECURITY

SWITCH

VBAT

VBAT _P

WD_EN

VS

CP CPSW

C1A

C1B

C2A

C2B

GH1

HB1

GL1

OPTIONAL

14V

LIMITER

VCC

5V

M

NCV7547

VCC

GH2

HB2

GL2

CSB

SCLK

SI

SO

RSTB

PWM1

PWM2

PWM3

PWM4

GH3

HB3

GL3

M

GH4

HB4

GL4

WATCHDOG

FSM

N/C

GH5

HB5

GL5

GH7

SH7

DL7

GL7

GH6

HB6

GL6

AGND PGND DGND

A/D

3−5

mW

Figure 2. Application Diagram

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3

NCV7547

PACKAGE PIN DESCRIPTION

Label

Function

Description

48 PIN QFN EXPOSED PAD PACKAGE

42

36

VS

Main Power Supply

Logic Supply

Main high−power device supply (battery) input; VDS sense reference node for the half−

bridge high−side drivers. An external ceramic bypass capacitor shall be connected be-

tween VS and GND close to the pin.

VCC

SPI block and internal logic and low power (analog) supply input. An external ceramic

bypass capacitor shall be connected between VCC and GND close to the pin.

24

25

13

AGND

DGND

PGND

Signal Ground

Digital Ground

Power Ground

Low power return path; reference for the analog circuitry.

Low power return path; reference for the digital circuitry.

High power return path; reference for the half−bridge drivers; VDS sense reference node

for the half−bridge low−side drivers.

45

46

47

48

43

C1A

C1B

C2A

C2B

CP

Charge Pump

Switch Node

Switching nodes for external ceramic charge pumping capacitors 1 & 2.

Charge Pump

Output

Charge pump output; an external ceramic buffer capacitor shall be connected between

CP and VS to provide stable output voltage during transient noise on VS.

44

29

34

CPSW

RSTB

FSM

Charge Pump

Switched charge pump output; activates external reverse battery and security power

MOSFET switches via SPI.

Switched Output

Wake Input

Fail−safe Input

PWM Inputs

Digital input with falling edge digital de−glitch and pull−down resistor; active low master

reset; the device is in wake state when the pin is high.

Digital input with symmetrical digital de−glitch and pull−down resistor; active high fail−safe

mode (can be set via an external watchdog circuit).

33

32

31

30

26

27

28

35

PWM1

PWM2

PWM3

PWM4

CSB

Digital inputs with symmetrical adaptive digital de−glitch and pull−down resistor; provide

PWM signals to the half−bridge pre−drivers.

SPI Chip Select

SPI Clock

Digital input with pull−up resistor; active low chip select.

Digital input with pull−down resistor.

SCLK

SI

SPI Serial Input

SPI Serial Output

Digital input with pull−down resistor.

SO

Digital tri−state output with high−side path protection to prevent VCC back−bias in the

event of an external voltage regulator failure or short to VS.

2

5

GH1

GH2

GH3

GH4

GH5

GH6

HB1

HB2

HB3

HB4

HB5

HB6

High−side

Pre−driver

Output

High−side pre−drivers with pull−down resistor to HBx switch nodes; gate drive for external

logic−level N−MOS FETs.

8

11

15

18

3

Half−bridge

Switch Node

Monitoring inputs for external half−bridge switches 1:6 with pull−down resistor to AGND;

high−side MOSFET source node; low−side MOSFET drain node.

6

9

12

16

19

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4

NCV7547

PACKAGE PIN DESCRIPTION

Label

Function

Description

48 PIN QFN EXPOSED PAD PACKAGE

1

4

GL1

GL2

GL3

GL4

GL5

GL6

GH7

Low−side

Pre−driver

Output

Low−side pre−drivers with pull−down resistor to PGND;

gate drive for external logic−level N−MOS FETs.

7

10

14

17

22

High−side Pre−driver High−side pre−driver with pull−down resistor to SH7 input; gate drive for external logic−

Output

level N−MOS FETs.

23

21

20

SH7

DL7

GL7

High−side

Monitoring input for external high−side switch 7 with pull−down resistor to AGND; high−

Source Node

side MOSFET source node.

Low−side

Drain Node

Monitoring input for external low−side switch 7 with pull−down resistor to AGND; low−side

MOSFET drain node.

Low−side Pre−driver Low−side pre−driver with pull−down resistor to PGND;

Output

gate drive for external logic−level N−MOS FETs.

41

40

39

38

37

N/C

EP

–

No internal connection.

Exposed Pad

Connect to GND.

Exposed Pad

(EP)

48 47 46 45 44 43 42 41 40 39 38 37

1

2

36

35

34

33

32

31

30

29

28

27

26

25

GL1

GH1

HB1

GL2

GH2

HB2

GL3

GH3

HB3

GL4

GH4

HB4

VCC

SO

3

FSM

4

PWM1

PWM2

PWM3

PWM4

RSTB

SI

5

6

NCV7547

7

8

9

10

11

12

SCLK

CSB

DGND

13 14 15 16 17 18 19 20 21 22 23 24

Figure 3. 32 Pin 5 x 5 mm Exposed Pad Pin−out (Top View)

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5

NCV7547

MAXIMUM RATINGS (Except as noted, voltages are with respect to AGND = DGND = PGND = GND.)

Rating

Symbol

VS

Value

Unit

VS Supply

DC: 2 min @ 25°C

−0.3 to 28

V

MAX

AC: ISO7637 Pulse 5b, 400 ms @ 25°C

40

VCC Supply

VCC

−0.3 to 7.0

V

MAX

Output Voltage:

CP, CPSW

SO

V_OUT

V_SO

−0.3 to 40

−0.3 to 20

MAX

Input Voltage:

FSM, C1A, C1B, C2A, C2B

V_IN

I_IN

T

−0.3 to 40

−1.0 to 40

−0.3 to 20

5.0

V

MAX1

MAX2

MAX3

MAX

J

Input Voltage (Clamped):

HBx, SH7, DL7

Input Voltage: CSB, SCLK, SI, RSTB, PWMx

V

Input Current (Clamped): CSB, SCLK, SI, RSTB, FSM, PWMx, GHx, GLx

Junction Temperature

mA

°C

−40 to 150

−55 to 150

260

Storage Temperature

T

STG

Peak Reflow Soldering Temperature: Lead−free 60 to 150 seconds at 217°C (Note 1)

T

PK

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. See or download ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D

ATTRIBUTES

Characteristic

Symbol

Value

Unit

ESD Capability:

V

ESD_HBM

Human Body Model per AEC−Q100−002

All pins

≥

2.0

4.0

kV

VS, HBx, SH7, DL7

Charged Device Model per AEC−Q100−011

All Pins

V

ESD_CDM

≥

500

750

V

Corner Pins

Moisture Sensitivity (Note 1)

Package Thermal Resistance – Still−air, P = 1 W (Uniform Power Density)

MSL

1

–

°C/W

IN

Junction–to–Ambient, Rq

(Note 2)

(Note 3)

Rq

RY

JPAD

61.7

37.5

10.8

JA

Junction–to–Exposed Pad, RY

JPAD

2. Based on JESD51−3, 1.2 mm thick FR4, 2S0P PCB, 1 oz. signal, 4 thermal vias to 28 x 28 mm 1 oz. spreader on bottom layer.

3. Based on JESD51−7, 1.2 mm thick FR4, 1S2P PCB, 1 oz. signal, 4 thermal vias to 76 x 76 mm 1 oz. internal spreader planes.

RECOMMENDED OPERATING CONDITIONS

Parameter

Symbol

VS

Min

7.0

4.5

3.5

0

Max

18.0

5.5

Unit

V

Main Power Supply Voltage

Logic Power Supply Voltage

Logic High Input Voltage

OP

VCC

V

OP

IN_HIGH

V

VCC

V

OP

Logic Low Input Voltage

V

1.5

25

V

IN_LOW

Half−bridge Output PWM Rate

f

–

kHz

nF

MHz

ms

PWM

Charge Pump Capacitors (C1, C2, CCP)

SPI Clock Frequency

−

220

0.1

–

4700

2.5

f

SCLK

Startup Delay at VCC Power−On Reset (POR) (Note 4)

Ambient Still−Air Operating Temperature

t

200

125

RESET

T

A

−40

°C

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

4. Minimum wait time until device is ready to accept serial input data.

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6

NCV7547

PARAMETRIC TABLES

ELECTRICAL CHARACTERISTICS

(4.5 V ≤ VCC ≤ 5.5 V, 7.0 V ≤ VS ≤ 18 V, RSTB = VCC, CR1.D[10] = 1, −40°C ≤ T ≤ 150°C, unless otherwise specified.) (Note 5)

J

Characteristic

VS SUPPLY

Symbol

Conditions

Min

Typ

Max

Unit

Standby Current

VS = 12.0V, 0 v VCC v 5.5 V, RSTB = 0,

A

–

5.0

I

mA

VS_SBY

T = 25°C

Operating Current

VCC = 5.0 V , RSTB = 1, T = 25°C

A

Default Settings at POR, SPI Inactive

CR1.D[10]=0

1.6

5.0

I

mA

VS_OP0

–

CR1.D[10]=1

20.3

5.0

25.0

5.5

–

mA

V

VS_OP1

Under−voltage Lockout

VS

VS decreasing, SR0.D[5] ³ 1

SR0.D[5] ³ 0

4.5

100

UVLO

UVHY

Under−voltage Hysteresis

200

VS

mV

(after read status if VS > VS

)

UVLO+UVHY

Under−voltage Filter Time

Over−voltage Shutdown

t

VS decreasing

4.0

19.0

18.0

–

5.0

20.0

19.0

0.9

6.0

21.0

20.0

–

ms

V

UVDGL

VS

VS increasing, SR0.D[4] ³ 1

VS decreasing, SR0.D[4] ³ 0

SR0.D[4] ³ 0

OVSDR

OVSDF

VS

V

Over−voltage Hysteresis

VS

V

OVHY

(after read status if VS < VS

)

OV – OVHY

Over−voltage Filter Time

VS PWM Threshold

VS PWM Hysteresis

t

VS increasing

4.0

8.90

−

5.0

9.45

100

6.0

10.0

–

ms

OVDGL

VS

VS decreasing, SR0.D[7] ³ 1

V

PWM

SR0.D[7] ³ 0 and/or SR0.D[6] ³ 0

(after read status if VS > VS

VS

mV

PWM_HY

)

PWM +PWM_HY

VCC SUPPLY

Standby Current

VS = 12.0V, VCC = 5.5 V , RSTB = 0, T = 25°C

–

5.0

A

I

mA

VCC_SBY

Default Settings at POR, SPI Inactive

Operating Current

I

VS = 12.0V, RSTB = 1, T = 25°C

–

8.0

12.0

4.49

4.20

mA

V

VCC_OP

A

Power−On Reset Threshold

VCC

VCC Increasing

VCC Decreasing

3.71

3.50

4.10

3.85

PORR

PORF

VCC

V

CHARGE PUMP

C1 = C2 = 470 nF; CCP = 1000 nF

Single−stage, complementary−phase topology

(Note 6)

Switching Frequency

f

0.75

1.10

1.45

MHz

CP

Spread Spectrum

Modulation Depth

Modulation Rate

CP

CPMOD

−

15.0

45.6

−

%

kHz

MOD

f

Regulation Voltage

Startup Delay

CP

V(CP, VS), VS > VS

, 0 v I(CP) v 15 mA

8.3

–

8.9

–

9.5

V

REG

PWM

VS = 13V, I(CP) = no load

C1 = C2 = 470 nF, CCP = 1000 nF

(Note 6)

500

CP

ms

DLY

Dropout Voltage

CP

V(VS) − V(CP, VS), I(CP) = 10 mA, VS=9.4

V(VS) − V(CP, VS), I(CP) = 15 mA,

–

1.50

1.75

1.90

8.8

DROP0

DROP1

V

VS=10V and SR0.D[7] = 0

T w 125°C

J

–

Charge Pump Low Detection

CP

V(CP, VS) decreasing, VS > VS

, SR0.D[7] ³ 1

7.3

300

120

8.0

–

V

LOW0

PWM

Detection margin, CP

= CP

− CP

LOW0

–

mV

LOW1

REG

Charge Pump Low Detection

Filter Time

150

180

t

ms

CPL_DGL

Charge Pump Low Hysteresis

SR0.D[7] ³ 0

(after read status if V(CP,VS) > CP

–

100

–

CP

mV

LOW_HY

)

LOW+LOW_HY

5. Min/Max values are valid for the stated temperature range unless noted otherwise. Min/Max values are guaranteed by test, design or statis-

tical correlation

6. No production test

7. These values, measured in production via test mode, result in values that are t

longer than the stated values. The specification limits

SYNC

shall therefore be: (t

Typ + t

Typ) 20%, (t

Typ + t

Typ) 20%, and (t

Typ + t

Typ) 20%.

CAL_PCx

SYNC

CAL_DLYx

SYNC

DLYX

SYNC

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7

NCV7547

ELECTRICAL CHARACTERISTICS

(4.5 V ≤ VCC ≤ 5.5 V, 7.0 V ≤ VS ≤ 18 V, RSTB = VCC, CR1.D[10] = 1, −40°C ≤ T ≤ 150°C, unless otherwise specified.) (Note 5)

J

Characteristic

CHARGE PUMP

Symbol

Conditions

Min

Typ

Max

Unit

Charge Pump Fail Detection

CP

V(CP, VS) decreasing, SR0.D[6] ³ 1

4.925

120

5.375

150

5.750

180

V

FAIL

Charge Pump Fail Detection

Filter Time

t

ms

CPF_DGL

Charge Pump Fail Hysteresis

SR0.D[6] ³ 0

–

28.0

0.5

–

100

30.25

1.0

1.5

–

32.5

2.0

–

CP

mV

V

FAIL_HY

(after read status if V(CP,VS) > CP

)

FAIL+FAIL_HY

Charge Pump Over−voltage

Detection

VS increasing

CP

OV

Charge Pump Over−voltage

Hysteresis

CP

V

OV_HYS

CPTOT

CP Switch Resistance

*Guaranteed by Simulation*

8x CP switches in parallel, T = 25°C

R

W

A

Switched CP Output Resis-

tance

CR1.D[9] = 1, I(CPSW) = 5 mA

CR1.D[9] = 0

–

100

1.0

R

W

CPSW_ON

Switched CP Output Leakage

CP

−1.0

0

uA

SW_LKG

DIGITAL I/O

V

High

Low

V

CSB, SCLK, SI, RSTB, FSM, PWMx

3.5

–

V

IN_X

INHX

V

1.5

130

INLX

Input Pull−down Resistance

Input Pull−up Resistance

Input Current

R

SCLK, SI, RSTB, FSM, PWMx, V

= VCC

70

100

0

kW

PDX

INX

R

CSB, V = 0V

IN

PU

V

INX

V

INX

= 5.5V: SCLK, SI, RSTB, FSM, PWMx

= 0V: CSB

–

−80

80

–

I

mA

INX

Input Leakage

V

INX

V

INX

= 0V: SCLK, SI, RSTB, FSM, PWMx

= VCC: CSB

−1.0

0

1.0

I

IN_LKG

Input Filter Time

Reset De−glitch Time

Reset Assert Time

SO Low Voltage

t

FSM input

8.0

–

10

–

12

–

ms

V

IN_DGL

t

Minimum RSTB pulse (H ³ L ³ H) detected

Minimum RSTB hold after H ³ L transition

RST_DGL

t

11

–

15

0.4

–

WRST

V

SOL

I

= 1.0 mA

–

SINK

SO High Voltage

= 1.0 mA

VCC –

0.4

–

SOURCE

V

SOH

V

SO Tri−State Leakage Current

SO

CSB = VCC, SO = VCC/2

−1.0

–

1.0

mA

LKG

SERIAL PERIPHERAL INTERFACE (See Figure 4)

VCC = 5.0V, FSCLK = 2.5 MHz, CLOAD = 80 pF, all timing is at 30% and 70% VCC unless otherwise specified.

SCLK Clock Period

SCLK High Time

SCLK Low Time

Maximum Input Capacitance

Sl Setup Time

t

400

200

–

ns

pF

ns

SCLK

CLKH

t

SCLK = 70% VCC to 70% VCC

SCLK = 30% VCC to 30% VCC

SCLK, Sl

t

–

CLKL

C

(Note 6)

–

15

–

INX

SISU

SIHD

t

Sl = 30%|70% to SCLK = 70% VCC

SCLK = 30% to Sl = 30%|70% VCC

25

–

Sl Hold Time

t

–

SO Rise Time

t

(20% V to 80% VCC)

25

–

50

–

SOR

SO

SO Fall Time

t

(80% V to 20% VCC)

–

SOF

SO

CSB Setup Time

CSB Hold Time

t

CSB = 30% to SCLK = 30% VCC

SCLK = 30% to CSB = 70% VCC

60

75

–

CSBSU

CSBHD

t

–

5. Min/Max values are valid for the stated temperature range unless noted otherwise. Min/Max values are guaranteed by test, design or statis-

tical correlation

6. No production test

7. These values, measured in production via test mode, result in values that are t

longer than the stated values. The specification limits

SYNC

shall therefore be: (t

Typ + t

Typ) 20%, (t

Typ + t

Typ) 20%, and (t

Typ + t

Typ) 20%.

CAL_PCx

SYNC

CAL_DLYx

SYNC

DLYX

SYNC

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8

NCV7547

ELECTRICAL CHARACTERISTICS

(4.5 V ≤ VCC ≤ 5.5 V, 7.0 V ≤ VS ≤ 18 V, RSTB = VCC, CR1.D[10] = 1, −40°C ≤ T ≤ 150°C, unless otherwise specified.) (Note 5)

J

Characteristic

Symbol

Conditions

Min

Typ

Max

Unit

SERIAL PERIPHERAL INTERFACE (See Figure 4)

CSB to SO Assert Time

CSB to SO Release Time

CSB = 30% VCC to SO = 30%|70% VCC

RLOAD = 5 kW

–

65

–

125

350

t

ns

SO_A

(Note 6)

CSB = 70% VCC to SO = 20%|80% VCC/2

RLOAD = 5 kW

t

SO_R

(Note 6)

SO Delay Time

SO

CS

SCLK = 70% VCC to SO = 30%|70%

–

65

–

125

1.0

ns

DLY

Transfer Delay Time

CSB rising edge to next falling edge.

(Note 6)

ms

DLY

HALF−BRIDGE PRE−DRIVER OUTPUTS

VS > VS

PWM

On−state Drive Voltage

High−side, V

= H = V(GHx, HBx) or V(GHX,

8.3

8.1

–

9.5

9.8

PDHX

V

PDHX

SH7), No External Load

Low−side, V = H =V(GLx, PGND),

PDLX

V

PDLX

No External Load

High−side driver Gate−source

Clamp Positive Voltage

V(GHx, HBx), V(GH7, SH7), I

= 3.0 mA

14.0

−20.0

11.5

−1.0

18.0

−16.0

15.0

–

CLMP

V

GSX_CLPH

High−side driver Source−gate

Clamp Negative Voltage

V(HBx, GHx), V(SH7, GH7), I

= −2.0 mA

SGX_CLPH

Low−side driver Gate−source

Clamp Positive Voltage

V(GLx, PGND), I

= 10 mA

CLMP

V

GSX_CLPL

Low−side driver Gate−source

Clamp Negative Voltage

= −1.0 mA

CLMP

V

GSX_CLN

Gate Drive Timeout

t

I

v I

16

−1.2

70

20

−1.0

–

24

ms

TIMEOUT

GHx

GHx_SS

Gate Drive Timeout Current

I

V(GHx, HBx) or V(GHx, SH7) = 0 V, t > t

−0.8

130

mA

GHx_SS

TIMEOUT

Gate−source Pull−down

Resistor

R(GHx, HBx), R(GHx, SH7), R(GLx, PGND)

R

kW

ms

GSX

Cross Conduction Blank Time

BLANKx[1:0] = 0x00

BLANKx[1:0] = 0x01

BLANKx[1:0] = 0x02

BLANKx[1:0] = 0x03

0.8

1.6

2.4

3.2

1.0

2.0

3.0

4.0

1.2

2.4

3.6

4.8

t

GHx, GLx

BLANKX

PRE−DRIVER SLOPE CONTROL

VS > VS

PWM

High−side Pre−charge Time

GHx Rising and Falling Slope

T_PCx[1:0] = 0x00

T_PCx[1:0] = 0x01

T_PCx[1:0] = 0x02

T_PCx[1:0] = 0x03

I_PCRx[2:0] = 0x00

I_PCRx[2:0] = 0x01

I_PCRx[2:0] = 0x02

I_PCRx[2:0] = 0x03

I_PCRx[2:0] = 0x04

I_PCRx[2:0] = 0x05

I_PCRx[2:0] = 0x06

I_PCRx[2:0] = 0x07

80

100

200

120

240

160

t

ns

PRCX

240

300

360

320

400

480

High−side Pre−charge Current

GHx Rising Slope

1.23

4.52

7.42

10.65

14.19

17.42

20.64

24.19

1.50

5.25

8.63

12.38

16.50

20.25

24.00

28.13

1.77

5.99

9.84

14.11

18.81

23.09

27.36

32.07

V(GHx) = 3.5 V

I

mA

PRCX_R

5. Min/Max values are valid for the stated temperature range unless noted otherwise. Min/Max values are guaranteed by test, design or statis-

tical correlation

6. No production test

7. These values, measured in production via test mode, result in values that are t

longer than the stated values. The specification limits

SYNC

shall therefore be: (t

Typ + t

Typ) 20%, (t

Typ + t

Typ) 20%, and (t

Typ + t

Typ) 20%.

CAL_PCx

SYNC

CAL_DLYx

SYNC

DLYX

SYNC

www.onsemi.com

9

NCV7547

ELECTRICAL CHARACTERISTICS

(4.5 V ≤ VCC ≤ 5.5 V, 7.0 V ≤ VS ≤ 18 V, RSTB = VCC, CR1.D[10] = 1, −40°C ≤ T ≤ 150°C, unless otherwise specified.) (Note 5)

J

Characteristic

Symbol

Conditions

Min

Typ

Max

Unit

PRE−DRIVER SLOPE CONTROL

High−side Pre−charge Current

GHx Falling Slope

I_PCFx[2:0] = 0x00

I_PCFx[2:0] = 0x01

24.84

30.64

36.12

41.61

47.41

52.89

58.38

64.18

1.23

28.88

35.63

42.00

48.38

55.13

61.50

67.88

74.63

1.50

32.92

40.62

47.88

55.15

62.85

70.11

77.38

85.08

1.77

V(GHx) = (VS + 3.5) V

I_PCFx[2:0] = 0x02

I_PCFx[2:0] = 0x03

I

mA

PRCX_F

I_PCFx[2:0] = 0x04

I_PCFx[2:0] = 0x05

I_PCFx[2:0] = 0x06

I_PCFx[2:0] = 0x07

High−side Slew Current

SR_CTRLx[2:0] = 0x00

SR_CTRLx[2:0] = 0x01

SR_CTRLx[2:0] = 0x02

SR_CTRLx[2:0] = 0x03

SR_CTRLx[2:0] = 0x04

SR_CTRLx[2:0] = 0x05

SR_CTRLx[2:0] = 0x06

SR_CTRLx[2:0] = 0x07

SR_CTRLx[2:0] = 0x00

SR_CTRLx[2:0] = 0x01

SR_CTRLx[2:0] = 0x02

SR_CTRLx[2:0] = 0x03

SR_CTRLx[2:0] = 0x04

SR_CTRLx[2:0] = 0x05

SR_CTRLx[2:0] = 0x06

SR_CTRLx[2:0] = 0x07

GHx Rising and Falling Slope

1.94

2.25

2.57

Rising: V(GHx) = (VS + 3.5) V

Falling: V(GHx) = 3.5 V

2.91

3.38

3.85

4.52

5.25

5.99

I

mA

SRX

6.78

7.88

8.98

10.00

14.84

21.93

5.16

11.63

17.25

25.50

6.00

13.26

19.67

29.07

6.84

Low−side Drive Current

GLx Rising and Falling slope

7.74

9.00

10.26

15.41

23.94

35.93

53.03

78.66

11.63

18.06

27.11

40.01

59.34

87.72

13.52

21.00

31.52

46.52

69.00

V(GLx) = 3.5 V

I

mA

LSX

102.00 116.28

SLOPE CONTROL CALIBRATION UNIT

Slope Calibration Comparator

Window Thresholds

V

Falling slope window lower threshold

Falling slope window upper threshold

Rising slope window lower threshold

Rising slope window upper threshold

3.0

13

82

92

–

5.0

15

7.0

17

88

98

100

–

CALF_L

CALF_U

CALR_L

CALR_U

CAL_PD

V

% VS

85

V

95

Comparator Propagation Delay

Sample Synchronization Delay

Calibration Pre−charge Time

t

62

ns

t

= 2/f

CORE

–

50

SYNC

CAL_PC[3:0] = 0x00

50

CAL_PC[3:0] = 0x01

CAL_PC[3:0] = 0x02

CAL_PC[3:0] = 0x03

CAL_PC[3:0] = 0x04

CAL_PC[3:0] = 0x05

150

250

350

450

550

HBx Rising & Falling Slope

t

(Note 7)

ns

CAL_PCx

5. Min/Max values are valid for the stated temperature range unless noted otherwise. Min/Max values are guaranteed by test, design or statis-

tical correlation

6. No production test

7. These values, measured in production via test mode, result in values that are t

longer than the stated values. The specification limits

SYNC

shall therefore be: (t

Typ + t

Typ) 20%, (t

Typ + t

Typ) 20%, and (t

Typ + t

Typ) 20%.

CAL_PCx

SYNC

CAL_DLYx

SYNC

DLYX

SYNC

www.onsemi.com

10

NCV7547

ELECTRICAL CHARACTERISTICS

(4.5 V ≤ VCC ≤ 5.5 V, 7.0 V ≤ VS ≤ 18 V, RSTB = VCC, CR1.D[10] = 1, −40°C ≤ T ≤ 150°C, unless otherwise specified.) (Note 5)

J

Characteristic

Symbol

Conditions

Min

Typ

Max

Unit

SLOPE CONTROL CALIBRATION UNIT

Calibration Pre−charge Time

CAL_PC[3:0] = 0x06

CAL_PC[3:0] = 0x07

CAL_PC[3:0] = 0x08

CAL_PC[3:0] = 0x09

CAL_PC[3:0] = 0x0A

CAL_PC[3:0] = 0x0B

CAL_PC[3:0] = 0x0C

CAL_PC[3:0] = 0x0D

CAL_PC[3:0] = 0x0E

CAL_PC[3:0] = 0x0F

CAL_DLY[3:0] = 0x00

CAL_DLY[3:0] = 0x01

CAL_DLY[3:0] = 0x02

CAL_DLY[3:0] = 0x03

CAL_DLY[3:0] = 0x04

CAL_DLY[3:0] = 0x05

CAL_DLY[3:0] = 0x06

CAL_DLY[3:0] = 0x07

CAL_DLY[3:0] = 0x08

CAL_DLY[3:0] = 0x09

CAL_DLY[3:0] = 0x0A

CAL_DLY[3:0] = 0x0B

CAL_DLY[3:0] = 0x0C

CAL_DLY[3:0] = 0x0D

CAL_DLY[3:0] = 0x0E

CAL_DLY[3:0] = 0x0F

650

750

HBx Rising & Falling Slope

850

950

1050

1150

1250

1350

1450

1550

0.35

0.55

0.75

0.95

1.15

1.35

1.55

1.75

1.95

2.15

2.35

2.55

2.75

2.95

3.15

3.35

t

(Note 7)

ns

CAL_PCx

Calibration Delay Time

HBx Rising & Falling Slope

t

(Note 7)

ms

CAL_DLYx

HALF−BRIDGE DIAGNOSTICS

VDS Monitor Thresholds

VDSx[2:0] = 0x00

VDSx[2:0] = 0x01

VDSx[2:0] = 0x02

VDSx[2:0] = 0x03

VDSx[2:0] = 0x04

VDSx[2:0] = 0x05

VDSx[2:0] = 0x06

VDSx[2:0] = 0x07

263

356

445

534

623

712

801

890

0.92

–

300

400

500

600

700

800

900

1000

1.15

550

337

444

555

666

777

888

999

1110

1.38

750

VDS = V(VS, HBx)

− or−

VDS

mV

THRX

VDS = V(HBx, GND)

VDS Monitor Filter Time

t

ms

DGL_STAT

VDS Monitor Propagation Delay

t

ns

VDSS_PD

5. Min/Max values are valid for the stated temperature range unless noted otherwise. Min/Max values are guaranteed by test, design or statis-

tical correlation

6. No production test

7. These values, measured in production via test mode, result in values that are t

longer than the stated values. The specification limits

SYNC

shall therefore be: (t

Typ + t

Typ) 20%, (t

Typ + t

Typ) 20%, and (t

Typ + t

Typ) 20%.

CAL_PCx

SYNC

CAL_DLYx

SYNC

DLYX

SYNC

www.onsemi.com

11

NCV7547

ELECTRICAL CHARACTERISTICS

(4.5 V ≤ VCC ≤ 5.5 V, 7.0 V ≤ VS ≤ 18 V, RSTB = VCC, CR1.D[10] = 1, −40°C ≤ T ≤ 150°C, unless otherwise specified.) (Note 5)

J

Characteristic

Symbol

Conditions

Min

Typ

Max

Unit

HALF−BRIDGE DIAGNOSTICS

VDS Overload Detection

Delay Time

T_DLYX[3:0] = 0x00

T_DLYX[3:0] = 0x01

1.05

1.65

2.25

2.85

3.45

4.05

4.65

5.25

5.85

6.45

7.05

7.65

8.25

8.85

9.45

10.05

26

T_DLYX[3:0] = 0x02

Rising or Falling Slope

T_DLYX[3:0] = 0x03

T_DLYX[3:0] = 0x04

T_DLYX[3:0] = 0x05

T_DLYX[3:0] = 0x06

T_DLYX[3:0] = 0x07

t

(Note 7)

ms

DLYX

T_DLYX[3:0] = 0x08

T_DLYX[3:0] = 0x09

T_DLYX[3:0] = 0x0A

T_DLYX[3:0] = 0x0B

T_DLYX[3:0] = 0x0C

T_DLYX[3:0] = 0x0D

T_DLYX[3:0] = 0x0E

T_DLYX[3:0] = 0x0F

HBx, SH7, DL7 − Pull−down to AGND

HBx Input Resistance

R

−

kW

% VS

ms

HBX

HBx Monitor Threshold

VHB

45

–

50

55

2.0

9.0

THR

HBx Monitor Propagation Delay

HBx Monitor Test Currents

t

1.0

HBX_PD

CR0.HB_ENx = 0, HB1, HB3

source or sink, 10V v VS v 16V

6.0

7.5

I

mA

TST

WATCHDOG TIMER

Watchdog Timeout

CR1.D[8] = 0

CR1.D[8] = 1

20

400

25

500

30

600

t

ms

WD

Core Clock Oscillator

THERMAL OVERLOAD (Note 6)

Warning Threshold

f

–

40

–

MHz

CORE

T

T increasing, SR0.D[3] → 1

110

–

125

20

140

–

°C

ms

OTW

J

Warning Hysteresis

SR0.D[3] → 0

T

OTW_HY

(after read status if T < T

)

J

OTW – OTW_HY

Shutdown Threshold

Shutdown Hysteresis

T

T increasing, SR0.D[2] → 1, all outputs → OFF

J

150

–

170

20

190

–

OTS

SR0.D[2] → 0

OTS_HY

(after read status if T < T

)

J

OTS – OTS_HY

Shutdown Filter Time

t

–

11.9

–

OTDGL

5. Min/Max values are valid for the stated temperature range unless noted otherwise. Min/Max values are guaranteed by test, design or statis-

tical correlation

6. No production test

7. These values, measured in production via test mode, result in values that are t

longer than the stated values. The specification limits

SYNC

shall therefore be: (t

Typ + t

Typ) 20%, (t

Typ + t

Typ) 20%, and (t

Typ + t

Typ) 20%.

CAL_PCx

SYNC

CAL_DLYx

SYNC

DLYX

SYNC

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

www.onsemi.com

12

NCV7547

TRANSFER

DELAY

CSB

SETUP

70%

CSB

SCLK

SI

30%

SCLK PERIOD

CSB

HOLD

SCLK

HIGH

SCLK

LOW

70%

1

16

30%

70%

SI

SETUP

SI

HOLD

X

BITS 14...1

LSB IN

MSB IN

30%

CSB to SO

ASSERT

SO

DELAY

SO

RISE,FALL

CSB to SO

RELEASE

70%

30%

80%

20%

SO

BITS 14...1

LSB OUT

X

MSB OUT

Figure 4. SPI Timing

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13

NCV7547

DETAILED OPERATING DESCRIPTION

Power Supply

The power supply block provides:

• all internal supply and reference voltages;

• all internal bias and reference currents;

• VCC power−on reset (POR) and VS

under/over−voltage lockout signals.

Table 1 gives suggested values for the external pump and

buffer capacitors to support the charge pump DC loading

while maintaining good transient response and regulation

stability.

Table 1. SUGGESTED CHARGE PUMP CAPACITORS

DC Load

(mA)

Pump Capacitors

C1, C2 (nF)

Buffer Capacitor

CCP (nF)

The analog and power portions of the device (reference

voltages/currents, charge pump, low−side gate drivers, etc.)

are supplied from the VS terminal. Each of the low−side gate

driver outputs (GLx) is supplied from VS via an individual

buffer (source follower) with voltage limit functionality.

The high−side gate driver outputs (GHx) are supplied from

a regulated charge pump.

The logic core and the SPI communication interface are

supplied from the VCC terminal in order to achieve a high

frequency operation by use of external bypass capacitors. In

case of breakdown of the external voltage regulator, the

device can be protected by use of an external voltage limiter,

which must limit the maximum voltage at the VCC terminal

1.0

7.5

100

220

470

220

470

15.0

1000

The device is initialized at power−up into a reduced power

state and the charge pump disabled. The charge pump is

controlled by SPI command via the CR1.DRV_EN bit (see

Table 7) and the charge pump is:

• disabled when CR1.DRV_EN=0;

• enabled when CR1.DRV_EN=1.

The optional external reverse protection and security

switches are connected to the charge pump buffer capacitor

through the switched charge pump (CPSW) output. The

output is controlled by SPI command via the CR1.CP_SW

bit (see Table 7). The CPSW output is:

• disabled (the reverse and security MOSFETs are turned

OFF) when CR1.CP_SW=0;

to VCC

(see § MAXIMUM RATINGS).

MAX

The outputs are disabled during device initialization at

power−up via an interlock between VS and VCC and such

that no control is available until after VCC > VCC

§ Electrical Characteristics: VCC Supply). Reverse battery

protection for VS and the VCC regulator is provided

externally by the application (see Figure 2).

(

see

PORR

• enabled (the reverse and security MOSFETs are turned

ON) when CR1.CP_SW=1.

The device is initialized at power−up into a reduced power

state (CR1.DRV_EN = 0, see § SPI Control Set):

• the charge pump is disabled;

The charge pump is internally monitored to ensure safe

operation of the charge pump circuit and the high−side

driver outputs (see § Protection and Diagnosis − Charge

Pump Monitoring). Due to the single stage configuration the

charge pump provides the following output characteristics

(see Figure 5, Figure 6, § SPI Diagnosis Set and § Electrical

Characteristics: Charge Pump):

• all gate drive currents are disabled;

• gate pull−down structures are enabled;

• HBx diagnostic test currents are available (see

§ OFF−state Monitoring of Half−bridge Drivers).

The device is placed into a full power state when

CR1.DRV_EN = 1.

Multiple GND pins are used in order to avoid loss of GND

due to a single−point failure, to improve ESD capability, and

to improve the VDS overload protection performance of the

device.

• V(CP, VS) < CP

FAIL

SR0.CPF → 1

the GHx and GLx outputs are shut down to prevent

damage to the external power MOSFETs;

• VS < VS

PWM

SR0.CPL → 1

Charge Pump

the CP output voltage follows the VS voltage (the

regulation saturates) with a maximum drop voltage per

A regulated charge pump circuit in single−stage /

complementary−phase configuration is implemented. The

charge pump is sized to drive up 2 high−side drivers in PWM

the equation V(CP, VS) = VS − CP

;

DROP

≤

(

.

• CP

< V(CP, VS) < CP

operation f

25 kHz)

FAIL

LOW

PWM

SR0.CPL → 1

• VS ≤ VS ≤ VS

The topology utilizes 2 external pump capacitors and an

external buffer capacitor (see Figure 2) to supply:

• the high−side gate driver outputs (GHx);

• an optional external reverse protection power

MOSFET;

PWM

OVSDR

the charge pump delivers a regulated output voltage

V(CP, VS) = CP and PWM operation of the GHx

REG

outputs is allowed;

• an optional external security switch power MOSFET.

www.onsemi.com

14

NCV7547

In the case of VS overvoltage, the charge pump

• VS

< VS < VS(CP

the charge pump including the CPSW output is

functional, but the GHx outputs are shut down;

)

OVSDF

OV

automatically resumes normal operation when the VS

.

voltage returns to below CP − CP

In the case of

it should be

OV

OV_HYS

VS < VS

or V(CP, VS) < CP

PWM

LOW

• VS > VS(CP

)

OV

considered for the microcontroller to adopt a PWM duty

ratio management schema in order to minimize charge pump

loading while ensuring smooth motor operation.

the charge pump is disabled and the charge pump buffer

capacitor is discharged to VS in order to protect the

device from destruction.

V(CP, VS)

CP In Regulation

CP_REG

CP_LOW

(MIN)

CP Low OR VS < VS

SR0.D[7] → 1

PWM

CP_FAIL

(MIN)

CP Fail

GHx → L

GLx → L

SR0.D[6] → 1

V(VS)

VS_PWM

(MAX)

VS_OVSD

(MIN)

CP_DROP

Figure 5. Charge Pump Characteristics

V

Load Dump Rise Time

(per ISO7637 Pulse 5b)

V(VS_MAX

)

V(CP_OV

CP_REG

V(CP)

V(VS)

CP_REG

t

CP Oscillator Stopped

Buffer Cap Discharged to VS

Figure 6. Charge Pump Overvoltage Behavior

www.onsemi.com

15

NCV7547

SPI Interface

Watchdog Timer) in order to facilitate module boot loader

programming. The timeout setting is controlled by the

CR1.WD_CFG bit:

A full−duplex synchronous serial data transfer interface

(SPI) is used to control the device and provide diagnosis

during normal operation. Daisy chain capability of the

interface is implemented in order to minimize circuit

expenditure and communication efforts. The SPI protocol

utilizes 16−bit data words (B15 = MSB). The idle state of

SCLK is low and the SI data must be stable before the falling

edge of SCLK (“legacy mode 1”: CPOL=0, CPHA=1).

The interface consists of 4 I/O lines with 5V CMOS logic

levels and termination resistors (see Figure 7, Figure 2):

• when CR1.WD_CFG=0 (default setting) the WD

timeout is t

= 25 ms;

WD

• when CR1.WD_CFG=1 the WD timeout is t

=

WD

500 ms.

The first WD bit value sent after VCC POR or wake−up

must be WD = 0 in the first frame, then WD = 1 in the next.

A correct communication is reported when bit SR0.SPIF

= 0 and the device is in NORMAL MODE (NM) when bit

SRx.NM = 1. The device enters FAILSAFE MODE

immediately in the event of an SPI communication error(see

§ Operating Modes).

• the active−low CSB enables the SPI interface;

• the SCLK pin clocks the internal shift registers of the

device;

• the SI pin receives data of the input shift registers MSB

first;

Serial Data and SPI Register Structures

• the SO pin sends data of the output shift registers MSB

The input and output message formats of the implemented

SPI protocol are as shown in the following tables. In the

descriptions in the following sections, it is implied that the

frame length is correct and that the WD bit has been properly

toggled when sending and receiving SPI messages. Please

also note that the SPI hardware protocol is a “frame−behind”

response type, i.e. the requested data is delivered in the next

frame.

first.

The device offers the following SPI communication error

checks in order to protect the application from unintended

motor activation:

• protocol length error (modulo 16);

• no edges on SCLK during a CSB period;

• an undefined SPI command (not used bits must be set

to logic 0);

• watchdog (WD) toggle (the internal watchdog bit

(CRx.WD) must be toggled with each SPI message);

• WD timeout (the WD bit must be toggled before the

internal watchdog timeout is reached).

SPI Control Set

The first 4 bits (D15 ... D12) serve as address bits, while

12 bits (D11 ... D0) are used as data bits. The D11 bit is the

WD toggle bit: A SPI fail is detected if the bit is not toggled

within the WD timeout. The D10 bit may be used as an

extended address in some messages.

All Control Register (CRx) bits are initialized to logic 0

after a reset. The predefined value is off / inactive unless

otherwise noted. The SPI control set (input data map) and

input data structure prototype are shown in the following

tables.

An SI pin stuck−at condition during a CSB period is

detected by a WD toggle error. A VCC under−voltage

condition is directly blocking the complete SPI functionality

via the VCC

signal.

PORF

The length of the watchdog timeout is SPI programmable

(see § SPI Control Set and § Electrical Characteristics:

TOGGLE

CSB

SAMPLE

4 − 13

1

2

3

14

15

16

SCLK

SI

X

B15

MSB

B15

B14

B13

B12 − B3

B2

B1

B0

LSB

B0

Z

SO

X

Z

Note: SPI Legacy Mode 1; X=Don’t Care, Z=Tri−State

Figure 7. SPI Communication Frame Format

www.onsemi.com

16

NCV7547

Table 2. SPI INPUT DATA FORMAT

Command Input Message Format

MSB

LSB

B0

D0

B15

A3

B14

A2

B13

A1

B12

A0

B11

WD

B10

D10

B9

D9

B8

D8

B7

D7

B6

D6

B5

D5

B4

D4

B3

D3

B2

D2

B1

D1

WATCH DOG

11−bit INPUT DATA

4−bit REGISTER ADDRESS

Table 3. INPUT DATA STRUCTURE PROTOTYPE

Input Data Prototype

CRx

WD

?

D10

?

D9

?

D8

?

D7

?

D6

?

D5

?

D4

?

D3

?

D2

D1

?

D0

?

Table 4. SPI INPUT REGISTER DEFINITIONS

Defined Command Input Registers (CRx)

D15

A3

0

D14

A2

0

D13

D12

A0

0

D11

D10

Register Name

Status Output Mode & HBx Enable

HBx Mode

Alias

CR0

A1

0

WD

D10

0

CR1

0

1

HBx PWM Control

HBx PWM Mode A

HBx PWM Mode B

HBx Calibration Control

HB1 Configuration A

HB1 Configuration B

HB2 Configuration A

HB2 Configuration B

HB3 Configuration A

HB3 Configuration B

HB4 Configuration A

HB4 Configuration B

HB5 Configuration A

HB5 Configuration B

HB6 Configuration A

HB6 Configuration B

HB7 Configuration A

HB7 Configuration B

HBx Diagnosis

CR2

0

1

0

CR3A

CR3B

CR4

0

1

0

1

0

1

0

1

D10

0

CR5A

CR5B

CR6A

CR6B

CR7A

CR7B

CR8A

CR8B

CR9A

CR9B

CR10A

CR10B

CR11A

CR11B

CR12

CR13

CR14

CR15

1

0

1

0

1

0

1

WD

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

Not Used

0

HBx PWM De−glitch

Test Mode

0

D10

NOTE: Half−bridge gate drive settings must only be changed when HBx is in tri−state (HB_ENx = 0);

Gate drive pre−charge time settings must only be changed in single increments (i.e. 00 to 01, 01 to 10 etc.).

Table 5. CR0: STATUS OUTPUT MODE & HBx ENABLE REGISTER

CR0

WD

D10

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0

SRA_MODE

SRA[2:0]

HB_EN7 … HB_EN1

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NCV7547

Table 6. CR0 INSTRUCTION DEFINITIONS

Mnemonic

Value

Comment

SRA_MODE

The Status Register Address selected via CR0.SRA [2:0] will be used for a single read command. The address

always points to SR0 after the read (default state).

0

The Status Register Address selected via SRA [2:0] will be used for the next and all further read commands

until a new address is selected.

1

SRA[2:0]

000

001

010

011

100

101

110

111

0

SR0 data is returned in the next frame (default state).

SR1 data is returned in the next frame.

SR2 data is returned in the next frame.

SR3 data is returned in the next frame.

SR4 data is returned in the next frame.

SR5 data is returned in the next frame.

SR6 data is returned in the next frame.

SR7 data is returned in the next frame.

HBx output disabled (default state).

HBx output enabled.

HB_ENx

1

Table 7. CR1: HBx MODE CONTROL REGISTER

CR1

WD

D10

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0

DRV_EN

CP_SW

WD_CFG

HB_CFG7

HB_MODE7 … HB_MODE1

Table 8. CR1 INSTRUCTION DEFINITIONS

Mnemonic

Value

Comment

0

1

0

1

0

1

0

1

0

1

Charge pump and gate drive currents are disabled (default state).

Charge pump and gate drive currents are enabled.

Charge pump switched output is OFF: CPSW = Hi−Z (default state).

Charge pump switched output is ON: CPSW = V(CP−VS).

Watch dog timeout = 25 ms (default state).

DRV_EN

CP_SW

WD_CFG

HB_CFG7

HB_MODEx

Watch dog timeout = 500 ms.

Half−bridge configuration (default state).

Split configuration (see Figure 13 and Figure 16).

Low−side pre−driver active (default state).

High−side pre−driver active.

Table 9. CR2: HBx PWM CONTROL REGISTER

CR2

WD

D10

0

D9

0

D8

0

D7

0

D6

D5

D4

D3

D2

D1

D0

HB_PWM7 … HB_PWM1

Table 10. CR2 INSTRUCTION DEFINITIONS

Mnemonic

Value

Comment

0

1

Output is in 100% ON mode (default).

Output is in PWM mode.

HB_PWMx

Table 11. CR3: HBx PWM MODE CONTROL REGISTER

WD

D10

0

D9

D8

D7

D6

D5

D4

D3

D2

D1

PWM1[1:0]

D1 D0

PWM6[1:0]

D0

CR3A

CR3B

PWM5[1:0]

PWM4[1:0]

PWM3[1:0]

PWM2[1:0]

D10

1

D9

0

D8

0

D7

0

D6

0

D5

D4

0

D3

0

PWM7[1:0]

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NCV7547

Table 12. CR3 INSTRUCTION DEFINITIONS

Mnemonic

Value

00

Comment

Output PWM source is input PWM1 (default).

Output PWM source is input PWM2.

Output PWM source is input PWM3.

Output PWM source is input PWM4.

PWMx[1:0]

01

10

11

Table 13. CR4: HBx CALIBRATION CONTROL REGISTER

WD

D10

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0

CR4

CAL_DLY[3:0]

CAL_PC[3:0]

CAL_SEL[2:0]

Table 14. CR4 INSTRUCTION DEFINITIONS

Mnemonic

Value

0000

0001

0010

0011

0100

0101

0110

0111

1000

1001

1010

1011

1100

1101

1110

1111

0000

0001

0010

0011

0100

0101

0110

0111

1000

1001

1010

1011

1100

1101

1110

1111

Comment

CAL_DLY[3:0]

Delay time: end of rising|falling slope 0.35 ms (default).

Delay time: end of rising|falling slope 0.55 ms.

Delay time: end of rising|falling slope 0.75 ms.

Delay time: end of rising|falling slope 0.95 ms.

Delay time: end of rising|falling slope 1.15 ms.

Delay time: end of rising|falling slope 1.35 ms.

Delay time: end of rising|falling slope 1.55 ms.

Delay time: end of rising|falling slope 1.75 ms.

Delay time: end of rising|falling slope 1.95 ms.

Delay time: end of rising|falling slope 2.15 ms.

Delay time: end of rising|falling slope 2.35 ms.

Delay time: end of rising|falling slope 2.55 ms.

Delay time: end of rising|falling slope 2.75 ms.

Delay time: end of rising|falling slope 2.95 ms.

Delay time: end of rising|falling slope 3.15 ms.

Delay time: end of rising|falling slope 3.35 ms.

Pre−charge time: start of rising|falling slope 50 ns (default).

Pre−charge time: start of rising|falling slope 150 ns.

Pre−charge time: start of rising|falling slope 250 ns.

Pre−charge time: start of rising|falling slope 350 ns.

Pre−charge time: start of rising|falling slope 450 ns.

Pre−charge time: start of rising|falling slope 550 ns.

Pre−charge time: start of rising|falling slope 650 ns.

Pre−charge time: start of rising|falling slope 750 ns.

Pre−charge time: start of rising|falling slope 850 ns.

Pre−charge time: start of rising|falling slope 950 ns.

Pre−charge time: start of rising|falling slope 1050 ns.

Pre−charge time: start of rising|falling slope 1150 ns.

Pre−charge time: start of rising|falling slope 1250 ns.

Pre−charge time: start of rising|falling slope 1350 ns.

Pre−charge time: start of rising|falling slope 1450 ns.

Pre−charge time: start of rising|falling slope 1550 ns.

CAL_PC[3:0]

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NCV7547

Table 14. CR4 INSTRUCTION DEFINITIONS

Mnemonic

Value

000

001

010

011

100

101

110

111

Comment

CAL_SEL[2:0]

Calibration unit disabled (default).

Select output HB1.

Select output HB2.

Select output HB3.

Select output HB4.

Select output HB5.

Select output HB6.

Select output SH7.

Table 15. CR5A − CR11A: HBx CONFIGURATION A REGISTER

CR5A – CR11A

WD

D10

0

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0

BLANKx[1:0]

I_PCFx[2:0]

I_PCRx[2:0]

T_PCx[1:0]

Table 16. CR5A − CR11A INSTRUCTION DEFINITIONS

Mnemonic

Value

00

Comment

Select cross−conduction blanking time 1 ms (default).

BLANKx[1:0]

01

Select cross−conduction blanking time 2 ms.

10

Select cross−conduction blanking time 3 ms.

11

Select cross−conduction blanking time 4 ms.

I_PCFx[2:0]

I_PCRx[2:0]

T_PCx[1:0]

000

001

010

011

100

101

110

111

000

001

010

011

100

101

110

111

00

Select falling slope pre−charge current 28.88mA (default).

Select falling slope pre−charge current 35.63 mA.

Select falling slope pre−charge current 42.00 mA.

Select falling slope pre−charge current 48.38 mA.

Select falling slope pre−charge current 55.13mA.

Select falling slope pre−charge current 61.50 mA.

Select falling slope pre−charge current 67.88 mA.

Select falling slope pre−charge current 74.63 mA.

Select rising slope pre−charge current 1.50 mA (default).

Select rising slope pre−charge current 5.25 mA.

Select rising slope pre−charge current 8.63 mA.

Select rising slope pre−charge current 12.38 mA.

Select rising slope pre−charge current 16.50 mA.

Select rising slope pre−charge current 20.25 mA.

Select rising slope pre−charge current 24.00 mA.

Select rising slope pre−charge current 28.13 mA.

Select rising/falling slope pre−charge time 100 ns (default).

Select rising/falling slope pre−charge time 200 ns.

Select rising/falling slope pre−charge time 300 ns.

Select rising/falling slope pre−charge time 400 ns.

01

10

11

Table 17. CR5B − CR11B: HBx CONFIGURATION B REGISTER

CR5B – CR11B

WD

D10

1

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0

VDSx[2:0]

T_DLY[3:0]

SR_CTRL[2:0]

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NCV7547

Table 18. CR5B − CR11B INSTRUCTION DEFINITIONS

Mnemonic

Value

000

Comment

VDSx[2:0]

Select VDS sense threshold 300 mV (default).

Select VDS sense threshold 400 mV.

Select VDS sense threshold 500 mV.

Select VDS sense threshold 600 mV.

Select VDS sense threshold 700 mV.

Select VDS sense threshold 800 mV.

Select VDS sense threshold 900 mV.

Select VDS sense threshold 1000 mV.

001

010

011

100

101

110

111

T_DLY[3:0]

0000

0001

0010

0011

0100

0101

0110

0111

1000

1001

1010

1011

1100

1101

1110

1111

000

Select VDS overload detect delay 1.05 ms (default).

Select VDS overload detect delay 1.65 ms.

Select VDS overload detect delay 2.25 ms.

Select VDS overload detect delay 2.85 ms.

Select VDS overload detect delay 3.45 ms.

Select VDS overload detect delay 4.05 ms.

Select VDS overload detect delay 4.65 ms.

Select VDS overload detect delay 5.25 ms.

Select VDS overload detect delay 5.85 ms.

Select VDS overload detect delay 6.45 ms.

Select VDS overload detect delay 7.05 ms.

Select VDS overload detect delay 7.65 ms.

Select VDS overload detect delay 8.25 ms.

Select VDS overload detect delay 8.85 ms.

Select VDS overload detect delay 9.45 ms.

Select VDS overload detect delay 10.05 ms.

Select rising/falling slope slew phase current 1.5 mA (default).

Select rising/falling slope slew phase current 2.25 mA.

Select rising/falling slope slew phase current 3.38 mA.

Select rising/falling slope slew phase current 5.25 mA.

Select rising/falling slope slew phase current 7.88 mA.

Select rising/falling slope slew phase current 11.63 mA.

Select rising/falling slope slew phase current 17.25 mA.

Select rising/falling slope slew phase current 25.50 mA.

SR_CTRL[2:0]

001

010

011

100

101

110

111

Table 19. CR12: HBx DIAGNOSIS CONTROL REGISTER

CR12

WD

D10

0

D9

0

D8

0

D7

D6

D5

D4

D3

D2

D1

D0

TST_LS7 TST_LS5 TST_LS3 TST_LS1 TST_HS7 TST_HS5 TST_HS3 TST_HS1

Table 20. CR12 INSTRUCTION DEFINITIONS

Mnemonic

Value

Comment

TST_LSx

0

1

0

1

Disable low−side test current (default).

Enable low−side test current.

TST_HSx

Disable high−side test current (default).

Enable high−side test current.

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NCV7547

Table 21. CR14: HBx PWM DE−GLITCH

CR14

WD

D10

0

D9

0

D8

0

D7

D6

D5

D4

D3

D2

D1

D0

0

DGL7

DGL6

DGL5

DGL4

DGL3

DGL2

DGL1

Table 22. CR14 INSTRUCTION DEFINITIONS

Mnemonic

Value

Comment

0

1

Type 1 de−glitch: t

Type 2 de−glitch: t

= t

+ t

DLYx

(default).

PWM_DGL

BLANKx

PRCx

DGLx

= t

PRCx

+ t

DLYx

PWM_DGL

Table 23. CR15: TEST MODE REGISTER

CR15

WD

D10

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0

Factory Use Only

SPI Diagnosis Set

The first 3 bits D[15:13] serve as address bits, while the

13 bits D[12:0] are used as data bits. Output data for “not

used” register adresses is D[11:0] = 0. The address of the

Status Register (SRx) accessed for status information to be

retrieved via a subsequent SPI frame is selected by the

control register bits CR0.SRA_MODE and CR0.SRA[2:0]

(see Table 5, Table 6).

Two different reading modes are provided depending on

the SRA_MODE bit:

• when CR0.SRA_MODE = 0, the SRx address selected

via bits CR0.SRA[2:0] will be used for a single status

read command and the SR address returns to SR0

(device status register, default state) after reading;

All status diagnosis bits are initialized to logic 0 after a reset

event and in normal operation except:

• the NORMAL MODE (NM) bit indicates NORMAL MODE

when SRx.NM = 1;

• the Register Clear Flag (RCF) bit is set (SR0.RCF = 1)

after a mode change to NORMAL MODE

(see § Operating Modes).

The RCF bit indicates that all input and output registers

were initialized; the bit is cleared after SR0 is read.

All status diagnosis bits are latched with the exception of

the SR5.D[3:0] bits (see § Output Status Monitoring). To

de−latch a diagnosis:

• the referring failure has to be removed;

• when CR0.SRA_MODE = 1, the SRx address selected

via bits CR0.SRA[2:0] will be used for the next and all

further status read commands until a new address or

mode is selected.

• the referring failure bit has to be read by SPI diagnosis.

Refer to § Protection and Diagnosis to restart the outputs

after a fault condition. The SPI diagnosis set (output data

map) and output data structure prototype are shown in the

following tables.

The default reading mode and address after VCC POR or

wake−up is CR0.SRA_MODE = 0, CR0.SRA[2:0] = 00.

Table 24. SPI OUTPUT DATA FORMAT

Status Output Message Format

MSB

B15

A2

LSB

B14

A1

B13

A0

B12

NM

B11

D11

B10

D10

B9

D9

B8

D8

B7

D7

B6

D5

B5

D5

B4

D4

B3

D3

B2

D2

B1

D1

B0

D0

3−bit REGISTER

NORMAL

MODE

12−bit OUTPUT DATA

ADDRESS

Table 25. OUTPUT DATA STRUCTURE PROTOTYPE

Output Data Prototype

NM

D11

?

D10

?

D9

?

D8

?

D7

?

D6

?

D5

?

D4

?

D3

?

D2

?

D1

D0

?

SRx

?

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NCV7547

Table 26. SPI OUTPUT REGISTER DEFINITIONS

Defined Status Output Registers (SRx)

D15

A2

0

D14

A1

0

D13

A0

0

D12

Register Name

Device Status

Alias

SR0

SR1

SR2

SR3

SR4

NM

HB 1…6 Status Monitor

HB 7 Status & VDS Monitors

HB 1…6 VDS Monitor

HBx Calibration Result

0

1

0

1

0

1

NM

1

0

SH7, DL7 & HB 1…6 Output Status

Not Used

SR5

SR6

SR7

1

0

1

0

Device ID/Test Mode

1

Table 27. SR0: DEVICE STATUS REGISTER

NM

D11

TM

D10

D9

D8

D7

D6

D5

D4

OVF

D3

0

D2

0

D1

D0

0

SR0

RCF

FSM

SPIF

CPL

CPF

UVF

HB_QSB

Table 28. SR0 RESPONSE DEFINITIONS

Mnemonic

Value

Comment

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

Test mode inactive (default).

Test mode active.

TM

Registers not cleared (command input and status output registers).

Registers cleared (after mode change to “NORMAL”).

FSM input pin = 0 (FSM not asserted).

FSM input pin = 1 (FSM asserted).

SPI message correct.

RCF

FSM

SPIF

CPL

CPF

UVF

OVF

SPI message failure.

Charge pump in regulation

V(CP, VS) < CP

−OR− VS < VSPWM (Charge Pump Low).

LOW

Half bridge high−side pre−driver activation allowed.

Half bridge high−side pre−driver activation not allowed (Charge Pump Fail).

VS supply in normal range.

VS supply below normal range.

VS supply in normal range.

VS supply above normal range.

D3

D2

Not used.

Quick Status Bit: VDS normal – no overload detected.

Quick Status Bit: VDS failure – overload detected (VDS_Hx or VDS_Lx).

Not used.

HB_QSB

D0

Table 29. SR1: HBx STATUS MONITOR REGISTER

NM

D11

D10

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0

SR1

SWH6

SWL6

SWH5

SWL5

SWH4

SWL4

SWH3

SWL3

SWH2

SWL2

SWH1

SWL1

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Table 30. SR1 RESPONSE DEFINITIONS

Mnemonic

Value

Comment

0

1

0

1

GHx output is “low” (default).

GHx output is “high”.

SWHx

GLx output is “low” (default).

GLx output is “high”.

SWLx

Table 31. SR2: HB 7 STATUS & VDS MONITOR REGISTER

SR2

NM

D11

0

D10

0

D9

0

D8

0

D7

0

D6

0

D5

0

D4

0

D3

D2

D1

D0

VDS_H7

VDS_L7

SWH7

SWL7

Table 32. SR2 RESPONSE DEFINITIONS

Mnemonic

Value

Comment

0

1

0

1

0

1

0

1

SH7 high−side power switch normal – no overload detected (default).

SH7 high−side power switch failure – overload detected.

DL7 low−side power switch normal – no overload detected (default).

DL7 low−side power switch failure –overload detected.

GH7 output is “low” (default).

VDS_H7

VDS_L7

SWH7

SWL7

GH7 output is “high”.

GL7 output is “low” (default).

GL7 output is “high”.

Table 33. SR3: HBx VDS MONITOR REGISTER

SR3

NM

D11

D10

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0

NM VDS_H6 VDS_L6 VDS_H5 VDS_L5 VDS_H4 VDS_L4 VDS_H3 VDS_L3 VDS_H2 VDS_L2 VDS_H1 VDS_L1

Table 34. SR3 RESPONSE DEFINITIONS

Mnemonic

Value

Comment

HBx high−side power switch normal – no overload detected (default).

HBx high−side power switch failure – overload detected.

HBx low−side power switch normal – overload detected (default).

HBx low−side power switch failure – overload detected.

0

1

0

1

VDS_Hx

VDS_Lx

Table 35. SR4: HBx CALIBRATION RESULT REGISTER

SR4

NM

D11

0

D10

0

D9

0

D8

D7

D6

D5

D4

D3

D2

D1

D0

CAL_READY CAL_DLY_R[1:0]

CAL_PC_R[1:0]

CAL_DLY F[1:0]

CAL_PC _F[1:0]

Table 36. SR4 RESPONSE DEFINITIONS

Mnemonic

Value

0

Comment

Calibration result not ready or has been read via SPI (default).

CAL_READY

1

Calibration is successfully performed with a valid result (the bit is reset after SPI read command).

Rising slope result: VHBx < 15% (default).

Rising slope result: 15% < VHBx < 85%.

00

01

10

11

00

01

10

11

CAL_DLY_R[1:0]

CAL_PC_R[1:0]

Rising slope result: 85% < VHBx < 95%.

Rising slope result: VHBx >95%.

Rising slope result: VHBx < 5% (default).

Rising slope result: 5% < VHBx < 15%.

Rising slope result: 15% < VHBx < 85%.

Rising slope result: VHBx > 85%.

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NCV7547

Table 36. SR4 RESPONSE DEFINITIONS

00

01

10

11

00

01

10

11

Falling slope result: VHBx > 85% (default).

Falling slope result: 85% > VHBx > 15%.

Falling slope result: 15% > VHBx > 5%.

Falling slope result: VHBx < 5%.

CAL_DLY_F[1:0]

Falling slope result: VHBx > 95% (default).

Falling slope result: 95% > VHBx > 85%.

Falling slope result: 85% > VHBx > 15%.

Falling slope result: VHBx < 15%.

CAL_PC _F[1:0]

Table 37. SR5: HBx OUTPUT STATUS REGISTER

SR5

NM

D11

0

D10

0

D9

0

D8

0

D7

D6

D5

D4

D3

D2

D1

D0

SH_OUT7 DL_OUT7

HB_OUT6 … HB_OUT1

Table 38. SR5 RESPONSE DEFINITIONS

Mnemonic

Value

Comment

SH_OUT7

0

1

0

1

0

1

Output < VHB

Output > VHB

Output < VHB

Output > VHB

Output < VHB

Output > VHB

(default).

THR

THR.

THR

THR.

THR

THR.

DL_OUT7

HB_OUTx7

Table 39. SR7: TEST MODE STATUS REGISTER − SR0.TM = 1: TEST MODE FORMAT

SR7

NM

D11

D10

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0

Factory Use Only

Table 40. SR7: DEVICE ID/TEST MODE STATUS REGISTER − SR0.TM = 0: DEVICE ID FORMAT

SR7

NM

D11

D10

D9

D8

D7

D6

D5

D4

D3

D2

D1

DEV_ID[11:9]

DEV_ID[8:6]

DEV_ID[5:3]

DEV_ID[2:0]

Table 41. SR7 RESPONSE DEFINITIONS: DEVICE ID FORMAT

Mnemonic

ID Type

Value

000

Comment

NCV7547

001

NCV7544

DEV_ID[11:9]

Device Name

010

NCV7546

011−111

000

etc.

Generation 0

Generation 1 etc.

Generation 0 (NCV7547)

First Silicon (REV_n.m)

DEV_ID[8:6]

DEV_ID[5:3]

DEV_ID[2:0]

Generation

Silicon Revision

Mask Revision

001−110

111

000

001

Second Silicon (REV_n+1.m)

etc.

010−111

000

Initial Mask Revision (REV_n.m)

001

First Mask Revision (REV_n.m+1)

etc.

010−111

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NCV7547

Control of Half−bridge Drivers

When not in test mode (SR0.TM = 0), a status request via

CR0.D[10:7] returns SR7.D[11:0] = DEV_ID[11:0] as

defined in Table 41. The default content of SR7 after VCC

POR or wake−up is SR7.D[11:0] = 0.

The DEV_ID[5:0] revision value may be changed based on

whether the entire die (silicon) or intermediate layer (mask)

is affected. The revisions can be e.g. classified accordingly:

The operation of the drivers is controlled by SPI

configuration individually for each driver. All half−bridges can

be operated in 100% “ON” mode as well as in PWM mode.

The control schema for HB1 … HB7 in half−bridge

configuration and for HB7 in split configuration is shown in

Table 44 (see also § SPI Control Set).

The CR0.HB_ENx bits are used to enable the operation of

the selected half−bridges and to re−start the drivers after a

fault condition:

• silicon revision: defined area changed (isolation pocket or

other boundary, bond pad etc. changed/moved) or digital

core changed (isolation pocket changed or unchanged);

• mask revision: interconnect changed (metal and/or

polysilicon/contact/via).

• when CR0.HB_ENx=0, the GHx and GLx outputs are

disabled (i.e. VGS ≈ 0 V);

• when CR0.HB_ENx=1, the GHx and GLx outputs are

enabled.

The mask revision value is set to DEV_ID[2:0] = 000

whenever the die revision is incremented. Table 42 shows

how the value encoding scheme is used to indicate the device

revision level.

The CR1.HB_CFG7 bit is used to enable the split

configuration of half−bridge HB7:

• when CR1.HB_CFG7=0, HB7 is in operating in

half−bridge configuration;

Table 42. DEVICE REVISION LEVEL ENCODING

• when CR1.HB_CFG7=1, HB7 is in operating in split

Silicon Revision

DEV_ID[5:3] LEVEL

Mask Revision

DEV_ID[2:0] LEVEL

configuration.

NOTE: When operating HB7 in split configuration, both

the high−side and low−side switches are in

ON−state simultaneously. Therefore the

CR1.HB_CFG7 bit should only be set to ‘1’

when the application hardware is configured

correctly. In case of erratic hardware

000

001

010

011

100

101

110

111

A

B

C

D

E

F

000

001

010

011

100

101

110

111

0

1

2

3

4

5

6

7

configuration, VDS overload monitoring

protects the external power switches.

G

H

The CR1.HB_MODEx bits are used to control the polarity

of the selected half−bridge:

• when CR1.HB_MODEx=0, the low−side driver (PDL)

Half−bridge Gate Drivers

is in an ON state (i.e. GLx = VGS ≈ V

, see

PDLX

The half−bridge drivers are used to control the gates of

external logic−level NMOS power switches. Drivers HB1

… HB6 are dedicated to e.g. motor control – the switches are

normally connected in half−bridge configuration. HB7 is

dedicated to e.g. heater control – the switches are normally

connected independently in a split configuration but may be

optionally connected in a half−bridge configuration (see

Figure 2). The device is initialized at power−up into a reduced

power state (CR1.DRV_EN = 0, see Table 7, Table 8):

§ Electrical Characteristics: Half−Bridge Pre−Driver

Outputs);

• when CR1.HB_MODEx=1, the high−side driver (PDH)

is in an ON state (i.e. GHx = VGS ≈ V , see

PDHX

§ Electrical Characteristics: Half−Bridge Pre−Driver

Outputs).

The CR2.HB_PWMx bits are used to enable PWM mode

control of the selected half−bridge:

• when CR2.HB_PWMx=0, an output is in 100% ON

state according to its CR1.HB_MODEx bit;

• when CR2.HB_PWMx=1, an output is in PWM with

state according to its CR1.HB_MODEx bit.

• the charge pump is disabled;

• all gate drive currents are disabled.

• HBx diagnostic test currents are available (see

§ Monitoring of Half−bridge Drivers in OFF−state).

The device is placed into a full power state when

CR1.DRV_EN = 1. The half−bridges are held in

high−impedance state (external NMOS are off) via gate

pull−down structures which are activated during power−up,

while in reduced power state, or when in sleep mode.

The application of a PWM mode selected via the

CR2.HB_PWMx bits to the corresponding output is

performed asynchronous to the PWMx input (i.e. a change

is applied after the rising edge of the CSB signal). Each

half−bridge can be controlled in PWM mode by one of the

PWMx inputs as selected via the CR3.PWMx[1:0] bits

according to Table 43 (see also Table 11, Table 12):

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26

NCV7547

The application of a selected PWMx input signal routing

Table 43. CR3A/CR3B: PWM SOURCE SELECTION

to the corresponding output is performed asynchronous to

the PWMx input (i.e. a change is applied after the rising edge

of the CSB signal).

The selected output is controlled via the selected

positive−logic PWMx input (see Figure 8):

PWMx1

PWMx0

PWM Source Selection

0

1

0

1

0

1

Output PWM source is input PWM1

Output PWM source is input PWM2

Output PWM source is input PWM3

Output PWM source is input PWM4

• when input PWMx=0, the driver defined by its

HB_MODEx bit is turned OFF (i.e. VGS ≈ 0 V) and its

complementary gate driver is turned ON (i.e. VGS ≈

V

PDHX

or VGS ≈ V

);

PDLX

Table 44. HBx DRIVER CONTROL

CR0

CR1

CR2

External MOS Power

HB_ENx

HB_CFG7*

HB_MODEx

HB_PWMx

Switches Operation Mode

Output

Comment

0

1

X

0

1

X

0

1

0

1

X

0

1

X

0

1

0

1

HBx “OFF”

Disable (HBx = Hi−Z)

Low−side “ON”

HB1...HB7

Half−bridge

Configuration

100% “ON”

High−side “ON”

Low−side PWM

PWM Mode

100% “ON”

High−side PWM

Low−side & high−side “ON”

Low−side “ON”, high−side PWM

High−side “ON”, low−side PWM

HB7

Split

Configuration

PWM Mode

*HB_CFG7 = X for HB1...HB6 operations.

Switching Behavior of Half−bridge Drivers

• when input PWMx=1, the driver defined by its

HB_MODEx bit is turned ON (i.e. VGS ≈ V

The external high−side NMOS switches are controlled

with gate pre−charge and slew phases, while the external

low−side switches are controlled via simple drive stages

supplying a nominal 4x multiple of the selected high−side

driver slew current (see Figure 9 and § Electrical

Characteristics: Pre−driver Slope Control). The timing for

the gate drivers is provided by the digital logic, where the

key parameters can be programmed via SPI in order to adapt

different MOSFET types and application switching speeds.

Each individual half−bridge can be programmed via three

configuration registers, e.g. CR5A and CR5B for HB1, and

CR14 (see § SPI Control Set, Table 15 − Table 17 and

Table 21, summarized in Table 45):

or

PDHX

V

) and its complementary gate driver is turned

PDLX

OFF (i.e. VGS ≈ 0 V).

When multiple PWMx inputs are needed to be active, the

scheduled PWM signals should be offset in time to avoid

degradation of the VDS overload detection due to crosstalk

(see § Overload Protection). The minimum offset should be

based on the t

times appropriate for the respective

PWM_DGL

channels (see § Switching Behavior of Half−bridge Drivers,

Figure 10 and Figure 11).

NOTE: The PWM source selection logic does not

prevent more than one half−bridge output to be

controlled by the same PWMx input.

Table 45. HALF−BRIDGE CONFIGURATION REGISTERS

WD

D10

0

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0

CR5A – CR11A

CR5B – CR11B

CR14

BLANKx[1:0]

I_PCFx[2:0]

I_PCRx[2:0]

T_PCx[1:0]

WD

D10

1

D9

D8

D7

D6

D4

D3

D1

D0

VDSx[2:0]

T_DLY[3:0]

SR_CTRL[2:0]

WD

D10

0

D9

0

D8

0

D7

0

D6

D5

D4

DGL5

D3

D1

D0

DGL7

DGL6

DGL4

DGL3

DGL2

DGL1

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NCV7547

GHx

GLx

0

time

PWMx

HB_PWMx

Low-side

High-side

High-side PWM

Low-side PWM

ON

HB_MODEx

HB_ENx

0

time

Note 1. GLx and GHx are for the same HBx output control (e.g. HB1: GL1, GH1).

Note 2. GLx and GHx time offset from PWMx via adaptive PWM input de-glitch not shown.

Figure 8. Gate Drive Operation in PWM Mode

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NCV7547

For each individual half−bridge:

• cross−conduction blanking time is selected via the

BLANKx[1:0] bits;

• pre−charge current is selected via the I_PCRx[2:0]

bits for the rising slope and via the I_PCFx[2:0]

bits for the falling slope;

Please refer to § Electrical Characteristics for defined

blanking (t ), pre−charge (t ,

PRCX_R

,

I

BLANKX

PRCX

I

), slew (I

PRCX_F

), delay (t

) and VDS threshold

SRX

DLYX

(VDS

) parametric values.

THRX

NOTE: A proper initial switching parameter set (e.g.

VDS , t , I , I ) for a

I

THRX PRCX PRCX_R SRX, PRCX_F

• pre−charge time for both slopes is selected via the

chosen MOSFET has to be evaluated for a

desired switching speed (see also § Overload

Protection).

T_PCx[1:0] bits;

• slew current for both slopes is selected via the

SR_CTRLx[2:0] bits – this parameter controls the

external NMOS switches’ rise/fall times to adopt proper

EMC performance and minimize switching losses;

• VDS overload detection delay is selected via the

T_DLYx[3:0] bits – this parameter controls when the

VDS overload detection is performed (see § Overload

Protection);

• VDS overload detection threshold is selected via the

VDSx[2:0] bits – this parameter controls the VDS

monitoring comparator threshold (see Table 17,

Table 18);

• adaptive PWM input de−glitch construction when in

half−bridge configuration is selected by DGLx[6:0] bits

(see Figure 10, Figure 11, Table 21 and Table 22).

When operated in PWM mode, the PWMx input signals

are each provided with a symmetrical de−glitch within a

)

half− bridge’s control logic. The de−glitch time (t

PWM_DGL

,

is adapted to the SPI settings t

t

and

BLANKX PRCX DLYX

DGLx as selected for each channel (see § Electrical

Characteristics: Half−Bridge Pre−Driver Outputs &

Pre−driver Slope Control).

The adapted t

avoids mistreatment of the

PWM_DGL

half−bridge drivers by ensuring that a complete turn−on or

turn−off sequence is executed (erratic pulse widths are

thereby avoided) and assures correct operation of the VDS

overload protection (see § Overload Protection).

PWMx_DGL

1

< DEGLITCHED INTERNAL SIGNAL >

time

0

t_BLANK

I(GHx)

t_PRCx

t_TIMEOUT

−I

PRCX_R

−I

SRX

−I

GHx_SS

0

time

+I_SRX

+I_{PRCX_F}

I(GLx)

−I

LSX

0

time

+I_LSX

Figure 9. Gate Drive Current Evolution

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29

NCV7547

t

_{PWM_DGL}+ t_PRCX) t_DLYX

In order to not overload the charge pump circuit in case of

(eq. 2)

loss of VS or in case of a disconnected security switch, the

When operating HB7 in PWM mode and in split

configuration, the adapted time is type 2 (CR14.DGL7 = X).

steady state output current of the high−side gate drivers is

(

limited to I

after t

see I(GHx) in Figure 9

GHX_SS

TIMEOUT

NOTE: To avoid synchronization issues, the de−glitch

type must be selected before beginning PWM of

a load.

Once a switching parameter set for EMC optimization and

stable VDS overload detection has been chosen, the

allowable duty ratio (D) is bounded by the selected adaptive

de−glitch type and PWM frequency such that:

and § Electrical Characteristics: Half−Bridge Pre−Driver

Outputs).

NOTE: Driver turn−ON/OFF via SPI (i.e.

CR1.HB_MODEx bits) includes both the

pre−charge and slew phases, but adapted

de−glitch strategy is not applied.

When operating HB1…HB7 in PWM mode and in

half−bridge configuration, type 1 de−glitch is selected when

CR14.DGLx = 0 (see Figure 10) and the adapted time is

given by:

ǒ

Ǔ

f_PWM t_PWMv D v 1 * f_PWM t_PWM

(eq. 3)

DGL

When operating HB1…HB7 in PWM mode and in

half−bridge configuration, the timing of the gate drivers is

according to Figure 12.

t

_{PWM_DGL}+ t_BLANKX) t_PRCX) t_DLYX

(eq. 1)

Type 2 de−glitch is selected when CR14.DGLx = 1 (see

Figure 11) and the adapted time is given by:

PWMx

1

0

time

t_PRCx

t_DLYx

t_PRCx

t_DLYx

t_BLANKX

t_{PWM_DGL}

PWMx_DGL

1

0

< DEGLITCHED INTERNAL SIGNAL >

time

Type 1 PWM De−glitch

_{PWM_DGL}= t_BLANKX+ t_PRCX+ t_DLYX

t

Figure 10. Type 1 PWMx Input De−glitch − CR14.DGLx = 0

PWMx

1

0

time

t_PRCx

t_DLYx

t_PRCx

t_DLYx

t_{PWM_DGL}

PWMx_DGL

1

0

< DEGLITCHED INTERNAL SIGNAL >

Type 2 PWM De−glitch

t

_{PWM_DGL}= t_PRCX+ t_DLYX

Figure 11. Type 2 PWMx Input De−glitch − CR14.DGLx = 1

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30

NCV7547

PWMx_DGL

1

0

< DEGLITCHED INTERNAL SIGNAL >

time

t_BLANK

t_PRCx

t_BLANK

t_PRCx

V(GHx)

V_PDHX

V_GSP

V(HBx)

V(GLx)

V_PDLX

time

PGND

V(HBx)

time

t_DLYx

t_BLANK

t_DLYx

VS

0.9 VS

0.5 VS

VHB_THR

0.1 VS

GND

time

High−side

VDS Overload

Detection

Low−side

VDS Overload

Detection

Figure 12. HBx Output Switching in Half−Bridge Configuration

Slope Control Calibration Unit

When operating HB7 in PWM mode and in split

configuration, both the high−side and low−side drivers can

be in the ON−state simultaneously. Cross−conduction does

A slope control calibration unit is implemented in order to

allow adjustments to a selected MOSFET’s initial switching

parameter set and to verify proper setting of the high−side

gate drivers (GHx). The calibration assists optimizing EMC

performance and alignment of the GHx switching slopes

with the VDS overload detection delay time and threshold

to assure stable behavior of the protection strategy (see

§ Overload Protection).

not occur however, therefore t

is not needed and the

BLANK

timing of the gate is according to Figure 13 (e.g.

HB_CFG7=1, HB_PWM7=1, HB_MODE7=0 is shown).

In either configuration, in the pre−charge phase (V

<

GHX

V

GSP

) the GHx output delivers the selected rise (I

)

PRCX_R

or fall (I

) current for the selected time (t

), and in

PRCX_F

PRCx

A calibration detection unit, consisting of 4 multiplexed

high−speed comparators, samples the voltage at the desired

the slew phase (V

delivers the selected current (I

≤ V

SRX

) the GHx output

) for up to the gate drive

GSP

GHX

PDHX

HBx input at a selected calibration sample time (see

timeout time (t

). After t

, the GHx output

). The GLx output

TIMEOUT

,

t

in § Electrical Characteristics: Slope

delivers the timeout current (I

CAL_PCx CAL_DLYx

GHx_SS

Control Calibration Unit). A complete calibration cycle

consists of sampling both the rising and falling switching

slopes, and the encoded calibration result is stored in the

device’s calibration register (SR4).

always delivers a multiple (I ) of the selected slew current

(see Figure 9 and § Electrical Characteristics: Half− Bridge

LSX

Pre−Driver Outputs, Pre−driver Slope Control)

.

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31

NCV7547

PWMx_DGL

1

0

< DEGLITCHED INTERNAL SIGNAL >

time

t_BLANK

t_PRCx

t_BLANK

t_PRCx

V(GH7)

V_PDHX

V_GSP

time

V(SH7)

V(GL7)

V_PDLX

PGND

V(SH7)

time

t_DLYx

t_BLANK

t_DLYx

VS

0.9 VS

0.5 VS

VHB_THR

0.1 VS

GND

time

High−side

VDS Overload

Detection

Low−side

VDS Overload

Detection

Figure 13. HB7 Output Switching in Split Configuration

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NCV7547

Calibration is enabled when the calibration register (CR4)

and falling edges are completed (see Figure 13). The

detection results are stored in the calibration result register

SR4 (summary Table 46 − see also Table 33):

is written (summary Table 46 − see also Table 13):

• the desired HBx input is selected by the

CR4.CAL_SEL[2:0] bits where the resulting binary

code refers directly to the selected half−bridge

(e.g. 100 = HB4);

The CAL_READY bit indicates that when:

• SR4.CAL_READY = 0, calibration has not been

executed OR the calibration result has been read;

• SR4.CAL_READY = 1, successful detection was

performed for both slopes AND a valid comparator

output state is delivered.

• the detection pre−charge and delay sample times

(t

and t

) for calibration of the desired

CAL_PCx

CAL_DLYx

input are selected individually by the

CR4.CAL_PC[3:0] bits and by the

CR4.CAL_DLY[3:0] bits for both the rising and falling

slopes.

As long as the CAL_READY bit is not set (≠ 1), the

calibration of a particular slope for the selected channel may

be repeated. Calibration may be terminated by sending

CR4.CAL_SEL[2:0] = 000.

The calibration result is encoded in the SR4.

CAL_PC_R[1:0] bits and the SR4.CAL_DLY_R[1:0] bits

for the rising slope and in the SR4. CAL_PC_F[1:0] bits and

the SR4.CAL_DLY_F[1:0] bits for the falling slope

according to Table 47.

The calibration unit is turned off when

CR4.CAL_SEL[2:0] = 000 (POR default) is selected (see

also Table 14).

Detection is started with the next edge of a routed PWMx

input signal (see § Control of Half−bridge Drivers) on the

selected channel and detection is finished when both rising

Table 46. HBx CALIBRATION CONTROL AND RESULT REGISTERS

WD

D10

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0

CR4

CAL_DLY[3:0]

CAL_PC[3:0]

CAL_SEL[2:0]

NM

D11

0

D10

D9

0

D8

D7

D6

D5

D4

D3

D2

D1

D0

SR4

0

CAL_READY CAL_DLY_R[1:0]

CAL_PC_R[1:0]

CAL_DLY F[1:0]

CAL_PC _F[1:0]

Table 47. CALIBRATION RESULT RELATIVE TO HBx SAMPLE TIME

Relative HBx Level Detected

at Selected Sample Times

Mnemonic

Value

Comment

Start of Rising Slope

00

01

10

11

VHBx < 5%

5% < VHBx < 15%

15% < VHBx < 85%

VHBx > 85%

Pre−charge too low.

Pre−charge within target.

Pre−charge too high.

CAL_PC_R[1:0]

Pre−charge far too high.

End of Rising Slope

CAL_DLY_R[1:0]

00

01

10

11

VHBx < 15%

15% < VHBx < 85%

85% < VHBx < 95 %

VHBx >95%

Transition far too slow.

Transition slightly too slow.

Gate drive setting correct.

Transition too fast.

Start of Falling Slope

CAL_PC _F[1:0]

00

01

10

11

VHBx > 95%

95% > VHBx > 85%

85% > VHBx > 15%

VHBx < 15%

Pre−charge too low.

Pre−charge within target.

Pre−charge too high.

Pre−charge far too high.

End of Falling Slope

CAL_DLY_F[1:0]

00

01

10

11

VHBx > 85%

85% > VHBx > 15%

15% > VHBx > 5%

VHBx < 5%

Transition far too slow.

Transition slightly too slow.

Gate drive setting correct.

Transition too fast.

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NCV7547

The temporal position (see Figure 13) of the target

transition detection point (e.g. 10%, 90%) with respect to

or t (or in normal operation, t ) of

• the I

slew phase current setting.

SRX

Calibration may be performed at the application level

during module end−of−line (EOL) test where the (adjusted)

settings may be stored in a microcontroller’s EEPROM. In

order to maintain stable function and proper EMC

performance with temperature drift and output load

variations, the calibration can be verified/updated on a

sample basis during normal application operation.

t

CAL_PCx

CAL_DLYx

DLYX

the channel selected for calibration is dependent upon:

• the PWMx_DGL resulting from the channel’s operating

configuration (see § Switching Behavior of Half−bridge

Drivers, Figure 10 and Figure 11);

• the t

cross−conduction blank time setting as

BLANKX

applicable;

• the t , I

and I

pre−charge phase time

PRCX PRCX_R

and current settings;

PRCX_F

PWMx_DGL

< DEGLITCHED INTERNAL SIGNAL >

PWMx_DGL

BLANK

t_BLANKx

t_BLANKxt_BLANKx

t_PRCx

PRE−CHARGE

t_DLYx

(Low−side Overload)

SLEW

(High−side Overload)

time

V(HBx)

V_{CALR_U}

90%

V_{CALR_L}

95%

85%

RISING

SLOPE

FALLING

SLOPE

V_{CALF_U}

15%

10%

V_{CALF_L}

5%

time

CALx

t_{CAL_PCx}

CAL PRE−CHARGE

CAL SLEW

t_{CAL_DLYx}

CAL_PC_R[1:0]

CAL_DLY_R[1:0]

CAL_PC_F[1:0]

CAL_DLY_F[1:0]

“01”

“10”

“01”

“10”

“1”

CAL_READY

time

Figure 14. HBx Slope Control Calibration

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NCV7547

OVERLOAD PROTECTION

Overload Protection

• the SR0.HB_QSB Quick Status Bits and the

appropriate VDS_Hx or VDS_Lx bit is latched in the

corresponding VDS monitor status register (SR2:

HB1...HB6 and SR3: HB7 − see Table 31 thru

Table 34).

A VDS monitoring technique is used to protect the

external MOS power switches in case of overload resulting

from short circuit conditions applied before or during the

turn−on process of the power switches (“short circuit 1”

condition), and short circuit conditions applied after the

turn−on process of the power switches (“short circuit 2”

condition).

The thresholds of the VDS monitoring comparators

(CMP1 and CMP2 in Figure 15 and Figure 16) are SPI

programmable for each individual half−bridge via the

VDSx[2:0] bits in the HBx configuration “B” registers. An

When a switch is in the ON−state and its drain−source

voltage exceeds the programmed VDS threshold (“short

circuit 2” condition, t > t

):

DLYx

• the corresponding half−bridge’s GHx and GLx drivers

are latched off immediately after the fixed de−glitch

time t

;

DGL_STAT

• the SR0.HB_QSB Quick Status Bits and the

appropriate VDS_Hx or VDS_Lx bit is latched in the

corresponding VDS monitor status register.

overload detection delay time parameter (t

) – which

DLYx

controls when the VDS overload detection is performed – is

also SPI programmable via the T_DLY[3:0] bits in the HBx

configuration “B” registers (see Table 17, Table 18 and

§Electrical Characteristics: Half−Bridge Diagnostics).

When a switch is in the turn−on process and its

drain−source voltage already exceeds the programmed VDS

threshold (“short circuit 1” condition):

Please refer to §Output Fault (Local) Protection to restart

the half−bridge drivers after a shutdown event.

NOTE: Additional protection via use of current sensing

in the low−side path of the power MOSFETs

(see Figure 2) may be necessary in order to

• the corresponding half−bridge’s GHx and GLx drivers

avoid destruction due to soft short condition.

are latched off immediately after the selected delay

time t

plus a fixed de−glitch time t

;

DLY

DGL_STAT

HB1...HB6 Diagnostic & Overload Protection

(Half−bridge Configuration)

CR1.D[5:0]

HB_MODEx

VDS_{THR_S}

VS

t_DLY

+

t_{DGL_STAT}

CMP1

SECURITY

SWITCH

−

STATIC VDS

VBAT_P

GHx

(reset dominant)

R

Q

PDH

LATCH

Q

S

VDS_HX

HBx

LOAD

SR3.D[11:0]

VDS_LX

S

Q

GLx

PDL

LATCH

R

(reset dominant)

STATIC VDS

3−5

mW

+

PGND

CMP2

t_{DGL _STAT}

t_DLY

−

VDS_{THR_S}

SR5.D[5:0]

HB_OUTx

+

CMP3

VHB_THR

−

TRANSPARENT VS /2

= INDIRECT PATH

Figure 15. HB10HB6 Diagnostic and Overload Protection

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35

NCV7547

HB7 Diagnostic & Overload Protection

(Split Configuration )

CR1.D[6]

HB_MODE7

TRANSPARENT VS /2

VHB_THR

−

SH_OUT7

SR5.D[7]

CMP4

+

VDS_{THR_S}

VS

t_DLY

t_{DGL_STAT}

+

CMP1

SECURITY

SWITCH

−

STATIC VDS

VBAT_P

GHx

(reset dominant)

R

Q

PDH

LATCH

Q

S

VDS_H7

SH7

DL7

SR2.D[3:2]

VDS_L7

LOAD

S

Q

GLx

PDL

LATCH

R

(reset dominant)

STATIC VDS

3−5

mW

+

PGND

CMP2

t_{DGL _STAT}

t_DLY

−

VDS_{THR_S}

SR5.D[6]

DL_OUT7

+

CMP3

VHB_THR

−

TRANSPARENT VS /2

= INDIRECT PATH

Figure 16. HB7 Diagnostic and Overload Protection

Gate Protection Features

OFF−state Monitoring of Half−bridge Drivers

The half−bridge gate drivers provide integrated gate

protection features for the external power MOSFETs:

In order to support functional safety and to avoid

unintended motor activation, the status of each of the

half−bridge gate drivers can be monitored by SPI diagnosis

(see § Gate Driver Status Monitoring). The switch nodes

(i.e. HBx) status can be monitored by SPI communication

via the half−bridge output status register (SR5.D[7:0] − see

Table 35, Table 36). The system response depends on the

load configuration; the test procedure has to be provided by

the supervising microcontroller.

• a passive pull−down resistor R

keeps the MOSFET

GSX

in OFF−state, when no control of the device is available

(see § Package Pin Description and § Electrical

Characteristics: Half−Bridge Pre−Driver Outputs);

• a clamping structure limits the gate−source voltage to

+V

or to −V

in order to protect the

GSX_CLP

GSX_CLN

power MOSFETs from destruction via e.g. gate oxide

failure (see § Electrical Characteristics: Half−Bridge

Pre−Driver Outputs).

Several test current sources (I

– see § Electrical

TST

Characteristics:

Half−Bridge

Diagnostics)

and

comparators are implemented in order to provide OFF−state

diagnosis of the power MOSFET half−bridges.

The resistors and clamping structures are available in all

operating modes, including SLEEP MODE and in case of loss

of supply voltage.

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36

NCV7547

The diagnostic consists of (see Figure 14 and Figure 15):

• a high−side and a low−side test current source at each

odd−numbered HBx feedback input;

• a comparator (CMP5) at each HBx feedback input.

activated individually by the TST_HSx and TST_LSx bits

in the HB diagnosis register (CR12.D[5:0] − see Table 19,

Table 20). Active pull−down current sources are disabled in

all GHx when any test current is activated via CR12. Passive

pull−down structures are always present.

Provided the device is in NORMAL MODE (see §Operating

Modes) and no global failure (see § Device Fault (Global)

Protection) has been detected, the test current sources can be

NOTE: Both TST_HSx and TST_LSx test currents can

be turned on simultaneously.

… HB

HB1

6 OFF−State Diagnostic

HB7 OFF−State Diagnostic

VS

I_TST

R

HB1, HB3,

CR12.TST_HS7

HB5

CR12.TST_HSx

SH7

+

SR5.SH_OUT7

SR5.DL_OUT7

CMP4

SR5.D[3:0]

HB_OUTx

HB1 ... HB6

+

−

CMP5

VHB_THR

−

DL7

I_TST

+

I_TST

R

CMP3

VHB_THR

HB1, HB3,

HB5

−

CR12.TST_LSx

CR12.TST_LS7

PGND

AGND

= INDIRECT PATH

Figure 17. Half−bridge OFF−state Diagnostic

Operating Modes

SR0.RCF bit inside the device status register is set (see

Table 27, Table 28).

The device enters FAILSAFE MODE when the device is

active and either a SPI failure condition is detected or the

external fail input (FSM) is activated i.e. FAILSAFE =

(RSTB = 1) AND [(SPIF=1) –OR– (FSM=1)].

The operating modes of the device are shown in the

diagram of Figure 16. The logic input pin pull up / pull down

resistors and the integrated gate protection pull−down

resistors and clamping structures (see § Gate Protection

Features) are available in all operating modes.

The SLEEP MODE is the default mode after applying VCC

In FAILSAFE MODE:

• the half−bridge gate drive outputs (GHx, GLx) are

disabled immediately;

• the HBx test currents (see § OFF−state Monitoring of

Half−bridge Drivers) are disabled immediately;

• the CPSW output is deactivated (the external MOS

half−bridge switches may be locked additionally by an

optional external security switch which can be under

control of a separate supervisory microcontroller (see

“WD_EN” in Figure 2) in order to support functional

safety even in case of logic issues/single point failures);

(VCC < VCC ) and while VCC > VCC

PORF

(power−on

PORR

reset) prior to wake−up of the device. During SLEEP MODE:

• the device is inactive and all outputs are disabled.

The device enters NORMAL MODE after applying the

wake−up signal (i.e. RSTB 0 → 1). During NORMAL MODE:

• the device is active (RSTB = 1);

• the entire device functionality is available;

• the SPI can be used to provide control and diagnosis of

the device.

When the device enters NORMAL MODE the internal

registers and settings are cleared to default values and the

• the charge pump is disabled;

• SPI control is not possible.

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37

NCV7547

VCC < VCC_POR

VCC > 0

SLEEP

MODE

VCC < VCC _POR

−OR−

VCC < VCC_POR

−OR−

RSTB = 0

VCC>VCC _POR

−AND−

RSTB=1

FAILSAFE

MODE

NORMAL

MODE

FSM = 0

−AND−

SPIF = 0

SRx.NM = 0

SRx.NM = 1

FSM = 1 −OR− SPIF = 1

Figure 18. Operating Modes State Diagram

Although SPI control of the outputs is not possible in

FAILSAFE MODE, the status registers are not cleared during

the transition from NORMAL MODE to FAILSAFE MODE. The

device status therefore is accessible in FAILSAFE MODE as

long as the SPI interface is available (i.e. as long as VCC is

present). The SPI can thus be used in FAILSAFE MODE to

provide limited diagnosis of the device (CR0.SRA_MODE,

CR0.SRA[2;0]) and to re−enter NORMAL MODE.

Re−entering NORMAL MODE after FAILSAFE MODE is

achieved by toggling the WD bit while FSM = 0. After this

mode change the internal registers and settings are cleared

and the SR0.RCF bit inside the device status register is set

(see Table 27, Table 28).

PROTECTION AND DIAGNOSIS

NOTE: An external aluminum electrolytic capacitor at

the VS terminal is necessary to handle the

turn−off energy of the motors in emergency

condition.

again and the restart will not be successful. The restart will

be only successful after the error condition is removed. It is

recommended to use OFF state diagnosis (see § OFF−state

Monitoring of Half−bridge Drivers) to check the HBx node

for any failure condition before restarting the output.

Output Fault (Local) Protection

The external power MOSFET switches are protected

against overload condition (see § Overload Protection) in

NORMAL MODE by VDS monitoring. In case of a VDS

overload failure, the corresponding pre−driver outputs are

latched off (GHx = L AND GLx = L) after a de−glitch time

and the status is reported in the VDS monitor register SR3

(see Table 32).

Device Fault (Global) Protection

The device is protected against all relevant failure

conditions inside the automotive application. In case of a

fault condition, the affected outputs are latched off

immediately after a de−glitch time and the status is reported

the device status register (SR0 − see Table 27, Table 28).

To restart the device:

To restart a faulted half−bridge:

• the diagnosis has to be de−latched by reading the

corresponding failure flag;

• the output has to be restarted via the corresponding bits

in the CR0.HB_ENx register (see § SPI Control Set).

• the diagnosis has to be de−latched by reading the

corresponding failure flag (see § SPI Diagnosis Set);

• the functionality has to be restarted by use of the

corresponding control bit (see § SPI Control Set).

Charge Pump Monitoring

As long as a failure flag is not de−latched via SPI status

read, a faulted output cannot be turned back on. If the failure

condition is still present at a restart, the error flag will be set

The high−side pre−driver outputs are protected by charge

pump monitoring (see § Charge Pump, Figure 5 and

Figure 6):

www.onsemi.com

38

NCV7547

• when the battery supply voltage VS is below the

minimum supply voltage for a regulated charge pump

voltage OR V(CP,VS) drops below the minimum

• GH pull−down current is reduced to 1 mA

X

typ.(register contents are not changed − the current will

revert to its prior value after VS over−voltage is

resolved);

output voltage CP

this status is reported by the

LOW

SR0.CPL bit in the device status register immediately

after a de−glitch time t (see Table 27,

• the HBx test currents (see § OFF−state Monitoring of

Half−bridge Drivers) are disabled immediately.

CPL_DGL

Table 28). During this condition it should be considered

for the microcontroller to adopt a PWM duty ratio

management schema in order to minimize charge pump

loading while ensuring smooth motor operation.

The VS over−voltage condition is reported by the

SR0.OVF bit in the device status register (see Table 27,

Table 28). When the battery supply voltage is in

over−voltage condition VS > VS

the SR0.CPF bit is

OVSDR

• when the charge pump output voltage V(CP, VS) drops

masked. Please refer to § Device Fault (Global) Protection

to restart the outputs after a shutdown event.

A VCC overvoltage condition can occur during

breakdown of the external voltage regulator. Please refer to

§ Failure of External Voltage Regulator for details.

below the charge pump fail threshold CP , the half

FAIL

bridge high−side and low−side gate drivers are latched

off immediately after a de−glitch time t and the

CPF_DGL

status is reported by the SR0.CPF bit in the device

status register (see Table 27, Table 28).

• when the battery supply voltage VS is in the nominal

Under Voltage Condition

operation range VS

< VS < VS

the full

PWM

OVSDR

In case of VS under voltage condition:

• all outputs (GHx, GLx) are disabled immediately after

PWM operation of the GHx and GLx outputs is

allowed;

the de−glitch time t

and the condition is reported

UVDGL

• when the battery supply voltage is in over−voltage

by the SR0.UVF bit in the device status register (see

Table 27, Table 28);

condition VS > VS , the SR0.CPF bit is masked;

OVSDR

• when the battery supply voltage is in over−voltage

• the charge pump circuit and the switched charge pump

output (CPSW) are still functional in order to keep the

optional reverse battery and security switches active.

condition VS < VS < CP the charge pump

OVSDF

OV

− including the CPSW output − is functional but the

GHx outputs are shut down;

Please refer to § Device Fault (Global) Protection to

restart the outputs after a shutdown event.

In case of VCC under voltage condition (power−on reset

• when the battery supply voltage exceeds the maximum

supply voltage for the charge pump VS > CP the

OV

charge pump is disabled and the charge pump buffer

capacitor is discharged to VS in order to protect the

device from destruction.

condition, VCC < VCC

):

POR

• the device enters SLEEP MODE immediately without

de−glitch time;

• logic input pull−up/down resistors, GHx & GLx output

pull−down resistors, and VCC under voltage lockout

assure safe operating states for all outputs.

Please refer to § Device Fault (Global) Protection to

restart the outputs after a shutdown event.

Over−voltage Condition

During VS over−voltage, the behavior of the gate drivers

(GHx and GLx) depends on the programmed operation

mode:

To restart the device after this condition a wake−up

sequence is necessary (see § Operating Modes).

• the high side gate drivers (GHx) are latched off

Logic I/O Plausibility Check

The logic I/O pins are protected against mistreatment by

input de−glitch circuits. The de−glitch circuits are

implemented digitally, refer to § Electrical Characteristics:

Digital I/O for values.

immediately after de−glitch time t

(see

OVDGL

§ Electrical Characteristics: VS Supply) in order to

protect the application from over load condition; while

the low−side gate driver outputs (GLx) are operable in

order to provide controlled braking (e.g. for lift gate

motors);

www.onsemi.com

39

NCV7547

FUNCTIONAL SAFETY SUPPORT STRATEGY

The device uses a closed−loop verification strategy in

microcontroller by means of the SPI communication (see

Figure 14 and § SPI Diagnosis Set):

order to avoid mistreatment of the outputs and to support

functional safety. The verification strategy is implemented

based on the features in the following sections.

The output voltage levels of the half−bridge switches are

monitored by the transparent VS/2 comparators. The

comparator states are not latched and the current node states

are indicated by the HB_OUTx bits in the SR5 half−bridge

output status register. The controller can use the motor status

information for correlation of the operating mode, OFF state

diagnosis, or for controlled brake activation.

SPI Communication Monitoring

The SPI is protected against communication errors by use

of the WD toggle bit and protocol check features (see § SPI

Interface). In case of SPI communication error the device

enters FAILSAFE MODE immediately (see § Operating

Modes). A correct communication is reported in the NM bit

(see § SPI Diagnosis Set).

External Fail Mode Activation

The FAILSAFE MODE can be also activated by an external

signal (e.g. watchdog circuitry) via the FSM input. In case

of a malfunction of the microcontroller, an external

watchdog can cause the device to enter FAILSAFE MODE (see

§ Operating Modes).

Gate Driver Status Monitoring

The correct activation of the half−bridge drivers can be

monitored by the microcontroller by means of SPI

communication (see § SPI Diagnosis Set). The switching

status of the output drivers is indicated by the SWLx and

SWHx bits in the half− bridge status monitor register SR1.

The bit value corresponds to the logic status of the driver. In

PWM mode, both SWHx = 1 and SWLx = 1.

Failure of External Voltage Regulator

In case of breakdown of the external voltage regulator, the

device and the application’s VCC node may be protected

against overload by use of an optional external voltage

In case of a discrepancy between control data and status

information from the device, the microcontroller has to

drive the device into FAILSAFE MODE in order to avoid

mistreatment of the motor drives, then transition the device

to NORMAL MODE for reprogramming.

limiter circuit which must limit the voltage to VCC

Figure 2 and § MAXIMUM RATINGS).

The SPI port’s SO pin is protected against reverse biasing

by use of a back−to−back switch. The reverse voltage for this

(see

MAX

condition is limited to V_SO

(see § MAXIMUM

MAX

RATINGS).

Output Status Monitoring

The status of the MOS switches and the motor connection

lines can be monitored during NORMAL MODE by the

FLEXMOS is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.

www.onsemi.com

40

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

QFNW48 7x7, 0.5P

CASE 484AJ

ISSUE C

DATE 20 NOV 2019

1

48

SCALE 2:1

EXPOSED

COPPER

GENERIC

MARKING DIAGRAM*

A

= Assembly Location

1

WL = Wafer Lot

YY = Year

WW = Work Week

XXXXXXXX

AWLYYWWG

G

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “G”, may

or may not be present. Some products may

G

= Pb−Free Package

(Note: Microdot may be in either location) not follow the Generic Marking.

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DOCUMENT NUMBER:

DESCRIPTION:

98AON83011G

QFNW48 7x7, 0.5P

PAGE 1 OF 1

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

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


型号：	NCV7547MWTXG
厂家：	ONSEMI
描述：	七沟道半桥 MOSFET 预驱动器，用于电机控制应用电动机控制电机驱动驱动器
文件：	总42页 (文件大小：522K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

NCV7547MWTXG [ONSEMI]

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