NCV809SQ293T1G [ONSEMI]
Very Low Supply Current 3-Pin Microprocessor Reset Monitors;
| 型号： | NCV809SQ293T1G |
| 厂家： | 
ONSEMI |
| 描述： | Very Low Supply Current 3-Pin Microprocessor Reset Monitors |
| 文件： | 总13页 (文件大小：105K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MAX809 Series,
MAX810 Series
Very Low Supply Current
3-Pin Microprocessor
Reset Monitors
The MAX809 and MAX810 are cost−effective system supervisor
circuits designed to monitor VCC in digital systems and provide a reset
signal to the host processor when necessary. No external components
are required.
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MARKING
DIAGRAM
The reset output is driven active within 10 msec of VCC falling
through the reset voltage threshold. Reset is maintained active for a
timeout period which is trimmed by the factory after VCC rises above
the reset threshold. The MAX810 has an active−high RESET output
while the MAX809 has an active−low RESET output. Both devices
are available in SOT−23 and SC−70 packages.
3
3
SOT−23
(TO−236)
CASE 318
xxx MG
G
1
1
2
2
The MAX809/810 are optimized to reject fast transient glitches on
the VCC line. Low supply current of 0.5 mA (VCC = 3.2 V) makes these
devices suitable for battery powered applications.
SC−70
(SOT−323)
CASE 419
xx MG
G
1
Features
• Precision VCC Monitor for 1.5 V, 2.5 V, 3.0 V, 3.3 V, and 5.0 V
Supplies
xxx
M
= Specific Device Code
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
• Precision Monitoring Voltages from 1.2 V to 4.9 V Available
in 100 mV Steps
• Four Guaranteed Minimum Power−On Reset Pulse Width Available
(1 ms, 20 ms, 100 ms, and 140 ms)
PIN CONFIGURATION
• RESET Output Guaranteed to V = 1.0 V.
CC
• Low Supply Current
GND
1
• Compatible with Hot Plug Applications
• VCC Transient Immunity
V
3
CC
• No External Components
• Wide Operating Temperature: −40°C to 105°C
• These Devices are Pb−Free and are RoHS Compliant
RESET
RESET
2
Typical Applications
SOT−23/SC−70
• Computers
(Top View)
NOTE: RESET is for MAX809
RESET is for MAX810
• Embedded Systems
• Battery Powered Equipment
• Critical Microprocessor Power Supply Monitoring
ORDERING INFORMATION
See detailed ordering and shipping information in the package
V
CC
dimensions section on page 10 of this data sheet.
V
CC
V
CC
MAX809/810
PROCESSOR
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 10 of this data sheet.
RESET
RESET
RESET
INPUT
GND
GND
This document contains information on some products that
are still under development. ON Semiconductor reserves the
right to change or discontinue these products without notice.
Figure 1. Typical Application Diagram
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
November, 2017 − Rev. 28
MAX809S/D
MAX809 Series, MAX810 Series
3
V
CC
Timeout
Counter
Oscillator
V
CC
2
RESET
Vref
1 GND
Figure 2. MAX809 Series Complementary Active−Low Output
3
V
CC
Timeout
Counter
Oscillator
V
CC
2
RESET
Vref
1 GND
Figure 3. MAX810 Series Complementary Active−High Output
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2
MAX809 Series, MAX810 Series
PIN DESCRIPTION
Pin No.
Symbol
Description
1
2
GND
Ground
RESET (MAX809)
RESET output remains low while V is below the reset voltage threshold, and for a reset timeout
period after V rises above reset threshold
CC
CC
2
3
RESET (MAX810)
RESET output remains high while V is below the reset voltage threshold, and for a reset timeout
CC
period after V rises above reset threshold
CC
V
CC
Supply Voltage (Typ)
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
V
Value
Unit
V
Power Supply Voltage (V to GND)
−0.3 to 6.0
CC
CC
RESET Output Voltage (CMOS)
−0.3 to (V + 0.3)
V
CC
Input Current, V
20
20
mA
CC
Output Current, RESET
dV/dt (V
mA
)
100
V/msec
°C/W
CC
Thermal Resistance, Junction−to−Air (Note 1)
SOT−23
SC−70
R
301
314
q
JA
Operating Junction Temperature Range
Storage Temperature Range
T
−40 to +125
−65 to +150
+260
°C
°C
°C
V
J
T
stg
Lead Temperature (Soldering, 10 Seconds)
T
sol
ESD Protection
2000
200
Human Body Model (HBM): Following Specification JESD22−A114
Machine Model (MM): Following Specification JESD22−A115
Latchup Current Maximum Rating: Following Specification JESD78 Class II
I
mA
Latchup
200
200
Positive
Negative
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
2
1. This based on a 35x35x1.6mm FR4 PCB with 10mm of 1 oz copper traces under natural convention conditions and a single component
characterization.
2. The maximum package power dissipation limit must not be exceeded.
T
* T
J(max)
A
with T
= 150°C
P
D
+
J(max)
R
qJA
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3
MAX809 Series, MAX810 Series
ELECTRICAL CHARACTERISTICS T = −40°C to +105°C unless otherwise noted. Typical values are at T = +25°C. (Note 3)
A
A
Characteristic
Symbol
Min
Typ
Max
Unit
V
Range
T = 0°C to +70°C
T = −40°C to +105°C (Note 4)
V
CC
1.0
1.2
−
−
5.5
5.5
A
A
Supply Current
I
mA
CC
V
= 3.3 V
CC
−
−
0.5
−
1.2
2.0
T = −40°C to +85°C
A
T = 85°C to +105°C (Note 5)
A
V
CC
= 5.5 V
−
−
0.8
−
1.8
2.5
T = −40°C to +85°C
A
T = 85°C to +105°C (Note 5)
A
Reset Threshold (V Decreasing) (Note 6)
V
TH
V
in
MAX809SN490
T = +25°C
4.83
4.78
4.66
4.9
−
−
4.97
5.02
5.14
A
T = −40°C to +85°C
A
T = +85°C to +105°C (Note 5)
A
MAX8xxLTR, MAX8xxSQ463
T = +25°C
4.56
4.50
4.40
4.63
−
−
4.70
4.75
4.86
A
T = −40°C to +85°C
A
T = +85°C to +105°C (Note 5)
A
MAX809HTR
T = +25°C
4.48
4.43
4.32
4.55
4.38
4.62
4.67
4.78
A
T = −40°C to +85°C
A
T = +85°C to +105°C (Note 5)
A
MAX8xxMTR, MAX8xxSQ438
T = +25°C
4.31
4.27
4.16
4.45
4.49
4.60
A
T = −40°C to +85°C
A
T = +85°C to +105°C (Note 5)
A
MAX809JTR, MAX8xxSQ400
T = +25°C
3.94
3.90
3.80
4.00
−
−
4.06
4.10
4.20
A
T = −40°C to +85°C
A
T = +85°C to +105°C (Note 5)
A
MAX8xxTTR, MAX809SQ308
T = +25°C
3.04
3.00
2.92
3.08
−
−
3.11
3.16
3.24
A
T = −40°C to +85°C
A
T = +85°C to +105°C (Note 5)
A
MAX8xxSTR, MAX8xxSQ293
T = +25°C
2.89
2.85
2.78
2.93
−
−
2.96
3.00
3.08
A
T = −40°C to +85°C
A
T = +85°C to +105°C (Note 5)
A
MAX8xxRTR, MAX8xxSQ263
T = +25°C
2.59
2.56
2.49
2.63
−
−
2.66
2.70
2.77
A
T = −40°C to +85°C
A
T = +85°C to +105°C (Note 5)
A
MAX809SN232, MAX809SQ232
T = +25°C
2.28
2.25
2.21
2.32
−
−
2.35
2.38
2.45
A
T = −40°C to +85°C
A
T = +85°C to +105°C (Note 5)
A
MAX809SN160
T = +25°C
1.58
1.56
1.52
1.60
−
−
1.62
1.64
1.68
A
T = −40°C to +85°C
A
T = +85°C to +105°C (Note 5)
A
MAX809SN120, MAX8xxSQ120
T = +25°C
1.18
1.17
1.14
1.20
−
−
1.22
1.23
1.26
A
T = −40°C to +85°C
A
T = +85°C to +105°C (Note 5)
A
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Production testing done at T = 25°C, over temperature limits guaranteed by design.
A
4. For NCV automotive devices, this temperature range is T = −40°C to +125°C.
A
5. For NCV automotive devices, this temperature range is T = +85°C to +125°C.
A
6. Contact your ON Semiconductor sales representative for other threshold voltage options.
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4
MAX809 Series, MAX810 Series
ELECTRICAL CHARACTERISTICS (continued) T = −40°C to +105°C unless otherwise noted. Typical values are at
A
T = +25°C. (Note 7)
A
Characteristic
Symbol
Min
−
Typ
30
Max
−
Unit
Detector Voltage Threshold Temperature Coefficient
ppm/°C
V
CC
to Reset Delay V = V to (V − 100 mV)
−
10
−
msec
CC
TH
TH
Reset Active TimeOut Period (Note 8)
MAX8xxSN(Q)293D1
t
msec
RP
1.0
20
100
−
−
−
−
3.3
66
330
MAX8xxSN(Q)293D2
MAX8xxSN(Q)293D3
MAX8xxSN(Q)293
140
460
RESET Output Voltage Low (No Load) (MAX809)
V
OL
−
−
0.3
V
V
CC
= V − 0.2 V
TH
1.6 V v V v 2.0 V, I
= 0.5 mA
= 1.2 mA
= 3.2 mA
TH
SINK
SINK
SINK
2.1 V v V v 4.0 V, I
TH
4.1 V v V v 4.9 V, I
TH
RESET Output Voltage High (No Load) (MAX809)
= V + 0.2 V
V
V
0.8 V
0.8 V
−
−
−
−
−
−
V
V
V
OH
CC
V
CC
TH
1.6 V v V v 2.4 V, I
= 200 mA
= 500 mA
TH
SOURCE
SOURCE
2.5 V v V v 4.9 V, I
TH
RESET Output Voltage High (No Load) (MAX810)
= V − 0.2 V
OH
CC
V
CC
TH
1.6 V v V v 2.4 V, I
= 200 mA
= 500 mA
TH
SOURCE
SOURCE
2.5 V v V v 4.9 V, I
TH
RESET Output Voltage Low (No Load) (MAX810)
= V + 0.2 V
V
0.3
OL
V
CC
TH
1.6 V v V v 2.0 V, I
= 0.5 mA
= 1.2 mA
= 3.2 mA
TH
SINK
SINK
SINK
2.1 V v V v 4.0 V, I
TH
4.1 V v V v 4.9 V, I
TH
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
7. Production testing done at T = 25°C, over temperature limits guaranteed by design.
A
8. Contact your ON Semiconductor sales representative for timeout options availability for other threshold voltage options.
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5
MAX809 Series, MAX810 Series
TYPICAL OPERATING CHARACTERISTICS
0.6
0.5
0.4
0.3
0.2
0.35
V
TH
= 1.2 V
V
TH
= 4.9 V
0.30
0.25
0.20
85°C
85°C
25°C
25°C
0.15
0.10
−40°C
−40°C
0.1
0
0.05
0
0.5
1.5
2.5
3.5
4.5
5.5
6.5
0.5
1.5
2.5
3.5
4.5
5.5
6.5
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
Figure 4. Supply Current vs. Supply Voltage
Figure 5. Supply Current vs. Supply Voltage
0.35
0.30
0.25
0.20
0.15
0.10
1.002
1.001
1.000
0.999
0.998
0.997
0.996
V
TH
= 2.93 V
85°C
25°C
V
TH
= 4.9 V
−40°C
V
TH
= 1.2 V
0.05
0
0.995
0.994
0.5
1.5
2.5
3.5
4.5
5.5
6.5
−50
−25
0
25
50
75
100
SUPPLY VOLTAGE (V)
TEMPERATURE (°C)
Figure 6. Supply Current vs. Supply Voltage
Figure 7. Normalized Reset Threshold Voltage
vs. Temperature
0.40
0.40
0.32
0.24
0.16
MAX809L/M, V = 5.0 V
CC
0.32
0.24
0.16
MAX810L/M, V = 5.0 V
CC
MAX809R/S/T, V = 3.3 V
CC
MAX810R/S/T, V = 3.3 V
CC
MAX810L/M/R/S/T, V = 1.0 V
CC
0.08
0
0.08
0
MAX809L/M/R/S/T, V = 1.0 V
CC
−50
−25
0
25
50
75
100
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 8. Supply Current vs. Temperature
(No Load, MAX809)
Figure 9. Supply Current vs. Temperature (No
Load, MAX810)
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6
MAX809 Series, MAX810 Series
TYPICAL OPERATING CHARACTERISTICS
30
25
20
15
10
80
V
I
= 4.90 V
TH
70
60
50
40
30
20
V
= 4.63 V
TH
= 500 mA
SINK
I
= 100 mA
SOURCE
RESET ASSERTED
RESET ASSERTED
85°C
85°C
25°C
25°C
−40°C
−40°C
5.0
0
10
0
0.5 1.0 1.5
2.0 2.5 3.0 3.5 4.0 4.5 5.0
SUPPLY VOLTAGE (V)
0.5 1.0 1.5 2.0 2.5
3.0 3.5 4.0 4.5 5.0
SUPPLY VOLTAGE (V)
Figure 10. Output Voltage Low vs. Supply
Voltage
Figure 11. Output Voltage High vs. Supply
Voltage
125
100
75
400
V
OD
= V −V
CC TH
V
= 10 mV
V
OD
= V −V
CC TH
OD
V
= 10 mV
= 20 mV
OD
300
200
V
OD
V
OD
= 20 mV
50
V
= 100 mV
OD
V
V
= 100 mV
= 200 mV
OD
100
0
25
0
V
= 200 mV
−25
OD
OD
−50
0
25
50
75
100
125
−50
−25
0
25
50
75
100
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 12. Power−Down Reset Delay vs.
Temperature and Overdrive (VTH = 1.2 V)
Figure 13. Power−Down Reset Delay vs.
Temperature and Overdrive (VTH = 4.9 V)
1.3
1.2
1.1
1.0
0.9
0.8
0.7
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
Figure 14. Normalized Power−Up Reset vs.
Temperature
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7
MAX809 Series, MAX810 Series
Detail Operation Description
The MAX809/810 series microprocessor reset
supervisory circuits are designed to monitor the power
supplies in digital systems and provide a reset signal to the
processor without any external components. Figure 2 shows
the timing diagram and a typical application below. Initially
If there is an input power interruption and V becomes
significantly deficient, it will fall below the lower detector
CC
threshold (V ). This event causes the RESET output to be
TH−
in the low state for the MAX809, or in the high state for the
NCP810 devices. After completion of the power
consider that input voltage V is at a nominal level greater
interruption, V will rise to its nominal level and become
CC
CC
than the voltage detector upper threshold (V ). And the
greater than the V . This sequence activates the internal
TH
TH
oscillator circuitry and digital counter to count. After the
count of the timeout period, the reset output will revert back
to the original state.
RESET
(RESET) output voltage (Pin 2) will be in the high
state for MAX809, or in the low state for MAX 810 devices.
V
V
V
CC
TH+
TH–
Input Voltage
V
V
CC
Reset Output
TH–
MAX809, NCP803
0V
V
V
CC
Reset Output
MAX810
TH–
0V
t
RP
Figure 15. Timing Waveforms
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8
MAX809 Series, MAX810 Series
APPLICATIONS INFORMATION
VCC Transient Rejection
maintained valid to VCC = 0 V, a pull−down resistor must be
connected from RESET to ground to discharge stray
capacitances and hold the output low (Figure 17). This
resistor value, though not critical, should be chosen such that
it does not appreciably load RESET under normal operation
(100 kW will be suitable for most applications).
The MAX809 provides accurate VCC monitoring and
reset timing during power−up, power−down, and
brownout/sag conditions, and rejects negative−going
transients (glitches) on the power supply line. Figure 16
shows the maximum transient duration vs. maximum
negative excursion (overdrive) for glitch rejection. Any
combination of duration and overdrive which lies under the
curve will not generate a reset signal. Combinations above
the curve are detected as a brownout or power−down.
Typically, transient that goes 100 mV below the reset
threshold and lasts 5.0 ms or less will not cause a reset pulse.
Transient immunity can be improved by adding a capacitor
in close proximity to the VCC pin of the MAX809.
V
CC
V
CC
MAX809/810
RESET
RESET
R1
100 k
V
CC
GND
V
TH
Overdrive
Figure 17. Ensuring RESET Valid to VCC = 0 V
Duration
Processors With Bidirectional I/O Pins
Some Microprocessor’s have bidirectional reset pins.
Depending on the current drive capability of the processor
pin, an indeterminate logic level may result if there is a logic
conflict. This can be avoided by adding a 4.7 kW resistor in
series with the output of the MAX809 (Figure 18). If there
are other components in the system which require a reset
signal, they should be buffered so as not to load the reset line.
If the other components are required to follow the reset I/O
of the Microprocessor, the buffer should be connected as
shown with the solid line.
300
250
200
150
100
V
TH
= 4.9 V
V
TH
= 2.93 V
V
TH
= 1.2 V
50
0
BUFFER
BUFFERED RESET
TO OTHER SYSTEM
COMPONENTS
V
CC
10
60
110 160
210 260
310
360 410
RESET COMPARATOR OVERDRIVE (mV)
V
CC
V
CC
MAX809/810
Figure 16. Maximum Transient Duration vs.
Microprocessor
RESET
4.7 k
Overdrive for Glitch Rejection at 25°C
RESET
RESET
RESET Signal Integrity During Power−Down
GND
GND
The MAX809 RESET output is valid to VCC = 1.0 V.
Below this voltage the output becomes an “open circuit” and
does not sink current. This means CMOS logic inputs to the
Microprocessor will be floating at an undetermined voltage.
Most digital systems are completely shutdown well above
this voltage. However, in situations where RESET must be
Figure 18. Interfacing to Bidirectional Reset I/O
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9
MAX809 Series, MAX810 Series
ORDERING, MARKING AND THRESHOLD INFORMATION
†
Part Number
V
TH
* (V)
Timeout* (ms)
Description
Marking
Package
Shipping
MAX809SN160T1G
1.60
2.32
2.63
2.63
2.93
2.93
3.08
4.00
4.38
4.38
4.55
4.63
4.63
4.90
1.20
2.93
140−460
SAA
MAX809SN232T1G
MAX809RTRG
140−460
140−460
140−460
140−460
140−460
140−460
140−460
140−460
140−460
140−460
140−460
140−460
140−460
140−460
1−3.3
SQP
SPS
RPA
SPT
SUC
SPU
SPR
SPV
TAT
SBD
SPW
STA
SBH
SSO
SSP
ACT
SSQ
ACE
SSR
ZD
NCV809RTRG
MAX809STRG
NCV809STRG
MAX809TTRG
MAX809JTRG
MAX809MTRG
NCV809MTRG
SOT23−3
(Pb−Free)
3000 / Tape & Reel
MAX809HTRG
MAX809LTRG
NCV809LTRG
MAX809SN490T1G
MAX809SN120T1G
MAX809SN293D1T1G
NCV809SN293D1T1G*
MAX809SN293D2T1G
NCV809SN293D2T1G
MAX809SN293D3T1G
MAX809SQ120T1G
MAX809SQ232T1G
MAX809SQ263T1G
MAX809SQ293T1G
Push−Pull RESET
2.93
2.93
2.93
1.20
2.32
2.63
2.93
20−66
20−66
100−330
140−460
140−460
140−460
140−460
ZE
ZF
ZG
NCV809SQ293T1G*
(In Development)
SC70−3
(Pb−Free)
MAX809SQ308T1G
MAX809SQ400T1G
MAX809SQ438T1G
MAX809SQ463T1G
MAX809SQ293D1T1G
MAX809SQ293D2T1G
MAX809SQ293D3T1G
3.08
4.00
4.38
4.63
2.93
2.93
2.93
140−460
140−460
140−460
140−460
1−3.3
ZH
SZ
ZI
3000 / Tape & Reel
ZJ
ZK
ZL
ZM
20−66
100−330
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10
MAX809 Series, MAX810 Series
ORDERING, MARKING AND THRESHOLD INFORMATION
†
Part Number
MAX810RTRG
V
** (V)
Timeout** (ms)
Description
Marking
Package
Shipping
TH
2.63
140−460
SPX
MAX810STRG
2.93
3.08
4.38
4.63
1.20
2.93
2.93
2.93
1.20
2.63
2.70
2.93
4.00
4.38
4.63
2.93
2.93
2.93
140−460
140−460
140−460
140−460
140−460
1−3.3
SPY
SPZ
SQA
SQB
SSS
SST
SSU
SSZ
ZN
MAX810TTRG
MAX810MTRG
SOT23−3
(Pb−Free)
MAX810LTRG
3000 / Tape & Reel
MAX810SN120T1G
MAX810SN293D1T1G
MAX810SN293D2T1G
MAX810SN293D3T1G
MAX810SQ120T1G
MAX810SQ263T1G
MAX810SQ270T1G
MAX810SQ293T1G
MAX810SQ400T1G
MAX810SQ438T1G
MAX810SQ463T1G
MAX810SQ293D1T1G
MAX810SQ293D2T1G
MAX810SQ293D3T1G
20−66
100−330
140−460
140−460
20−66
Push−Pull RESET
ZO
ZB
140−460
20−66
ZP
ZC
SC70−3
(Pb−Free)
3000 / Tape & Reel
140−460
140−460
1−3.3
ZQ
ZR
ZS
20−66
ZT
100−330
ZU
†For information on tape and reel specifications,including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
**Contact your ON Semiconductor sales representative for other threshold voltage options.
www.onsemi.com
11
MAX809 Series, MAX810 Series
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AR
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
THE BASE MATERIAL.
0.25
3
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
T
H
E
E
1
2
MILLIMETERS
INCHES
DIM
A
A1
b
c
D
E
e
L
L1
MIN
0.89
0.01
0.37
0.08
2.80
1.20
1.78
0.30
0.35
2.10
0°
NOM
1.00
0.06
0.44
0.14
2.90
1.30
1.90
0.43
0.54
2.40
−−−
MAX
MIN
0.035
0.000
0.015
0.003
0.110
0.047
0.070
0.012
0.014
0.083
0°
NOM
0.039
0.002
0.017
0.006
0.114
0.051
0.075
0.017
0.021
0.094
−−−
MAX
0.044
0.004
0.020
0.008
0.120
0.055
0.080
0.022
0.027
0.104
10°
L
1.11
0.10
0.50
0.20
3.04
1.40
2.04
0.55
0.69
2.64
10°
3X
b
L1
VIEW C
e
TOP VIEW
A
H
E
T
c
A1
SEE VIEW C
SIDE VIEW
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
3X
2.90
0.90
3X
0.95
0.80
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
12
MAX809 Series, MAX810 Series
PACKAGE DIMENSIONS
SC−70 (SOT−323)
CASE 419−04
ISSUE N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
D
e1
MILLIMETERS
INCHES
DIM
A
A1
A2
b
c
D
E
e
MIN
0.80
0.00
NOM
0.90
0.05
0.70 REF
0.35
0.18
2.10
1.24
1.30
0.65 BSC
MAX
1.00
0.10
MIN
0.032
0.000
NOM
0.035
0.002
0.028 REF
0.014
0.007
0.083
0.049
0.051
0.026 BSC
MAX
0.040
0.004
3
E
H
E
1
2
0.30
0.10
1.80
1.15
1.20
0.40
0.25
2.20
1.35
1.40
0.012
0.004
0.071
0.045
0.047
0.016
0.010
0.087
0.053
0.055
b
e
e1
L
H
E
0.38
2.10
0.015
0.083
0.20
2.00
0.56
2.40
0.008
0.079
0.022
0.095
c
A
A2
0.05 (0.002)
L
A1
SOLDERING FOOTPRINT*
0.65
0.025
0.65
0.025
1.9
0.075
0.9
0.035
0.7
0.028
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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