NCV7681APWR2G [ONSEMI]

LED 驱动器,汽车,八路,100 mA;
NCV7681APWR2G
型号: NCV7681APWR2G
厂家: ONSEMI    ONSEMI
描述:

LED 驱动器,汽车,八路,100 mA

驱动 驱动器
文件: 总16页 (文件大小:197K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NCV7681  
100 mA Linear Current  
Regulator and Controller for  
Automotive LED Lighting  
The NCV7681 consists of eight linear programmable constant  
current sources. The part is designed for use in the regulation and  
control of LED based Rear Combination Lamps and blinking  
functions for automotive applications. System design with the  
NCV7681 allows for two programmed levels for stop (100% Duty  
Cycle) and tail illumination (programmable Duty Cycle), or an  
optional external PWM control can be implemented.  
www.onsemi.com  
MARKING  
DIAGRAM  
LED brightness levels are easily programmed (stop is programmed  
to the absolute current value, tail is programmed to the duty cycle)  
with two external resistors. The use of an optional external ballast FET  
allows for power distribution on designs requiring high currents. Set  
back power limit reduces the drive current during overvoltage  
conditions. This is most useful for low power applications when no  
external FET is used.  
NCV7681x  
AWLYYWWG  
SOIC−16 WB  
PW SUFFIX  
CASE 751DW  
NCV7681 = Specific Device Code  
x
= A (No Latch−Off Function)  
or L (Latch−Off Function)  
= Assembly Location  
The device is available in a SOIC−16 WB package with exposed pad.  
A
Features  
WL = Wafer Lot  
YY = Year  
WW = Work Week  
Constant Current Outputs for LED String Drive  
LED Drive Current up to 100 mA per Channel  
Open LED String Diagnostic with Open−Drain Output in All Modes  
Slew Rate Control Eliminates EMI Concerns  
Low Dropout Operation for Pre−Regulator Applications  
External Modulation Capable  
G
= Pb−Free Device  
ORDERING INFORMATION  
Device  
Package  
Shipping  
On−chip 800 Hz Tail PWM Dimming  
Single Resistor for Stop Current Set Point  
Single Resistor for Tail Dimming Set Point  
Overvoltage Set Back Power Limitation  
AEC−Q100 Qualified and PPAP Capable  
16 Lead SOICW Exposed Pad  
NCV7681APWR2G SOIC−16WB  
(Pb−Free)  
1000 /  
Tape & Reel  
NCV7681LPWR2G SOIC−16WB  
(Pb−Free)  
1000 /  
Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Improved EMC Performance  
Latch−Off Function on Open String (NCV7681L)  
Restart Option of Unaffected Strings  
Over Temperature Fault Reporting  
These are Pb−Free Devices  
Applications  
Rear Combination Lamps (RCL)  
Daytime Running Lights (DRL)  
Fog Lights  
Center High Mounted Stop Lamps (CHMSL) Arrays  
Turn Signal and Other Externally Modulated Applications  
Signature Lamp  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
November, 2016 − Rev. 1  
NCV7681/D  
NCV7681  
Open Load  
Detection  
Latch−Off Control  
DIAG  
Interface  
CC  
VP  
EMC Filter  
UVLO  
Vreg  
Overvoltage  
1 of 8  
Ballast  
Drive  
Soft Start,  
Bias and  
Out1  
Out2  
Out3  
Out4  
Out5  
Out6  
Out7  
Out8  
+
Reference  
Output  
Current  
Drive  
FB  
Channel  
Control  
FET Drive  
200K  
200K  
Over temperature &  
Over voltage sense  
Setback  
Current  
−20%  
1V  
Control Logic  
50% IOUT  
Open Load  
Detect  
Output  
Latch−Off  
STOP  
DIAG  
Vreg  
x 150  
Oscillator  
and PWM  
I
GND  
RSTOP  
Irstop  
+
2.2V  
0.4V  
V−I Converter  
CC  
Rtail  
Pin  
Current  
Limit  
+
Open  
1.8V  
Circuit  
Restart  
RTAIL  
RSTOP  
Boxes with dotted lines signify NCV7681L only.  
Figure 1. Block Diagram  
OUT1  
VP  
Ballast Drive  
FB  
OUT2  
OUT3  
OUT4  
GND  
EP  
STOP  
DIAG  
RSTOP  
RTAIL  
OUT5  
OUT6  
OUT7  
OUT8  
Figure 2. Pinout Diagram  
www.onsemi.com  
2
NCV7681  
V
MRA4003T3G  
MRA4003T3G  
STRING  
TAIL  
NVD2955  
STOP  
C2  
R3  
1K  
0.22uF  
C3  
100nF  
OUT1  
OUT2  
OUT3  
OUT4  
OUT5  
OUT6  
C1  
R1  
VP  
10K  
0.68uF  
Ballast  
Drive  
FB  
STOP  
DIAG  
RSTOP  
RTAIL  
R4, 3.01K  
R5, 1.62K  
OUT7  
OUT8  
C4  
10nF  
R6  
9.53K  
GND  
R7  
1K  
NCV7681  
Figure 3. Application Diagram with External FET Ballast Transistor  
R6 and R7 values shown yield 10.5 V regulation on V  
C1 is for line noise and stability considerations.  
C3 is for EMC considerations.  
.
STRING  
Unused OUTx channels should be shorted to ground as OUT7 shows in this example.  
MRA4003T3G  
V
STRING  
TAIL  
MRA4003T3G  
STOP  
C3  
100nF  
OUT1  
C1  
R1  
VP  
0.68uF  
OUT2  
OUT3  
OUT4  
OUT5  
OUT6  
OUT7  
OUT8  
10K  
Ballast  
Drive  
FB  
STOP  
DIAG  
R4, 3.01K  
RSTOP  
RTAIL  
C4  
10nF  
R5, 1.62K  
GND  
NCV7681  
Figure 4. Application Diagram without the FET Ballast Transistor  
When using the NCV7681 without the FET ballast transistor, tie the FB pin and Ballast Drive pin to GND.  
www.onsemi.com  
3
NCV7681  
Table 1. APPLICATION I/O TRUTH TABLE  
STOP  
INPUT  
TAIL  
MODE  
OUTx LATCH OFF  
(w/ LO = GND)  
OUTX  
CURRENT  
FAULT  
STATE*  
DIAG  
STATE**  
0
1
1
1
0
0
0
X
X
X
1
NCV7681A  
NCV7681A  
NCV7681A  
NCV7681L  
NCV7681A  
NCV7681A  
OFF  
1
I
I
NORMAL  
0
STOP  
STOP  
OPEN CIRCUIT***  
OPEN CIRCUIT***  
NORMAL  
1
1
OFF  
PWM  
PWM  
0
1
OPEN CIRCUIT***  
PWM  
Reference Figures below.  
X = don’t care  
0 = LOW  
1 = HIGH  
* Open Circuit, RSTOP Current Limit, Set Back Current Limit down 20%, and thermal shutdown  
**Pull−up resistor to DIAG required.  
*** OPEN CIRCUIT = Any string open.  
DIAG  
DIAG  
Open String Occurs  
Open String Removed  
Open String Occurs  
Open String Removed  
on  
OUTx  
on  
OUTx  
Current  
Current  
off  
off  
on  
OUTx  
on  
OUTx  
Outputs with no open string.  
Current  
Current  
Outputs with no open string.  
off  
off  
NCV7681L  
NCV7681A  
Figure 5. DIAG timing diagram WITH  
Open String Latch Active  
All outputs latch off.  
Figure 6. DIAG timing diagram WITHOUT  
Open String Latch Active  
No outputs are turned off.  
DIAG will report the state.  
www.onsemi.com  
4
 
NCV7681  
Table 2. PIN FUNCTION DESCRIPTION (16 Pin SO Wide Exposed Pad Package)  
Pin #  
Label  
Description  
1
OUT1  
Channel 1 constant current output to LED.  
Unused pin should be grounded.  
Supply Voltage Input.  
2
3
VP  
Ballast Drive  
Gate drive for external power distribution PFET.  
Ground if not used.  
4
FB  
Feedback Sense node for V regulation.  
P
Use feedback resistor divider or connect to V with a 10k resistor.  
P
5
6
STOP  
DIAG  
Stop Logic Input. External Modulation Input.  
Open−drain diagnostic output.  
Reporting Open Circuit, R  
Current Limit,  
STOP  
and Overvoltage Set Back Current down 20%.  
Normal Operation = LOW.  
Ground if not used.  
7
8
RSTOP  
RTAIL  
Stop current bias program resistor.  
Tail current duty cycle PWM program resistor.  
Ground if using external modulation.  
9
OUT8  
OUT7  
OUT6  
OUT5  
Channel 8 constant current output to LED.  
Unused pin should be grounded.  
10  
11  
12  
Channel 7 constant current output to LED.  
Unused pin should be grounded.  
Channel 6 constant current output to LED.  
Unused pin should be grounded.  
Channel 5 constant current output to LED.  
Unused pin should be grounded.  
13  
14  
GND  
Ground.  
OUT4  
Channel 4 constant current output to LED.  
Unused pin should be grounded.  
15  
16  
OUT3  
OUT2  
epad  
Channel 3 constant current output to LED.  
Unused pin should be grounded.  
Channel 2 constant current output to LED.  
Unused pin should be grounded.  
epad*  
Ground. Do not connect to pcb traces other than GND.  
*Grounding will provide better thermal and electrical performance.  
www.onsemi.com  
5
NCV7681  
Table 3. MAXIMUM RATINGS (Voltages are with respect to device substrate.)  
Rating  
Value  
Unit  
Supply Input (VP, Ballast Drive, STOP, DIAG)  
V
DC  
−0.3 to 40  
40  
Peak Transient  
Output Pin Voltage (OUTX)  
Output Pin Current (OUTX)  
DIAG Pin Current  
−0.3 to 40  
200  
V
mA  
mA  
V
10  
Input Voltage (RTAIL, RSTOP, FB)  
−0.3 to 3.6  
−40 to 150  
260 peak  
Junction Temperature, T  
°C  
°C  
J
Peak Reflow Soldering Temperature: Lead−free  
60 to 150 seconds at 217°C (Note 1)  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
Table 4. ATTRIBUTES  
Characteristic  
Value  
ESD Capability  
Human Body Model  
Machine Model  
4.0 kV  
200 V  
Moisture Sensitivity (Note 1)  
Storage Temperature  
MSL3  
−55 to 150°C  
Package Thermal Resistance (Note 2)  
SOIC−16 WB EP  
Junction−to−Board (R  
)
15°C/W  
73°C/W  
43°C/W  
Y
JB  
Junction−to−Ambient (R  
)
q
JA  
Junction−to−Pin (R  
)
Y
JL  
1. For additional information, see or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D,  
and Application Note AND8003/D.  
2
2. Values represent typical still air steady−state thermal performance on 1 oz. copper FR4 PCB with 650 mm copper area with OUT1−OUT8  
dissipating 50 mW each.  
www.onsemi.com  
6
 
NCV7681  
Table 5. ELECTRICAL CHARACTERISTICS  
(4.5 V < VP < 16 V, STOP = VP, RSTOP = 3.01 kW, RTAIL = 1.62 kW, −40°C T 150°C, unless otherwise specified.)  
J
Characteristic  
Conditions  
Min  
Typ  
Max  
Unit  
GENERAL PARAMETERS  
Quiescent Current (IOUTx = 50 mA)  
STOP mode  
Tail mode  
mA  
VP = 16 V  
VP = 16 V  
VP = 16 V, STOP = 0 V, OUTx = 0 mA,  
6
5
12  
12  
2.0  
Fault mode (Note 5)  
Disconnected output  
Driver Ground Pin Current (pin12)  
Output Under Voltage Lockout  
IOUT1 to IOUT8 = 50 mA  
VP Rising  
3.8  
400  
4.1  
500  
4.4  
mA  
V
Output Under Voltage Lockout  
Hysteresis  
200  
mV  
Open Load Disable Threshold  
Open Load Disable Hysteresis  
THERMAL LIMIT  
7.2  
7.7  
8.2  
V
200  
mV  
Thermal Shutdown  
(Note 3)  
(Note 3)  
150  
175  
15  
°C  
°C  
Thermal Hysteresis  
CURRENT SOURCE OUTPUTS  
Output Current  
OUTX = 0.5 V, T = 25°C, 150°C  
45  
90  
50  
100  
55  
110  
mA  
J
OUTX = 1 V, R  
= 1.5 K  
STOP  
Maximum Regulated Output Current  
Current Matching  
0.5V to 16V  
100  
−4  
0
4
mA  
%
2IOUTx(min)  
ƪ
ƪ
* 1ƫ  
* 1ƫ  
  100  
  100  
IOUTx(min) ) IOUTx(max)  
2IOUTx(max)  
IOUTx(min) ) IOUTx(max)  
Line Regulation  
9 V VP 16 V  
1.2  
6.0  
mA  
Open Circuit Detection Threshold  
25 mA  
50 mA  
25  
35  
50  
50  
75  
65  
% of Output  
Current  
Current Slew Rate  
Iout = 44 mA, 10% to 90% points  
@ 99% Iout  
16.0  
6
17.2  
78  
80  
15  
18.4  
mA/ms  
V
Overvoltage Set Back Threshold  
Overvoltage Set Back Current  
Diag Reporting of Set Back Current  
Output Off Leakage  
VP = 20 V (Note 4)  
%Iout  
%Iout  
mA  
EN = high  
1
FET DRIVER  
Ballast Drive  
DC Bias  
Sink Current  
mA  
V
FB = 1.5 V, Ballast Drive = 3 V  
FB = 0.5 V, Ballast Drive = 3 V  
4
1.0  
13  
2.4  
20  
Ballast Drive Reference Voltage  
STOP LOGIC  
0.92  
1.00  
1.08  
Input High Threshold  
Input Low Threshold  
0.75  
0.70  
100  
120  
1.25  
1.00  
250  
200  
1.75  
1.44  
400  
300  
V
V
V
IN  
Hysteresis  
mV  
kW  
Input Impedance  
Vin = 14 V  
3. Designed to meet these characteristics over the stated voltage and temperature recommended operating ranges, though may not be 100%  
parametrically tested in production.  
4. The output current degrades at a rate of 8%/V.  
5. This test parameter applies only to the NCV7681LPWR2G.  
www.onsemi.com  
7
 
NCV7681  
Table 5. ELECTRICAL CHARACTERISTICS  
(4.5 V < VP < 16 V, STOP = VP, RSTOP = 3.01 kW, RTAIL = 1.62 kW, −40°C T 150°C, unless otherwise specified.)  
J
Characteristic  
CURRENT PROGRAMMING  
RSTOP Bias Voltage  
Conditions  
Min  
Typ  
Max  
Unit  
Stop current programming voltage  
0.94  
1.00  
150  
1.06  
V
RSTOP K multiplier  
I
/I  
OUTX RSTOP  
RSTOP Over Current Detection  
RTAIL Bias Current  
Duty Cycle  
RSTOP = 0 V  
0.70  
290  
1.00  
330  
1.45  
370  
mA  
mA  
%
Tail duty cycle programming current  
RTAIL = 0.49 V  
RTAIL = 0.76 V  
RTAIL = 1.66 V  
3.5  
17  
59.5  
5
20  
70  
6.5  
23  
80.5  
DIAG OUTPUT  
Output Low Voltage  
DIAG Active, I  
= 1 mA  
0.1  
0.40  
10  
V
mA  
V
DIAG  
DIAG Output Leakage  
Open Load Reset Voltage on DIAG  
AC CHARACTERISTICS  
Stop Turn−on Delay Time  
Stop Turn−off Delay Time  
PWM Frequency  
V
DIAG  
= 5 V  
(Note 5)  
1.6  
1.8  
2.0  
V(STOP) > 1.75 V to I(OUTx) = 90%  
V(STOP) < 0.75 V to I(OUTx) = 10%  
STOP = 0 V  
14  
14  
45  
45  
msec  
msec  
Hz  
400  
1
800  
2
1200  
4
Open Circuit to DIAG Reporting  
VP Turn−on Time  
4.8 mA pull−up to VP, V(DIAG) >1.5 V  
ms  
0.55  
0.80  
1.2  
msec  
3. Designed to meet these characteristics over the stated voltage and temperature recommended operating ranges, though may not be 100%  
parametrically tested in production.  
4. The output current degrades at a rate of 8%/V.  
5. This test parameter applies only to the NCV7681LPWR2G.  
www.onsemi.com  
8
 
NCV7681  
TYPICAL CHARACTERISTICS  
100  
90  
80  
70  
60  
50  
40  
30  
20  
53  
52  
51  
50  
49  
48  
10  
0
T = 25°C  
RSTOP = 3.01 kW  
47  
0
1
2
3
4
5
6
7
8
9
10  
−40 −20  
0
20 40 60 80 100 120 140 160  
RSTOP (kW)  
TEMPERATURE (°C)  
Figure 7. Iout vs. RSTOP  
Figure 8. Iout vs. Temperature  
100  
90  
100  
90  
80  
80  
70  
70  
60  
50  
40  
30  
20  
60  
50  
40  
30  
20  
10  
0
10  
0
RSTOP = 3.01 kW  
0
1
2
3
4
5
6
7
0
0.5  
1.0  
1.5  
2.0  
2.5  
RTAIL (kW)  
V(RTAIL)  
Figure 9. Duty Cycle vs. RTAIL  
Figure 10. Duty Cycle vs. V(RTAIL)  
80  
70  
60  
50  
40  
30  
20  
RTAIL = 5 kW  
RTAIL = 2.3 kW  
RTAIL = 1.5 kW  
10  
0
−40 −20  
0
20  
40 60 80 100 120 140 160  
TEMPERATURE (°C)  
Figure 11. Duty Cycle vs. Temperature  
www.onsemi.com  
9
 
NCV7681  
TYPICAL CHARACTERISTICS  
60  
50  
40  
30  
20  
51.0  
50.8  
50.6  
50.4  
50.2  
50.0  
49.8  
49.6  
49.4  
49.2  
10  
0
R
= 3.01 k  
STOP  
49.0  
9
11  
13  
15  
17  
19  
21  
23  
25  
27  
6
7
8
9
10 11 12  
(V)  
13 14 15 16  
VP (V)  
V
OUT  
Figure 12. IOUT vs. VP  
Figure 13. IOUT Line Regulation  
60  
50  
40  
30  
20  
60  
50  
40  
30  
20  
10  
0
10  
0
0
2
4
6
8
10  
12  
14  
16  
0
0.1  
0.2  
0.3  
0.4  
0.5  
V
OUT  
(V)  
V
OUT  
(V)  
Figure 14. IOUT vs. VOUT  
Figure 15. IOUT vs. VOUT  
14  
12  
10  
8
6
4
per eq. 1  
R7 = 1 kW  
2
0
0
2K  
4K  
6K  
8K  
10K  
12K 14K  
R6 (W)  
Figure 16. VSTRING vs. R6  
www.onsemi.com  
10  
NCV7681  
TYPICAL PERFORMANCE CHARACTERISTICS  
160  
140  
120  
100  
80  
1 oz  
2 oz  
60  
40  
20  
0
0
100  
200  
300  
400  
500  
600  
700  
2
COPPER HEAT SPREADER AREA (mm )  
Figure 17. qJA vs. Copper Spreader Area  
100  
D = 0.5  
0.2  
0.1  
10  
0.05  
0.02  
0.01  
SINGLE PULSE  
1
0.000001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
PULSE TIME (s)  
Figure 18. Thermal Duty Cycle Curves on 500 mm2 Spreader Test Board  
1000  
100  
2
100 mm  
2
50 mm  
2
500 mm  
10  
1
0.000001 0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
PULSE TIME (s)  
Figure 19. Single Pulse Heating Curve  
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11  
NCV7681  
DETAILED OPERATING DESCRIPTION  
General  
module will either display all LED strings or no LED strings  
The NCV7681 device is an eight channel LED driver  
at all. This function is designed into the NCV7681L.  
Each output has its own sensing circuitry. An open string  
detection on any output latches off all 8 outputs. There are  
three means to reinitiate the IC drivers.  
whose output currents up to 100 mA/channel are  
programmed by an external resistor. The target application  
for the device is in automotive Rear Combination Lighting  
(RCL) systems.  
The STOP logic input switches the two modes of the IC.  
While in the STOP mode (high), the duty cycle of the outputs  
is at 100%. When STOP is low, the duty cycle of the outputs  
is programmed via an external resistor on the RTAIL pin.  
A logic output (DIAG) communicates open circuit of the  
LED driver outputs back to the microprocessor. DIAG  
requires a pull−up resistor for proper operation.  
An optional external control for a ballast transistor helps  
distribute the system power.  
1. Forcing the DIAG pin below the Open Circuit  
Reset Voltage (1.8 V typical).  
2. Toggling the ENABLE input  
3. A complete power down of the device below the  
Under Voltage Lockout threshold including  
hysteresis (3.9 V typical).  
Open Load Detection  
Open load detection has an under voltage lockout feature  
to remove the possibility of turning off the device while it is  
powering up. The Open Load Disable Threshold is 7.7 V  
(typ). Open load detection becomes active above this  
threshold. Current is monitored internal to the NCV7681  
device and an open load is flagged when the current is 1/2  
of the targeted output current.  
Latch Off (NCV7681L)  
The Latch Off feature applies only to the NCV7681L.  
Automotive requirements sometime dictate all outputs  
turn off if one of the outputs is an open circuit. This  
eliminates driving with partial illuminated lights. The  
D1  
TAIL  
MRA4003T3G  
Q1  
NVD2955  
Q2  
NVD2955  
VSTRING  
D2  
MRA4003T3G  
STOP  
R1  
1K  
R2  
D3  
D4  
D5  
D6  
D7  
D8  
D9  
D12  
D13  
D14  
C2  
0.22uF  
C4  
0.22uF  
1K  
1 -8  
D10  
D11  
C1  
0.68uF  
C3  
0.68uF  
C6  
100nF  
C5  
100nF  
OUT1-OUT8  
OUT1-OUT8  
OUT1  
OUT1  
Ballast Drive  
VP  
VP  
Ballast Drive  
OUT8  
OUT8  
R3  
9.53K  
FB  
FB  
R4  
1K  
GND  
GND  
NCV7681 U2  
NCV7681 U1  
Figure 20.  
www.onsemi.com  
12  
NCV7681  
DIAG  
brightness level for tail. The PWM generator’s fixed  
The logic DIAG pin’s main function is to alert the  
frequency (800 Hz typ.) oscillator allows flicker−free  
illumination. PWM control is the preferred method for  
dimming LEDs.  
The diagnostic function allows the detection of an open in  
any one of the output circuits. The active−low diagnostic  
output (DIAG) is coincident with the STOP input and the ON  
state in the tail mode. DIAG remains high (pulled up) if an  
open load is detected in any LED string when STOP is high.  
controlling microprocessor an open string has occurred on  
one of the outputs (DIAG high = open string). Reference  
Table 1 for details on logic performance.  
Open circuit conditions are reported when the outputs are  
actively driven. When operating in STOP mode the DIAG  
signal is a DC signal. When operating in TAIL the DIAG  
signal is a PWM signal reporting open circuit when the  
output drive is active.  
Output Current Programming  
Ballast Drive  
Reference Figure 7 (typ performance graph) to choose  
programming resistor (RSTOP) value for stop current.  
Reference Figure 9 Typical Performance Graph (Duty Cycle  
vs. RTAIL) to choose a typical value programming resistor  
for output duty cycle (with a typical RSTOP value of  
3.01 kW). Note the duty cycle is dependent on both RSTOP  
and RTAIL values. RSTOP should always be chosen first as  
the stop current is only dependent on this value.  
Alternatively, the equations below can be used to calculate  
a typical value and used for worst case analysis.  
Set the Stop Current using RSTOP  
The use of an external FET device (NVD2955) helps  
distribute the system power. A DC voltage regulation system  
is used which regulates the voltage at the top (anode) of the  
LED strings (Vstring). This has the effect of limiting the  
power in the NCV7681 by setting the voltage on the IOUTx  
pins specific to each customer application. The Ballast Drive  
pin provides the drive in the feedback loop from the FB pin.  
In steady state, the voltage is regulated at the feedback  
voltage (FB). A simple voltage divider helps set the voltage  
at Vstring. Unlike other systems, the ballast drive current  
does not turn off in a leakage state when turned off (FB high),  
but instead provides 1 mA of current providing a faster  
response of the system loop. This sets the gate voltage of the  
NVD2955 to 1 V at 25°C.  
RSTOP_Bias_Voltage  
(eq. 1)  
IOUTX + 150 @  
RSTOP  
RSTOP Bias Voltage = 1 V (typ)  
Set the Duty Cycle (DC) using RTAIL  
Parallel Outputs  
RTAIL + 1.8 @ RSTOP(DC ) 0.22)  
(eq. 2)  
The maximum rating per output is 100 mA. In order to  
increase system level LED string current, parallel  
combinations of any number of outputs is allowed.  
Combining all 8 outputs will allow for a maximum system  
level string current design of 800 mA.  
DC = duty cycle expressed in fractional form. (e.g. 0.50  
is equivalent to 50% duty cycle) (ground RTAIL when using  
external modulation)  
Output Current is directly tested per the electrical  
parameter table to be 10% (with RSTOP = 3.01 KW) or  
45 mA (min), 50 mA (typ), 55 mA (max) at room and hot  
temperature.  
Duty Cycle will vary according to the changes in RTAIL  
Voltage and RTAIL Bias Current (generated from the current  
through RSTOP).  
Unused Outputs  
Unused outputs should be shorted to ground. The  
NCV7681 detects the condition during power−up using the  
open load disable threshold and disables the open circuit  
detection circuitry.  
Voltage errors encompass generator errors (0.4 V to  
2.2 V) and comparator errors and are included in testing as  
the Duty Cycle. Typical duty cycle measurements are 5%  
with RTAIL = 0.49 V and 70% with RTAIL = 1.66 V.  
RTAIL Bias Current errors are measured as RTAIL Bias  
Current and vary as 290 mA (min), 330 mA (typ), and 370 mA  
(max) with RSTOP = 3.01 kW.  
The error duality originating from both the internal current  
source generated on the RSTOP pin and the comparator  
voltage thresholds of the RTAIL pin combined with the  
choice of duty cycle levels make it difficult to specify duty  
cycle minimum and maximum limits, but worst case  
conditions can be calculated when considering the variation  
in the voltage threshold and current source. Duty Cycle  
variation must include the direct duty cycle as specified in  
the electrical parameter table plus an additional error due to  
the Irstop current which generates this voltage in the system.  
Programmability  
Strings of LEDs are a common configuration for RCL  
applications. The NCV7681 provides eight matched outputs  
allowing individual string drive with current set by a single  
resistor. Output currents are mirrored and matched within  
4% at hot temperature.  
A high STOP condition sets the output current using  
equation 1 below.  
A low STOP condition, modulates the output currents at  
a duty cycle (DC) programmed using equation 2 below.  
Note, current limiting on RSTOP limits the current which  
can be referenced from the RSTOP Pin. Exceeding the  
RSTOP Current Limit will set the output current to less than  
100 mA, and the DIAG Pin will go high. This helps limit  
output current (brightness and power) for this type of fault.  
The average ISTOP Duty Cycle current provides the  
dimmed tail illumination function and assures a fixed  
www.onsemi.com  
13  
NCV7681  
RSTOP Over Current Protection  
consistent LED light output at low line voltage. Unlike  
adjustable regulator based constant current source schemes  
where the set point resistor resides in the load path, the  
NCV7681’s set point resistor lies outside the LED load path,  
and aids in the low dropout capability.  
Setback Current Limit is employed during high voltage.  
During a Setback Current Limit event, the drive current is  
reduced resulting in lower power dissipation on the IC. This  
occurs during high battery voltage (VP > 16 V). In this way  
the NCV7681 can operate in extreme conditions and still  
provide a controlled level of light output The Setback  
Current (−20%) condition is reported on the DIAG Pin.  
Activation of the set back current feature provides a  
roll−off rate of −8%/V.  
Over Current protection has been included for the RSTOP  
pin. Without protection, the device performance could cause  
excessive high current and potential damage to the external  
LEDs. Detection of the RSTOP over current event (RSTOP  
to ground) is 1 mA (typ) and is current limited to 2.2 mA  
(typ). Output drive currents will limit to typically 65 mA.  
Note – A feature of the NCV7681 device includes  
operation of the device during a short circuit on the RSTOP  
pin. Iout is decreased during the STOP condition and the  
TAIL duty cycle is reduced to less than 40% by reducing the  
voltage on the RTAIL pin to 2/3 of normal operation.  
Set Back Current  
Automotive battery systems have wide variations in line  
supply voltage. Low dropout is a key attribute for providing  
www.onsemi.com  
14  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOIC16 WB, EP  
CASE 751DW  
ISSUE A  
DATE 23 OCT 2015  
SCALE 1:1  
NOTES:  
D
A
B
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
M
M
B
0.25  
16  
9
M
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL  
BE 0.13 TOTAL IN EXCESS OF b DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
PROTRUSIONS.  
H
E
5. MAXIMUM MOLD PROTRUSION OR FLASH TO  
BE 0.15 PER SIDE.  
MILLIMETERS  
h
DIM MIN  
MAX  
2.65  
0.10  
0.49  
0.32  
10.45  
2.00  
7.60  
2.47  
1
8
PIN 1  
INDICATOR  
x 45  
A
A1  
b
2.35  
0.00  
0.35  
0.25  
10.15  
1.79  
7.40  
2.27  
DETAIL A  
16X b  
e
M
S
S
0.25  
T A  
B
END VIEW  
c
TOP VIEW  
D
D1  
E
16X  
E1  
e
L
1.27 BSC  
H
10.05  
10.55  
h
0.53 REF  
A1  
A
SEATING  
PLANE  
L
0.50  
0.90  
T
M
0
7
_
_
SIDE VIEW  
D1  
c
DETAIL A  
GENERIC  
MARKING DIAGRAM*  
xxxxxxxxxx  
xxxxxxxxxx  
xxxxxxxxxx  
AWLYYWWG  
E1  
xxx  
A
WL  
YY  
WW  
G
= Specific Device Code  
= Assembly Location  
= Wafer Lot  
= Year  
= Work Week  
BOTTOM VIEW  
RECOMMENDED  
SOLDERING FOOTPRINT  
16X  
0.58  
= PbFree Package  
2.50  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”,  
may or may not be present.  
11.00  
2.87  
1
1.27  
PITCH  
16X  
1.62  
DIMENSIONS: MILLIMETERS  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON96277F  
SOIC16 WB, EP  
PAGE 1 OF 1  
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