NCV890101MWTXG [ONSEMI]

汽车开关稳压器,降压,1.2 A,2 MHz;
NCV890101MWTXG
型号: NCV890101MWTXG
厂家: ONSEMI    ONSEMI
描述:

汽车开关稳压器,降压,1.2 A,2 MHz

开关 光电二极管 输出元件 稳压器
文件: 总20页 (文件大小:312K)
中文:  中文翻译
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NCV890101  
Switching Regulator -  
Automotive, Buck  
1.2 A, 2 MHz  
The NCV890101 is a fixedfrequency, monolithic, Buck switching  
regulator intended for Automotive, batteryconnected applications  
that must operate with up to a 36 V input supply. The regulator is  
suitable for systems with low noise and small form factor  
requirements often encountered in automotive driver information  
systems. The NCV890101 is capable of converting the typical 4.5 V to  
18 V automotive input voltage range to outputs as low as 3.3 V at a  
constant switching frequency above the sensitive AM band,  
eliminating the need for costly filters and EMI countermeasures. Two  
pins are provided to synchronize switching to a clock, or to another  
NCV890101. The NCV890101 also provides several protection  
features expected in Automotive power supply systems such as current  
limit, short circuit protection, and thermal shutdown. In addition, the  
high switching frequency produces low output voltage ripple even  
when using small inductor values and an allceramic output filter  
capacitor forming a spaceefficient switching regulator solution.  
Features  
www.onsemi.com  
MARKING DIAGRAM  
V8901  
01  
ALYWG  
DFN10  
G
CASE 485C  
A
L
Y
W
G
= Assembly Location  
= Wafer Lot  
= Year  
= Work Week  
= PbFree Device  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 18 of this data sheet.  
Internal NChannel Power Switch  
Low V Operation Down to 4.5 V  
IN  
High V Operation to 36 V  
IN  
Withstands Load Dump to 40 V  
2 MHz Freerunning Switching Frequency  
Low Shutdown Current  
Wettable Flanks DFN  
NCV Prefix for Automotive and Other Applications  
Requiring Unique Site and Control Change  
Requirements; AECQ100 Qualified and PPAP  
Capable  
Autosynchronizes with Other NCV890101 or to an  
External Clock  
Logic level Enable Input Can be Directly Tied to  
Battery  
1.4 A (min) CyclebyCycle Peak Current Limit  
These Devices are PbFree and are RoHS Compliant  
Applications  
Short Circuit Protection enhanced by Frequency  
Foldback  
Audio  
1.75% Output Voltage Tolerance  
Output Voltage Adjustable Down to 0.8 V  
1.4 Millisecond Internal SoftStart  
Thermal Shutdown (TSD)  
Infotainment  
Safety Vision Systems  
Instrumentation  
CDRV  
DBST  
NCV890101  
VIN  
L1  
VOUT  
COUT  
1
2
3
4
5
VIN  
SW 10  
CBST  
CIN  
SYNC  
DFW  
DRV  
BST  
9
8
7
6
SYNC IN  
OUT  
RFB1  
SYNCO SYNCI  
GND  
EN  
FB  
EN  
RFB2  
COMP  
RCOMP  
CCOMP  
Figure 1. Typical Application  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
August, 2019 Rev. 3  
NCV890101/D  
NCV890101  
CDRV  
SW  
DBST  
VIN  
VIN  
CIN  
L1  
VOUT  
DFW  
3 V  
CBST  
Reg  
COUT  
Oscillator  
DRV  
BST  
PWM  
LOGIC  
ON  
SYNCO  
OFF  
SYNCI  
Sync Out  
Sync In  
Sync  
Out In  
1.2 A  
+
S
+
+
FB  
GND  
+
+
TSD  
SoftStart  
RESET  
COMP  
VOLTAGES  
MONITORS  
RCOMP  
CCOMP  
EN  
Enable  
Figure 2. NCV890101 Block Diagram  
www.onsemi.com  
2
NCV890101  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
0.3 to 40  
40  
Unit  
V
Min/Max Voltage VIN  
Max Voltage VIN to SW  
Min/Max Voltage SW  
V
0.7 to 40  
3.0  
V
Min Voltage SW 20ns  
Min/Max Voltage BST  
Min/Max Voltage BST to SW  
Min/Max Voltage on EN  
Min/Max Voltage COMP  
Min/Max Voltage FB  
V
0.3 to 40  
0.3 to 3.6  
0.3 to 40  
0.3 to 2  
0.3 to 18  
0.3 to 3.6  
0.3 to 3.6  
0.3 to 6  
50  
V
V
V
V
Min/Max Voltage SYNCO  
Min/Max Voltage DRV  
Min/Max Voltage SYNCI  
V
V
V
Thermal Resistance, 3x3 DFN JunctiontoAmbient*  
Storage Temperature range  
R
°C/W  
°C  
°C  
q
JA  
55 to +150  
40 to +150  
Operating Junction Temperature Range  
T
J
ESD withstand Voltage  
Human Body Model  
V
ESD  
2.0  
200  
>1.0  
kV  
V
kV  
Machine Model  
Charge Device Model  
Moisture Sensitivity  
MSL  
Level 1  
260  
Peak Reflow Soldering Temperature  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
*Mounted on 1 sq. in. of a 4layer PCB with 1 oz. copper thickness.  
www.onsemi.com  
3
NCV890101  
SW  
1
2
3
4
5
VIN  
DRV  
10  
9
BST  
8
SYNCI  
FB  
SYNCO  
GND  
7
COMP  
EN  
6
(Top View)  
Figure 3. Pin Connections  
PIN FUNCTION DESCRIPTIONS  
Pin No.  
Symbol  
VIN  
Description  
1
2
3
Input voltage from battery. Place an input filter capacitor in close proximity to this pin.  
Output voltage to provide a regulated voltage to the Power Switch gate driver.  
DRV  
SYNCO  
Synchronization output. Turnon of the Power Switch causes the SYNCO signal to fall. SYNCO rises  
half a switching period later. Connecting to the SYNCI pin of another NCV890101 causes them to switch  
outofphase  
4
5
GND  
EN  
Battery return, and output voltage ground reference.  
This TTL compatible Enable input allows the direct connection of Battery as the enable signal. Grounding  
this input stops switching and reduces quiescent current draw to a minimum.  
6
7
8
COMP  
FB  
Error Amplifier output, for tailoring transient response with external compensation components.  
Feedback input pin to program output voltage, and detect precharged or shorted output conditions.  
SYNCI  
Synchronization input. Connecting an external clock to the SYNCI pin synchronizes switching to the ris-  
ing edge of the SYNCI voltage.  
9
BST  
SW  
Bootstrap input provides drive voltage higher than VIN to the Nchannel Power Switch for optimum  
switch R  
and highest efficiency.  
DS(on)  
10  
Switching node of the Regulator. Connect the output inductor and cathode of the freewheeling diode to  
this pin.  
Exposed  
Pad  
Connect to Pin 4 (electrical ground) and to a low thermal resistance path to the ambient temperature  
environment.  
www.onsemi.com  
4
NCV890101  
ELECTRICAL CHARACTERISTICS (V = 4.5 V to 28 V, V = 5 V, V  
= V  
+ 3.0 V, C  
= 0.1 mF, Min/Max values are valid  
IN  
EN  
BST  
SW  
DRV  
for the temperature range 40°C T 150°C unless noted otherwise, and are guaranteed by test, design or statistical correlation.)  
J
Parameter  
QUIESCENT CURRENT  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
Quiescent Current, shutdown  
Quiescent Current, enabled  
UNDERVOLTAGE LOCKOUT VIN (UVLO)  
UVLO Start Threshold  
UVLO Stop Threshold  
UVLO Hysteresis  
I
I
V
IN  
= 13.2 V, V = 0 V, T = 25°C  
5
3
mA  
qSD  
EN  
J
V
IN  
= 13.2 V  
mA  
qEN  
V
V
V
rising  
falling  
4.1  
3.9  
0.1  
4.5  
4.4  
0.2  
V
V
V
UVLSTT  
UVLSTP  
UVLOHY  
IN  
V
IN  
V
ENABLE (EN)  
Logic Low  
V
0.8  
8
V
V
ENLO  
Logic High  
V
2
ENHI  
Input Current  
I
30  
mA  
EN  
SOFTSTART (SS)  
SoftStart Completion Time  
VOLTAGE REFERENCE  
FB Pin Voltage during regulation  
ERROR AMPLIFIER  
FB Bias Current  
t
0.8  
1.4  
0.8  
2.0  
0.814  
1
ms  
V
SS  
V
FBR  
COMP shorted to FB  
0.786  
0.25  
I
V
FB  
= 0.8 V  
mA  
FBBIAS  
Transconductance  
V
= 1.3 V  
IN  
IN  
mmho  
COMP  
g
4.5 V < V < 18 V  
0.6  
0.3  
1
0.5  
1.5  
0.75  
m
g
20 V < V < 28 V  
m(HV)  
Output Resistance  
R
1.4  
MW  
mA  
OUT  
SOURCE  
COMP Source Current Limit  
I
V
FB  
= 0.63 V, V  
= 1.3 V  
COMP  
4.5 V < V < 18 V  
75  
40  
IN  
20 V < V < 28 V  
IN  
COMP Sink Current Limit  
I
V
FB  
= 0.97 V, V  
= 1.3 V  
mA  
SINK  
COMP  
4.5 V < V < 18 V  
75  
40  
IN  
20 V < V < 28 V  
IN  
Minimum COMP voltage  
OSCILLATOR  
V
F
V
= 0.97 V  
0.2  
0.7  
V
CMPMIN  
FB  
Frequency  
F
4.5 < V < 18 V  
20 V < V < 28 V  
1.8  
0.9  
2.0  
1.0  
2.2  
1.1  
MHz  
SW  
SW(HV)  
IN  
IN  
VIN FREQUENCY FOLDBACK MONITOR  
Frequency Foldback Threshold  
V
FB  
= 0.63 V  
V
V
V
IN  
V
IN  
rising  
falling  
V
18.4  
18  
20  
FLDUP  
FLDDN  
V
19.8  
Frequency Foldback Hysteresis  
V
FLDHY  
0.2  
0.3  
0.4  
1. Not tested in production. Limits are guaranteed by design.  
www.onsemi.com  
5
NCV890101  
ELECTRICAL CHARACTERISTICS (V = 4.5 V to 28 V, V = 5 V, V  
= V  
+ 3.0 V, C  
= 0.1 mF, Min/Max values are valid  
IN  
EN  
BST  
SW  
DRV  
for the temperature range 40°C T 150°C unless noted otherwise, and are guaranteed by test, design or statistical correlation.)  
J
Parameter  
SYNCHRONIZATION  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
SYNCO Output Pulse Duty Ratio  
SYNCO Output Pulse Falltime  
SYNCO Output Pulse Risetime  
SYNCI Input Resistance to ground  
SYNCI Input High Threshold Voltage  
SYNCI Input Low Threshold Voltage  
SYNCI High Pulse Width  
D
C
= 40 pF  
LOAD  
40  
60  
%
ns  
ns  
k
(SYNC)  
t
C
C
= 40 pF, 90% to 10%  
= 40 pF, 10% to 90%  
4
4
R(SYNC)  
LOAD  
LOAD  
t
F(SYNC)  
R
V
SYNCI  
= 5.0 V  
50  
200  
2.0  
H(SYNC)  
V
V
HSYNC  
V
0.8  
40  
V
LSYNC  
t
V
> max V  
ns  
ns  
MHz  
ns  
HSYNCI  
SYNC  
HSYNC  
SYNCI Low Pulse Width  
t
V
< min V  
40  
LSYNCI  
SYNC  
LSYNC  
External Sync Frequency  
F
1.8  
2.5  
SYNCI  
Master Reassertion Time  
t
Time from last rising SYNCI edge  
to first unsynchronized turnon.  
650  
I(SYNC)  
SLOPE COMPENSATION  
Ramp Slope (Note 1)  
(With respect to switch current)  
S
4.5 < V < 18 V  
0.7  
0.25  
1.3  
0.6  
A/ms  
ramp  
IN  
S
20 V < V < 28 V  
ramp(HV)  
IN  
POWER SWITCH  
ON Resistance  
R
V
= V + 3.0 V  
SW  
650  
10  
mW  
mA  
ns  
DSON  
BST  
Leakage current VIN to SW  
Minimum ON Time  
Minimum OFF Time  
I
V
= 0 V, V  
= 0, V = 18 V  
SW IN  
LKSW  
EN  
t
Measured at SW pin  
Measured at SW pin  
45  
70  
ONMIN  
t
ns  
OFFMIN  
At F  
= 2 MHz (normal)  
30  
50  
SW  
At F  
= 500 kHz (max duty cycle)  
30  
70  
SW  
PEAK CURRENT LIMIT  
Current Limit Threshold  
I
1.4  
1.55  
1.7  
A
LIM  
SHORT CIRCUIT FREQUENCY FOLDBACK  
Lowest Foldback Frequency  
F
V
= 0 V, 4.5 V < V < 18 V  
400  
200  
24  
500  
250  
32  
600  
300  
40  
kHz  
SWAF  
FB  
IN  
Lowest Foldback Frequency High V  
F
V
= 0 V, 20 V < V < 28 V  
in  
SWAFHV  
FB IN  
Hiccup Mode  
F
V
FB  
= 0 V  
SWHIC  
GATE VOLTAGE SUPPLY (DRV pin)  
Output Voltage  
V
3.1  
2.7  
2.5  
16  
3.3  
2.9  
2.8  
3.5  
3.05  
3.0  
45  
V
V
DRV  
DRV POR Start Threshold  
DRV POR Stop Threshold  
DRV Current Limit  
V
V
DRVSTT  
DRVSTP  
DRVLIM  
V
I
V
DRV  
= 0 V  
mA  
OUTPUT PRECHARGE DETECTOR  
Threshold Voltage  
V
SSEN  
20  
35  
50  
mV  
THERMAL SHUTDOWN  
Activation Temperature (Note 1)  
Hysteresis (Note 1)  
T
150  
5
190  
20  
°C  
°C  
SD  
T
HYS  
1. Not tested in production. Limits are guaranteed by design.  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
6
 
NCV890101  
TYPICAL CHARACTERISTICS CURVES  
8
7
6
5
4
3
2
1
0
2.6  
V
= 13.2 V  
IN  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
50  
25  
0
25  
50  
75  
100  
125  
150  
50  
25  
0
25  
50  
75  
100  
125  
150  
T . JUNCTION TEMPERATURE (°C)  
J
T . JUNCTION TEMPERATURE (°C)  
J
Figure 4. Shutdown Quiescent Current vs.  
Junction Temperature  
Figure 5. Enabled Quiescent Current vs.  
Junction Temperature  
4.7  
4.6  
4.5  
4.4  
4.3  
4.2  
4.1  
4.0  
3.9  
4.6  
4.5  
4.4  
4.3  
4.2  
4.1  
4.0  
3.9  
3.8  
3.7  
50  
25  
0
25  
50  
75  
100  
125  
150  
50  
25  
0
25  
50  
75  
100  
125  
150  
T . JUNCTION TEMPERATURE (°C)  
J
T . JUNCTION TEMPERATURE (°C)  
J
Figure 6. UVLO Start Threshold vs. Junction  
Temperature  
Figure 7. UVLO Stop Threshold vs. Junction  
Temperature  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.85  
0.84  
0.83  
0.82  
0.81  
0.80  
0.79  
0.78  
0.77  
0.76  
0.75  
50  
25  
0
25  
50  
75  
100  
125  
150  
50  
25  
0
25  
50  
75  
100  
125  
150  
T . JUNCTION TEMPERATURE (°C)  
J
T . JUNCTION TEMPERATURE (°C)  
J
Figure 8. SoftStart Duration vs. Junction  
Figure 9. FB Regulation Voltage vs. Junction  
Temperature  
Temperature  
www.onsemi.com  
7
NCV890101  
TYPICAL CHARACTERISTICS CURVES  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
100  
90  
V
IN  
= 4.5 V  
80  
V
= 4.5 V  
IN  
70  
60  
50  
40  
30  
20  
V
IN  
= 28 V  
V
IN  
= 28 V  
50  
25  
0
25  
50  
75  
100  
125  
150  
50  
25  
0
25  
50  
75  
100  
125  
150  
T . JUNCTION TEMPERATURE (°C)  
J
T . JUNCTION TEMPERATURE (°C)  
J
Figure 10. Error Amplifier Transconductance  
vs. Junction Temperature  
Figure 11. Error Amplifier Max Sourcing  
Current vs. Junction Temperature  
100  
90  
80  
70  
60  
50  
40  
30  
20  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
V
= 13.2 V  
IN  
V
= 4.5 V  
IN  
V
= 28 V  
IN  
V
= 28 V  
IN  
50  
25  
0
25  
50  
75  
100  
125  
150  
50  
25  
0
25  
50  
75  
100  
125  
150  
T . JUNCTION TEMPERATURE (°C)  
J
T . JUNCTION TEMPERATURE (°C)  
J
Figure 12. Error Amplifier Max Sinking Current  
vs. Junction Temperature  
Figure 13. Oscillator Frequency vs. Junction  
Temperature  
19.6  
19.4  
19.2  
19.0  
18.8  
18.6  
18.4  
18.2  
56  
55  
54  
53  
52  
51  
50  
49  
48  
V
V
FLDUP  
FLDDN  
50  
25  
0
25  
50  
75  
100  
125  
150  
50  
25  
0
25  
50  
75  
100  
125  
150  
T . JUNCTION TEMPERATURE (°C)  
J
T . JUNCTION TEMPERATURE (°C)  
J
Figure 14. Rising Frequency Foldback  
Threshold vs. Junction Temperature  
Figure 15. SYNCO Pulse Duty Ratio vs.  
Junction Temperature  
www.onsemi.com  
8
NCV890101  
TYPICAL CHARACTERISTICS CURVES  
160  
140  
120  
100  
80  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
60  
40  
50  
25  
0
25  
50  
75  
100  
125  
150  
150  
150  
50  
25  
0
25  
50  
75  
100  
125  
15
T . JUNCTION TEMPERATURE (°C)  
T . JUNCTION TEMPERATURE (°C)  
J
J
Figure 16. SYNCI Input Resistance vs.  
Junction Temperature  
Figure 17. Power Switch RDS(on) vs. Junction  
Temperature  
80  
75  
70  
65  
60  
55  
50  
45  
40  
75  
70  
65  
60  
55  
50  
45  
40  
35  
50  
50  
25  
0
25  
50  
75  
100  
125  
25  
0
25  
50  
75  
100  
125  
150  
T . JUNCTION TEMPERATURE (°C)  
J
T . JUNCTION TEMPERATURE (°C)  
J
Figure 18. Minimum On Time vs. Junction  
Temperature  
Figure 19. Minimum Off Time vs. Junction  
Temperature  
1.70  
1.65  
1.60  
1.55  
1.50  
1.45  
1.40  
600  
V
= 4.5 V  
IN  
550  
500  
450  
400  
350  
300  
250  
200  
V
= 28 V  
IN  
50  
25  
0
25  
50  
75  
100  
125  
50  
25  
0
25  
50  
75  
100  
125  
150  
T . JUNCTION TEMPERATURE (°C)  
J
T . JUNCTION TEMPERATURE (°C)  
J
Figure 20. Current Limit Threshold vs.  
Junction Temperature  
Figure 21. ShortCircuit Foldback Frequency  
vs. Junction Temperature  
www.onsemi.com  
9
NCV890101  
TYPICAL CHARACTERISTICS CURVES  
40  
38  
36  
34  
32  
30  
28  
26  
24  
3.50  
3.45  
3.40  
3.35  
3.30  
3.25  
3.20  
3.15  
3.10  
I
= 0 mA  
DRV  
I
= 16 mA  
DRV  
50  
25  
0
25  
50  
75  
100  
125  
150  
50  
25  
0
25  
50  
75  
100  
125  
150  
T . JUNCTION TEMPERATURE (°C)  
J
T . JUNCTION TEMPERATURE (°C)  
J
Figure 22. Hiccup Mode Switching Frequency  
vs. Junction Temperature  
Figure 23. DRV Voltage vs. Junction  
Temperature  
3.1  
3.0  
2.9  
2.8  
2.7  
2.6  
2.5  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
V
V
DRVSTT  
DRVSTP  
50  
25  
0
25  
50  
75  
100  
125  
150  
50  
25  
0
25  
50  
75  
100  
125  
150  
T . JUNCTION TEMPERATURE (°C)  
J
T . JUNCTION TEMPERATURE (°C)  
J
Figure 24. DRV Reset Threshold vs. Junction  
Temperature  
Figure 25. DRV Current Limit vs. Junction  
Temperature  
55  
50  
45  
40  
35  
30  
25  
20  
50  
25  
0
25  
50  
75  
100  
125  
150  
T . JUNCTION TEMPERATURE (°C)  
J
Figure 26. Output Precharge Detector  
Threshold vs. Junction Temperature  
www.onsemi.com  
10  
NCV890101  
GENERAL INFORMATION  
INPUT VOLTAGE  
SLOPE COMPENSATION  
An Undervoltage Lockout (UVLO) circuit monitors the  
input, and inhibits switching and resets the Softstart circuit  
if there is insufficient voltage for proper regulation. The  
NCV890101 can regulate a 3.3 V output with input voltages  
above 4.5 V and a 5.0 V output with an input above 6.5 V.  
The NCV890101 withstands input voltages up to 40 V.  
To limit the power lost in generating the drive voltage for  
the Power Switch, the switching frequency is reduced by a  
A fixed slope compensation signal is generated internally  
and added to the sensed current to avoid increased output  
voltage ripple due to bifurcation of inductor ripple current  
at duty cycles above 50%. The fixed amplitude of the slope  
compensation signal requires the inductor to be greater than  
a minimum value, depending on output voltage, in order to  
avoid subharmonic oscillations. For 3.3 V and 5 V output  
voltages, the recommended inductor value is 4.7 mH.  
factor of 2 when the input voltage exceeds the V  
IN  
SHORT CIRCUIT FREQUENCY FOLDBACK  
Frequency Foldback threshold V  
(see Figure 27).  
FLDUP  
During severe output overloads or short circuits, the  
NCV890101 automatically reduces its switching frequency.  
This creates duty cycles small enough to limit the peak  
current in the power components, while maintaining the  
ability to automatically reestablish the output voltage if the  
overload is removed. If the current is still too high after the  
switching frequency folds back to 500 kHz, the regulator  
enters an autorecovery burst mode that further reduces the  
dissipated power.  
Frequency reduction is automatically terminated when the  
input voltage drops back below the V Frequency Foldback  
IN  
threshold V  
.
FLDDN  
Fsw  
(MHz)  
2
1
CURRENT LIMITING  
Due to the ripple on the inductor current, the average  
output current of a buck converter is lower than the peak  
current setpoint of the regulator. Figure 28 shows for a  
4.7 mH inductor how the variation of inductor peak current  
with input voltage affects the maximum DC current the  
NCV890101 can deliver to a load.  
4
18 20  
36  
VIN (V)  
1.4  
1.3  
Figure 27. NCV890101 Switching Frequency  
Reduction at High Input Voltage  
(3.3 V  
)
OUT  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
ENABLE  
(5 V  
)
OUT  
The NCV890101 is designed to accept either a logic level  
signal or battery voltage as an Enable signal. EN low induces  
a ’sleep mode’ which shuts off the regulator and minimizes  
its supply current to a couple of mA typically (I ) by  
qSD  
disabling all functions. Upon enabling, voltage is  
established at the DRV pin, followed by a softstart of the  
switching regulator output.  
0
5
10  
15  
20  
25  
30  
35  
40  
SOFTSTART  
INPUT VOLTAGE (V)  
Upon being enabled or released from a fault condition,  
and after the DRV voltage is established, a softstart circuit  
ramps the switching regulator error amplifier reference  
voltage to the final value. During softstart, the average  
switching frequency is lower than its normal mode value  
(typically 2 MHz) until the output voltage approaches  
regulation.  
Figure 28. NCV890101 Load Current Capability  
with 4.7 mH Inductor  
www.onsemi.com  
11  
 
NCV890101  
SYNCHRONIZATION  
does not arrive at the SYNCI pin within the Master  
Reassertion Time, the NCV890101 controls its own  
switching frequency, allowing uninterrupted operation in  
the event that the clock (or controlling NCV890101) is  
turned off.  
If internal conditions or excessive input voltage cause an  
NCV890101 to fold back its switching frequency, the main  
oscillator switching frequency is no longer derived from the  
frequency received at the SYNCI pin. Under these  
conditions, the SYNCO pin is held low.  
Two NCV890101 can be synchronized outofphase to  
one another by connecting the SYNCO pin of one to the  
SYNCI pin of the other (Figure 29). Any number of  
NCV890101 can also be synchronized to an external clock  
(Figure 30). If a part does not have its switching frequency  
controlled by the SYNCI input, it drives the SYNCO pin low  
when it turns on the power switch, and drives it high half a  
switching period later. When the switching frequency is  
controlled by the SYNCI input, the SYNCO pin is held low.  
Synchronization starts within 2 ms of softstart completion.  
A rising edge at the SYNCI pin causes an NCV890101 to  
immediately turn on the power switch. If another rising edge  
An external pulldown resistor is not required at the  
SYNCI pin if it is unconnected.  
VIN  
CDRV1  
DBST1  
NCV890101  
CDRV2  
VOUT1  
COUT1  
L1  
DBST2  
NCV890101  
1 VIN  
SW 10  
CBS1T  
CIN1  
VOUT2  
L2  
DFW2  
1
2
3
4
5
VIN  
SW 10  
2 DRV  
3 SYNCO  
4 GND  
5 EN  
BST  
SYNCI  
FB  
9
8
7
6
DFW1  
CBST2  
CIN2  
COUT2  
RFB1  
DRV  
SYNCO  
GND  
EN  
BST  
SYNCI  
FB  
9
8
7
6
RFB1  
Synchronization  
COMP  
RFB2  
RCOMP1  
EN2  
COMP  
RFB2  
SYNC MASTER  
CCOMP1  
RCOMP2  
CCOMP2  
SYNC SLAVE  
Figure 29. NCV890101s Synchronized to Each Other  
Master Enabled by Battery  
VIN  
CDRV1  
DBST1  
NCV890101  
CDR2V  
VOUT1  
COUT1  
L1  
DBST2  
1 VIN  
SW 10  
CBS1T  
NCV890101  
VIN SW 10  
CIN1  
VOUT2  
COUT2  
L2  
DFW1  
1
2 DRV  
3 SYNCO  
4 GND  
5 EN  
BST 9  
SYNCI 8  
FB 7  
CBST2  
CIN2  
RFB11  
2
3
4
5
DRV  
BST  
SYNCI  
FB  
9
8
7
6
RFB21  
DFW2  
SYNCO  
GND  
EN  
COMP  
6
RFB12  
RCOMP1  
EN2  
COMP  
RFB22  
RCOMP2  
CCOMP1  
Synchronization  
CLK  
CCOMP2  
Figure 30. Both NCV890101s Synchronized to External Clock  
#1 Enabled by Battery  
www.onsemi.com  
12  
 
NCV890101  
BOOTSTRAP  
In order for the bootstrap capacitor to stay charged, the  
Switch node needs to be pulled down to ground regularly. In  
very light load condition, the NCV890101 skips switching  
cycles to ensure the output voltage stays regulated. When the  
skip cycle repetition frequency gets too low, the bootstrap  
voltage collapses and the regulator stops switching.  
Practically, this means that the NCV890101 needs a  
minimum load to operate correctly. Figure 31 shows the  
minimum current requirements for different input and  
output voltages.  
At the DRV pin an internal regulator provides a  
groundreferenced voltage to an external capacitor (C ),  
to allow fast recharge of the external bootstrap capacitor  
DRV  
(C ) used to supply power to the power switch gate driver.  
BST  
If the voltage at the DRV pin goes below the DRV UVLO  
Threshold V  
, switching is inhibited and the  
DRVSTP  
Softstart circuit is reset, until the DRV pin voltage goes  
back up above V  
.
DRVSTT  
50  
40  
30  
20  
16  
14  
12  
L = 2.2 mH  
L = 4.7 mH  
10  
8
6
L = 4.7 mH  
4
10  
0
L = 2.2 mH  
2
0
4.2  
5.2  
6.2  
7.2  
8.2  
9.2  
4.2  
4.7  
5.2  
5.7  
6.2  
6.7  
7.2  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
Minimum Load 5 V Out  
Minimum Load 3.3 V Out  
20  
18  
16  
14  
12  
10  
8
50  
45  
40  
35  
30  
25  
20  
15  
10  
L = 2.2 mH  
L = 2.2 mH  
L = 4.7 mH  
6
L = 4.7 mH  
4
2
0
5
0
4.2  
4.7  
5.2  
5.7  
6.2  
6.7  
7.2  
4.2  
6.2  
8.2  
10.2  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
Minimum Load 3.7 V Out  
Minimum Load 5.5 V Out  
Figure 31. Minimum Load Current with Different Input and Output Voltages  
www.onsemi.com  
13  
 
NCV890101  
OUTPUT PRECHARGE DETECTION  
EXPOSED PAD  
Prior to Softstart, the FB pin is monitored to ensure the  
SW voltage is low enough to have charged the external  
The exposed pad (EPAD) on the back of the package must  
be electrically connected to the electrical ground (GND pin)  
for proper, noisefree operation.  
bootstrap capacitor (C ). If the FB pin is higher than  
BST  
V
, restart is delayed until the output has discharged.  
SSEN  
DESIGN METHODOLOGY  
Figure 32 shows the IC starts to switch after the voltage on  
FB pin reaches VSSEN, even the EN pin is high. After the  
IC is switching, the FB pin follows the soft starts reference  
to reach the final set point.  
The NCV890101 being a fixedfrequency regulator with  
the switching element integrated, is optimized for one value  
of inductor. This value is set to 4.7 mH, and the slope  
compensation is adjusted for this inductor. The only  
components left to be designed are the input and output  
capacitor and the freewheeling diode. Please refer to the  
design spreadsheet www.onsemi.com NCV890101 page  
that helps with the calculation.  
EN  
Output capacitor:  
The minimum output capacitor value can be calculated  
based on the specification for output voltage ripple:  
Time  
FB  
DIL  
(eq. 1)  
COUTmin  
+
V
SSEN  
8 @ DVOUT @ FSW  
With  
Time  
DI the inductor ripple current:  
L
SW  
V
OUT  
ǒ
Ǔ
V
OUT @ 1 *  
V
IN  
(eq. 2)  
DIL +  
L @ FSW  
Time  
DV  
the desired voltage ripple.  
Figure 32. Output Voltage Detection  
OUT  
However, the ESR of the output capacitor also contributes  
to the output voltage ripple, so to comply with the  
THERMAL SHUTDOWN  
requirement, the ESR cannot exceed R  
:
ESRmax  
A thermal shutdown circuit inhibits switching, resets the  
Softstart circuit, and removes DRV voltage if internal  
temperature exceeds a safe level. Switching is automatically  
restored when temperature returns to a safe level.  
DVOUT @ L @ FSW  
RESRmax  
+
(eq. 3)  
V
OUT  
ǒ1 *  
Ǔ
VOUT  
V
IN  
Finally, the output capacitor must be able to sustain the ac  
current (or RMS ripple current):  
MINIMUM DROPOUT VOLTAGE  
When operating at low input voltages, two parameters  
play a major role in imposing a minimum voltage drop  
across the regulator: the minimum off time (that sets the  
maximum duty cycle), and the on state resistance.  
When operating in continuous conduction mode (CCM),  
the output voltage is equal to the input voltage multiplied by  
the duty ratio. Because the NCV890101 needs a sufficient  
bootstrap voltage to operate, its duty cycle cannot be 100%:  
DIL  
(eq. 4)  
IOUTac  
+
Ǹ
2 3  
Typically, with the recommended 4.7 mH inductor, two  
ceramic capacitors of 10 mF each in parallel give very good  
results.  
Freewheeling diode:  
it needs a minimum off time (t  
) to periodically refuel  
OFFmin  
The diode must be chosen according to its maximum  
current and voltage ratings, and to thermal considerations.  
As far as max ratings are concerned, the maximum reverse  
voltage the diode sees is the maximum input voltage (with  
some margin in case of ringing on the Switch node), and the  
maximum forward current the peak current limit of the  
the bootstrap capacitor C . This imposes a maximum duty  
BST  
ratio D  
= 1 t  
.F  
, with the switching  
MAX  
OFFmin SW(min)  
frequency being folded back down to F  
keep regulating at the lowest input voltage possible.  
The drop due to the onstate resistance is simply the  
voltage drop across the Switch resistance R  
= 500 kHz to  
SW(min)  
at the  
DSON  
NCV890101, I  
.
LIM  
given output current: V  
= I  
.R  
.
SWdrop  
OUT DSon  
The power dissipated in the diode is P  
:
Dloss  
Which leads to the maximum output voltage in low Vin  
condition: V = D .V V  
VOUT  
OUT  
MAX IN(min)  
SWdrop  
(eq. 5)  
@ VF ) IDRMS @ RD  
@ ǒ1 * Ǔ  
P
Dloss + IOUT  
VIN  
www.onsemi.com  
14  
 
NCV890101  
with:  
I  
It can be designed in combination with an inductor to build  
an input filter to filter out the ripple current in the source, in  
order to reduce EMI conducted emissions.  
the average (dc) output current  
OUT  
V the forward voltage of the diode  
F
I  
the RMS current in the diode:  
For example, using a 4.7 mH input capacitor, it is easy to  
calculate that an inductor of 200 nH will ensure that the  
input filter has a cutoff frequency below 200 kHz (low  
enough to attenuate the 2 MHz ripple).  
DRMS  
2
DIL  
2
(
)
1 * D ǒ  
IOUT  
(eq. 6)  
Ǔ
IDRMS  
+
)
Ǹ
12  
R the dynamic resistance of the diode (extracted from  
D
Error Amplifier and Loop Transfer Function  
the V/I curve of the diode in its datasheet).  
The error amplifier is a transconductance type amplifier.  
The output voltage of the error amplifier controls the peak  
inductor current at which the power switch shuts off. The  
Current Mode control method employed allows the use of a  
simple, type II compensation to optimize the dynamic  
response according to system requirements.  
Then, knowing the thermal resistance of the package and  
the amount of heatsinking on the PCB, the temperature rise  
corresponding to this power dissipation can be estimated.  
Input capacitor:  
The input capacitor must sustain the RMS input ripple  
current I  
Figure 33 shows the error amplifier with the  
compensation components and the voltage feedback divider.  
:
INac  
DIL  
D
(eq. 7)  
Ǹ
IINac  
+
2
3
VOUT  
RFB1  
VCOMP  
RCOMP  
V
FB  
V
RO  
Cp  
RFB2  
g
m
* V  
CCOMP  
Vref  
Figure 33. Feedback Compensator Network Model  
The transfer function from VOUT to VCOMP is the  
product of the feedback voltage divider and the error  
amplifier.  
1
wpl +  
(eq. 11)  
(eq. 12)  
Ro @ CCOMP  
1
wph +  
RCOMP @ Cp  
RFB2  
Gdivider(s) +  
(eq. 8)  
(eq. 9)  
RFB1 ) RFB2  
The output resistor Ro of the error amplifier is 1.4 MW and  
gm is 1 mA/V. The capacitor Cp is for rejecting noise at high  
frequency and is integrated inside the IC with a value of  
18 pF.  
The power stage transfer function (from Vcomp to output)  
is shown below:  
s
1 )  
wz  
Gerramp(s) + gm @ Ro @  
s
s
ǒ1 ) Ǔǒ1 ) Ǔ  
wpl  
wph  
1
wz +  
(eq. 10)  
RCOMP @ CCOMP  
s
1 )  
Rload  
Ri  
wz  
s
1
(eq. 13)  
@ Fh(s)  
Gps(s) +  
@
@
Rload@Tsw  
1 )  
[
]
1 )  
@ Mc @ (1 * D) * 0.5  
wp  
L
1
wp +  
(eq. 14)  
(eq. 15)  
Resr @ Cout  
Mc @ (1 * D) * 0.5  
L @ Cout @ Fsw  
1
wp +  
)
Rload @ Cout  
www.onsemi.com  
15  
 
NCV890101  
where  
The bode plots of the open loop transfer function will  
show the gain and phase margin of the system. The  
compensation network is designed to make sure the system  
has enough phase margin and bandwidth.  
Se  
Sn  
Mc + 1 )  
(eq. 16)  
(eq. 17)  
Vin * Vout  
Sn +  
@ Ri  
L
Design of the Compensation Network  
Ri represents the equivalent sensing resistor which has a  
value of 0.29 W, Se is the compensation slope which is  
291.9 kV/S, Sn is the slope of the sensing resistor current  
during on time. Fh(s) represents the sampling effect from the  
current loop which has two poles at one half of the switching  
frequency:  
The function of the compensation network is to provide  
enough phase margin at crossover frequency to stabilize the  
system as well as to provide high gain at low frequency to  
eliminate the steady state error of the output voltage. Please  
refer to the design spreadsheet www.onsemi.com  
NCV890101 page that helps with the calculation.  
1
Fh(s) +  
(eq. 18)  
The design steps will be introduced through an example.  
s
s2  
1 )  
)
wn2  
Example:  
wn@Qp  
wn + p @ Fsw  
Vin = 15.5 V, Vout = 3.3 V, Rload = 2.75 W, Iout = 1.2 A,  
L = 4.7 mH, Cout = 20 mF (Resr = 7 mW)  
The reference voltage of the feedback signal is 0.8 V and  
to meet the minimum load requirements, select RFB1 =  
100 W, RFB2 = 31.6 W.  
1
Qp +  
(eq. 19)  
[
]
p @ Mc @ (1 * D) * 0.5  
The total loop transfer function is the product of power  
stage and feedback compensation network.  
From the specification, the power stage transfer function can  
be plotted as below:  
Gloop(s) + Gdivider(s) @ Gerramp(s) @ Gps(s) (eq. 20)  
90  
180  
45  
90  
180  
20log Gps f  
arg Gps f  
(
( m))  
0
0
(m)  
p
45  
90  
90  
100  
180  
110  
3
4
5
6
110  
110  
110  
f
m
(Hz)  
Figure 34. Power Stage Bode Plots  
(eq. 21)  
The crossover frequency is chosen to be Fc = 70 kHz, the  
power stage gain at this frequency is 8 dB (0.398) from  
calculation. Then the gain of the feedback compensation  
network must be 8 dB. Next is to decide the locations of one  
zero and one pole of the compensator. The zero is to provide  
phase boost at the crossover frequency and the pole is to  
reject the noise of high frequency. In this example, a zero is  
placed at 1/10 of the crossover frequency and a pole is placed  
at 1/5 of the switching frequency (Fsw = 2 MHz):  
2
Fc  
1 ) ǒFpǓ  
Ǹ
Fp @ gm  
Vout  
RCOMP +  
@
@ Ǹ  
|
|
(Fp * Fz) @ Gps(Fc) Vref  
2
Fz  
1 ) ǒFcǓ  
1
CCOMP +  
(eq. 22)  
2p @ Fz @ RCOMP  
Fz = 7000 Hz, Fp = 400000 Hz,  
RCOMP, CCOMP and Cp can be calculated from the  
following equations:  
1
Cp +  
(eq. 23)  
2p @ Fp @ RCOMP  
Note: there is an 18 pF capacitor at the output of the OTA  
integrated in the IC, and if a larger capacitor needs to be  
used, subtract this value from the calculated Cp. Figure 35  
shows Cp is split into two capacitors. Cint is the 18 pF in the  
IC. Cext is the extra capacitor added outside the IC.  
www.onsemi.com  
16  
NCV890101  
From the calculation:  
So the feedback compensation network is as below:  
RCOMP = 10.6 KW, CCOMP = 2 nF, Cp = 37 pF  
VOUT  
RFB1  
100 W  
VCOMP  
V
FB  
RCOMP  
10 KW  
V
18 pF  
Cint  
19 pF  
Cext  
RO  
RFB2  
31.6 W  
g *V  
m
CCOMP  
2 nF  
Vref  
0.8 V  
Figure 35. Example of the Feedback Compensation Network  
Figure 36 shows the bode plot of the OTA compensator  
90  
180  
90  
45  
180  
20log Gerr_amp  
f
arg Gerr_amp  
(
f
(
m ))  
0
0
(m )  
⎦ ⎦  
p
45  
90  
90  
100  
180  
110  
3
4
5
6
110  
110  
110  
f
m
(Hz)  
Figure 36. Bode Plot of the OTA Compensator  
The total loop bode plot is as below:  
90  
180  
90  
45  
180  
20log Gloop  
f
arg Gloop  
(
f
(
m ))  
0
0
(m )  
⎦ ⎦  
p
45  
90  
90  
100  
180  
110  
3
4
5
6
110  
110  
110  
f
m
(Hz)  
Figure 37. Bode Plot of the Total Loop  
The crossover frequency is at 70 KHz and phase margin is 75 degrees.  
www.onsemi.com  
17  
 
NCV890101  
PCB LAYOUT RECOMMENDATION  
Freewheeling diode ³ inductor ³ Output capacitor  
³ return through ground  
Minimize the length of high impedance signals, and  
route them far away from the power loops:  
Feedback trace  
As with any switching power supplies, there are some  
guidelines to follow to optimize the layout of the printed  
circuit board for the NCV890101. However, because of the  
high switching frequency extra care has to be taken.  
Minimize the area of the power current loops:  
Comp trace  
Input capacitor ³ NCV890101 switch ³ Inductor  
³ output capacitor ³ return through Ground  
ORDERING INFORMATION  
Device  
NCV890101MWTXG  
Package  
DFN10 with wettable flanks  
Shipping  
3000 / Tape & Reel  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
18  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
DFN10, 3x3, 0.5P  
CASE 485C  
ISSUE F  
SCALE 2:1  
DATE 16 DEC 2021  
GENERIC  
MARKING DIAGRAM*  
XXXXX  
XXXXX  
ALYWG  
G
XXXXX = Specific Device Code  
A
L
Y
W
G
= Assembly Location  
= Wafer Lot  
= Year  
= Work Week  
= PbFree Package  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
(Note: Microdot may be in either location) not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON03161D  
DFN10, 3X3 MM, 0.5 MM PITCH  
PAGE 1 OF 1  
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