NCV7693DB0R2G [ONSEMI]
3 沟道控制器,带诊断,用于汽车 LED 灯;型号: | NCV7693DB0R2G |
厂家: | ONSEMI |
描述: | 3 沟道控制器,带诊断,用于汽车 LED 灯 控制器 |
文件: | 总14页 (文件大小:314K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or
subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi
product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without
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liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws,
regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/
or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application
by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for
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Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.
Controller for Automotive
LED Lamps
NCV7693
The NCV7693 is a device which drives multiple external switching
components for 3 independent functions. The average current in each
LED string can be regulated with a proper choice of duty−cycle and
battery voltage. The target application for this device is automotive
rear combination lamps. Each individual driver has its own diagnostic
to detect open load, short circuit to ground or to battery.
LED average brightness levels are easily programmed using
appropriate duty cycle control and external resistors in series with the
switching transistors.
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14
1
Multiple strings of LEDs can be operated with a single NCV7693
device. The device is available in a TSSOP−14 package.
TSSOP−14 WB
CASE 948G
Features
MARKING DIAGRAM
• 3x Pulse Width Modulation (PWM) Control
• Independent Diagnostic Feedback per Function
• External Switching Device for Wide Current Range Flexibility
• External Resistors Define Maximum Current
• Open LED String Diagnostic
• Short−Circuit LED String Diagnostic
• Thermal Shut−down Diagnostic and Protection
• Protection against Short−Circuit on the PWM Input Pins
• Multiple LED String Control
• TSSOP−14 Package
• AEC−Q100 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
14
NCV
7693
ALYWG
G
1
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Applications
†
Device
Package
Shipping
• Rear Combination Lamps (RCL)
• Daytime Running Lights (DRL)
• Fog Lights
• Center High Mounted Stop Lamps (CHMSL) Arrays
• Turn Signal and Other Externally Modulated Applications
• General Automotive LED Driver
NCV7693DB0R2G TSSOP−14
(Pb−Free)
2500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
December, 2019 − Rev. 1
NCV7693/D
NCV7693
VSupply
R1
VS
FB1
SW1
PWM 1
PWM 2
IO1
IO2
IO3
FB2
R2
PWM 3
SW2
n.c.
FB3
TSTEN
n.c.
SW3
GND
R3
Figure 1. Application Diagram
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2
NCV7693
VS
−
FBx
OL
Supply
Monitoring
+
VS
Ref1
Ref2
Ref3
Error
Monitoring
Filtering
−
SC_GND
Thermal
Monitoring
+
& decoding
−
SC_VS
+
5.5V
Slew Rate
Control
3.15V
7mA
SWx
GND
Protection
IOx
Reference
Voltages
and Currents
Refx
Figure 2. Block Diagram
PIN FUNCTION DESCRIPTION
TSSOP−14 Package
Pin #
Label
VS
Description
1
2
3
4
5
6
Automotive Battery input voltage
IO1
Logic input1 for output SW1 on / off control and diagnostic feedback. Pull high for output on.
Logic input2 for output SW2 on / off control and diagnostic feedback. Pull high for output on.
Logic input3 for output SW3 on / off control and diagnostic feedback. Pull high for output on.
Not connected
IO2
IO3
NC
TSTEN
Pin used for test purpose only, has to be connected to GND pin during the normal
operation.
7
NC
GND
SW3
FB3
SW2
FB2
SW1
FB1
Not connected
8
Ground
9
Switch Driver 3 for external transistor
Feedback pin for error detection on SW3
Switch Driver 2 for external transistor
Feedback pin for error detection on SW2
Switch Driver 1 for external transistor
Feedback pin for error detection on SW1
10
11
12
13
14
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3
NCV7693
MAXIMUM RATINGS
(Voltages are with respect to GND, unless otherwise specified)
Rating
Value
Unit
Supply Voltage (VS)
DC
−0.3 to 50
V
V
Peak Transient
50
High Voltage Input−Output Pins (IO1, IO2, IO3)
High Voltage Input Pins (FB1, FB2, FB3)
Low Voltage Pins (SW1, SW2, SW3)
−40 to 50
−0.3 to 50
−0.3 to 6.5
−40 to 150
260 peak
V
V
V
Junction Temperature, T
°C
°C
J
Peak Reflow Soldering Temperature: Pb−Free, 60 to 150 seconds at 217°C (Note 1)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. For additional information, please see or download the ON Semiconductor Soldering and Mounting Techniques Reference Manual,
SOLDERRM/D and Application Note AND8003/D.
ATTRIBUTES
Characteristic
Value
ESD Capability
Human Body Model without any filter all Iox versus GND and VS versus GND
Charge Device Model
6.0 kV (Note 2)
≥
750 V
Moisture Sensitivity
MSL2
Storage Temperature Range
−55 to 150°C
Package Thermal Resistance − TSSOP−14 (Note 3)
Junction–to–Ambient, R
135°C/W
45°C/W
q
JA
Junction–to–Case, R
Y
JC
2. Minimum 2 kV HBM for all pin combinations.
3. Values represent typical still air steady−state thermal performance on 1 oz. copper FR4 PCB with 650 mm copper area.
2
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4
NCV7693
ELECTRICAL CHARACTERISTICS
(6.17 V < VS < 16 V, Transistor NPN = BCP56 or NMOS = NVR5198, −40°C ≤ T ≤ 150°C, unless otherwise specified) (Note 4)
J
Characteristic
General Parameters
Conditions
Min
Typ
Max
Unit
Supply Current
VS = 14 V, all IOx > 2.2 V, SWx current subtracted
VS = 14 V, all IOx = 0 V
2.2
30
5.2
185
10
380
mA
mA
Under Voltage Lockout
Under Voltage Lockout Hysteresis
Thermal Shutdown (TSD)
Thermal Hysteresis
VS rising (Note 5)
(Note 5)
2.24
−
3.35
500
170
15
4.43
−
V
mV
°C
°C
(Note 5)
155
−
190
−
(Note 5)
Switch Driver
Output Source Current
Output Source Current
Output Source Current
Swx ON Voltage
SWx = 0.7 V (Note 6), −40°C ≤ T ≤ +25°C
25
15
50
30
15
−
−
−
mA
mA
mA
J
SWx = 0.7 V (Note 6), +25°C ≤ T ≤ +125°C
J
SWx = 0.7 V (Note 6), +125°C ≤ T ≤ +150°C
7.0
J
ISWx = −100 mA, 7 V < VS < 19 V
ISWx = −100 mA
4.5
4.5
5.5
−
6.5
−
V
V
Open Load Timing
Open Load Detection Threshold
Open Load Blanking Time
Short Circuit to VS
IOx High
0.7
10
0.85
22
1.0
35
V
ms
Short Circuit Detection Threshold
Input pull−up current on FBx pins
Short Circuit Blanking Time
Short Circuit to Ground
Short Circuit Detection Threshold
Short Circuit Blanking Time
IOx
IOx High
VS−1.0
−35
VS−1.2
−20
VS−1.4
−2.0
15
V
Tested at V(FBx) = VS − 1.0 V
Tested at 15 V
mA
ms
5.0
10
IOx Low
0.7
10
0.85
22
1.0
35
V
Tested at 15 V
ms
Input High Threshold
−
1.1
−
−
2.2
−
V
V
Input Low Threshold
−
Hysteresis
0.52
150
3.15
−
V
Input Pull−down Resistor
IOx Clamp Voltage in error mode
AC Characteristics
Tested at V(IOx) = 15 V
75
300
3.46
kW
V
PWMx > 5 V, 2 mA < I(IOx) < 9.5 mA
2.80
Propagation Delay
50% criterion (Note 7)
−
−
−
−
5
5
−
−
15
15
5
ms
ms
ms
ms
IOx rising to Iout
BJT
Propagation Delay
IOx falling to Iout
50% criterion (Note 7)
BJT
Propagation Delay
IOx rising to Vout
From IOx input high threshold to 90% rising of
SWx_ON Voltage, C
= 470 pF
NMOS
load
Propagation Delay
IOx falling to Vout
From IOx input low threshold to 10% falling of
SWx_ON Voltage, C = 470 pF
5
NMOS
load
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Designed to meet these characteristics over the stated voltage and temperature recommended operating ranges, though may not be 100%
parametrically tested in production.
5. Guaranteed by design.
6. This current is designed to decrease over temperature in case the switching element is an external bipolar to compensate internal heating
and Beta.
7. Evaluated at VS = 14V.
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5
NCV7693
TYPICAL PERFORMANCE CHARACTERISTICS
Equivalent schematics
The following figure gives the equivalent schematics of the user relevant inputs and outputs. The diagrams are simplified
representations of the circuits used.
VS
VS
Low Power mode
VS
FBx
VREF1
OL, SC_GND
SC_VS
VS
VREF 2
Type 1: VS supply pin
Type 2: FBx input pins
VS
3.15V
5.5V
Ifault = 7mA
Slope Control / current derating
Fault
SWx_ON / OFF / Low power mode
PWMx_ON / OFF
SWx
IOx
Pull−down
150kW
Type 4: SWx output pins
Type 3: IOx output pins
Figure 3. Input and Output Equivalent Diagrams
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6
NCV7693
Detailed Operating Description
The NCV7693 device provides low−side current drive via
an external switching transistor in series with the LEDs and
a resistor. The drop across the resistor plus either the V or
Where;
VS is the Automotive Battery input voltage,
V is the sum of the forward voltage of the LEDs,
F
V
DROP
is either V
(saturation voltage of the chosen
CE
CEsat
the V of the transistor is supposed to be above 1V in
BJT) or V (in case NMOSFET is chosen),
DS
DS
normal operation. Dimming is performed using the
dedicated PWM at the IOx pins of the IC.
DC is the Duty Cycle present at the input of the IOx pins
and
R the series resistance with the LEDs (typical value range
is in between 50 and 100 W).
Output Drive
Figure 4 shows an example of the typical output drive
configuration. The average current through the external
LED is equal to:
ǒ
Ǔ
VS * VF * VDROP
ILED
Vsupply
+
DC
R
optional
10kΩ
100nF
optional
W
1.5k +/−5%
VS
FBx
10kΩ
NCV7693
IOx
PWM / DIAG
μC
SWx
from
30kΩ
W
4.7k
+/−5%
TSTEN
GND
μC
to
C1
2.2nF
10kΩ
2.2nF
Figure 4. Output Drive configuration
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7
NCV7693
Open Load Detection
than 22 ms typical then an open load error is activated. The
IOx pin is pulled down to 3.15 V typical allowing the
mcontroller to detect the error when the PWM input signal
is activated High. During open load condition the driver
stays active. If the open load disappears the device is
working properly again and the diagnostic flag disappears.
Faulted output strings due to open load conditions
sometimes require detection in an automotive rear lighting
system. The NCV7693 provides that feature.
When LED driver is ON (PWM is active high) and when
the voltage on the FBx pin is detected below 0.85 V for more
Vsupply
optional
10kΩ
10kΩ
100nF
optional
W
1.5k +/−5%
VS
FBx
NCV7693
IOx
PWM / DIAG
μC
SWx
from
or
30kΩ
W
4.7k
+/−5%
TSTEN
GND
10kΩ*
μC
to
C1
2.2nF
10kΩ
2.2nF
*recommended if MOSFET is used
Figure 5. Open Load Detection
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8
NCV7693
Short Circuit to Ground Detection
mcontroller to detect the error when the PWM input signal
is activated High. During SC to Ground condition the driver
stays active. If the short circuit disappears the device is
working properly on next falling edge of the PWM input pin.
If at least one IOx pin remains High, then short to Ground
detection is guaranteed. Note that in case all IOx pins are
Low, the device is in low power mode and a short to Ground
cannot be detected.
The FeedBack (FBx) pins of the device are used as inputs
to detect a fault when the resistor on top of either the
collector or the drain of the external transistor is shorted to
Ground. When LED driver is OFF (PWM is low) and when
the voltage on the FBx pin is detected below 0.85 V for more
than 22 ms typical then a SC to Ground is latched. The IOx
pin is then pulled down to 3.15 V typical allowing the
Vsupply
optional
10kΩ
100nF
optional
W
1.5k +/−5%
VS
FBx
10kΩ
NCV7693
IOx
PWM / DIAG
μC
SWx
from
or
30kΩ
W
4.7k
+/−5%
GND
TSTEN
μC
10kΩ*
to
C1
2.2nF
10kΩ
2.2nF
*recommended if MOSFET is used
Figure 6. Short Circuit to Ground Detection
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9
NCV7693
Short Circuit to VS Detection
to 3.15 V typical allowing the mcontroller to detect the error
when the PWM input signal is activated High. Because of
the large power dissipation possible during this error, the
driver is switched OFF. If the SC disappears the device is
working properly on next rising edge of the PWM input pin.
In case multiple strings are connected to the same driver (see
Figure 9), this error is only detected at the condition each
string is shorted to VS (a single string detection is not
detected because of the blocking diodes).
The FeedBack (FBx) pins of the device are used as inputs
to detect a fault when the resistor on top of either the
collector or the drain of the external transistor is shorted to
the battery voltage. This error is detected when the driver is
ON (PWM active High). The threshold voltage detection is
referenced 1.2 V typical down from the VS pin. A voltage
of less than 1.2 V between VS and FBx for more than 10 ms
then a SC to VS is detected. The IOx pin is then pulled down
Vsupply
optional
10kΩ
100nF
optional
W
1.5k +/−5%
VS
FBx
10kΩ
NCV7693
IOx
PWM / DIAG
μC
SWx
from
or
30kΩ
10kΩ
W
4.7k
+/−5%
TSTEN
GND
10kΩ*
μC
to
C1
2.2nF
2.2nF
*recommended if MOSFET is used
Figure 7. Short Circuit to VS Detection
Thermal shut down
pulled down to 3.15 V typical allowing the mcontroller to
detect the error when the PWM input signal is activated
High. It is the responsibility of the mcontroller to
switch−OFF all IOx when the error is detected to avoid large
power dissipation in the device due to the large current
flowing in the IOx pins.
The thermal shut down circuit checks the internal junction
temperature of the device. When the internal temperature
rises above the Thermal shutdown threshold, then after a
short filter time the output channels are switched off. The
filter is implemented to avoid parasitic TSD, switching off
the driver in case of TSD, will also make the IOx pin is then
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10
NCV7693
6.5V
Vsupply
10kΩ
10kΩ
DC/DC
Automotive Grade
(example: NCV8853
buck controller)
100nF
optional
W
1.5k
VS
+/−5%
FBx
NCV7693
IOx
PWM / DIAG
μC
SWx
from
or
30kΩ
W
4.7k
+/−5%
TSTEN
GND
10kΩ*
μC
to
C1
2.2nF
10kΩ
2.2nF
*recommended if MOSFET is used
Figure 8. Application diagram with a DC/DC
Vsupply
optional
10kΩ
100nF
optional
W
1.5k +/−5%
VS
FBx
10kΩ
NCV7693
or
or
IOx
PWM / DIAG
μC
SWx
from
30kΩ
10kΩ
W
4.7k
+/−5%
GND
TSTEN
μC
to
10kΩ*
C1
2.2nF
2.2nF
*recommended if MOSFET is used
Figure 9. Application diagram with multiple strings
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11
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−14 WB
CASE 948G
ISSUE C
14
DATE 17 FEB 2016
1
SCALE 2:1
NOTES:
14X K REF
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
M
S
S
V
0.10 (0.004)
T
U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
S
0.15 (0.006) T
U
N
0.25 (0.010)
14
8
2X L/2
M
B
L
N
−U−
PIN 1
IDENT.
F
7
1
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DETAIL E
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
K
0.15 (0.006) T
U
A
−V−
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
A
B
C
D
F
G
H
J
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
J J1
1.20
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N−N
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
J1
K
−W−
C
K1 0.19
L
M
6.40 BSC
0.252 BSC
0.10 (0.004)
0
8
0
8
_
_
_
_
SEATING
PLANE
−T−
H
G
DETAIL E
D
GENERIC
MARKING DIAGRAM*
14
SOLDERING FOOTPRINT
XXXX
XXXX
ALYWG
G
7.06
1
1
A
L
= Assembly Location
= Wafer Lot
Y
W
G
= Year
= Work Week
= Pb−Free Package
0.65
PITCH
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
01.34X6
14X
1.26
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASH70246A
TSSOP−14 WB
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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ONSEMI
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