NCV7693DB0R2G [ONSEMI]

3 沟道控制器,带诊断,用于汽车 LED 灯;
NCV7693DB0R2G
型号: NCV7693DB0R2G
厂家: ONSEMI    ONSEMI
描述:

3 沟道控制器,带诊断,用于汽车 LED 灯

控制器
文件: 总14页 (文件大小:314K)
中文:  中文翻译
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Controller for Automotive  
LED Lamps  
NCV7693  
The NCV7693 is a device which drives multiple external switching  
components for 3 independent functions. The average current in each  
LED string can be regulated with a proper choice of dutycycle and  
battery voltage. The target application for this device is automotive  
rear combination lamps. Each individual driver has its own diagnostic  
to detect open load, short circuit to ground or to battery.  
LED average brightness levels are easily programmed using  
appropriate duty cycle control and external resistors in series with the  
switching transistors.  
www.onsemi.com  
14  
1
Multiple strings of LEDs can be operated with a single NCV7693  
device. The device is available in a TSSOP14 package.  
TSSOP14 WB  
CASE 948G  
Features  
MARKING DIAGRAM  
3x Pulse Width Modulation (PWM) Control  
Independent Diagnostic Feedback per Function  
External Switching Device for Wide Current Range Flexibility  
External Resistors Define Maximum Current  
Open LED String Diagnostic  
ShortCircuit LED String Diagnostic  
Thermal Shutdown Diagnostic and Protection  
Protection against ShortCircuit on the PWM Input Pins  
Multiple LED String Control  
TSSOP14 Package  
AECQ100 Qualified and PPAP Capable  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
14  
NCV  
7693  
ALYWG  
G
1
A
L
Y
W
G
= Assembly Location  
= Wafer Lot  
= Year  
= Work Week  
= PbFree Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
Applications  
Device  
Package  
Shipping  
Rear Combination Lamps (RCL)  
Daytime Running Lights (DRL)  
Fog Lights  
Center High Mounted Stop Lamps (CHMSL) Arrays  
Turn Signal and Other Externally Modulated Applications  
General Automotive LED Driver  
NCV7693DB0R2G TSSOP14  
(PbFree)  
2500 /  
Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
December, 2019 Rev. 1  
NCV7693/D  
NCV7693  
VSupply  
R1  
VS  
FB1  
SW1  
PWM 1  
PWM 2  
IO1  
IO2  
IO3  
FB2  
R2  
PWM 3  
SW2  
n.c.  
FB3  
TSTEN  
n.c.  
SW3  
GND  
R3  
Figure 1. Application Diagram  
www.onsemi.com  
2
NCV7693  
VS  
FBx  
OL  
Supply  
Monitoring  
+
VS  
Ref1  
Ref2  
Ref3  
Error  
Monitoring  
Filtering  
SC_GND  
Thermal  
Monitoring  
+
& decoding  
SC_VS  
+
5.5V  
Slew Rate  
Control  
3.15V  
7mA  
SWx  
GND  
Protection  
IOx  
Reference  
Voltages  
and Currents  
Refx  
Figure 2. Block Diagram  
PIN FUNCTION DESCRIPTION  
TSSOP14 Package  
Pin #  
Label  
VS  
Description  
1
2
3
4
5
6
Automotive Battery input voltage  
IO1  
Logic input1 for output SW1 on / off control and diagnostic feedback. Pull high for output on.  
Logic input2 for output SW2 on / off control and diagnostic feedback. Pull high for output on.  
Logic input3 for output SW3 on / off control and diagnostic feedback. Pull high for output on.  
Not connected  
IO2  
IO3  
NC  
TSTEN  
Pin used for test purpose only, has to be connected to GND pin during the normal  
operation.  
7
NC  
GND  
SW3  
FB3  
SW2  
FB2  
SW1  
FB1  
Not connected  
8
Ground  
9
Switch Driver 3 for external transistor  
Feedback pin for error detection on SW3  
Switch Driver 2 for external transistor  
Feedback pin for error detection on SW2  
Switch Driver 1 for external transistor  
Feedback pin for error detection on SW1  
10  
11  
12  
13  
14  
www.onsemi.com  
3
NCV7693  
MAXIMUM RATINGS  
(Voltages are with respect to GND, unless otherwise specified)  
Rating  
Value  
Unit  
Supply Voltage (VS)  
DC  
0.3 to 50  
V
V
Peak Transient  
50  
High Voltage InputOutput Pins (IO1, IO2, IO3)  
High Voltage Input Pins (FB1, FB2, FB3)  
Low Voltage Pins (SW1, SW2, SW3)  
40 to 50  
0.3 to 50  
0.3 to 6.5  
40 to 150  
260 peak  
V
V
V
Junction Temperature, T  
°C  
°C  
J
Peak Reflow Soldering Temperature: PbFree, 60 to 150 seconds at 217°C (Note 1)  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. For additional information, please see or download the ON Semiconductor Soldering and Mounting Techniques Reference Manual,  
SOLDERRM/D and Application Note AND8003/D.  
ATTRIBUTES  
Characteristic  
Value  
ESD Capability  
Human Body Model without any filter all Iox versus GND and VS versus GND  
Charge Device Model  
6.0 kV (Note 2)  
750 V  
Moisture Sensitivity  
MSL2  
Storage Temperature Range  
55 to 150°C  
Package Thermal Resistance TSSOP14 (Note 3)  
Junction–to–Ambient, R  
135°C/W  
45°C/W  
q
JA  
Junction–to–Case, R  
Y
JC  
2. Minimum 2 kV HBM for all pin combinations.  
3. Values represent typical still air steadystate thermal performance on 1 oz. copper FR4 PCB with 650 mm copper area.  
2
www.onsemi.com  
4
 
NCV7693  
ELECTRICAL CHARACTERISTICS  
(6.17 V < VS < 16 V, Transistor NPN = BCP56 or NMOS = NVR5198, 40°C T 150°C, unless otherwise specified) (Note 4)  
J
Characteristic  
General Parameters  
Conditions  
Min  
Typ  
Max  
Unit  
Supply Current  
VS = 14 V, all IOx > 2.2 V, SWx current subtracted  
VS = 14 V, all IOx = 0 V  
2.2  
30  
5.2  
185  
10  
380  
mA  
mA  
Under Voltage Lockout  
Under Voltage Lockout Hysteresis  
Thermal Shutdown (TSD)  
Thermal Hysteresis  
VS rising (Note 5)  
(Note 5)  
2.24  
3.35  
500  
170  
15  
4.43  
V
mV  
°C  
°C  
(Note 5)  
155  
190  
(Note 5)  
Switch Driver  
Output Source Current  
Output Source Current  
Output Source Current  
Swx ON Voltage  
SWx = 0.7 V (Note 6), 40°C T +25°C  
25  
15  
50  
30  
15  
mA  
mA  
mA  
J
SWx = 0.7 V (Note 6), +25°C T +125°C  
J
SWx = 0.7 V (Note 6), +125°C T +150°C  
7.0  
J
ISWx = 100 mA, 7 V < VS < 19 V  
ISWx = 100 mA  
4.5  
4.5  
5.5  
6.5  
V
V
Open Load Timing  
Open Load Detection Threshold  
Open Load Blanking Time  
Short Circuit to VS  
IOx High  
0.7  
10  
0.85  
22  
1.0  
35  
V
ms  
Short Circuit Detection Threshold  
Input pullup current on FBx pins  
Short Circuit Blanking Time  
Short Circuit to Ground  
Short Circuit Detection Threshold  
Short Circuit Blanking Time  
IOx  
IOx High  
VS1.0  
35  
VS1.2  
20  
VS1.4  
2.0  
15  
V
Tested at V(FBx) = VS 1.0 V  
Tested at 15 V  
mA  
ms  
5.0  
10  
IOx Low  
0.7  
10  
0.85  
22  
1.0  
35  
V
Tested at 15 V  
ms  
Input High Threshold  
1.1  
2.2  
V
V
Input Low Threshold  
Hysteresis  
0.52  
150  
3.15  
V
Input Pulldown Resistor  
IOx Clamp Voltage in error mode  
AC Characteristics  
Tested at V(IOx) = 15 V  
75  
300  
3.46  
kW  
V
PWMx > 5 V, 2 mA < I(IOx) < 9.5 mA  
2.80  
Propagation Delay  
50% criterion (Note 7)  
5
5
15  
15  
5
ms  
ms  
ms  
ms  
IOx rising to Iout  
BJT  
Propagation Delay  
IOx falling to Iout  
50% criterion (Note 7)  
BJT  
Propagation Delay  
IOx rising to Vout  
From IOx input high threshold to 90% rising of  
SWx_ON Voltage, C  
= 470 pF  
NMOS  
load  
Propagation Delay  
IOx falling to Vout  
From IOx input low threshold to 10% falling of  
SWx_ON Voltage, C = 470 pF  
5
NMOS  
load  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. Designed to meet these characteristics over the stated voltage and temperature recommended operating ranges, though may not be 100%  
parametrically tested in production.  
5. Guaranteed by design.  
6. This current is designed to decrease over temperature in case the switching element is an external bipolar to compensate internal heating  
and Beta.  
7. Evaluated at VS = 14V.  
www.onsemi.com  
5
 
NCV7693  
TYPICAL PERFORMANCE CHARACTERISTICS  
Equivalent schematics  
The following figure gives the equivalent schematics of the user relevant inputs and outputs. The diagrams are simplified  
representations of the circuits used.  
VS  
VS  
Low Power mode  
VS  
FBx  
VREF1  
OL, SC_GND  
SC_VS  
VS  
VREF 2  
Type 1: VS supply pin  
Type 2: FBx input pins  
VS  
3.15V  
5.5V  
Ifault = 7mA  
Slope Control / current derating  
Fault  
SWx_ON / OFF / Low power mode  
PWMx_ON / OFF  
SWx  
IOx  
Pulldown  
150kW  
Type 4: SWx output pins  
Type 3: IOx output pins  
Figure 3. Input and Output Equivalent Diagrams  
www.onsemi.com  
6
NCV7693  
Detailed Operating Description  
The NCV7693 device provides lowside current drive via  
an external switching transistor in series with the LEDs and  
a resistor. The drop across the resistor plus either the V or  
Where;  
VS is the Automotive Battery input voltage,  
V is the sum of the forward voltage of the LEDs,  
F
V
DROP  
is either V  
(saturation voltage of the chosen  
CE  
CEsat  
the V of the transistor is supposed to be above 1V in  
BJT) or V (in case NMOSFET is chosen),  
DS  
DS  
normal operation. Dimming is performed using the  
dedicated PWM at the IOx pins of the IC.  
DC is the Duty Cycle present at the input of the IOx pins  
and  
R the series resistance with the LEDs (typical value range  
is in between 50 and 100 W).  
Output Drive  
Figure 4 shows an example of the typical output drive  
configuration. The average current through the external  
LED is equal to:  
ǒ
Ǔ
VS * VF * VDROP  
ILED  
Vsupply  
+
  DC  
R
optional  
10kΩ  
100nF  
optional  
W
1.5k +/5%  
VS  
FBx  
10kΩ  
NCV7693  
IOx  
PWM / DIAG  
μC  
SWx  
from  
30kΩ  
W
4.7k  
+/5%  
TSTEN  
GND  
μC  
to  
C1  
2.2nF  
10kΩ  
2.2nF  
Figure 4. Output Drive configuration  
www.onsemi.com  
7
 
NCV7693  
Open Load Detection  
than 22 ms typical then an open load error is activated. The  
IOx pin is pulled down to 3.15 V typical allowing the  
mcontroller to detect the error when the PWM input signal  
is activated High. During open load condition the driver  
stays active. If the open load disappears the device is  
working properly again and the diagnostic flag disappears.  
Faulted output strings due to open load conditions  
sometimes require detection in an automotive rear lighting  
system. The NCV7693 provides that feature.  
When LED driver is ON (PWM is active high) and when  
the voltage on the FBx pin is detected below 0.85 V for more  
Vsupply  
optional  
10kΩ  
10kΩ  
100nF  
optional  
W
1.5k +/5%  
VS  
FBx  
NCV7693  
IOx  
PWM / DIAG  
μC  
SWx  
from  
or  
30kΩ  
W
4.7k  
+/5%  
TSTEN  
GND  
10kΩ*  
μC  
to  
C1  
2.2nF  
10kΩ  
2.2nF  
*recommended if MOSFET is used  
Figure 5. Open Load Detection  
www.onsemi.com  
8
NCV7693  
Short Circuit to Ground Detection  
mcontroller to detect the error when the PWM input signal  
is activated High. During SC to Ground condition the driver  
stays active. If the short circuit disappears the device is  
working properly on next falling edge of the PWM input pin.  
If at least one IOx pin remains High, then short to Ground  
detection is guaranteed. Note that in case all IOx pins are  
Low, the device is in low power mode and a short to Ground  
cannot be detected.  
The FeedBack (FBx) pins of the device are used as inputs  
to detect a fault when the resistor on top of either the  
collector or the drain of the external transistor is shorted to  
Ground. When LED driver is OFF (PWM is low) and when  
the voltage on the FBx pin is detected below 0.85 V for more  
than 22 ms typical then a SC to Ground is latched. The IOx  
pin is then pulled down to 3.15 V typical allowing the  
Vsupply  
optional  
10kΩ  
100nF  
optional  
W
1.5k +/5%  
VS  
FBx  
10kΩ  
NCV7693  
IOx  
PWM / DIAG  
μC  
SWx  
from  
or  
30kΩ  
W
4.7k  
+/5%  
GND  
TSTEN  
μC  
10kΩ*  
to  
C1  
2.2nF  
10kΩ  
2.2nF  
*recommended if MOSFET is used  
Figure 6. Short Circuit to Ground Detection  
www.onsemi.com  
9
NCV7693  
Short Circuit to VS Detection  
to 3.15 V typical allowing the mcontroller to detect the error  
when the PWM input signal is activated High. Because of  
the large power dissipation possible during this error, the  
driver is switched OFF. If the SC disappears the device is  
working properly on next rising edge of the PWM input pin.  
In case multiple strings are connected to the same driver (see  
Figure 9), this error is only detected at the condition each  
string is shorted to VS (a single string detection is not  
detected because of the blocking diodes).  
The FeedBack (FBx) pins of the device are used as inputs  
to detect a fault when the resistor on top of either the  
collector or the drain of the external transistor is shorted to  
the battery voltage. This error is detected when the driver is  
ON (PWM active High). The threshold voltage detection is  
referenced 1.2 V typical down from the VS pin. A voltage  
of less than 1.2 V between VS and FBx for more than 10 ms  
then a SC to VS is detected. The IOx pin is then pulled down  
Vsupply  
optional  
10kΩ  
100nF  
optional  
W
1.5k +/5%  
VS  
FBx  
10kΩ  
NCV7693  
IOx  
PWM / DIAG  
μC  
SWx  
from  
or  
30kΩ  
10kΩ  
W
4.7k  
+/5%  
TSTEN  
GND  
10kΩ*  
μC  
to  
C1  
2.2nF  
2.2nF  
*recommended if MOSFET is used  
Figure 7. Short Circuit to VS Detection  
Thermal shut down  
pulled down to 3.15 V typical allowing the mcontroller to  
detect the error when the PWM input signal is activated  
High. It is the responsibility of the mcontroller to  
switchOFF all IOx when the error is detected to avoid large  
power dissipation in the device due to the large current  
flowing in the IOx pins.  
The thermal shut down circuit checks the internal junction  
temperature of the device. When the internal temperature  
rises above the Thermal shutdown threshold, then after a  
short filter time the output channels are switched off. The  
filter is implemented to avoid parasitic TSD, switching off  
the driver in case of TSD, will also make the IOx pin is then  
www.onsemi.com  
10  
NCV7693  
6.5V  
Vsupply  
10kΩ  
10kΩ  
DC/DC  
Automotive Grade  
(example: NCV8853  
buck controller)  
100nF  
optional  
W
1.5k  
VS  
+/5%  
FBx  
NCV7693  
IOx  
PWM / DIAG  
μC  
SWx  
from  
or  
30kΩ  
W
4.7k  
+/5%  
TSTEN  
GND  
10kΩ*  
μC  
to  
C1  
2.2nF  
10kΩ  
2.2nF  
*recommended if MOSFET is used  
Figure 8. Application diagram with a DC/DC  
Vsupply  
optional  
10kΩ  
100nF  
optional  
W
1.5k +/5%  
VS  
FBx  
10kΩ  
NCV7693  
or  
or  
IOx  
PWM / DIAG  
μC  
SWx  
from  
30kΩ  
10kΩ  
W
4.7k  
+/5%  
GND  
TSTEN  
μC  
to  
10kΩ*  
C1  
2.2nF  
2.2nF  
*recommended if MOSFET is used  
Figure 9. Application diagram with multiple strings  
www.onsemi.com  
11  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TSSOP14 WB  
CASE 948G  
ISSUE C  
14  
DATE 17 FEB 2016  
1
SCALE 2:1  
NOTES:  
14X K REF  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
M
S
S
V
0.10 (0.004)  
T
U
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL  
NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL  
IN EXCESS OF THE K DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
S
0.15 (0.006) T  
U
N
0.25 (0.010)  
14  
8
2X L/2  
M
B
L
N
U−  
PIN 1  
IDENT.  
F
7
1
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
DETAIL E  
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE W.  
S
K
0.15 (0.006) T  
U
A
V−  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
K1  
A
B
C
D
F
G
H
J
4.90  
4.30  
−−−  
0.05  
0.50  
5.10 0.193 0.200  
4.50 0.169 0.177  
J J1  
1.20  
−−− 0.047  
0.15 0.002 0.006  
0.75 0.020 0.030  
SECTION NN  
0.65 BSC  
0.026 BSC  
0.60 0.020 0.024  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
0.50  
0.09  
0.09  
0.19  
J1  
K
W−  
C
K1 0.19  
L
M
6.40 BSC  
0.252 BSC  
0.10 (0.004)  
0
8
0
8
_
_
_
_
SEATING  
PLANE  
T−  
H
G
DETAIL E  
D
GENERIC  
MARKING DIAGRAM*  
14  
SOLDERING FOOTPRINT  
XXXX  
XXXX  
ALYWG  
G
7.06  
1
1
A
L
= Assembly Location  
= Wafer Lot  
Y
W
G
= Year  
= Work Week  
= PbFree Package  
0.65  
PITCH  
(Note: Microdot may be in either location)  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”,  
may or may not be present.  
01.34X6  
14X  
1.26  
DIMENSIONS: MILLIMETERS  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98ASH70246A  
TSSOP14 WB  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
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