NCV8774CDT33RKG [ONSEMI]
LDO Regulator - Ultra Low Iq 350 mA;
| 型号： | NCV8774CDT33RKG |
| 厂家： | 
ONSEMI |
| 描述： | LDO Regulator - Ultra Low Iq 350 mA |
| 文件： | 总13页 (文件大小：171K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LDO Regulator - Ultra
Low Iq
350 mA
NCV8774C
The NCV8774C is a 350 mA LDO regulator. Its robustness allows
NCV8774C to be used in severe automotive environments. Ultra low
quiescent current as low as 17 mA typical makes it suitable for
applications permanently connected to battery requiring ultra low
quiescent current with or without load. This feature is especially critical
when modules remain in active mode when ignition is off. The
NCV8774C contains protection functions as current limit, thermal
shutdown.
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MARKING
DIAGRAM
DPAK−3
DT SUFFIX
CASE 369C
8774CxG
ALYWW
Features
• Output Voltage Options: 3.3 V and 5 V
• Output Voltage Accuracy: 2%
• Output Current up to 350 mA
• Ultra Low Quiescent Current: typ 17 mA
• Wide Input Voltage Operation Range: up to 40 V
x
A
= Voltage Option
= Assembly Location
WL, L = Wafer Lot
• Protection Features
− Current Limitation
− Thermal Shutdown
• EMC Compliant
Y
WW
G
= Year
= Work Week
= Pb−Free Package
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100 Grade 1
Qualified and PPAP Capable
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 12 of this data sheet.
• These are Pb−Free Devices
Typical Applications (For safety applications refer to Figure 29)
• Body Control Module
• Instruments and Clusters
• Occupant Protection and Comfort
• Powertrain
V
BAT
V
out
V
out
V
in
C
0.1 mF
C
out
1 mF
in
NCV8774C
GND
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2019
1
Publication Order Number:
May, 2020 − Rev. 2
NCV8774C/D
NCV8774C
V
in
V
out
Driver
With
Current
Limit
−
+
Thermal
Vref
Shutdown
GND
Figure 2. Simplified Block Diagram
PIN CONNECTIONS
PIN 1. V
in
Tab, 2. GND
3. V
out
1
DPAK−3
Figure 3. Pin Connections
PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
Description
1
2, TAB
3
V
Positive Power Supply Input. Connect 0.1 mF capacitor to ground.
Power Supply Ground.
in
GND
V
out
Regulated Output Voltage. Connect 1 mF capacitor with ESR < 5 W to ground.
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2
NCV8774C
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Min
−0.3
−
Max
40
Unit
V
Input Voltage (Note 1)
DC
Load Dump − Suppressed
V
in
*
Input Voltage (Note 2)
Output Voltage
U
45
V
S
V
out
−0.3
−40
−55
7
V
Junction Temperature
Storage Temperature
T
J
150
150
°C
°C
T
STG
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. Load Dump Test B (with centralized load dump suppression) according to ISO16750−2 standard. Guaranteed by design. Not tested in
production. Passed Class A according to ISO16750−1.
ESD CAPABILITY (Note 3)
Rating
ESD Capability, Human Body Model
ESD Capability, Charged Device Model
Symbol
Min
−4
Max
4
Unit
kV
ESD
ESD
HBM
CDM
−1
1
kV
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2017)
Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes smaller than
2 x 2 mm due to the inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current
waveform characteristic defined in JEDEC JS−002−2018
LEAD SOLDERING TEMPERATURE AND MSL (Note 4)
Rating
Symbol
Min
Max
Unit
Moisture Sensitivity Level
DPAK−3
MSL
1
−
4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Characteristics, DPAK−3
°C/W
R
Y
49
6.6
28
Thermal Resistance, Junction−to−Air (Note 5)
q
JA
JC
JA
R
Thermal Reference, Junction−to−Case (Note 5)
Thermal Resistance, Junction−to−Air (Note 6)
Thermal Reference, Junction−to−Case (Note 6)
R
R
q
6.6
Y
JC
2
2
5. Values based on 1s0p board with copper area of 645 mm (or 1 in ) of 1 oz copper thickness and FR4 PCB substrate. Single layer − according
to JEDEC51.3.
2
2
6. Values based on 2s2p board with copper area of 645 mm (or 1 in ) of 1 oz copper thickness and FR4 PCB substrate. 4 layers − according
to JEDEC51.7.
RECOMMENDED OPERATING RANGE
Rating
Symbol
Min
4.5
Max
40
Unit
V
Input Voltage (Note 7)
Junction Temperature
V
in
T
J
−40
150
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
7. Minimum V = 4.5 V or (V + V ), whichever is higher.
in
out
DO
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3
NCV8774C
ELECTRICAL CHARACTERISTICS V = 13.5 V, C = 0.1 mF, C = 1 mF, Min and Max values are valid for temperature range
in
in
out
−40°C ≤ T ≤ +150°C unless noted otherwise and are guaranteed by test, design or statistical correlation. Typical values are referenced to
J
T = 25°C. (Note 8)
J
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
REGULATOR OUTPUT
Output Voltage (Accuracy %)
V
out
V
3.3 V V = 4.5 V to 40 V, I = 0.1 mA to 200 mA
3.234
3.234
4.9
3.3
3.3
5.0
5.0
3.366
3.366
5.1
in
in
out
V
= 4.5 V to 16 V, I = 0.1 mA to 350 mA
out
5.0 V V = 5.45 V to 40 V, I = 0.1 mA to 200 mA
in
in
out
out
V
= 5.7 V to 16 V, I = 0.1 mA to 350 mA
4.9
5.1
Output Voltage (Accuracy %)
Line Regulation
V
V
out
3.3 V V = 4.5 V to 40 V, I = 0 mA
3.234
4.9
3.3
5.0
3.366
5.1
in
out
5.0 V V = 5.45 V to 40 V, I = 0 mA
in
out
Reg
−20
0
20
mV
line
3.3 V V = 4.5 V to 28 V, I = 5 mA
in
out
5.0 V V = 6 V to 28 V, I = 5 mA
in
out
Load Regulation
I
= 0.1 mA to 350 mA
Reg
−35
0
35
mV
mV
out
load
Dropout Voltage (Note 9)
V
DO
5.0 V I = 200 mA
−
−
200
350
350
600
out
out
I
= 350 mA
QUIESCENT CURRENT
Quiescent Current (I = I − I
)
I
q
mA
q
in
out
I
I
I
I
= 0 mA, T = 25°C
−
−
−
−
17
−
19
−
21
23
23
25
out
out
out
out
J
= 0 mA, T ≤ 125°C
J
= 0.1 mA, T = 25°C
J
= 0.1 mA, T ≤ 125°C
J
CURRENT LIMIT PROTECTION
Current Limit
V
= 0.96 x V
= 0 V
I
400
400
−
−
1100
1100
mA
mA
out
out_nom
LIM
Short Circuit Current Limit
PSRR
V
out
I
SC
Power Supply Ripple Rejection (Note 10) f = 100 Hz, 0.5 V
PSRR
−
80
−
dB
pp
THERMAL SHUTDOWN
Thermal Shutdown Temperature
(Note 10)
T
T
150
175
10
195
°C
°C
SD
Thermal Shutdown Hysteresis
(Note 10)
−
−
SH
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
8. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at T [ T . Low duty cycle
A
J
pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
9. Measured when output voltage falls 100 mV below the regulated voltage at V = 13.5 V.
in
10.Values based on design and/or characterization.
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4
NCV8774C
TYPICAL CHARACTERISTICS
800
30
28
26
24
22
20
18
16
14
12
10
V
I
= 13.5 V
= 100 mA
in
I
= 100 mA
V
out
= 3.3 V
out
700
600
out
T = 25°C
J
500
400
300
200
V
out
= 5 V
100
0
−40 −20
0
20 40 60 80 100 120 140 160
0 2 4 6 8 10 1214 16 1820 2224 2628 30 32 34 363840
T , JUNCTION TEMPERATURE (°C)
J
V , INPUT VOLTAGE (V)
in
Figure 4. Quiescent Current vs. Temperature
Figure 5. Quiescent Current vs. Input Voltage
1200
1000
800
600
400
200
0
T = −40°C
J
T = 25°C
J
T = 150°C
J
V
in
= 13.5 V
300 350
0
50
100
150
200
250
I , OUTPUT CURRENT (mA)
OUT
Figure 6. Quiescent Current vs. Output Current
5.10
5.08
5.05
5.03
5.00
4.98
4.95
4.93
4.90
3.38
V
= 13.5 V
= 100 mA
V
= 13.5 V
= 100 mA
in
in
3.36
3.34
3.32
3.3
I
I
out
out
V
= 5.0 V
V
= 3.3 V
out(nom)
out(nom)
3.28
3.26
3.24
3.22
−40 −20
0
20 40 60 80 100 120 140 160
−40 −20
0
20 40 60 80 100 120 140 160
T , JUNCTION TEMPERATURE (°C)
T , JUNCTION TEMPERATURE (°C)
J
J
Figure 7. Output Voltage vs. Temperature
Figure 8. Output Voltage vs. Temperature
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5
NCV8774C
TYPICAL CHARACTERISTICS
4.0
6
5
4
3
2
1
0
I
V
= 100 mA
I
V
= 100 mA
out
out
= 5.0 V
= 3.3 V
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
out(nom)
out(nom)
T = 150°C
J
T = 150°C
J
T = 25°C
J
T = 25°C
J
T = −40°C
J
T = −40°C
J
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
V , INPUT VOLTAGE (V)
in
V , INPUT VOLTAGE (V)
in
Figure 9. Output Voltage vs. Input Voltage
Figure 10. Output Voltage vs. Input Voltage
700
600
500
400
300
200
100
0
700
600
500
400
300
200
100
0
V
= 5.0 V
V
= 5.0 V
out(nom)
out(nom)
T = 150°C
J
I
= 350 mA
out
T = 25°C
J
T = −40°C
J
I
= 200 mA
out
0
50
100
150
200
250
300
350
0
20
40
60
80
100
120
140 160
I
, OUTPUT CURRENT (mA)
T , JUNCTION TEMPERATURE (°C)
J
out
Figure 12. Dropout vs. Temperature
Figure 11. Dropout vs. Output Current
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6
NCV8774C
TYPICAL CHARACTERISTICS
T = 25°C
out(nom)
T = 25°C
J
out(nom)
J
V
1000
800
600
400
200
0
1000
800
600
400
200
0
= 5.0 V
V
= 3.3 V
I
@ V = 0 V
out
SC
I
@ V = 0 V
out
SC
I
@ V = 3.168 V
out
LIM
I
@ V = 4.8 V
out
LIM
0
5
10
15
20
25
30
35
40
0
5
10
15
20
25
30
35
40
V , INPUT VOLTAGE (V)
in
V , INPUT VOLTAGE (V)
in
Figure 13. Output Current Limit vs. Input
Voltage
Figure 14. Output Current Limit vs. Input
Voltage
1100
1000
900
800
700
600
500
400
1100
1000
900
800
700
600
500
400
V
= 13.5 V
V = 13.5 V
in
in
V
= 5.0 V
V
= 3.3 V
out(nom)
out(nom)
I
@ V = 0 V
out
SC
I
@ V = 0 V
SC
out
I
@ V = 3.168 V
out
LIM
I
@ V = 4.8 V
LIM
out
−40 −20
0
20 40 60 80 100 120 140 160
−40 −20
0
20 40 60 80 100 120 140 160
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 15. Output Current Limit vs. Temperature
Figure 16. Output Current Limit vs. Temperature
100
10
100
10
Unstable Region
Stable Region
Unstable Region
Stable Region
1
1
0.1
0.01
0.1
0.01
V
= 13.5 V
V = 13.5 V
in
in
V
= 5.0 V
V
= 3.3 V
out(nom)
out(nom)
C
= 1.0 mF − 100 mF
C
= 1.0 mF − 100 mF
out
out
0
50
100
150
200
250
300
350
0
50
100
I , OUTPUT CURRENT (mA)
out
150
200
250
300
350
I
, OUTPUT CURRENT (mA)
out
Figure 17. Cout ESR Stability Region vs. Output
Current
Figure 18. Cout ESR Stability Region vs. Output
Current
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7
NCV8774C
TYPICAL CHARACTERISTICS
T = 25°C
out
T = 25°C
J
out
J
26 V
26 V
I
= 1 mA
I
= 1 mA
C
= 10 mF
C
= 10 mF
out
out
t
= 1 ms (V )
t = 1 ms (V )
rise/fall in
rise/fall
in
V
= 5.0 V
V
= 3.3 V
out(nom)
out(nom)
6 V
6 V
3.310 V
5.013 V
4.989 V
3.286 V
TIME (1 ms/div)
TIME (1 ms/div)
Figure 19. Line Transients
Figure 20. Line Transients
T = 25°C
in
T = 25°C
J
in
J
V
100 mA
= 13.5 V
V = 13.5 V
100 mA
C
= 10 mF
C
= 10 mF
out
out
t
= 1 ms (I
)
t
= 1 ms (I
)
rise/fall
out
rise/fall
out
V
= 5.0 V
V
= 3.3 V
out(nom)
out(nom)
0.1 mA
0.1 mA
5.07 V
3.37 V
3.21 V
4.87 V
TIME (200 ms/div)
TIME (200 ms/div)
Figure 21. Load Transients
Figure 22. Load Transients
13.5 V
13.5 V
0 V
0 V
T = 25°C
out
T = 25°C
J
out
J
I
= 1 mA
I
= 1 mA
C
= 10 mF
C
= 10 mF
out
out
t
= 100 ms (V )
t = 100 ms (V )
rise/fall in
rise/fall
in
V
= 5.0 V
V
= 3.3 V
out(nom)
out(nom)
TIME (100 ms/div)
TIME (100 ms/div)
Figure 23. Power Up/Down Response
Figure 24. Power Up/Down Response
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8
NCV8774C
TYPICAL CHARACTERISTICS
120
100
80
60
40
20
0
120
100
I
= 100 mA
I
= 100 mA
out
out
80
60
40
20
0
I
= 100 mA
I
= 100 mA
out
out
V
C
= 13.5 V $ 0.5 V
V = 13.5 V $ 0.5 V
in
in
pp
pp
= 1 mF
C
= 1 mF
out
out
V
= 5.0 V
V
= 3.3 V
out(nom)
out(nom)
10
100
1000
10000
100000 1000000
10
100
1000
10000
100000 1000000
f, FREQUENCY (Hz)
f, FREQUENCY (Hz)
Figure 25. PSRR vs. Frequency
Figure 26. PSRR vs. Frequency
6000
5000
4000
3000
2000
1000
T = 25°C
in
J
V
= 13.5 V
C
= 1 mF
out
I
= 100 mA
out
0
10
100
1000
f, FREQUENCY (Hz)
10000
100000
Figure 27. Noise vs. Frequency
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9
NCV8774C
DEFINITIONS
General
Current Limit and Short Circuit Current Limit
All measurements are performed using short pulse low
duty cycle techniques to maintain junction temperature as
close as possible to ambient temperature.
Current Limit is value of output current by which output
voltage drops below 96% of its nominal value. Short Circuit
Current Limit is output current value measured with output
of the regulator shorted to ground.
Output voltage
The output voltage parameter is defined for specific
temperature, input voltage and output current values or
specified over Line, Load and Temperature ranges.
PSRR
Power Supply Rejection Ratio is defined as ratio of output
voltage and input voltage ripple. It is measured in decibels
(dB).
Line Regulation
The change in output voltage for a change in input voltage
measured for specific output current over operating ambient
temperature range.
Line Transient Response
Typical output voltage overshoot and undershoot
response when the input voltage is excited with a given
slope.
Load Regulation
The change in output voltage for a change in output
current measured for specific input voltage over operating
ambient temperature range.
Load Transient Response
Typical output voltage overshoot and undershoot
response when the output current is excited with a given
slope between low−load and high−load conditions.
Dropout Voltage
The input to output differential at which the regulator
output no longer maintains regulation against further
reductions in input voltage. It is measured when the output
drops 100 mV below its nominal value. The junction
temperature, load current, and minimum input supply
requirements affect the dropout level.
Thermal Protection
Internal thermal shutdown circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated at typically 175°C,
the regulator turns off. This feature is provided to prevent
failures from accidental overheating.
Quiescent and Disable Currents
Maximum Package Power Dissipation
Quiescent Current (I ) is the difference between the input
current (measured through the LDO input pin) and the
output load current.
The power dissipation level is maximum allowed power
dissipation for particular package or power dissipation at
which the junction temperature reaches its maximum
operating value, whichever is lower.
q
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10
NCV8774C
APPLICATIONS INFORMATION
The NCV8774C regulator is self−protected with internal
thermal shutdown and internal current limit. Typical
characteristics are shown in Figures 4 to 27.
can dissipate up to 2.53 W for 1s0p PCB board and 4.49 W
for 2s2p PCB board when the ambient temperature (T ) is
A
25°C. See Figure 28 for R
versus PCB area. The power
qJA
dissipated by the NCV8774C can be calculated from the
following equations:
Input Decoupling (Cin)
A ceramic or tantalum 0.1 mF capacitor is recommended
and should be connected close to the NCV8774C package.
Higher capacitance and lower ESR will improve the overall
line and load transient response.
If extremely fast input voltage transients are expected then
appropriate input filter must be used in order to decrease
rising and/or falling edges below 4 V/ms for proper
operation. The filter can be composed of several capacitors
in parallel.
ǒ
Ǔ
ǒ
Ǔ
in * Vout
(eq. 2)
(eq. 3)
P
D + Vin Iq@Iout ) Iout
V
or
ǒ
Ǔ
PD(max) ) Vout Iout
Vin(max)
+
Iout ) Iq
NOTE: Items containing I can be neglected if I >> I .
q
out
q
110
100
90
80
70
60
50
40
30
20
10
0
Output Decoupling (Cout
)
The NCV8774C is a stable component and does not
require a minimum Equivalent Series Resistance (ESR) for
the output capacitor. Stability region of ESR vs Output
Current is shown in Figures 17 to 18. The minimum output
decoupling value is 1 mF and can be augmented to fulfill
stringent load transient requirements. The regulator works
with ceramic chip capacitors as well as tantalum devices.
Larger values improve noise rejection and load regulation
transient response.
1 oz, Single Layer
2 oz, Single Layer
1 oz, 4 Layer
2 oz, 4 Layer
Thermal Considerations
0
200
400
600
800
2
1000
As power in the NCV8774C increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
affect the rate of junction temperature rise for the part. When
the NCV8774C has good thermal conductivity through the
PCB, the junction temperature will be relatively low with
high power applications. The maximum dissipation the
NCV8774C can handle is given by:
COPPER HEAT SPREADER (mm )
Figure 28. Thermal Resistance vs. PCB Copper Area
Hints
V
and GND printed circuit board traces should be as
in
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the NCV8774C and
make traces as short as possible. The NCV8774C is not
developed in compliance with ISO26262 standard. If
application is safety critical then the below application
example diagram shown in Figure 29 can be used.
ƪT
ƫ
J(max) * TA
(eq. 1)
PD max
+
(
)
RqJA
Since T is not recommended to exceed 150°C, then the
J
2
NCV8774C soldered on 645 mm , 1 oz copper area, FR4
V
BAT
V
out
V
in
V
DD
V
Cin
0.1 μF
CC
Cout
1 μF
NCV8774C
GND
Voltage
Microprocessor
Supervisor
(e.g. NCV30X, NCV809)
RESET
I/O
GND
Figure 29. NCV8774C Application Diagram
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11
NCV8774C
ORDERING INFORMATION
Device
†
Output Voltage
Marking
Package
Shipping
NCV8774CDT50RKG
5.0 V
8774C5G
DPAK−3
(Pb−Free)
2500 /
Tape & Reel
NCV8774CDT33RKG
3.3 V
8774C3G
DPAK−3
(Pb−Free)
2500 /
Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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12
NCV8774C
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C
NOTES:
ISSUE F
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
A
D
E
C
A
b3
B
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
c2
4
2
L3
L4
Z
DETAIL A
H
1
3
7. OPTIONAL MOLD FEATURE.
INCHES
DIM MIN MAX
0.086 0.094
A1 0.000 0.005
0.025 0.035
b2 0.028 0.045
b3 0.180 0.215
MILLIMETERS
NOTE 7
MIN
2.18
0.00
0.63
0.72
4.57
0.46
0.46
5.97
6.35
MAX
2.38
0.13
0.89
1.14
5.46
0.61
0.61
6.22
6.73
c
b2
e
BOTTOM VIEW
A
SIDE VIEW
b
b
M
0.005 (0.13)
C
TOP VIEW
c
0.018 0.024
c2 0.018 0.024
Z
Z
D
E
e
0.235 0.245
0.250 0.265
0.090 BSC
H
2.29 BSC
9.40 10.41
1.40 1.78
2.90 REF
0.51 BSC
0.89 1.27
GAUGE
PLANE
SEATING
PLANE
H
L
L1
L2
0.370 0.410
0.055 0.070
0.114 REF
L2
C
0.020 BSC
L3 0.035 0.050
L
BOTTOM VIEW
A1
L4
Z
−−− 0.040
0.155 −−−
−−−
3.93
1.01
−−−
L1
ALTERNATE
CONSTRUCTIONS
DETAIL A
ROTATED 905 CW
SOLDERING FOOTPRINT*
6.20
0.244
3.00
0.118
2.58
0.102
5.80
0.228
1.60
0.063
6.17
0.243
mm
inches
ǒ
Ǔ
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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